Contenu connexe Similaire à ONFI 3.0 NAND Flash Controller Similaire à ONFI 3.0 NAND Flash Controller (20) Plus de Arasan Chip Systems Plus de Arasan Chip Systems (10) ONFI 3.0 NAND Flash Controller2. Arasan Chip Systems Total IP Solutions
ONFI 3.0 Features
Core Architecture
Deliverables
Arasan Advantages
©Arasan Chip Systems Inc. 2011
4. ONFI Background
ONFI Open NAND Flash Interface
• NAND Flash Industry Consortium
Version 3.0
• Latest specification for NAND Flash control
• Faster data transfers and new features
• Backwards compatible with previous versions
©Arasan Chip Systems Inc. 2011
5. ONFI 3.0 Features
Operates memory devices at any frequency
up to 200 MHz
• 200 MT/S
Differential signaling on clock and data lines
DDR-2 Transfers
• True and Complement Data Strobes
• SDR, NV-DDR and NV-DDR2
©Arasan Chip Systems Inc. 2011
6. ONFI 3.0 Features
Single and Dual data bus discovery
Eight chip enables
Page sizes up to 8K
ECC up to 64 bits
• Dynamically configurable ECC width
Warm-up cycles for high-speed operation
Supports all new commands
©Arasan Chip Systems Inc. 2011
7. Patented BCH Coding
BCH Coded ECC supports dynamically
scalable correction bits
Parallel bit processing on the BCH encoder
Parallel syndrome generation
Inversion-less Berlekamp-Massey algorithm
for key equation solver
Parallel computation for the key equation
solver
Parallel Chien search algorithm
©Arasan Chip Systems Inc. 2011
10. Deliverables
RMM (Reuse Methodology Manual)
compliant Verilog
Configurable Behavioral models
Verification Suite & Test Cases
Documentation and Design Support
©Arasan Chip Systems Inc. 2011
11. Total IP Solutions
Features
• Analog and Digital cores, with no gaskets or
wrappers for efficient, low-gate design
• Software, Synthesis scripts and Test
Environments
• Verification IP, ESL models
• HW Development Kits & Verification Platforms
• Design Services
©Arasan Chip Systems Inc. 2011
12. Total IP Solutions
Benefits
• Compliance across the standard
• Single supplier – Single support
• Guaranteed compatibility
• Lowest overall cost and risk
• Seamless integration from PHY to SW layers
• Fastest cycle: MRD to SoC
©Arasan Chip Systems Inc. 2011