Scaling API-first – The story of a global engineering organization
Presentation pressfit english july 2013
1. INNOVATIVE
PRESS FIT TECHNOLOGY
for Interconnect Solutions
"LOUPOT’s mission is to deliver superior quality
products and services to our customers through
innovation and partnership."
INTERCONNECT
20
13
SOLUTIONS
1
2. Press fit technology
Pressfit technology offers a compliant
connection between a PCB with a plated
through-hole and a single pin or a connector.
Press fit shape design is a technology
introduced to eliminate the need of
soldering process.
INNOVATIVE
INTERCONNECT
SOLUTIONS
2
3. Loupot’s compliant pin shape
E.O.N. – Eye Of the Needle shape
INNOVATIVE
INTERCONNECT
SOLUTIONS
3
5. STAMPED TERMINALS
RAW MATERIAL : CuSn6
THICKNESS : 0.25 mm
0.40 mm
0.63 mm
0.80 mm
1.00 mm
PLATING : Post-tin Sn 0.8 to 2m maxi
Underlayer Ni 1 to 2 m
INNOVATIVE
INTERCONNECT
SOLUTIONS
5
6. STAMPED TERMINALS
Pins & blade terminals in reel
form for insertion in PCB
boards or connectors through
Loupot machines.
Leadframes for overmolded
products
INNOVATIVE
INTERCONNECT
SOLUTIONS
6
7. OVERMOULDED CONNECTORS
Overmolded press fit
terminals for automotive
application
Overmolded connector
for electrical application
Overmolded pressfit for
automotive application
INNOVATIVE
INTERCONNECT
SOLUTIONS
7
8. ASSEMBLY – Pressfit terminals on PCB boards
AXIS 350
automatic insertion
machine (stand alone or in line)
P4000
semi-automatic
insertion machine
INNOVATIVE
INTERCONNECT
SOLUTIONS
8
9. ASSEMBLY – Pressfit terminals into plastic housing
Loupot specific automatic insertion machine Customized connectors
with press fit terminals
INNOVATIVE
INTERCONNECT
SOLUTIONS
9
10. ASSEMBLY – Electronic circuit boards
PCB inserted into
connectors
Loupot specific press Connector inserted
on PCB board
INNOVATIVE
INTERCONNECT
SOLUTIONS
10
12. DESIGN for 0.6 mm thickness
Raw material & plating :
PCB definition :
Raw material Bronze CuSn6P R560
Thickness (mm) 0.63 +/- 0.03
Surface treatment
Post-tin Sn 100% 0.8 to 2µ maxi
underlayer : Ni 1 to 2 µ
ID IMDS 16280
Requirements for printed board
(according to IEC60352-5)
Material FR-4
Diameter of the hole prior to
plating (mm)
Diameter of the finished
plated-through hole (mm)
PCB Thickness 1.6 mm
Copper thickness ≥ 30µm
Plating qualified
Chemical Sn,
Chemical Ni/Au &
immersion Ag
09.0
06.000.1
025.015.1
09.0
06.000.1
INNOVATIVE
INTERCONNECT
SOLUTIONS
12
13. DESIGN for 0.6 mm thickness
025.015.1
Press-fit design rules :
INNOVATIVE
INTERCONNECT
SOLUTIONS
13
14. Test criteria
Contact resistance :
INNOVATIVE
INTERCONNECT
SOLUTIONS
14
H1
(mm)
R max
(mΩ)
Rmin
(mΩ)
Average
(mΩ)
0.75 1.38 1.22 1.31
1.15 1.36 1.51 1.43
Derating curve :
Contact resistance measured after
temperature stabilization of 10 mn.
Current : Maximum current allowed: 10 A
=> DTemp(10 A) = + 25°C (at ambient Temp)
15. Test criteria
Retention Force :
Load (N)
0
10
20
30
40
50
Extension (mm)
-46.5 -46.0 -45.5 -45.0 -44.5
LimitGreatest Slope
INNOVATIVE
INTERCONNECT
SOLUTIONS
15
Insertion Force : Load (N)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
Extension (mm)
0.0 1.0 2.0
Greatest Slope
The minimal push-out force
is higher than 20N.
16. Test criteria
Contact replacement :
LOUPOT EON compliant Press-fit can be replaced
2 times (3 insertions).
This operation can be realised by hand directly,
but with high precautions. Indeed, this action must
be done with an angle less than 5° around the
terminal axis and without any rotation.
Climatic and vibration tests :
The electrical comportment is
qualified by the variation of
contact resistances, before
and after tests. This variation
doesn’t exceed 0.50mΩ.
INNOVATIVE
INTERCONNECT
SOLUTIONS
16
R (mΩ)
Thermal
Shock
< 0.10
Thermal
Cycling
< 0.40
Dry Heat < 0.40
Corrosion < 0.40
Vibration < 0.45
17. Test criteria
Microsection Data : One of the most interesting points of the Pressfit Eye Of Needle
technology is the low distortion of the hole.
INNOVATIVE
INTERCONNECT
SOLUTIONS
17