Electra EMP110 AS + Argus PC9000 Technology Presentation

CarapaceCarapace®®
EMP110 SprayEMP110 Spray
Spray ApplicationSpray Application
Liquid Photoimageable SoldermaskLiquid Photoimageable Soldermask
www.electrapolymers.comwww.electrapolymers.com

Electra & SprayElectra & Spray
• 19931993 Supply Electrostatic spray resist in UK and DenmarkSupply Electrostatic spray resist in UK and Denmark
• 19931993 Work with Halco to formulate vertical spray soldermask.Work with Halco to formulate vertical spray soldermask.
• 19941994 Supply first Halco production unitSupply first Halco production unit
• 1995 Supply first Argus horizontal unit in USA1995 Supply first Argus horizontal unit in USA
• 1995 Onwards – Resist of choice for Halco & Argus systems1995 Onwards – Resist of choice for Halco & Argus systems
• 2000 Supply first Argus horizontal unit in Europe2000 Supply first Argus horizontal unit in Europe
• 2000-2001 Further 4 Argus horizontal units installed into UK2000-2001 Further 4 Argus horizontal units installed into UK

Electra & SprayElectra & Spray
• Electra Spray material currently supplied:Electra Spray material currently supplied:
Yellow
Black
White
Red
Blue
Matt
Green
Standard Surface FinishStandard Colours
Gloss Extra Matt

Electra Spray SoldermaskElectra Spray Soldermask
StrengthsStrengths
• Rheological characteristicsRheological characteristics
• Uniform track coverageUniform track coverage
• Uniformity of coatingUniformity of coating
• No mottlingNo mottling
• No craters or pin-holesNo craters or pin-holes
• Atomisation propertiesAtomisation properties
• Transfer efficiencyTransfer efficiency
• Solvent balanceSolvent balance
• Levelling without slumpingLevelling without slumping

Argus Air SprayArgus Air Spray
BenefitsBenefits
• Coating uniformity & low wastageCoating uniformity & low wastage
• Good track encapsulationGood track encapsulation
• Low copper up to 400 µm coating capabilityLow copper up to 400 µm coating capability

Sprayed WetSprayed Wet
ThicknessThickness
30µm 35µm30µm 35µm
1.2 mil to 1.41.2 mil to 1.4
milmil
1.6 mil to 1.81.6 mil to 1.8
milmil
2 mil to 2.22 mil to 2.2
milmil
2.4 mil to 2.62.4 mil to 2.6
milmil
2.8 mil to 3.0 mil2.8 mil to 3.0 mil
3.2 mil to 3.43.2 mil to 3.4
milmil
Track HeightTrack Height 5050µµm to 55m to 55µµmm 5050µµm to 55m to 55µµmm 5050µµm to 55m to 55µµmm 5050µµm to 55m to 55µµmm 5050µµm to 55m to 55µµmm 5050µµm to 55m to 55µµmm
Track WidthTrack Width 300300µµmm 300300µµmm 300300µµmm 300300µµmm 300300µµmm 300300µµmm
Track SpacingTrack Spacing 400400µµmm 400400µµmm 400400µµmm 400400µµmm 400400µµmm 400400µµmm
Laminate (A)Laminate (A) 1010µµm to 14m to 14µµmm 2222µµm to 26m to 26µµmm 2929µµm to 34m to 34µµmm 3434µµm to 39m to 39µµmm 3434µµm to 38m to 38µµmm 4040µµm to 43m to 43µµmm
Top of Track (B)Top of Track (B) 1212µµm to15m to15µµmm 1212µµm to 16m to 16µµmm 1414µµm to 18m to 18µµmm 1414µµm to 18m to 18µµmm 1717µµm to 20m to 20µµmm 2828µµm to 30m to 30µµmm
Edge CoverageEdge Coverage
(C)(C)
44µµm to 8m to 8µµmm 88µµm to 10m to 10µµmm 1212µµm to 17m to 17µµmm 1414µµm to 17m to 17µµmm 1515µµm to 20m to 20µµmm 2424µµm to 26m to 26µµmm
Ratio (A to B)Ratio (A to B) 0.9 : 10.9 : 1 (1:1)(1:1) 1.8 : 11.8 : 1 (2:1)(2:1) 2.0 : 12.0 : 1 (2:1)(2:1) 2.3 : 12.3 : 1 (2:1)(2:1) 2.0 : 12.0 : 1 (2:1)(2:1) 1.4 : 11.4 : 1 (1:1)(1:1)
Ratio (A to C)Ratio (A to C) 2.2 : 12.2 : 1 (2:1)(2:1) 2.7 : 12.7 : 1 (3:1)(3:1) 2.2 : 12.2 : 1 (2:1)(2:1) 2.4 : 12.4 : 1 (2:1)(2:1) 2.1 : 12.1 : 1 (2:1)(2:1) 1.7 : 11.7 : 1 (2:1)(2:1)
Ratio (B to C)Ratio (B to C) 2.4 : 12.4 : 1 (2:1)(2:1) 1.5 : 11.5 : 1 (2:1)(2:1) 1.1 : 11.1 : 1 (1:1)(1:1) 1.0 : 11.0 : 1 (1:1)(1:1) 1.0 :11.0 :1 (1:1)(1:1) 1.0 : 11.0 : 1 (1:1)(1:1)
Track EncapsulationTrack Encapsulation

Coverage vs edge-coverageCoverage vs edge-coverage
30-35 micron wet30-35 micron wet 40-45 micron wet40-45 micron wet 50-55 micron wet50-55 micron wet 60-65 micron wet60-65 micron wet 70-75 micron wet70-75 micron wet

5oz Heavy copper5oz Heavy copper
15.2 microns on top of
track
11.4 microns on edge of
track
32.3 microns over laminate
or ground plane areas

400 µm
54 µm
400 micron heavy copper400 micron heavy copper

Blind Via EncapsulationBlind Via Encapsulation
Electra Matt AS FormulationElectra Matt AS Formulation Electra Gloss AS FormulationElectra Gloss AS Formulation

BenefitsBenefits
• 400 µm coating capability400 µm coating capability
• Pin-hole free coatingPin-hole free coating
• Conformal coatingConformal coating

• Conformal coverageConformal coverage
• Less ink between tracksLess ink between tracks
• Improved through exposureImproved through exposure
• Faster tack-dry timesFaster tack-dry times
• Reduced exposure timesReduced exposure times
• Reduced image growthReduced image growth
• Straighter side-wallsStraighter side-walls
Conformal CoverageConformal Coverage

Conformal CoverageConformal Coverage

BenefitsBenefits
• No skipping or dewetting on high/close tracksNo skipping or dewetting on high/close tracks

No Skipping or DewettingNo Skipping or Dewetting
• Uniform coverage on fine-linecircuitryUniform coverage on fine-linecircuitry
100µm Track & Gap100µm Track & Gap
No skipping or
dewetting after AS
coating

BenefitsBenefits
• No skipping or dewetting on high/closeNo skipping or dewetting on high/close
trackstracks
• No bubbles between tracksNo bubbles between tracks

• Elimination of Air BubblesElimination of Air Bubbles
50µm50µm
BenefitsBenefits
XXXXXX

BenefitsBenefits
• No skipping or dewetting on high/close tracksNo skipping or dewetting on high/close tracks
• No bubbles between tracksNo bubbles between tracks
• No Ink in HolesNo Ink in Holes

BenefitsBenefits
• Faster developing speedsFaster developing speeds
• Typical developing speed for 2m chamber:Typical developing speed for 2m chamber:
• Screen-print:Screen-print: 1.3 to 2.0 mmin1.3 to 2.0 mmin-1-1
• Curtain-coat:Curtain-coat: 2.0 to 2.5 mmin2.0 to 2.5 mmin-1-1
• Air-spray:Air-spray: 3.5 to 4.03.5 to 4.0 mminmmin-1-1

• ExampleExample
• Screen Print versus Air-sprayScreen Print versus Air-spray
• Same base soldermask chemistrySame base soldermask chemistry
• Purpose designed test panel - requirements:Purpose designed test panel - requirements:
• Maintain 10µm on track edgesMaintain 10µm on track edges
• Wash clean 0.2mm via-holesWash clean 0.2mm via-holes
• Maintain 50µm solderdamsMaintain 50µm solderdams
BenefitsBenefits

High ResolutionHigh Resolution
Screen Print SMScreen Print SM
Dark GreenDark Green
Air Spray SMAir Spray SM
High ResolutionHigh Resolution
Air Spray SMAir Spray SM
Developing SpeedDeveloping Speed
CleanClean 0.2mm0.2mm holesholes
90s dwell90s dwell
NoteNote::
Holes were pluggedHoles were plugged
after printingafter printing
30s dwell30s dwell 30s dwell30s dwell
Exposure EnergyExposure Energy
HoldHold 50µm50µm damsdams
583 mJcm583 mJcm-2-2
BenefitsBenefits

Argus Air-SprayArgus Air-Spray
PC9000 TechnologyPC9000 Technology
www.electrapolymers.comwww.electrapolymers.com

Argus International PrincipleArgus International Principle
• Single gun per sideSingle gun per side
• Atomisation by Compressed AirAtomisation by Compressed Air
• Gun traverses across conveyorised panelGun traverses across conveyorised panel
• Resist overlap from multiple passResist overlap from multiple pass
• In-line IR tack-dry (option)In-line IR tack-dry (option)

• Panel sizesPanel sizes
• WidthWidth
• Max:Max: 610 mm610 mm
• Min:Min: 150 mm150 mm
• LengthLength
• Any supportedAny supported
• ThicknessThickness
• Min:Min: 0.8-1.0mm0.8-1.0mm
• Conveyor speed:Conveyor speed:
• 1.1 – 1.5 m/min1.1 – 1.5 m/min
• Throughput:Throughput:
(based on 610 x 457 x 1.6mm):(based on 610 x 457 x 1.6mm):
• 110 – 200 panels/hr110 – 200 panels/hr
 Argus International CapabilityArgus International Capability

Argus International CapabilityArgus International Capability
• PC9524D + Convection ovenPC9524D + Convection oven 200 pph200 pph 1 operator1 operator
• PC9524D + PC9724x3PC9524D + PC9724x3 140 pph140 pph 1 operator1 operator
• PC9524D + PC9724x5PC9524D + PC9724x5 200 pph200 pph 1 operator1 operator
Based on 18” x 24” panels with auxiliary auto load/unloadBased on 18” x 24” panels with auxiliary auto load/unload

 Conveyor handlingConveyor handling
Automatic Width
Automatic Width
adjustment
adjustment Mechanical chain driveMechanical chain drive
with extended pin supportwith extended pin support
for PCBfor PCB
Zero gap between adjacent PCBsZero gap between adjacent PCBs

• Maximum panel weightMaximum panel weight::
• Standard spray coater conveyor:Standard spray coater conveyor: 36.6kg/sqm36.6kg/sqm
• Standard dryer conveyor:Standard dryer conveyor: 9.8kg/sqm9.8kg/sqm
• Heavy panel option for dryer:Heavy panel option for dryer: 36.6kg/sqm36.6kg/sqm

• PC9524DPC9524D – double sided HVLP air spray system– double sided HVLP air spray system
• PC9724PC9724 – 3 zone or 5 zone IR tack dry oven– 3 zone or 5 zone IR tack dry oven
• 3 zone3 zone Typically 1.1 m/minTypically 1.1 m/min (140 panels per hour)*(140 panels per hour)*
• 5 zone5 zone Typically 1.5 m/minTypically 1.5 m/min (200 panels per hour)*(200 panels per hour)*
* Based on 1.6mm thick panels with 1oz base copper construction* Based on 1.6mm thick panels with 1oz base copper construction

Heated GunHeated Gun
– The Argus gun design with it’s heated technology allowsThe Argus gun design with it’s heated technology allows
high atomisation at high viscosities and lower pressures.high atomisation at high viscosities and lower pressures.
If difficult to atomise the soldermask will form a mottled surfaceIf difficult to atomise the soldermask will form a mottled surface
or require excessive atomisation pressure and/or dilutionor require excessive atomisation pressure and/or dilution
leading to lower transfer efficiency and poor track coverage.leading to lower transfer efficiency and poor track coverage.

Spray Gun Concept & AtomisationSpray Gun Concept & Atomisation

Cosmetics and UniformityCosmetics and Uniformity
Spray Gun FeaturesSpray Gun Features
Heater Jacket heats gun to 90°CHeater Jacket heats gun to 90°C
Raised temperature drops viscosity.Raised temperature drops viscosity.
Lower viscosity allows higherLower viscosity allows higher
atomisation and in-flight solvent lossatomisation and in-flight solvent loss
Compressed Air-Supply heated to 50°CCompressed Air-Supply heated to 50°C
Raised temperature drops viscosity.Raised temperature drops viscosity.
Lower viscosity allows higherLower viscosity allows higher
atomisation and in-flight solvent lossatomisation and in-flight solvent loss
Atomisation Cap AngleAtomisation Cap Angle
Cap angle set to give optimumCap angle set to give optimum
overlap and spray transferenceoverlap and spray transference

Spray PatternSpray Pattern
Machine spray pitch set at 35-55mmMachine spray pitch set at 35-55mm
Spray pattern with x4-6 overlapSpray pattern with x4-6 overlap
1.1 – 1.5 m/min1.1 – 1.5 m/min
Spray Pattern:Spray Pattern:
approx. 5cm x 20cmapprox. 5cm x 20cm
Spray pattern orientation and shapeSpray pattern orientation and shape
allows spraying to panel or imageallows spraying to panel or image
edge with minimised wastageedge with minimised wastage
(controlled by(controlled by fanfan adjustment)adjustment)

Atomisation CapAtomisation Cap
Soldermask Outlet (apertureSoldermask Outlet (aperture
controlled by knob on gun-top)controlled by knob on gun-top) Atomisation Air OutletAtomisation Air Outlet
Spray pattern orientationSpray pattern orientation

Single-Gun Air-spray Coating uniformitySingle-Gun Air-spray Coating uniformity
Thickness Uniformity
Argus Air-spray at 1.2 m/min
Area
(thou) (microns)
1 1.16 29.5 Mean dry thickness: 30.4 microns
2 1.14 29.0
3 1.22 31.0 Standard deviation: 0.7 microns
4 1.19 30.2
5 1.17 29.7 UCL 32.6 microns
6 1.17 29.7 LCL 28.2 microns
7 1.23 31.2
8 1.21 30.7
9 1.18 30.0
10 1.18 30.0
11 1.19 30.2
12 1.22 31.0
13 1.21 30.7
14 1.26 32.0
15 1.19 30.2
16 1.19 30.2
17 1.22 31.0
18 1.23 31.2
19 1.17 29.7
20 1.19 30.2
Dry Thickness

Atomisation & droplet sizeAtomisation & droplet size
30 PSI30 PSI 35 PSI35 PSI 40 PSI40 PSI 45 PSI45 PSI 50 PSI50 PSI
25°C25°C
90°C90°C
50°C50°C
Higher atomisation pressure reduces droplet size and orange-peel. GivesHigher atomisation pressure reduces droplet size and orange-peel. Gives
smoother coating and in-fill of fine trackssmoother coating and in-fill of fine tracks
Higher temperature increasesHigher temperature increases
atomisation efficiency and solventatomisation efficiency and solvent
loss leading to less orange-peel andloss leading to less orange-peel and
better track-coveragebetter track-coverage
Higher atomisation leads to “bounce” and ink loss (< transfer efficiency)Higher atomisation leads to “bounce” and ink loss (< transfer efficiency)
Optimum area giving goodOptimum area giving good
cosmetics and reduced ink losscosmetics and reduced ink loss

Application MethodApplication Method Dry Thickness (µm)Dry Thickness (µm) Coverage (ftCoverage (ft22
kgkg-1-1
))
ES/EDES/ED ≅≅ 30-3530-35 ≅≅ 35 to 11035 to 110
PC9524DPC9524D ≅≅ 30-3530-35 ≅≅ 105 to 120105 to 120
Typical Soldermask Consumption (Min. 10µm over 60µm tracks)Typical Soldermask Consumption (Min. 10µm over 60µm tracks)
Figures dependent on ED machine type and circuit layoutFigures dependent on ED machine type and circuit layout

Simple Spray Process ControlSimple Spray Process Control
– Soldermask ViscositySoldermask Viscosity FixedFixed
– Gun & Air temperatureGun & Air temperature FixedFixed
– Atomisation pressureAtomisation pressure FixedFixed
– Fan pressure/spray patternFan pressure/spray pattern FixedFixed
– Needle openingNeedle opening Fixed per soldermask typeFixed per soldermask type
– Spray pitchSpray pitch FixedFixed
– Conveyor speedConveyor speed FixedFixed
– Ink pressureInk pressure Varied for req. thicknessVaried for req. thickness

Particle ControlParticle Control
Exhaust & FiltrationExhaust & Filtration
UPPER SPRAY SECTION LOWER SPRAY SECTION
66
5
5
3
3
4
4 2
2
18
17
9
9
18
10 1111
13
8
A TOM IZ ATION RESERVOIR
A TOM I ZATION A IR PRES SURE RESE RVOI R A IR PRESSURE
3
17
CONVEYOR
8
12 14
16
A TOM IZ ATION AI R P RESS URE
A TOMI ZATION RES ERV OI R
A TOMI ZATION A IR PRESSURE
ATOM IZA TION AIR PRESSURE RE SERV OIR AIR PRESS URE
CONTROLM AIN
POWER
15
7
11
3
CONVEYOR DIRECTION
FORWARD REVERSE
Exhaust of 1500 cfm per chamberExhaust of 1500 cfm per chamber
ensures all particles are removed fromensures all particles are removed from
spray chambers and trapped in filterspray chambers and trapped in filter
mediummedium
Filter Medium to catch exhausted over-Filter Medium to catch exhausted over-
spray and particlesspray and particles

Exhaust & FiltrationExhaust & Filtration
2-Ply Filter medium collects2-Ply Filter medium collects
overspray ink particles drawn byoverspray ink particles drawn by
exhaust in top and bottom sprayexhaust in top and bottom spray
units.units.

Chain CleanerChain Cleaner
53
3 3
1 4 2

Exhaust Dryer for ChainExhaust Dryer for Chain
Exhaust for excess chain cleaner removalExhaust for excess chain cleaner removal
Excess chain cleaner collectionExcess chain cleaner collection
Exhaust fan for excess chain cleanerExhaust fan for excess chain cleaner

Safety & ProtectionSafety & Protection
– Out of range operating conditions and various malfunctionsOut of range operating conditions and various malfunctions
are communicated to the operator by the touch screen.are communicated to the operator by the touch screen.
– The system is designed for proper air exhaust. HighThe system is designed for proper air exhaust. High exhaustexhaust
flows (1500 cfm per booth) ensure that particles/fumes doflows (1500 cfm per booth) ensure that particles/fumes do
not enter the room or build-up inside the spray compartment.not enter the room or build-up inside the spray compartment.
(1500cfm equates to approx. 1 air change per second).(1500cfm equates to approx. 1 air change per second).
– In the the event that exhaust flow is undetected by theIn the the event that exhaust flow is undetected by the
sensors the spray unit will shut down and error displayed onsensors the spray unit will shut down and error displayed on
touch-screen.touch-screen.

Safety & ProtectionSafety & Protection
Exhaust of 1500 cfm perExhaust of 1500 cfm per
chamber ensures all particleschamber ensures all particles
are removed from sprayare removed from spray
chambers and trapped inchambers and trapped in
filter mediumfilter medium
2-Ply Filter medium collects
overspray ink particles drawn
by exhaust in top and bottom
spray units.

Options:Options:
– Automatic or manual load into horizontal orAutomatic or manual load into horizontal or
vertical convection ovenvertical convection oven
– Argus PC9724 3-zone or 5-zone IR DryerArgus PC9724 3-zone or 5-zone IR Dryer

PC9724 IR Dryer:PC9724 IR Dryer:
CONVEYOR
1
678 91011
5
175 15
14 4
2
12
3
18
9 7 6
COOLINGFANS
MAXIMUM
POWER
MAIN
MINI MUM
CONTROL
16
13
19
Patented IR heater for rapid top sidePatented IR heater for rapid top side
and bottom side simultaneous dryingand bottom side simultaneous drying
1.2 to 1.6 m/min drying speed for 1.6mm boards1.2 to 1.6 m/min drying speed for 1.6mm boards

PC9724 IR Dryer (3-zone profile):PC9724 IR Dryer (3-zone profile):

ConclusionsConclusions
• Although an application method cannot satisfy all the demandsAlthough an application method cannot satisfy all the demands
put on LPI; careful selection of coating technology can open theput on LPI; careful selection of coating technology can open the
process window, improve quality and reduce costs.process window, improve quality and reduce costs.
• Based on the changes in technological demands put upon LPIBased on the changes in technological demands put upon LPI
Soldermask it is felt that air-spray application offers significantSoldermask it is felt that air-spray application offers significant
processing and end-user advantages.processing and end-user advantages.
• In combination with Carapace EMP110 AS, Argus PC9000 AirIn combination with Carapace EMP110 AS, Argus PC9000 Air
spray offers the best solution for:spray offers the best solution for:
• Efficient track encapsulation & coverageEfficient track encapsulation & coverage
• Particularly with copper weights >100Particularly with copper weights >100 µmµm
• High image resolutionHigh image resolution
• Rapid, clean developing of small via holesRapid, clean developing of small via holes
• Minimal soldermask deposit over laminateMinimal soldermask deposit over laminate

All images and technical information in this presentation are the property of ElectraAll images and technical information in this presentation are the property of Electra
Polymers Ltd.Polymers Ltd.
All information in this presentation is based on customer experience and does notAll information in this presentation is based on customer experience and does not
form part of any binding specification.form part of any binding specification.
All performance figures are those obtained using Electra EMP110 soldermask.All performance figures are those obtained using Electra EMP110 soldermask.
Performance figures may differ depending on the type soldermask used.Performance figures may differ depending on the type soldermask used.
Thank youThank you

Electra EMP110 AS + Argus PC9000 Technology Presentation

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