zEC12 e zBC12 Hardware Overview

©2014IBM Corporation
zEnterprise EC12 & BC12 Hardware
Overview
Nome: Felipe Lanzillotta Grandolpho
Email: felipeg@br.ibm.com
IBM Brasil – System and Technology Group (STG)
Trainee System zEnterprise

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Notes:
Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any
user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload
processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here.
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All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have
achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions.
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This information provides only general descriptions of the types and portions of workloads that are eligible for execution on Specialty Engines (e.g., zIIPs, zAAPs, and IFLs) ("SEs"). IBM
authorizes customers to use IBM SE only to execute the processing of Eligible Workloads of specific Programs expressly authorized by IBM as specified in the “Authorized Use Table for IBM
Machines” provided at www.ibm.com/systems/support/machine_warranties/machine_code/aut.html (“AUT”). No other workload processing is authorized for execution on an SE. IBM offers SE at
a lower price than General Processors/Central Processors because customers are authorized to use SEs only to process certain types and/or amounts of workloads as specified by IBM in the
AUT.
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DirMaint
ECKD
HiperSockets
IBM*
IBM (logo)*
OMEGAMON*
Performance Toolkit for VM
RACF*
REXX
System z*
zEnterprise*
z/VM*

“The postings on this site / presentation are my own
and don’t necessarily represent IBM’s positions,
strategies or opinions.”

Agenda:
– Sistemas Operacionais e Processadores;
– System z Gerações;
– zEC12 Hardware;
– zBC12 Hardware;
– Chips zEC12 x zBC12;
– Gerenciamento de Hardware;
– Features de I/O;
– Referência de Cliente;

Sistemas Operacionais
Tipos de Processadores
ICF

IBM System z - Gerações

N-4N-4
z990
•Anunciado em 5/2003
•1.2 GHz
•32 Cores caracterizáveis
•CP, IFL, ICF, zAAP
•Memória de 256 GB
z890
•1.0 GHz
•CP, IFL, ICF, zAAP
•Memória de32 GB Memory
N-3N-3
z9 Enterprise Class
•1.7 GHz
•CP, IFL, ICF, zAAP, zIIP
z9 Business Class
•1.4 GHz
N-5N-5
z800
•625 MHz
•CP, IFL, ICF
z900
•770 MHz
•CP, IFL, ICF
N-2N-2
z10 Enterprise Class
•4.4 GHz
•Memória de 1.5 TB
z10 Business Class
•3.5 GHz
• 5 GCP
N-1N-1
zEnterprise 196
•Anunciado em 22/07/2010
•5.2 GHz
•Memória de 3 TB
zEnterprise 114
•Anunciado em 12/07/2011
•3.8 GHz
•5 GCP
IBM System z - Gerações

zEnterprise EC12
• zEC12 - Lançada em 28 de Agosto de 2012
– RAIM como design de memória
– Memória mínima de 32 GB
– Até 768 GB por book
– 101 Cores rodando a 5.5 GHz
– Até 3 TB por sistema e até 1 TB por LPAR
• 32 GB HSA gerenciado separadamente

For IBM and Business Partner Education Use Only prior to Announcement
Baterias
Internas
(opcional)
Fontes
de
Energia
2 x Support
Elements
PCIe I/O
drawers
(Máximo de
5 por
zEC12)
Overhead
Power
(opcional)
Processor Books
com Flexible
Support
Processors
(FSPs), PCIe and
HCA I/O fanouts
Radiador N +1
bombas,
ventiladores e
motores
Cabos PCIe I / O de
interconexão,cabos
Ethernet e placas de
controle do SFP
cage
Overhead I/O
feature é um co-
requisito para a
opção de overhead
power
zEC12 com Resfriamento a ar baseada em radiador – (Model H89 ou
HA1) Vista Frontal

For IBM and Business Partner Education Use Only prior to Announcement
Baterias
Internas
(opcionais)
Fontes
de
energia
I/O cage
Carried
Forward
Unidades de
Resfriamento
a água N+1
Support
Elements
PCIe I/O
drawer
Processor Books
com Flexible
Support
Processors
(FSPs), PCIe and
HCA I/O fanouts
Cabos PCIe I / O de
interconexão,cabos
Ethernet e placas de
controle do SFP
cage
zEC12 Resfriada a Água (Upgraded de uma z196) - (Model H89 ou
HA1)

zEnterprise EC12 - Modelos
Memória
Memóri
a
MC
M
Frente
Conector de
resfriamento
3 x Fontes de
energia
DCA n+1
(Distributed Converter Assemblies)
16 DIMMs
( 4 GB, 16 GB,
ou 32 GB )
14
DIMMs

zEnterprise EC12 – MCM (Multi Chip Module)
PU 0PU 2
SC
0
SC
1
PU 1
PU 5PU 3 PU 4
Cada PU chip possui 6 cores com Cache L1 e
L2 internos, ainda dividindo 2 SC chips de
Cache L3 48 MB.
Cada MCM posui 2 SC chips de Cache L4 com
384 MB, que são divididos pelos PU Chips.

zEnterprise BC12
 zBC12 - Lançada em 23 de Julho de 2013
– 13 Cores rodando a 4.2 GHz
– Até 512 GB por sistema
• Sistema mínimo = 8 GB (Modelo H06), 16
GB (Modelo H13)
• 16 GB HSA gerenciado separadamente
• RAIM
• Máximo para uso do cliente 496 GB
(Modelo H13)

© 2014 IBM CorporationzBC12TLLB14
Bateria
interna
(opcionais)
Fontes
de
Energia
I/O Drawer
2 x CPC Drawers,
Memória & HCAs
PCIe I/O
drawers
Vista
Traseira
Vista Frontal
2 x Support
Elements
zBC12 Model H13

zEnterprise BC12 - Modelos
Processor SCM
Processor
SCM
Storage Control
SCM
Slots for 5 DIMMs
Slots for 5
DIMMs
2 x DCA n+1

zEnterprise BC12 – SCM (Single Chip Module)
 Cache
– Cache L1 e L2 compartilhado por core
– Cache L3 de 24MB compartilhado por chip
– Cache L4 de 192MB compartilhado por CPC-
drawer
 Mais processadores no mesmo espaço de uma
z114
– 6 cores por PU chip
– Mesmo consumo de energia que a z114
– 4.2 GHz por core
L3C0
L3C1
GX
MCU
Core0
Core1
Core2
Core3
Core4
Core5

 MCM
– MCM : 96mm x 96mm
– 6 PU chips por MCM
• 6 core chips com 4, 5 ou 6 cores ativos
• PU Chip : 23.7 mm x 25.2 mm
• 5.5GHz
– 2 SC chips por MCM
• 384 MB cache L4 per MCM (por book)
• SC Chip : 26.72 mm x 19.67 mm
– Até 4 MCMs por System
zEC12 Multi Chip Module (MCM)
 PU SCM
– SCM : 50mm x 50mm
– Hexa core chip com 4 ou 5 cores ativos
– 2 PU SCMs para H06 e 4 PU SCMs para H13
– PU Chip: 23.7 mm x 25.2 mm
– 4.2 GHz
 SC SCM
– 1 SC SCM para H06, 2 SC SCMs para H13
– 192 MB cache L4 por CPC Drawer
– SC Chip : 26.72 mm x 19.67 mm
zBC12 Single Chip Module (SCM)
PU 0PU 2
SC
0
SC
1
PU 1
PU 5PU 3 PU 4
zBC12 SCM vs zEC12 MCM

Uma HMC pode se comunicar com
todos as outras HMCs
– Controle de qualquer servidor em
qualquer site.
– No caso de Ensemble existe a
necessidade de um HMC secundário
 O SE possui uma relação de
backup ativo com o segundo SE
– Controle dedicado a um único servidor
HMC
HMC HMC
HMC
HMCs e SEs

Estrutura de I/O – PCIe I/O Drawer
Vista
Frontal
Vista
Traseira

I/O features
Flash Express FICON Express8SCrypto Express 4S
 10km LX Feature
– 10km
– One slot in the PCIe I/O
Drawer
– 2Gbps,4Gbps e 8Gbps
 SX Feature
– 2Gbps até 500 metros
– Disponível em pares de placas
– Memória SSD de 1.4 TB por
par
– Máximo de 4 pares por
máquina
– RAID 10
– Acelerador para operações de
criptografia usando SSL/TLS
– Co-processador
– De 1 até 16 features por
máquina

I/O features
IBM zEDC Express 10 GbE RoCE OSA- Express 5S
– Prover acelereção para
compressão e decompressão
dados
– De 1 até 5 features por
sistema
– Uma placa pode ser divida por
até 15 LPARs
– Exclusiva para z/OS
– Reduzir o consumo de CPU
por aplicações TCP/IP
– De 1 até 16 placas por
máquina
– Cada placa deve ser
dedicada a uma LPAR
 10GbE LR Feature
 10GbE SR Feature
 GbE LX Feature
 GbE SX Feature
 1000BASE-T Feature

© 2013 IBM Corporation22
Desafio
Para suportar a crescente demanda, a Algar Telecom
precisava de uma infraestrutura forte e flexível, que
entregasse alta disponibilidade e confiabilidade para os
serviços de telecomunicações.
Solução
A Algar Telecom consolidou mais de 90 servidores
distribuídos em servidores virtuais Linux, usando z/VM em
uma única IBM zEnterprise 196, utilizando também uma
IBM zEnterprise BladeCenter Extension.
Benefícios
Entregou uma plataforma confiável e flexível para os
serviços de ponta, que :
 Reduziram os custos do data center em 70%
 Reduziu os esforços em manutenção em 65%
 Impulsionou a eficiência operacional em 30%
“Transformamos
completamente nossa
infraestrutura e a forma
como a gerenciamos com o
IBM zEnterprise System.
Como consequência,
estimamos que nossa
eficiência operacional
aumentou em pelo menos
30%.”
Rogério Okada, Gerente de TI
Algar Telecom
Referência de cliente – Algar Telecom

Siglas
CP – Central Processor zEDC - zEnterprise Data Compression
zAAP - System z Application Assist Processors OSA - Open System Adapter
zIIP - System z Integrated Information Processor RoCE – Remote Direct Access over Converged
ICF – Internal Coupling Facility Ethernet
SAP – System assist processor CICS – Costumer Information Control System
IFL – Integrated Facility for Linux IMS – Information Management System
RAIM – Redundant Array of Independent Memory
HSA – Hardware System Area
PCIe - Peripheral Component Interconnect Express
MCM – Multi Chip Module
SCM – Single Chip Module
DIMM - Dual Inline Memory Modules
DCA – Distributed Convertor Assemblies
PU – Processor Unit
SC – Storage Control
CPC – Central Processor Complex
HMC – Hardware Management Console
SE – Support Elements
FICON – Fiber Channel Connection

Referências Bibliográficas
 IBM zEnterprise BC12 Technical Guide (
http://www.redbooks.ibm.com/abstracts/sg248138.html?Open )
 IBM zEnterprise EC12 Technical Guide (
http://www.redbooks.ibm.com/abstracts/sg248049.html?Open )
 Estudo de caso Algar Telecom (
http://www-01.ibm.com/common/ssi/cgi-bin/ssialias?subtype=AB&infotype=PM&appname=STGE_ZS_ZS_BRPT&htmlfid=ZSC0316
)

zEC12 e zBC12 Hardware Overview

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