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I N S T I T U T D E R E C H E R C H E T E C H N O L O G I Q U E
IRT Nanoelec
A new Grenoble-based
research & technology
initiative
07/01/2015
IRT Nanoelec 2012-2019
11/26/2014 2
• 17 partners
• 8 public funders
• Total budget: M€ 400
(incl. M€ 160 of public funds)
+ 11 associated partners
+ > 30 SME involved
The institute CEA-Leti acts as global coordinator of the IRT, which involves:
(December 2014)
IRT Nanoelec (1/2)
11/26/2014 3
• Development of technologies
– Develop global state-of-the-art technologies for the Integrated Circuits (IC) of
the future.
– Focus on 3D IC integration and integrated silicon photonics to help improve
CMOS circuits by building on a strong expertise and skills base in micro-and
nanotechnologies.
• Diffusion and valorization of technologies
– Development of new products or applications leaning on the connectivity
between objects.
– Exploit and generalize the use of the resulting technological building block by
incorporating them in demonstrators and systems representing the applications
of tomorrow
– Wide diffusion of the digital technologies towards companies (in particular for
SME).
– Diffusion in answer to the need for the application markets.
• Formations
– Implementation of trainings to support the technology programs.
– To prepare students for tomorrow’s challenges.
Consortium for the development of specific programs, coordinated by CEA-Leti
A global project in 3 axes
IRT Nanoelec (2/2)
1/7/2015 4
Characterization
TECHNOLOGICAL
DEVELOPMENT
AXE
3D
Si-based
photonics
DIFFUSION – VALORISATION
AXE
Easytech Program
Uses of Integrated
System and support
for companies
Program
EDUCATION AND
TRAINING AXE
Development of technologies
1/7/2015 5
Intrinsic power
consumption
Speed
Input / Output
Speed of
µ-processor to
memory access
New transistor concepts
Multi-core Hardware et Software
Architectures
Integrated Si Photonics
Program
3D IC Integration Program
Advanced chips
Performance
Energy efficiency
Heart CMOS
Diffusion of technologies
1/7/2015 6
User-driven
exploitation /
Integrated
systems
programs
Transport
Housing
Health
Education and training Program
1/7/2015 7
Attract new
audiences
Train
growing
staff by
raising their
level of
qualification
on the new
technologies
Training
platforms –
innovative
educational
approaches
Deepen tree
priority
applications
sectors
Employability /
Matching of
training to jobs
3D Program
1/7/2015 8
Objective: Validate a global approach to 3D
integration which simultaneously addresses design,
technology and characterization through a dedicated
platform.
– Development of generic technologies for high
density integration.
– Reliability, test methods & tools adapted to
3D.
– Wafer-level and package-level testing.
– Validation on technological demonstrators.
Si photonics Program (1/2)
1/7/2015 9
Objective : Integrate optical functions into silicon
CMOS technologies thanks to dedicated technology
and design platforms.
– Optimize technological process steps.
– Built a coherent design flow for integrating
photonic functions in silicon CMOS devices.
– Offer prototyping capabilities for complex
functions.
– Develop suitable test procedures.
Si photonics Program (2/2)
1/7/2015 10
Laser source
Grating coupler
Waveguide
In-plane coupler
Optical modulator
MUX & DEMUX
Photo detector
Integrated design flow
Packaging
Burn-in & testing
3D and Si photonics Programs convergence
1/7/2015 11
Active silicon
interposer
“More Than Moore” chips
(sensors, MEMS, RF,…)
Si Photonic Interface
End-of-program objective: Produce an « avant-gardiste » demonstrator in terms
of design and technology
Stacked logic
chips
Memory-on-logic stacks
Uses of Integrated Systems and support for companies Program
1/7/2015 12
Objective : Facilitate SME’s development of innovative products and
services integrating the latest advances in microelectronics for in-home
healthcare, home automation and transportation.
Means : A unique access highly interconnected
ecosystems and technological platforms:
1. Contributions of new contents by the industrial
partners
2. New tools purchasing by academic partners.
3. Development of new demonstrators
Uses of Integrated Systems and support for companies Program
A win-win concept, creator of valuation and
competitiveness for the economic players.
11/26/2014 13
Characterization Program - Large-scale instruments
1/7/2015 14
Objective: Facilitate access to the advanced
characterization techniques available at Grenoble’s
large-scale instruments for the IRT’s technological
R&D programs and for players in the micro-and
Nanoelectronics sector.
The axes of the program :
– Implementation of preparation &
characterization processes and resources
– Conducting of characterization experiments
for the IRT and for the micro-and
Nanoelectronics industry.
« Easytech » Program (support for SMEs)
1/7/2015 15
Objective :
- Give companies from all business sectors access
to the micro-and nanotechnologies developed in
research labs through R&D programs for adapting
technological building blocks to market
requirements, by providing companies with
guidance and advice, and through financial support.
- Disseminate micro-and nanotechnologies
nationally across the whole SME sector.
Education and training Program
1/7/2015 16
Objective : Implement training programs adapted to meet
the needs of the players in the micro-and
nanotechnologies sectors
Attract
new
audience
Physics, design and
micro-
nanoelectronics
technologies
Health
Employability / Matching of training
to jobs
New business
New skills
Development
on the
international
stage
Program
Engineering
Innovative
educational
approaches
Training
platforms
IRT Nanoelec tool boxes
Technological platforms
(200 et 300mm silicon cleanrooms)
Education and training platforms Easytech initiative
Diffusion and valorization platforms
1/7/2015 17
Added value of the IRT for program partners
1/7/2015 18
• What the partners contribute:
– Guidance.
– Skills.
– Resources (R&D workforce, cash(€), investments).
• What the partners get in return:
– Joint development involving all the partners in a global ecosystem.
– Acceleration of exploitation of R&D due to synergies between all the
partners in the Grenoble ecosystem.
– Leverage effect giving access to all the results (including demonstrators
– Direct role in the program steering (as a member of the IRT)
– Direct access to all the results and data from the IRT generic program
– Access to leading-edge prototypes and demonstrators.
The other IRTs
1/7/2015 19
Networks and
Digital
infrastructures
Infectiology
Composite materials
Materials
engineering and
metallurgy
Rail infrastructures
Nanoelectronics
Aeronautics, space and
embedded systems
Digital systems
engineering
Thank you for your attention

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About IRT Nanoelec

  • 1. I N S T I T U T D E R E C H E R C H E T E C H N O L O G I Q U E IRT Nanoelec A new Grenoble-based research & technology initiative 07/01/2015
  • 2. IRT Nanoelec 2012-2019 11/26/2014 2 • 17 partners • 8 public funders • Total budget: M€ 400 (incl. M€ 160 of public funds) + 11 associated partners + > 30 SME involved The institute CEA-Leti acts as global coordinator of the IRT, which involves: (December 2014)
  • 3. IRT Nanoelec (1/2) 11/26/2014 3 • Development of technologies – Develop global state-of-the-art technologies for the Integrated Circuits (IC) of the future. – Focus on 3D IC integration and integrated silicon photonics to help improve CMOS circuits by building on a strong expertise and skills base in micro-and nanotechnologies. • Diffusion and valorization of technologies – Development of new products or applications leaning on the connectivity between objects. – Exploit and generalize the use of the resulting technological building block by incorporating them in demonstrators and systems representing the applications of tomorrow – Wide diffusion of the digital technologies towards companies (in particular for SME). – Diffusion in answer to the need for the application markets. • Formations – Implementation of trainings to support the technology programs. – To prepare students for tomorrow’s challenges. Consortium for the development of specific programs, coordinated by CEA-Leti
  • 4. A global project in 3 axes IRT Nanoelec (2/2) 1/7/2015 4 Characterization TECHNOLOGICAL DEVELOPMENT AXE 3D Si-based photonics DIFFUSION – VALORISATION AXE Easytech Program Uses of Integrated System and support for companies Program EDUCATION AND TRAINING AXE
  • 5. Development of technologies 1/7/2015 5 Intrinsic power consumption Speed Input / Output Speed of µ-processor to memory access New transistor concepts Multi-core Hardware et Software Architectures Integrated Si Photonics Program 3D IC Integration Program Advanced chips Performance Energy efficiency Heart CMOS
  • 6. Diffusion of technologies 1/7/2015 6 User-driven exploitation / Integrated systems programs Transport Housing Health
  • 7. Education and training Program 1/7/2015 7 Attract new audiences Train growing staff by raising their level of qualification on the new technologies Training platforms – innovative educational approaches Deepen tree priority applications sectors Employability / Matching of training to jobs
  • 8. 3D Program 1/7/2015 8 Objective: Validate a global approach to 3D integration which simultaneously addresses design, technology and characterization through a dedicated platform. – Development of generic technologies for high density integration. – Reliability, test methods & tools adapted to 3D. – Wafer-level and package-level testing. – Validation on technological demonstrators.
  • 9. Si photonics Program (1/2) 1/7/2015 9 Objective : Integrate optical functions into silicon CMOS technologies thanks to dedicated technology and design platforms. – Optimize technological process steps. – Built a coherent design flow for integrating photonic functions in silicon CMOS devices. – Offer prototyping capabilities for complex functions. – Develop suitable test procedures.
  • 10. Si photonics Program (2/2) 1/7/2015 10 Laser source Grating coupler Waveguide In-plane coupler Optical modulator MUX & DEMUX Photo detector Integrated design flow Packaging Burn-in & testing
  • 11. 3D and Si photonics Programs convergence 1/7/2015 11 Active silicon interposer “More Than Moore” chips (sensors, MEMS, RF,…) Si Photonic Interface End-of-program objective: Produce an « avant-gardiste » demonstrator in terms of design and technology Stacked logic chips Memory-on-logic stacks
  • 12. Uses of Integrated Systems and support for companies Program 1/7/2015 12 Objective : Facilitate SME’s development of innovative products and services integrating the latest advances in microelectronics for in-home healthcare, home automation and transportation. Means : A unique access highly interconnected ecosystems and technological platforms: 1. Contributions of new contents by the industrial partners 2. New tools purchasing by academic partners. 3. Development of new demonstrators
  • 13. Uses of Integrated Systems and support for companies Program A win-win concept, creator of valuation and competitiveness for the economic players. 11/26/2014 13
  • 14. Characterization Program - Large-scale instruments 1/7/2015 14 Objective: Facilitate access to the advanced characterization techniques available at Grenoble’s large-scale instruments for the IRT’s technological R&D programs and for players in the micro-and Nanoelectronics sector. The axes of the program : – Implementation of preparation & characterization processes and resources – Conducting of characterization experiments for the IRT and for the micro-and Nanoelectronics industry.
  • 15. « Easytech » Program (support for SMEs) 1/7/2015 15 Objective : - Give companies from all business sectors access to the micro-and nanotechnologies developed in research labs through R&D programs for adapting technological building blocks to market requirements, by providing companies with guidance and advice, and through financial support. - Disseminate micro-and nanotechnologies nationally across the whole SME sector.
  • 16. Education and training Program 1/7/2015 16 Objective : Implement training programs adapted to meet the needs of the players in the micro-and nanotechnologies sectors Attract new audience Physics, design and micro- nanoelectronics technologies Health Employability / Matching of training to jobs New business New skills Development on the international stage Program Engineering Innovative educational approaches Training platforms
  • 17. IRT Nanoelec tool boxes Technological platforms (200 et 300mm silicon cleanrooms) Education and training platforms Easytech initiative Diffusion and valorization platforms 1/7/2015 17
  • 18. Added value of the IRT for program partners 1/7/2015 18 • What the partners contribute: – Guidance. – Skills. – Resources (R&D workforce, cash(€), investments). • What the partners get in return: – Joint development involving all the partners in a global ecosystem. – Acceleration of exploitation of R&D due to synergies between all the partners in the Grenoble ecosystem. – Leverage effect giving access to all the results (including demonstrators – Direct role in the program steering (as a member of the IRT) – Direct access to all the results and data from the IRT generic program – Access to leading-edge prototypes and demonstrators.
  • 19. The other IRTs 1/7/2015 19 Networks and Digital infrastructures Infectiology Composite materials Materials engineering and metallurgy Rail infrastructures Nanoelectronics Aeronautics, space and embedded systems Digital systems engineering
  • 20. Thank you for your attention