New Product Commercialization Strategy

1. New ProductNew Product
CommercializationCommercialization
John GlenningJohn Glenning
July 23, 2009July 23, 2009

2. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
1. Identify and resolve fundamental problems

3. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems

4. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification

5. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate

6. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing
conditions and equipment conditions in space and time

7. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing
conditions and equipment conditions in space and time
• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed
Experiments)

8. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing
conditions and equipment conditions in space and time
• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed
Experiments)
• Cp & Cpk will identify the accuracy & precision problems

9. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing
conditions and equipment conditions in space and time
• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed
Experiments)
• Cp & Cpk will identify the accuracy & precision problems
• Precision problems must be solved before accuracy problems

10. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
4. Consistently meet product specifications

11. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment

12. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions

13. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream

14. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions

15. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process
adjustment is required

16. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process
adjustment is required
• Correlate process conditions to interim product conditions

17. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process
adjustment is required
• Correlate process conditions to interim product conditions
• This identify the process adjustments to be made

18. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process
adjustment is required
• Correlate process conditions to interim product conditions
• This identify the process adjustments to be made
• Correlate incoming material conditions to final product conditions

19. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process
adjustment is required
• Correlate process conditions to interim product conditions
• This identify the process adjustments to be made
• Correlate incoming material conditions to final product conditions
• Incoming material specifications

20. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ

21. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”

22. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”

23. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection

24. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer

25. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
• High Yields

26. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
• High Yields
• Eliminate Mass Inspection
• Buckbee-Mears: 70% of the manufacturing costs occurred after the product was
made

27. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
• High Yields
• Eliminate Mass Inspection
• Buckbee-Mears: 70% of the manufacturing costs occurred after the product was
made
• IBM: “It cost 10 times more to solve problems in manufacturing than in
development and it cost 10 times more to solve problems in development than in
R & D”

28. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

29. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line

30. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards

31. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early

32. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
7. Transfer the process into manufacturing

33. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
7. Transfer the process into manufacturing
8. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)

34. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
7. Transfer the process into manufacturing
8. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time

35. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
7. Transfer the process into manufacturing
8. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time

36. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
7. Transfer the process into manufacturing
8. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs

37. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
7. Transfer the process into manufacturing
8. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
• WIP

38. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
7. Transfer the process into manufacturing
8. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
• WIP
• Identify trends early

39. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Process Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
7. Transfer the process into manufacturing
8. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
• WIP
• Identify trends early
• Maintain high quality and low costs

40. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Manufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time

41. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Manufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product

42. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Manufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis

43. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Manufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database

44. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Manufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
• Time stamp product when run in each process

45. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Manufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
• Time stamp product when run in each process
• Measure product mid-stream

46. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
Manufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
• Time stamp product when run in each process
• Measure product mid-stream
• Continuously track key product parameters to reduce variability, identify
problems and trends early
• Capability
• Cost
• Cycle Time
• Equipment Up-time
• WIP

47. John Glenning’s Presentation to GrafTechJohn Glenning’s Presentation to GrafTech
End of Presentation