Tony Green professional presentation 03122011 draft

Introducing

Tony Green

http://www.tonygreen.name
© Tony Green 2011
Introducing…

At 7:30 P.M. in the
evening I was born the
youngest identical twin on
May 19, 1969 at the
University of Pennsylvania
in Philadelphia, PA.
Photo courtesy of http://www.pennmedicine.org/health-
system/patient/hospitals-locations/

© Tony Green 2011
Birth

I grew up in West
Philadelphia near
Fairmount Park.

Photo: Courtesy of author’s personal collection

I attended Central High
graduating
in 1987

Photo: Courtesy of author’s personal collection

© Tony Green 2011
Youth

Attended the
University of
Delaware

From 1987-1993
1987-

Chemical Engineering
Major
Source of photos http://www.udel.edu/udphotos/

© Tony Green 2011 College

Undergraduate Research –Department of Chemistry

Hydrophobic surface laser(laser is light
amplification stimulated emission of radiation) to
measure relaxation
My contribution – Measured Contact Angles
Applications – Resistance of Phone cable to
corrosion
Publication – in May 1992 edition of Journal of
Analytical Chemistry

© Tony Green 2011
College

Yes I have sported different looks through my college years…….

Relaxing in Dickinson B
Dormitory
Halloween party in
Wilbur street

Graduation day!

Source of photos: Tony Green’s personal photo collection

© Tony Green 2011
College

Before arriving at my sea command. I went
through Nuke Training pipeline 1994 – 1996, which
consisted of Nuclear Field “A” School, Naval
Nuclear power school NNPS and finally Prototype
(NPTU)

Photo Courtesy of Tony Green’s personal collection


© Tony Green 2011
Navy Nuke

Was assigned as a Reactor operator to the U.S.S.
Topeka S.S.N. 754 stationed (at the time) in Pearl
Harbor, Hawaii.


Photo Source http://www.submarinebaseph.com/intropage1.html

© Tony Green 2011
Navy Nuke

This is Topeka
underway.
Just can’t say
where…..

Life underway during
deployment, I don’t
look bad with my
head shaven!


© Tony Green 2011
Navy Nuke

Who could serve in the Navy without any
port calls? …..

Visit to Esquimalt,
British Columbia

Sipping Cider in Hong Kong

Roppongi,
Tokyo
Japan

Downtown Hong Kong

Photos Courtesy of Tony Green’s personal collection

© Tony Green 2011
Navy Nuke

Serve in the Navy, see the world!

Pusan, South Korea

Hong Kong
From the sea

Cruising topside off of Lahiana, Maui
Photos Courtesy of Tony Green’s personal collection

© Tony Green 2011
Navy Nuke

Great to be home from another deployment!!!

Photo Courtesy of Dreamstime.com

Realities of a nuclear
Photo Courtesy Tony Green’s personal collection work environment

© Tony Green 2011
Navy Nuke

Here I am about to go to “Westpac” One of
three Pacific six-month deployments in 4
years…

Of course all good things must come to an
end…

© Tony Green 2011 Navy Nuke

Ever wonder how a nuclear reactor can provide propulsion to a
naval vessel ?

Source : http://www.fas.org/man/dod-101/sys/ship/eng/reactor.html

© Tony Green 2011
Navy Nuke

Just how is a reactor put together?

Source: Yun Po Ok’s Nuclear Power Electro Ceramics Lab Presentation
http://www.slideshare.net/viet4777/nuclear-power

© Tony Green 2011
Navy Nuke

What materials makes
this reactor go?

You guessed it, Uranium
more specifically U235
not U238

Chain reactions do not occur in uranium ore deposits.
Fission occurs mainly for the rare isotope U-235.
Only 0.7% or 1 part in 140 of uranium is U-235. The prevalent
isotope, U-238, absorbs neutrons but does not undergo fission.
A chain reaction stops as the U-238 absorbs neutrons.

Source: http://www.slideshare.net/Sarah17/nuclear-fission-and-fusion

© Tony Green 2011
Navy Nuke

In a typical example of nuclear fission, one neutron
starts the fission of the uranium atom and three
more neutrons are produced when the uranium
fissions


© Tony Green 2011
Navy Nuke

Note that one neutron starts the fission of the uranium atom, and, in the
example shown, three more neutrons are produced.
• Most nuclear fission reactions produce two or three neutrons.
• These neutrons can, in turn, cause the fissioning of two or three other
nuclei, releasing from four to nine more neutrons.
• If each of these succeeds in splitting an atom, the next step will
produce between 8 and 27 neutrons, and so on.


© Tony Green 2011
Navy Nuke

What happens when Uranium undergoes fission?
Well, you get energy, fission fragments and more
neutrons to cause more reactions….

Source: Applied Engineering Principles

© Tony Green 2011
Navy Nuke

Just what happens when the remaining Uranium decays?

The interaction of these radiations with the DNA in our bodies
is where problems, i.e. cancer and radiation sickness result
Source: http://www.atral.com/U2381.html

© Tony Green 2011
Navy Nuke

After I left the Navy I joined Gasonics
International as Technical Support Engineer

Gasonics manufactures ashers and etchers for
the that are used to manufacture
Semiconductor chips

Tony Green
Tony Green http://www.tonygreen.name
© Tony Green 2011 Novellus

Early in 2001 Gasonics was acquired by Novellus
Gamma 2310 Strip/Clean

Source: Peter J. Woytowitz’s 2004 Virtual Prototyping of
Semiconductor Processing Equipment presentation

My title changed to Product Support Engineer
but the job was still the same…..
Tony Green

What does Novellus do?
Vector PECVD

Founded in 1984, Novellus Systems is a
supplier of manufacturing systems used
to create integrated circuits.

Within the semiconductor machinery
manufacturing market, the company
builds equipment and develops
processes used to manufacture the
Source: Peter J. Woytowitz’s 2004
interconnect structures that tie together
Virtual Prototyping of Semiconductor
Processing Equipment presentation the transistors within a semiconductor
chip
Source: IBIS World


What does Novellus do?
Speed HDP
The company is maker of semiconductor
production equipment, including chemical vapor
deposition systems that layer dielectric (insulating)
material on semiconductor wafers, physical vapor
deposition systems that layer conductive metals, and
electro-fill systems that deposit copper layers. It also
makes surface preparation systems that clean wafers
before each round of deposition.

Novellus markets its products worldwide to
manufacturers of semiconductor devices including,
customers with captive fabrication lines, who
produce semiconductors primarily for internal
consumption; and merchant semiconductor
manufacturers, who produce semiconductors
primarily for sales to third party customers.

How does this relate to chip making in general? Source: Peter J. Woytowitz’s 2004
Virtual Prototyping of Semiconductor
Processing Equipment presentation
Source: IBIS World


What about these chips/where
does silicon fit in??
• Simply, silicon is beach sand processed
in high temperature so it’s cheep and
available

• Easily oxidized to form electrical
insulator

• Has excellent mechanical properties,
it’s strength exceeds high-strength
steel
Silicon is used to create transistors
Source: Integrated Circuits and MEMS fabrication Presentation by Amna Z. Shawwa
http://www.cecs.csulb.edu/~hill/ee330/Semiconductor%20Devices%20(Amna).ppt


Now that we have silicon…a
semiconductor is
A Semiconductor is a material with
properties in between conductors (allows
current to pass) and insulators (allows
little/no current to pass).

In the end it is all about how many free
electrons available to conduct current. A
feature of semiconductors is that the
supply of conduction electrons can be
controlled.

Source: Applied Engineering Principles Naval Training document


Now that we have
silicon…valance electrons
The most popular elements are Silicon and Germanium
both use 4 valance electrons. (outer shell electrons)
Doping can be done with elements that have 3,
(example boron) or 5, (example arsenic) valance
electrons. Doping can alter the properties of these
materials by affecting the available supply of conduction
electrons.
The materials doped with 3 valance electrons will form
holes since there will now be holes where there were
electrons while the materials doped 5 valance electrons
will form carriers are electrons since there will now be
excess electrons.



Now that we have silicon…doping
to make p and n type materials
Materials doped with 3 electrons elements are referred
to as p type while material doped with 5 electrons are
referred as n type.
Devices are made of p and n type of materials to
perform specific electrical functions.
When pieces of n type materials are brought in contact
with n type materials a p-n junction is formed.
The movement of electrons across these two materials
is called a Depletion zone is for which can be controlled
by the amount of bias or voltage that is applied.



Now that we have a P/N Junction
Depletion Zone

p type material n type material

Voltage

A p/n junction is a one way device allowing
current to flow in one direction and no
current flow in the other direction by
creating/removed of the depletion zone by
the application of current.


Now that we can put to P/N
junctions together
Transistors are comprised of three regions
of p and n type materials. This forms two
P/N junctions.

p type material n type material p type material
Emitter Base Collector

Voltage
Voltage



Our PNP junctions form the basic
Transistor
The center region is the base while the two outer
sections each of an opposite material type than the
base are referred as the collector and emitter.

The current can be controlled by the amount of
current supplied to the base.

This allows for a fair of crucial functionalities. One to
act as a amplifier, or to increase the strength of
current and the other is to act as a switch or the
ability to be in a “on” state or an “off” state. Both
functions are very useful in the assembly of more
complex components


Where do transistors come into play??
• Transistor is a semiconductor element, Has three terminals,
& a small current or voltage applied to one terminal controls
the current through the other two
• It is the key component in all modern electronics
• In digital circuits
– Very fast electrical switch
– Function as logic gate
– RAM-type memory
• In analog circuits
– Amplify current signals
– Amplify voltage signals
These are made to create the chips that are
use in electronics we all enjoy
Source: Integrated Circuits and MEMS fabrication Presentation by Amna Z. Shawwa
http://www.cecs.csulb.edu/~hill/ee330/Semiconductor%20Devices%20(Amna).ppt


Semiconductor hierarchy – Top level

Silicon
Analog discrete compounds
Combinations into simple digital
circuits
Combinations into larger complex
digital circuits, microprocessors

Source: The essential guide to Semiconductors by Jim Turley


Semiconductor family tree
This table provides an overview of the items made in
the Semiconductor industry……
Discrete Components Integrated Circuits (IC)
FPGA
Prog. Logic
PLD
Peripherals
CPU
Graphics
MPU
Logic Gate
Resistors
Processors MCU
Converters
Capacitors Networking
DSP
Optical Comms
Silicon Diodes
NPU
+ Inductors Sensors

Other Materials SRAM
Transistors Other
PROM
Memories DRAM
EPROM
= digital ROM
= analog EEPROM

Flash

Source: Adapted from the Essential Guide to Semiconductors by Jim Turley


Where are Semiconductors used??
The Top 5 supporting industries with their corresponding
end use are:
Data Processing - PC notebook and servers as well as
peripheral devices as printers and monitors

Communication - Mobile networks and Smart Phones

Consumer Electronics - Games consoles (Wii, Xbox,
Game Station), Digital TV, MP3 players, DVD recorders,
photo and video cameras

Automotive - engine control, instrument panel, safety
and driving dynamics, navigation and entertainment

Industrial - control and power electronics
Source: Price Water Coopers November 2009 Report titled Changing the
Pace of Semiconductor

Where are Semiconductors used??
These electronic components in these industries are
as follows:
Data Processing - Main products are Microprocessor,
DRAM and SRAM memory elements
Communication - Main products memory elements,
DAC converters, DSP processors, MCU, optical
semiconductors for displays
Consumer Electronics - Main products are
processors, graphic chips, memory modules, and
analogue chips
Automotive - Main products are sensors, MCU, DSP,
power electronics (IGBT) and analogue components
Industrial - Main products are MCU, DSP, and logic
Source: Price Water Coopers November 2009 Report titled Changing the
Pace of Semiconductor

Semiconductors Industry Application Data
Application 2006 2007 2008 2009
Data Processing 96.6 99.4 95.0 79.6
Communication 64.6 64.9 63.4 48.6
Consumer Electronics 42.9 45.8 45.2 39.4
Automotive 17.6 18.9 19.2 11.9
Industrial 26.0 26.6 25.8 21.6
Total 247.7 255.6 248.6 210.1
Growth 8.9% 3.2% -2.8% -19.1%

Semiconductor sales in billions of dollars by application
Source: Price Water Coopers November 2009 Report titled Changing the Pace
of Semiconductors

Semiconductors Industry Component Data
Component 2006 2007 2008 2009
Memories 56.4 54.0 43.4 38.6
MPU's and MCU's 51.8 52.5 53.3 47.5
Logic 63.2 69.3 71.4 57.7
Digital IC 171.4 175.8 168.1 143.8
Analog IC's 40.2 41.1 41.0 29.7
Total IC's 211.6 216.9 209.1 173.5
Discrete 16.2 17.0 16.5 10.5
Optical 16.3 17.7 18.9 14.1
Sensors 3.6 4.0 4.1 3.0
Total 247.7 255.6 248.6 201.1
Growth 8.9% 3.2% -2.8% -19.1%

Semiconductor sales in billions of dollars by component
Source: Price Water Coopers November 2009 Report titled Changing the Pace of
Semiconductors

Semiconductors Industry Country Data

Region 2006 2007 2008 2009
America 44.9 42.3 37.9 33.4
Europe 39.9 41.0 38.2 30.8
Japan 46.4 48.8 48.5 35.4
Asia(ex Japan) 116.5 123.5 124.0 101.5
Total 247.7 255.6 248.6 201.1
Growth 8.9% 3.2% -0.3% -19.1%

Semiconductor Sales by Region
Source: Price Water Coopers November 2009 Report titled Changing the Pace of
Semiconductors

How are Semiconductors
manufactured??
Create our wafer
Speed Process
Sand - silicon dioxide chamber
Melted at high temperature
Purified to 99.9999% purity
Grown into ingot – crystal
orientation
Inova: PVD Sliced into thin wafers
Wafer polished via CMP to
smooth one side
Epitaxial layer added in many
cases


manufactured??
Add insulator

Insulating layer of SiO2 (later
other )is added by Oxidation or
CVD

Done in a high temp furnace


manufactured??
Apply Photo-resist

Light resist material is applied
over wafer to allow desired
pattern to be burned into
wafer


manufactured??
Photo Resist is exposed
Reticle projects image of chip layout onto
wafer
Exposed photo-resist to Light
Photo-resist hardens as a result
As a result all are exposed to light has
crust while part that are not are still soft –
in accordance to desired pattern
Step to work through entire wafer (not
done at once due to focus of light)
Doping with ion implanter to create p and
n areas


manufactured??
Etch
Cut away unwanted material (soft
parts of resist not exposed to light)
Can be wet (acid bath) or dry(plasma)
Hardened resist will protect insulating
layer beneath keeping in intact by
design
Leaves desires pattern after harden
resist cleaned via ashing process
Now design in place ready to inter
connecting metal


manufactured??
Metal deposition
• Metal (aluminum and later copper )
will be added on top of insulting
layer which will be from
interconnects
• Added by deposition processes


manufactured??
Overall of Front End

Source: Semiconductor Device Fabrication Presentation lecture 11 05 May 2003
http://lpc1.clpccd.cc.ca.us/lpc/tswain/lect11.pdf


manufactured??
Test
First, several dozen basic measurements, called
parametric tests, are made on individual transistors
and other test structures in test patterns on the wafers.
This is the first check on proper fabrication.

The second test is a circuit function test. Each chip is
tested with a probe that has many tiny electrodes. A
computerized system performs many tests on the chip
and collects statistical data on the product. The test
system keeps a map of passed and failed die on every
wafer. Failed die are often marked with an ink dot or
“inked out.”
Source: Demystifying Chipmaking


manufactured??
Die Test and Wire Bonding
The good die are removed from the adhesive and attached
to a chip package. The dual inline package is the most
common and contains a lead frame to which the chip is
attached. The lead frame is a mounting that has the
appropriate number and configuration of contacts or “leads”
to attach to other electrical devices, circuit boards and the
like.

The chip itself is attached to the lead frame using
special solder such as goldgermanium alloy or epoxy.
Then the tiny gold or aluminum wires that connect to
the bonding pads on the chip are attached using special
techniques that do not damage the pads.
Source: Demystfying Chipmaking


manufactured??
Cut/Dicing
The chips on the wafer are
separated with a diamond saw to
form individual integrated circuits

Quality assurance; test series



manufactured??
Packaging
Encapsulation is the process of putting the chips
into protective packages. Many packages are
available for chips.

The intended use of the part is key in deciding
how to encapsulate it. Military hardware is
exposed to harsh environments so tough
packaging is used.

Simple plastic packages, such as the dual inline
package, suffice for many chips. Metal, ceramic
and composite packaging material are all used.

Moved on to Brooks Instrument,
Formerly a division of Emerson
Process Management as an
Technical Response Center
Manager
June 2003

© Tony Green 2011
Brooks Instrument

What are the Emerson Groups?

© Tony Green 2011
Brooks Instrument

What are the some of the Emerson Brands?
Perhaps you have worked with one of them…

© Tony Green 2011
Brooks Instrument

What does Brooks Instrument do?
“In industries as diverse as bio
pharmaceuticals, oil and gas, fuel cell, solar,
chemicals, medical devices, analytical
instrumentation, and semiconductors, Brooks
provides the broadest array of flow products
in the market”

I worked with mass flow devices

Source: http://www.brooksinstrument.com/brooks-
overview.html
http://www.tonygreen.name Brooks Instrument
© Tony Green 2011

What is a Technical Response
Center Manager?

Manager of the operation of
Overseer of all aspects of
the Fremont Response
local staffing to ensure
Center
effective, accurate
inventory management
and order processing to
Provider to customers and meet customer
local sales staff of product demands for rapid
application support turnaround product
throughout the entire sales availability.
process.

© Tony Green 2011 Brooks Instrument

What about Mass flow?……
The processes used to manufacture high
technical products such an integrated chips used
in everyday life involve chemical reactions.
These reactions require that the mass be tracked
in order measure and control the flow of
material.
Since Mass flow is independent of material,
temperature, and pressure and is useful for
measure the component of a reaction.
Mass Flow Controller technology is typically
utilized whenever the precise delivery of material
is required when a reaction is needed

© Tony Green 2011

What is Mass Flow controller?……
A mass flow controller is a device used to
measure and control the flow of gasses.
A mass flow controller is designed and
calibrated to control a specific type of gas at
a particular range of flow rates and inlet and
outlet pressures.
The mass flow controller can be given a set-
point from 0 to 100% of its full scale range
but is typically operated in the 10 to 90% of
full scale.
MFCs can controlled be either analog(in up
DC voltage or digital (serial communication).

© Tony Green 2011

What is Mass Flow inside a
controller?(Schematic)……
Communication port if Input AC
digital /DC Power

Amplifier

Wheatstone 0-5 VDC
Bridge Output
IC Board

Solenoid
Valve
Sensor Heater
Coil
Flow In Flow Out

ByPass Orifice

© Tony Green 2011

What is Mass Flow inside a
controller?(Valve)……
Valve body

Compression O ring

Spring

Small Spring

Core

Large Spring

Valve Seat

Valve O ring

Orifice

Orifice o ring

Block

© Tony Green 2011

What is a Gas Box?……
Gas delivery systems control the flow, pressure,
sequencing and mixing of specialty gases into and out
of the reaction chambers of semiconductor
manufacturing tools

A typical gas delivery system consists of one or more
gas lines, comprised of several filters, mass flow
controllers, regulators, pressure transducers and valves,
associated interconnect tubing and an integrated
electronic and/or pneumatic control system.

These systems are mounted on a pallet and are
typically enclosed in a sheet metal encasing. Many gas
delivery system designs are developed in collaboration
with end users are customized to meet the needs of
specific OEMs.

Source: Ultra Clean Technology 2009
10-K

© Tony Green 2011

What types of equipment use Gas
Boxes?……
Semiconductor equipment that flows gasses
for processes required to make chips

CVD

Etch

Ashing

PVD

© Tony Green 2011

What is a representation of a Gas
Box?……

Gas 1

Gas 2

Gas 3

Gas 4

Purge

Legend
MFC Regulator
Filter Manual Valve

© Tony Green 2011

What some of these processes?
Depositing of metal(interconnect) , oxide
(insulator), nitride (barrier)

Etch photo-resist

Ashing photo-resist

Adding epitaxial layer

Thermal oxidation

© Tony Green 2011

What does Mass Flow have to do with
Semiconductors?
Gas Name Category Gas Name Category Gas Name Category
He Helium Inert N2O Nitrous Oxide Inert Si2H6 Disilane Inert
Ne Neon Inert CH4 Methane Toxic/Corr SF6 Sulfur Hexafluoride Inert
Ar Argon Inert NH3 Ammonia Toxic/Corr C2F6 Hexafluoroethane (Freon-116)nert
I
Xe Xenon Inert PH3 Phosphine Toxic/Corr WF6 Tungsten Hexafluoride Toxic/Corr
H2 Hydrogen Toxic/Corr CH3F Methyl Fluoride Toxic/Corr C3F8 Perfluoropropane Inert
CO Carbon Monoxide Toxic/Corr C2H4 Ethylene Inert C4F8 Octafluorocyclobutane Inert
HBr Hydrogen Bromide Toxic/Corr SiH4 Silane Toxic/Corr SiHCl3 Trichlorosilane Toxic/Corr
HCl Hydrogen Chloride Toxic/Corr GeH4 Germane Toxic/Corr C2H2F4 Tetrafluoroethane Inert
N2 Nitrogen Inert CHF3 Fluoroform (Freon-23) Inert CH2F2 Difluoromethane Toxic/Corr
O2 Oxygen Inert NF3 Nitrogen Trifluoride Toxic/Corr (CH3)3SiHTrimethylsilane (TMSi) Toxic/Corr
NO Nitric Oxide Toxic/Corr C2H6 Ethane Toxic/Corr C5F8 Octafluorocyclopentene Inert
HI Hydrogen Iodide Toxic/Corr B2H6 Diborane Toxic/Corr C4F6 Hexafluoro-2-butyne Toxic/Corr
F2 Fluorine Toxic/Corr CF4 Carbon Tetrafluoride (Freon-14)
Inert C4F6-q Hexafluoro Butadiene-1,3 Toxic/Corr
Cl2 Chlorine Toxic/Corr SiH2Cl2 Dichlorosilane Toxic/Corr C3H6 Cyclopropane Toxic/Corr
H2S Hydrogen Sulfide Toxic/Corr BCl3 Boron Trichloride Toxic/Corr O3 Ozone Toxic/Corr
CO2 Carbon Dioxide Toxic/Corr SiF4 Silicon Tetrafluoride Toxic/Corr

The Gasses used in Wafer Processing need to controlled
and measured accurately!!! MFC’s allow this to happen
Source: Brooks Instrument Semiconductor Training presentation

© Tony Green 2011

Crowning achievement
Key Performance Indicators(KPI)
measures
Question: what is the FRC here to do?
Production, rapid turn MFC, to run a efficient
operation, support of critical semi OEM and
Integrators
What measure will tell us if we are
meeting that goal?


“Those who fail to plan, plan to fail” -
Proverb
KPI inform and guide the business process.

They give you a rational method, based on objective
data and results, for making business decisions

You first set the goals then establish how you
measure the progress towards those Goals

Thus you will be able to answer the question: What
is working? and What needs to be changed?

Source: Key Performance Indicator (KPIs) for Search Engine Marketing by Andrea Ramos and
Roslyn Layton of Axicom {Chapter from Search Engine Marketing}


Question: what is the FRC here to do?
Production, rapid turn MFC, to run a efficient
operation, support of critical semi OEM and
Integrators

What measure will tell us if we are meeting
that goal?


After much discussion the flowing five
KPI’s were selected for the Fremont
Response Center
Chosen Key Performance Indicators(KPI)
were

1. On time delivery - 80%
2. Critical Repairs within 1 day
3. Inventory counts – 90 % accurate
4. Inventory accurately - 100% goal
5. Turnaround time – 1 day

How do we do?

Crowning achievement/On Time
Delivery
Fremont Response Center On-Time Delivery

100 30

90
25

Number of Service Orders
80
On-Time Percentage

70 On Time Percentage
20
60
50 15 Number of Service Orders

40
10
30

20
5
10
0 0

Month

On average we were at 80% or higher


Crowning achievement/Inventory
Accuracy
Fremont Response Center Inventory Accuracy

90 80
80 70
70

Number of counts
Percent Accurate

60
60
50 Accurate Count Percentage
50
40
40
30 Number of Counts
30
20 20

10 10
0 0

Month

We had some work to do on this one…..


Crowning achievement/Critical
Account
FRC Critical Account Response

100 16
98 14
Percentage On-time

96

Number of orders
12
94
92 10
90 8
88 On Time Percentage
6
86 Number of Service Orders
4
84
82 2
80 0

Month

August was a tough month but after that the team
stepped up….


Crowning achievement/Turnaround
Time
Fremont Response Center Turnaround Time

9 30
8

Number of Service Orders
25
7
Average Days

6 20
5
15 Average Days Number of Service Orders
4
3 10
2
5
1
0 0

Month

As a service manager Turnaround time can never be
fast enough….

Crowning achievement/Invoicing
Fremont Response Center Invoicing within 1 Day

80 30

Numbers of Service Orders
70
Percentage with 1 day

25
60
20
50 Invoicing within a day One Day Percentage

40 15
Invoicing within a day Number of Service
30 orders
10
20
5
10

0 0

Month

From this plot we could have invoiced a bit faster


In the sprit of always improving
my self I went back to school….

I became a Phoenix!
Completed
M.B.A. Technology
Management
2003 - 2005
© Tony Green 2011 Phoenix

Technology Management is….
Technology Management is a set of management
disciplines that allows organizations to manage
its technological fundamentals to create
competitive advantage.
Typical concepts used in technology management
are:
technology strategy (a logic or role of technology in
organization)
technology mapping (identification of possible relevant
technologies for the organization)
technology road-mapping (a limited set of technologies
suitable for business)
technology project portfolio (a set of projects under
development) and
technology portfolio (a set of technologies in use).

Source: Wikipedia.com


Coursework - Traditional

What is in a traditional MBA
program?
Finance, Marketing, Accounting, Operations,
Statistics, Economics, Human Relations,
Business Law

Photos courtesy of dreamstime.com


Course – Non-Traditional
Non-
Technology Management Focus
R&D and Innovation
Project Management
E –Commerce
Capstone Project
Introduction to Information
Systems
Strategy Formulation Photo courtesy of dreamstime.com

Technology Transfer
Now what did our Capstone
Project entail?

Capstone project - Overall

GOTV: PROJECT
EXPANSION
THE DELIVERY OF
ENTERTAINMENT TO TRANSPORTATION
PRESENTED BY: TEAM MBA INC.

SHANNON CARTER PROCESS MANAGER
BARRY CHIARELLO PROJECT MANAGER
TONY GREEN ENGINEERING MANAGER
MARK REIBOLDT INFRASTRUCTURE MANAGER
JOHN PETERNEL DISTRIBUTION MANAGER
THOMAS ZIER TARGET MANAGER


Capstone project - highlights
The GoTV ‘s vision was to provide cutting edge media
entertainment products for mobile applications. GoTV
provided “on-the-go” consumers with an unmatched
transportable video-viewing experience with the best
performance and best value available.
GoTV’s proprietary service platform delivered entertainment
to mobile devices; particularly automobiles, trains, and
planes, and stores this content to make it available to the
consumer on their demand.

Source of photo: TEAM MBA
capstone project paper


Capstone project – highlights
(Continued)
GoTV has developed a proprietary set of video codecs,
scheduling algorithms, storage and playback applications,
and antenna technology that leverage existing
infrastructures and technologies. Existing technologies
include TV broadcast, WiFi, mobile telephony and satellite
media. GoTV cooperates and interoperates with established
infrastructure, manufacturing and distribution players

Source of photo: TEAM MBA
capstone project paper


Capstone project - Business Model

The GoTV distribution business model
addresses three principle topics: focus,
customers, and goals.

The GoTV sales team is made up of two sales
channels: pre-production sales (PS), and
distribution sales (DS).


Capstone project - Business
Model(Continued)

Revenue Streams

Revenues from service agreements for the
user equipment
Usage agreements for the GoTV service
New Product Sales, Pay-Per View, and
Advertising


With my Technology
Management studies
completed it was time to
apply these concepts to the
real world.

Here are my three favorite
concepts out of the
technology management
toolbox…

Coined by the
The Hype Cycle Gartner Group

It suggests that our
modern approach to
marketing
technology results in
the technology being
over hyped in the
early stages of
growth.

www.slideshare.net/.../gartner-hype-cycle-emerging-
technologies-2010 Give examples:
Dot.com boom then
bust

The Technology Adoption Life Cycle
Introduced in Geoffery’s Moore
book Crossing the Chasm

As far as I am concerned this is
the high technology marketing
bible

Difference from typical life cycle
due to presence of a “chasm” in
the early adopter
stage which must be crossed if
http://en.wikipedia.org/wiki/Crossing_the_Chasm
mainstream acceptance of a
product is going to occur

Current examples: alternative
energy as a whole


Bass Diffusion Developed by Frank
Bass in 1969

It describes the process
of how new products
get adopted as an
interaction between
users(Imitators) and
potential users
(Innovators)

Example: adoption of
http://en.wikipedia.org/wiki/Bass_diffusion
Mobile phones and more
_model recently on line social
networks


Opportunity as Sales and
Marketing as Manager at Nagase
America
in June 2008

Tasking : to penetrate North
American market with our Epoxy
products in Automotive, Heavy
Electric and wind turbine blades

© Tony Green 2011
Nagase

What were my responsibilities as a
Sales and Marketing manager?
Built new business by searching new
business seeds; by selecting and
contacting potential
suppliers/customers to determine their
needs, make persuasive business
discussion about our products and
services; and by focusing on the
activities required to close deals.
© Tony Green 2011
Nagase

Automotive Tier One Structure
OEM/System

Tier I/Sub-
System

Tier II/
Component

Source: Automotive Electrical and
Electromechanical System Design presentation by Ansoft Corporation

© Tony Green 2011
Nagase

NAGASE AMERICA
Activity in Automotive Hybrid/Electric Vehicles
HEV
Flex Fuel Power Air-Flow
Sensor
IGBT Battery Condenser
Module Sensor
Packs

Power-
Wind Alternator
Motor

Ignition
Transmission

Clutch
Air
Pressure
Power ECU
Sensor Battery(Lit Airbag Power
Stirring (Engine
hium Ion) Sensor Distributor Control Unit)
Motor

© Tony Green 2011 Nagase

Overview of Electric Transmission
Power Generation Transmission Distribution Additional Distribution End User
125- 765 KV ~ 69 KV 7.2 KV-13.8 KV 110/220 V

Wind

Commercial
Nuclear

Power Distribution
Oil/Coal Distribution Industrial
Substatio points/Trans
Substation formers
n
Solar
Residential

Geotherm
al

Switc GIS CT/P Bush Insul
hgear T ings ators

© Tony Green 2011
Nagase

Wind Turbines Blade/Molding Assembly
A wind turbine blade is typically manufactured as follows:
A mold made form Epoxy is used to create the
top and bottom portion of the blades

A wind turbine blade is formed of a fiberglass
reinforced
material that is comprised of a carbon or
glass or carbon fiber and an epoxy resin

Once cured two portions of the blade and bonded together
using an adhesive

© Tony Green 2011
Nagase

Wind Turbines Blade/Molding
Nagase currently works with our customers to:

Providing the epoxy resin that forms the
Fiberglass Reinforced Plastic (FRP)

-AND-

The molds that are used to create the pieces that are
bonded together to produce wind turbine blades

Using a variety of processes including:
Hand Wet Lay-up and vacuum infusion


As of the end of 2009 the Wind Turbine manufacturers by installed capacity
in the United States were listed below: (35169 MW) Acciona
AOC
Installed Capacity in MW Atlantic Orient Co.
AWE
Bergey Windpower
Clipper
Clipper Windpower
Danwin
DES
DeWind
EMS
Enertech
Entegrity
Fuhrlander
Gamesa
GE Energy
Howden
Integrity Wind Systems
Jacobs
Mitsubishi
Nedwind
NEG Micon
Nordex
Nordtank
Nordtank 65
Northern Power Systems
refurbished Nordtanks
REPower
Siemens
Silver Eagle
Suzlon
Tacke
Unspecified
Vanguard Windmatic
Various
Vestas
Wind Turbine Co.
Windmaster
Windmatic
Source: AWEA Website WindWorld

© Tony Green 2011
Nagase

NAGASE AMERICA

What does this mean?

To make a long story short GE
Energy holds the lion’s share with over
40% of the capacity followed by
Mitsubishi, Vestas, and Siemens.

The top 4 have over 80% of the total
capacity installed.

© Tony Green 2011
Nagase

NAGASE AMERICA
Now a look at lithium, what is the big deal
with lithium?

For starters Lithium is:

1. The lightest of all materials
Name: Lithium
Symbol: Li
2. High electrochemical potential Atomic Number: 3
Atomic Mass: 6.941 amu
Melting Point: 180.54 ° (453.69 °
C K,
356.972 °F)
3. High Thermodynamic Voltage Boiling Point: 1347.0 ° (1620.15 °
C K,
2456.6 °
F)

4. Largest Energy density for weight Source: CRC Handbook of
Chemistry and Physics

5. A cell voltage of 3.6 Volts(highest of all types)


NAGASE AMERICA
What about Lithium ion batteries that has
made them a household name?
High Energy Density

Low Maintenance

High Specific Power

High specific energy Drawing courtesy of “LiFePO4 for a Large Sized
Lithium Secondary Battery” Dated
2006. 12. 12

Ideal for very high current applications


NAGASE AMERICA
What about Lithium ion batteries? Just who
are making these?
Millions of Lithium Ion Battery Cells Shipped
800

700

600

500

400

300

200

100

0

LiB Manufacturer by Year

2007 2008 2009

Source: IIT LIB Related Study Program 08-09 Chapter 1 LIB Related Market bulletin http://wenku.baidu.com/view/188e7d1810a6f524ccbf8561.html


NAGASE AMERICA
And what applications are they being used
for?
1600
Millions of Lithium Ion Batteries Cells shipped
1400

NBPC Notebook/Personal Computer
1200
Cell Cellular/Mobile Phones
PT Power Tools
1000
DSC Digital Cameras
CAM Camcorders/Video Cameras
800
DMP Digital Music Players

600 Game Game Consoles

400

200

0
NBPC Cell PT DSC CAM DMP Game Other

LiB use by Application by Year
2007 2008 2009

Source: IIT LIB Related Study Program 08-09 Chapter 1 LIB Related Market bulletin http://wenku.baidu.com/view/188e7d1810a6f524ccbf8561.html

© Tony Green 2011
Nagase

NAGASE AMERICA
If you are wondering why there Automotive
is not listed as an application for lithium ion
batteries that is my point. It would be
covered in others but currently the
numbers are very small which will change if
EV, PHEV, HEV’s to gain large scale global
adoption!!

Source: Tony Green’s Personal Photos

And last but not lest of course there were trade shows to attend in order to
get out and meet Prospective customers…. Here is an example of a booth
I did…

Source: Tony Green’s Personal Photos

© Tony Green 2011
Nagase

Who am I??
Husband
Ex Submariner
M.B.A. educated Father
Engineering knowledge Ex Navy Nuke

Professional Certified
Marketer P.C.M.
Inbound Marketing
Navy veteran Certified Professional (IMCP)

Chemical trained
© Tony Green 2011 Summary

How can this help you?
Are you seeking someone with
background in the following
industries?
Contract Manufacturing
Electronics
Chemicals
Marketing/Sales,
Alternative Energy
High Technology
Tony Green

NAGASE AMERICA
Let me hear for you. Contact
me!!!!!!!

Other websites: http://www.ExNavyNuke.com
Personal Blog:
http://www.markanthonygreen.blogspot.com
Other blogs:
http://www.exanavynuke.blogspot.com
http://www.greenpowerresearch.com


Tony Green professional presentation 03122011 draft

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Tony Green professional presentation 03122011 draft