SlideShare une entreprise Scribd logo
1  sur  28
SOFICS © 2020 Proprietary & Confidential 1
BENJAMIN VAN CAMP -SOFICS
OPTIMIZING I/O’S AND ESD PROTECTION TO REDUCE
POWER CONSUMPTION IN SOI APPLICATIONS
D&R IP-SOC DAYS
An IC through the eyes of an ESD engineer
SOFICS © 2020 Proprietary & Confidential 2
GND
VDD
Output Input
I/O ESD architectures
SOFICS © 2020 Proprietary & Confidential 3
Leakage I/O to GND
Leakage I/O to VDD
Leakage VDD to GND
VDD
GND
I/O
I/O ESD architectures
SOFICS © 2020 Proprietary & Confidential 4
…
Leakage I/O to GND
Leakage I/O to VDD
Leakage VDD to GND
VDD
GND
I/O
VDD
GND
I/O
VDD
GND
I/O
VDD
GND
I/O
Dual diode Protection
SOFICS © 2020 Proprietary & Confidential 5
• ESD protection implications
– Simplest architecture
– For large design windows
• Signal voltage implications
– VI/O > GND - 0.3V
– VI/O < VDD + 0.3V
• Leakage
– I/O - > GND: Through reverse junction of diode
– I/O - > VDD: Through reverse junction of diode
– VDD -> GND: Determined by power clamp
VDD
GND
I/O
Leakage
I/O to GND
Leakage
I/O to VDD
Leakage
VDD to GND
Diode Cross Sections
SOFICS © 2020 Proprietary & Confidential 6
Bulk SOI
STI diode
Gated Diode
Diode characteristics
SOFICS © 2020 Proprietary & Confidential 7
• Current capability:
– Forward: 20-50mA/um
– Reverse: 0.5mA/um
• Parasitics
– PNP to substrate
– Diode from substrate to cathode
• Current capability:
– Forward: 5-10mA/um
– Reverse: 0.2mA/um
• No Parasitics
Bulk SOI
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0 1 2 3 4 5
Voltage [V]
Current [A]
Diode measurements
SOFICS © 2020 Proprietary & Confidential 8
65nm SOI
Diode perimeter: 80um
~9-10mA/um
0
0.5
1
1.5
2
2.5
3
3.5
0 0.5 1 1.5 2 2.5 3
Voltage [V]
Current [A]
65nm Bulk
Diode perimeter: 92um
~33mA/um
Diode – Reverse Leakage
SOFICS © 2020 Proprietary & Confidential 9
• Reverse diode are low leakage
– Measured in 65nm bulk
– Similar for all technologies
• Leakage @ 1.8V
– ~10pA for 25°C
– ~200pA for 125°C
10
-12
10
-10
10
-8
10
-6
10
-4
0 2 4 6 8 10 12 14 16
Voltage [V]
Current [A]
25°C
125°C Thermochuck
induced noise
1.8V
I/O ESD architectures
SOFICS © 2020 Proprietary & Confidential 10
…
Leakage I/O to GND
Leakage I/O to VDD
Leakage VDD to GND
VDD
GND
I/O
VDD
GND
I/O
VDD
GND
I/O
VDD
GND
I/O
Secondary Protection
SOFICS © 2020 Proprietary & Confidential 11
• ESD protection implications
– Simple architecture
 Diodes take most of ESD current
 Secondary protection limits voltage
– Secondary protection can be small
– For smaller design windows
– CDM sensitive pins
• Signal voltage implications
– VI/O > GND - 0.3V
– VI/O < VDD + 0.3V
Leakage
I/O to GND
Leakage
I/O to VDD
VDD
GND
I/O
Leakage
VDD to GND
Secondary Protection
SOFICS © 2020 Proprietary & Confidential 12
• Leakage
1. I/O - > GND:
 Path 1: Through reverse junction of diode
 Path 2: Through Secondary clamp
-> Assume small ggNMOS
2. I/O - > VDD:
 Path 1: Through reverse junction of diode
 Path 2: Through Secondary clamp
-> Assume small ggNMOS
3. VDD -> GND: Determined by power clamp
 + Sum of secondary clamps  Typically
negligible
Leakage
I/O to GND
Leakage
I/O to VDD
Leakage
VDD to GND
VDD
GND
I/O
NMOS in Snapback – one slide explanation
SOFICS © 2020 Proprietary & Confidential 13
1. Gate Grounded
– Voltage increases
– No current flow
2. Breakdown voltage drain-substrate reached
– Avalanching at drain
– Small current flow from drain to GND
3. Voltage built up over substrate resistance
– Substrate- Source reaches 0.7V
– NPN turns on
– Avalanching voltage lowered
 Snapback
I
V
I
V
I
V
1
2
3
NMOS in bulk technology – cross section
SOFICS © 2020 Proprietary & Confidential 14
• NMOS in bulk technology has a shared p-substrate
– Large volume for Heat dissipation
– This shared p-substrate will help to trigger all the fingers
SOI MOS
SOFICS © 2020 Proprietary & Confidential slide 15
• SOI MOS
– Less volume for heat dissipation
– Body regions are isolated  No body coupling between fingers
A
A’
GGNMOS Measurements
SOFICS © 2020 Proprietary & Confidential slide 16
0
0.5
1
1.5
2
2.5
0 1 2 3 4 5 6
current [A]
voltage [V]
90nm bulk process
It2 ~ 6 mA/um
• Bulk NMOS much higher It2
– Bulk: 5-10 mA/um
– SOI: 1-3 mA/um
• Voltages comparable
– SOI devices slightly lower trigger and holding voltage
0
0.5
1
1.5
2
2.5
0 0.5 1 1.5 2 2.5 3 3.5 4
current [A]
voltage [V]
90nm SOI process
It2 ~ 2.4 mA/um
SOI MOS devices - Degradation
SOFICS © 2020 Proprietary & Confidential 17
• Often degradation is seen
– Don’t use these devices Factor 10
ESD SOI MOS
Seen in many MOS
devices in SOI
SOI MOS Variation
SOFICS © 2020 Proprietary & Confidential 18
130nm SOI
Foundry ESD Solution
Measured over
multiple samples
Leakage ~few nA
or lower
I/O ESD architectures
SOFICS © 2020 Proprietary & Confidential 19
…
Leakage I/O to GND
Leakage I/O to VDD
Leakage VDD to GND
VDD
GND
I/O
VDD
GND
I/O
VDD
GND
I/O
VDD
GND
I/O
I/O signal conditions
SOFICS © 2020 Proprietary & Confidential 20
• ESD protection implications
– Local Clamp required
 Takes all of ESD current
 Needs to limit voltage
– Local clamp large
– For smallest design windows
– CDM sensitive pins
• Local clamp options
– ggNMOS
– SCR
Leakage
I/O to GND
Leakage
I/O to VDD Leakage
VDD to GND
VDD
GND
I/O
I/O signal conditions
SOFICS © 2020 Proprietary & Confidential 21
• Conditions that require (semi) local protection
– VI/O > VDD + 0.3V
– Supply can be powered down
 Energy Saving mode
 Cold Spare
– CMRR: no I/O – VDD capacitance allowed
• Leakage
1. I/O - > GND:
 Path 1: Through reverse junction of diode
 Path 2: Through local clamp
2. I/O - > VDD: None
3. VDD -> GND: Determined by power clamp
Leakage
I/O to GND
Leakage
I/O to VDD Leakage
VDD to GND
VDD
GND
I/O
Protection Device Example (1/3) – 1.2V in 90nm SOI
Proprietary & Confidential -- Sarnoff © 2005 slide 22
0
0.5
1
1.5
2
0 1 2 3 4 5 6 7
10
-12
10
-11
10
-10
10
-9
10
-8
10
-7
10
-6
voltage [V]
leakage current [A] @ 1.32V
current[A]
W=8x30um
Vt1 = 3.2V
• SCR based power clamp in SOI
– Vhold = 2V
– Vmax = 6.4V
– Imax=7.5 mA/um
– Ron = 586.7 Ohm.um
• Leakage ~ 0.5nA/um @ 25°C
Protection Device Example (2/3) - 22nm SOI
SOFICS © 2020 Proprietary & Confidential 23
• SCR Based clamps for different domains
1.2V-1.8V – 125°C
0.8V - 125°C
0.8V – 25°C
1.2V-1.8V –25°C
Leakage
ESD performance
Protection Device Example (3/3) - 3.3V in 130nm SOI
SOFICS © 2020 Proprietary & Confidential 24
• Specialized ggNMOS based clamp
– To lower leakage
– To avoid variation
11nA, FF, 125°C
200pA, TT, 25°C
same process
I/O ESD architectures
SOFICS © 2020 Proprietary & Confidential 25
…
Leakage I/O to GND
Leakage I/O to VDD
Leakage
VDD to GND
VDD
GND
I/O
VDD
GND
I/O
VDD
GND
I/O
VDD
GND
I/O
Power protection - Leakage
SOFICS © 2020 Proprietary & Confidential 26
• Choice of power clamp is important
– Dependent on leakage/power specifications
– Dependent on power up/down strategy
– Dependent on temperature range
22nm SOI
Clamp type 25°C 125°C
0.8V Rail clamp 80nA 6uA
1.8V Rail clamp 100nA uA
0.8V SCR based <0.5nA 20nA
1.8V SCR based <0.5nA 20nA
0.8V ggNMOS 2nA
1.8V ggNMOS 10nA
Leakage
VDD to GND
VDD
GND
I/O
Conclusion - Leakage
SOFICS © 2020 Proprietary & Confidential 27
• I/O to GND
– Low leakage
• I/O to VDD
– Low leakage IF
Vsignal < VDD at all times
• VDD to I/O
– Depends on power clamp
– < 1nA @ RT possible
• I/O to GND
– Depends on local clamp
– < 1nA @ RT possible
• I/O to VDD
– Low leakage IF
Vsignal < VDD at all times
• VDD to I/O
– Depends on power clamp
– < 1nA @ RT possible
• I/O to GND
– Depends on local clamp
– < 1nA @ RT possible
• I/O to VDD
– Low leakage IF
Vsignal < VDD at all times
• VDD to I/O
– Depends on power clamp
– < 1nA @ RT possible
VDD
GND
I/O
VDD
GND
I/O
VDD
GND
I/O
Contact us
SOFICS © 2019 Proprietary & Confidential 28
• Sofics contact
Koen Verhaege
Benjamin Van Camp
Bart Keppens
info@sofics.com
engineering office
Sint-Godelievestraat 32
9880 Aalter, Belgium

Contenu connexe

Tendances

IC Design of Power Management Circuits (II)
IC Design of Power Management Circuits (II)IC Design of Power Management Circuits (II)
IC Design of Power Management Circuits (II)
Claudia Sin
 

Tendances (20)

io-esd
io-esdio-esd
io-esd
 
Second order effects
Second order effectsSecond order effects
Second order effects
 
SCR based On-chip ESD protection for LNA
SCR based On-chip ESD protection for LNASCR based On-chip ESD protection for LNA
SCR based On-chip ESD protection for LNA
 
IC Design of Power Management Circuits (II)
IC Design of Power Management Circuits (II)IC Design of Power Management Circuits (II)
IC Design of Power Management Circuits (II)
 
Introduction to FINFET, Details of FinFET
Introduction to FINFET, Details of FinFETIntroduction to FINFET, Details of FinFET
Introduction to FINFET, Details of FinFET
 
Unit5 power devices and display devices class9
Unit5 power devices and display devices class9Unit5 power devices and display devices class9
Unit5 power devices and display devices class9
 
VLSI Technology Trends
VLSI Technology TrendsVLSI Technology Trends
VLSI Technology Trends
 
20EC602 VLSI Design.ppt
20EC602 VLSI Design.ppt20EC602 VLSI Design.ppt
20EC602 VLSI Design.ppt
 
White paper on ESD protection for 40nm/28nm
White paper on ESD protection for 40nm/28nmWhite paper on ESD protection for 40nm/28nm
White paper on ESD protection for 40nm/28nm
 
Analog vlsi
Analog vlsiAnalog vlsi
Analog vlsi
 
Layout02 (1)
Layout02 (1)Layout02 (1)
Layout02 (1)
 
Nanometer layout handbook at high speed design
Nanometer layout handbook at high speed designNanometer layout handbook at high speed design
Nanometer layout handbook at high speed design
 
Finfet Technology
Finfet TechnologyFinfet Technology
Finfet Technology
 
Layouts
LayoutsLayouts
Layouts
 
SPICE Compatible Models for Circuit Simulation of ESD Events
SPICE Compatible Models for Circuit Simulation of ESD EventsSPICE Compatible Models for Circuit Simulation of ESD Events
SPICE Compatible Models for Circuit Simulation of ESD Events
 
1.2V Analog I/O with full local ESD protection for TSMC 65nm technology
1.2V Analog I/O with full local ESD protection for TSMC 65nm technology1.2V Analog I/O with full local ESD protection for TSMC 65nm technology
1.2V Analog I/O with full local ESD protection for TSMC 65nm technology
 
Pass Transistor Logic
Pass Transistor LogicPass Transistor Logic
Pass Transistor Logic
 
Cmos fabrication
Cmos fabricationCmos fabrication
Cmos fabrication
 
Introduction to VLSI Technology
Introduction to VLSI TechnologyIntroduction to VLSI Technology
Introduction to VLSI Technology
 
CMOS LOGIC STRUCTURES
CMOS LOGIC STRUCTURESCMOS LOGIC STRUCTURES
CMOS LOGIC STRUCTURES
 

Similaire à Optimizing I/O’s and ESD protection to reduce power consumption in SOI applications

Datasheet sensor temperatura mcp9700
Datasheet sensor temperatura mcp9700Datasheet sensor temperatura mcp9700
Datasheet sensor temperatura mcp9700
ADELIUS
 
Lect2 up080 (100324)
Lect2 up080 (100324)Lect2 up080 (100324)
Lect2 up080 (100324)
aicdesign
 

Similaire à Optimizing I/O’s and ESD protection to reduce power consumption in SOI applications (20)

Sofics Linkedin
Sofics LinkedinSofics Linkedin
Sofics Linkedin
 
Introduction to TakeCharge on-chip ESD solutions from Sofics
Introduction to TakeCharge on-chip ESD solutions from SoficsIntroduction to TakeCharge on-chip ESD solutions from Sofics
Introduction to TakeCharge on-chip ESD solutions from Sofics
 
Tsmc65 1v2 full local protection analog io + cdm
Tsmc65 1v2 full local protection analog io + cdmTsmc65 1v2 full local protection analog io + cdm
Tsmc65 1v2 full local protection analog io + cdm
 
1.2V core power clamp for TSMC 65nm technology
1.2V core power clamp for TSMC 65nm technology1.2V core power clamp for TSMC 65nm technology
1.2V core power clamp for TSMC 65nm technology
 
1.2V Over-voltage tolerant Analog I/O for TSMC 65nm technology
1.2V Over-voltage tolerant Analog I/O for TSMC 65nm technology1.2V Over-voltage tolerant Analog I/O for TSMC 65nm technology
1.2V Over-voltage tolerant Analog I/O for TSMC 65nm technology
 
Atomic Layer Deposition solutions for SiC Power Electronics
Atomic Layer Deposition solutions for SiC Power ElectronicsAtomic Layer Deposition solutions for SiC Power Electronics
Atomic Layer Deposition solutions for SiC Power Electronics
 
Galvanic isolation & Triad Semiconductor Mixed-Signal ASIC Solutions
Galvanic isolation & Triad Semiconductor Mixed-Signal ASIC SolutionsGalvanic isolation & Triad Semiconductor Mixed-Signal ASIC Solutions
Galvanic isolation & Triad Semiconductor Mixed-Signal ASIC Solutions
 
Al5809
Al5809Al5809
Al5809
 
8 inch TFT-LCD Datesheet, AUO, 800*1280, MIPI Interface
8 inch TFT-LCD Datesheet, AUO, 800*1280, MIPI Interface8 inch TFT-LCD Datesheet, AUO, 800*1280, MIPI Interface
8 inch TFT-LCD Datesheet, AUO, 800*1280, MIPI Interface
 
wiDom Double Smart Switch Z-Wave Module
wiDom Double Smart Switch Z-Wave ModulewiDom Double Smart Switch Z-Wave Module
wiDom Double Smart Switch Z-Wave Module
 
Av02 3563 en-ds_acpl-c87x_04mar2013-2
Av02 3563 en-ds_acpl-c87x_04mar2013-2Av02 3563 en-ds_acpl-c87x_04mar2013-2
Av02 3563 en-ds_acpl-c87x_04mar2013-2
 
Original Mosfet 4N90C FQP4N90C FQP4N90 900V 4A TO-220 New
Original Mosfet 4N90C FQP4N90C FQP4N90 900V 4A TO-220 NewOriginal Mosfet 4N90C FQP4N90C FQP4N90 900V 4A TO-220 New
Original Mosfet 4N90C FQP4N90C FQP4N90 900V 4A TO-220 New
 
ACS37800-Datasheet.pdf
ACS37800-Datasheet.pdfACS37800-Datasheet.pdf
ACS37800-Datasheet.pdf
 
IoT workshop - Is 1kV Also Enough for IoT ESD Protection – Do Current Test Me...
IoT workshop - Is 1kV Also Enough for IoT ESD Protection – Do Current Test Me...IoT workshop - Is 1kV Also Enough for IoT ESD Protection – Do Current Test Me...
IoT workshop - Is 1kV Also Enough for IoT ESD Protection – Do Current Test Me...
 
Datasheet sensor temperatura mcp9700
Datasheet sensor temperatura mcp9700Datasheet sensor temperatura mcp9700
Datasheet sensor temperatura mcp9700
 
Lect2 up080 (100324)
Lect2 up080 (100324)Lect2 up080 (100324)
Lect2 up080 (100324)
 
Cd4069 ubc
Cd4069 ubcCd4069 ubc
Cd4069 ubc
 
Thông số kĩ thuật siemens fuse 001
Thông số kĩ thuật siemens fuse 001Thông số kĩ thuật siemens fuse 001
Thông số kĩ thuật siemens fuse 001
 
sfp-1g-cwdm-1290nm-80km-transceiver-module-151042.pdf
sfp-1g-cwdm-1290nm-80km-transceiver-module-151042.pdfsfp-1g-cwdm-1290nm-80km-transceiver-module-151042.pdf
sfp-1g-cwdm-1290nm-80km-transceiver-module-151042.pdf
 
Widom smart double_switch_l_en
Widom smart double_switch_l_enWidom smart double_switch_l_en
Widom smart double_switch_l_en
 

Plus de Sofics

On-chip ESD protection for Silicon Photonics
On-chip ESD protection for Silicon PhotonicsOn-chip ESD protection for Silicon Photonics
On-chip ESD protection for Silicon Photonics
Sofics
 

Plus de Sofics (20)

1.2V Analog I/O library for TSMC 65nm technology
1.2V Analog I/O library for TSMC 65nm technology1.2V Analog I/O library for TSMC 65nm technology
1.2V Analog I/O library for TSMC 65nm technology
 
2010 The Hebistor Device: Novel latch-up immune ESD Protection Clamp for High...
2010 The Hebistor Device: Novel latch-up immune ESD Protection Clamp for High...2010 The Hebistor Device: Novel latch-up immune ESD Protection Clamp for High...
2010 The Hebistor Device: Novel latch-up immune ESD Protection Clamp for High...
 
2011 ESD relevant issues and solutions for overvoltage tolerant, hot swap, op...
2011 ESD relevant issues and solutions for overvoltage tolerant, hot swap, op...2011 ESD relevant issues and solutions for overvoltage tolerant, hot swap, op...
2011 ESD relevant issues and solutions for overvoltage tolerant, hot swap, op...
 
2011 Protection of a 3.3V Domain and Switchable 1.8V/3.3V I/O in 40nm and 28n...
2011 Protection of a 3.3V Domain and Switchable 1.8V/3.3V I/O in 40nm and 28n...2011 Protection of a 3.3V Domain and Switchable 1.8V/3.3V I/O in 40nm and 28n...
2011 Protection of a 3.3V Domain and Switchable 1.8V/3.3V I/O in 40nm and 28n...
 
2011 Latch-up immune ESD Protection Clamp for High Voltage optimized on TSMC ...
2011 Latch-up immune ESD Protection Clamp for High Voltage optimized on TSMC ...2011 Latch-up immune ESD Protection Clamp for High Voltage optimized on TSMC ...
2011 Latch-up immune ESD Protection Clamp for High Voltage optimized on TSMC ...
 
2012 The impact of a decade of Technology downscaling
2012 The impact of a decade of Technology downscaling2012 The impact of a decade of Technology downscaling
2012 The impact of a decade of Technology downscaling
 
2012 Protection strategy for EOS (IEC 61000-4-5)
2012 Protection strategy for EOS (IEC 61000-4-5)2012 Protection strategy for EOS (IEC 61000-4-5)
2012 Protection strategy for EOS (IEC 61000-4-5)
 
2012 Unexpected failures due to dynamic avalanching caused by bipolar ESD stress
2012 Unexpected failures due to dynamic avalanching caused by bipolar ESD stress2012 Unexpected failures due to dynamic avalanching caused by bipolar ESD stress
2012 Unexpected failures due to dynamic avalanching caused by bipolar ESD stress
 
2017 Low Capacitive Dual Bipolar ESD Protection
2017 Low Capacitive Dual Bipolar ESD Protection2017 Low Capacitive Dual Bipolar ESD Protection
2017 Low Capacitive Dual Bipolar ESD Protection
 
ESD protection with ultra-low parasitic capacitance for high bandwidth commun...
ESD protection with ultra-low parasitic capacitance for high bandwidth commun...ESD protection with ultra-low parasitic capacitance for high bandwidth commun...
ESD protection with ultra-low parasitic capacitance for high bandwidth commun...
 
On-Chip Solutions for ESD/EOS/Latch up/EMC
On-Chip Solutions for ESD/EOS/Latch up/EMCOn-Chip Solutions for ESD/EOS/Latch up/EMC
On-Chip Solutions for ESD/EOS/Latch up/EMC
 
Sofics ESD solutions for FinFET processes
Sofics ESD solutions for FinFET processesSofics ESD solutions for FinFET processes
Sofics ESD solutions for FinFET processes
 
Optimization of On-chip ESD protection with ultra-low parasitic capacitance t...
Optimization of On-chip ESD protection with ultra-low parasitic capacitance t...Optimization of On-chip ESD protection with ultra-low parasitic capacitance t...
Optimization of On-chip ESD protection with ultra-low parasitic capacitance t...
 
Developing robust, 5V tolerant analog I/O libraries for CMOS processes & FinF...
Developing robust, 5V tolerant analog I/O libraries for CMOS processes & FinF...Developing robust, 5V tolerant analog I/O libraries for CMOS processes & FinF...
Developing robust, 5V tolerant analog I/O libraries for CMOS processes & FinF...
 
On-chip ESD protection for Silicon Photonics
On-chip ESD protection for Silicon PhotonicsOn-chip ESD protection for Silicon Photonics
On-chip ESD protection for Silicon Photonics
 
On chip esd protection for Internet of Things
On chip esd protection for Internet of ThingsOn chip esd protection for Internet of Things
On chip esd protection for Internet of Things
 
On-Chip ESD Protection with Improved High Holding Current SCR (HHISCR) Achiev...
On-Chip ESD Protection with Improved High Holding Current SCR (HHISCR) Achiev...On-Chip ESD Protection with Improved High Holding Current SCR (HHISCR) Achiev...
On-Chip ESD Protection with Improved High Holding Current SCR (HHISCR) Achiev...
 
On-Chip ESD Protection Achieving 8kV HBM Without Compromising the 3.4Gbps HDM...
On-Chip ESD Protection Achieving 8kV HBM Without Compromising the 3.4Gbps HDM...On-Chip ESD Protection Achieving 8kV HBM Without Compromising the 3.4Gbps HDM...
On-Chip ESD Protection Achieving 8kV HBM Without Compromising the 3.4Gbps HDM...
 
Patented solution to improve ESD robustness of SOI MOS transistors
Patented solution to improve ESD robustness of SOI MOS transistorsPatented solution to improve ESD robustness of SOI MOS transistors
Patented solution to improve ESD robustness of SOI MOS transistors
 
Patented way to create Silicon Controlled Rectifiers in SOI technology
Patented way to create Silicon Controlled Rectifiers in SOI technology Patented way to create Silicon Controlled Rectifiers in SOI technology
Patented way to create Silicon Controlled Rectifiers in SOI technology
 

Dernier

scipt v1.pptxcxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx...
scipt v1.pptxcxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx...scipt v1.pptxcxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx...
scipt v1.pptxcxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx...
HenryBriggs2
 
Standard vs Custom Battery Packs - Decoding the Power Play
Standard vs Custom Battery Packs - Decoding the Power PlayStandard vs Custom Battery Packs - Decoding the Power Play
Standard vs Custom Battery Packs - Decoding the Power Play
Epec Engineered Technologies
 
Integrated Test Rig For HTFE-25 - Neometrix
Integrated Test Rig For HTFE-25 - NeometrixIntegrated Test Rig For HTFE-25 - Neometrix
Integrated Test Rig For HTFE-25 - Neometrix
Neometrix_Engineering_Pvt_Ltd
 

Dernier (20)

litvinenko_Henry_Intrusion_Hong-Kong_2024.pdf
litvinenko_Henry_Intrusion_Hong-Kong_2024.pdflitvinenko_Henry_Intrusion_Hong-Kong_2024.pdf
litvinenko_Henry_Intrusion_Hong-Kong_2024.pdf
 
Computer Networks Basics of Network Devices
Computer Networks  Basics of Network DevicesComputer Networks  Basics of Network Devices
Computer Networks Basics of Network Devices
 
Working Principle of Echo Sounder and Doppler Effect.pdf
Working Principle of Echo Sounder and Doppler Effect.pdfWorking Principle of Echo Sounder and Doppler Effect.pdf
Working Principle of Echo Sounder and Doppler Effect.pdf
 
Augmented Reality (AR) with Augin Software.pptx
Augmented Reality (AR) with Augin Software.pptxAugmented Reality (AR) with Augin Software.pptx
Augmented Reality (AR) with Augin Software.pptx
 
Path loss model, OKUMURA Model, Hata Model
Path loss model, OKUMURA Model, Hata ModelPath loss model, OKUMURA Model, Hata Model
Path loss model, OKUMURA Model, Hata Model
 
scipt v1.pptxcxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx...
scipt v1.pptxcxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx...scipt v1.pptxcxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx...
scipt v1.pptxcxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx...
 
Call for Papers - Journal of Electrical Systems (JES), E-ISSN: 1112-5209, ind...
Call for Papers - Journal of Electrical Systems (JES), E-ISSN: 1112-5209, ind...Call for Papers - Journal of Electrical Systems (JES), E-ISSN: 1112-5209, ind...
Call for Papers - Journal of Electrical Systems (JES), E-ISSN: 1112-5209, ind...
 
HOA1&2 - Module 3 - PREHISTORCI ARCHITECTURE OF KERALA.pptx
HOA1&2 - Module 3 - PREHISTORCI ARCHITECTURE OF KERALA.pptxHOA1&2 - Module 3 - PREHISTORCI ARCHITECTURE OF KERALA.pptx
HOA1&2 - Module 3 - PREHISTORCI ARCHITECTURE OF KERALA.pptx
 
Autodesk Construction Cloud (Autodesk Build).pptx
Autodesk Construction Cloud (Autodesk Build).pptxAutodesk Construction Cloud (Autodesk Build).pptx
Autodesk Construction Cloud (Autodesk Build).pptx
 
Overview of Transformation in Computer Graphics
Overview of Transformation in Computer GraphicsOverview of Transformation in Computer Graphics
Overview of Transformation in Computer Graphics
 
Introduction to Geographic Information Systems
Introduction to Geographic Information SystemsIntroduction to Geographic Information Systems
Introduction to Geographic Information Systems
 
Signal Processing and Linear System Analysis
Signal Processing and Linear System AnalysisSignal Processing and Linear System Analysis
Signal Processing and Linear System Analysis
 
Fundamentals of Structure in C Programming
Fundamentals of Structure in C ProgrammingFundamentals of Structure in C Programming
Fundamentals of Structure in C Programming
 
Worksharing and 3D Modeling with Revit.pptx
Worksharing and 3D Modeling with Revit.pptxWorksharing and 3D Modeling with Revit.pptx
Worksharing and 3D Modeling with Revit.pptx
 
Standard vs Custom Battery Packs - Decoding the Power Play
Standard vs Custom Battery Packs - Decoding the Power PlayStandard vs Custom Battery Packs - Decoding the Power Play
Standard vs Custom Battery Packs - Decoding the Power Play
 
Dynamo Scripts for Task IDs and Space Naming.pptx
Dynamo Scripts for Task IDs and Space Naming.pptxDynamo Scripts for Task IDs and Space Naming.pptx
Dynamo Scripts for Task IDs and Space Naming.pptx
 
UNIT 4 PTRP final Convergence in probability.pptx
UNIT 4 PTRP final Convergence in probability.pptxUNIT 4 PTRP final Convergence in probability.pptx
UNIT 4 PTRP final Convergence in probability.pptx
 
Integrated Test Rig For HTFE-25 - Neometrix
Integrated Test Rig For HTFE-25 - NeometrixIntegrated Test Rig For HTFE-25 - Neometrix
Integrated Test Rig For HTFE-25 - Neometrix
 
Computer Graphics Introduction To Curves
Computer Graphics Introduction To CurvesComputer Graphics Introduction To Curves
Computer Graphics Introduction To Curves
 
Presentation on Slab, Beam, Column, and Foundation/Footing
Presentation on Slab,  Beam, Column, and Foundation/FootingPresentation on Slab,  Beam, Column, and Foundation/Footing
Presentation on Slab, Beam, Column, and Foundation/Footing
 

Optimizing I/O’s and ESD protection to reduce power consumption in SOI applications

  • 1. SOFICS © 2020 Proprietary & Confidential 1 BENJAMIN VAN CAMP -SOFICS OPTIMIZING I/O’S AND ESD PROTECTION TO REDUCE POWER CONSUMPTION IN SOI APPLICATIONS D&R IP-SOC DAYS
  • 2. An IC through the eyes of an ESD engineer SOFICS © 2020 Proprietary & Confidential 2 GND VDD Output Input
  • 3. I/O ESD architectures SOFICS © 2020 Proprietary & Confidential 3 Leakage I/O to GND Leakage I/O to VDD Leakage VDD to GND VDD GND I/O
  • 4. I/O ESD architectures SOFICS © 2020 Proprietary & Confidential 4 … Leakage I/O to GND Leakage I/O to VDD Leakage VDD to GND VDD GND I/O VDD GND I/O VDD GND I/O VDD GND I/O
  • 5. Dual diode Protection SOFICS © 2020 Proprietary & Confidential 5 • ESD protection implications – Simplest architecture – For large design windows • Signal voltage implications – VI/O > GND - 0.3V – VI/O < VDD + 0.3V • Leakage – I/O - > GND: Through reverse junction of diode – I/O - > VDD: Through reverse junction of diode – VDD -> GND: Determined by power clamp VDD GND I/O Leakage I/O to GND Leakage I/O to VDD Leakage VDD to GND
  • 6. Diode Cross Sections SOFICS © 2020 Proprietary & Confidential 6 Bulk SOI STI diode Gated Diode
  • 7. Diode characteristics SOFICS © 2020 Proprietary & Confidential 7 • Current capability: – Forward: 20-50mA/um – Reverse: 0.5mA/um • Parasitics – PNP to substrate – Diode from substrate to cathode • Current capability: – Forward: 5-10mA/um – Reverse: 0.2mA/um • No Parasitics Bulk SOI
  • 8. 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 1 2 3 4 5 Voltage [V] Current [A] Diode measurements SOFICS © 2020 Proprietary & Confidential 8 65nm SOI Diode perimeter: 80um ~9-10mA/um 0 0.5 1 1.5 2 2.5 3 3.5 0 0.5 1 1.5 2 2.5 3 Voltage [V] Current [A] 65nm Bulk Diode perimeter: 92um ~33mA/um
  • 9. Diode – Reverse Leakage SOFICS © 2020 Proprietary & Confidential 9 • Reverse diode are low leakage – Measured in 65nm bulk – Similar for all technologies • Leakage @ 1.8V – ~10pA for 25°C – ~200pA for 125°C 10 -12 10 -10 10 -8 10 -6 10 -4 0 2 4 6 8 10 12 14 16 Voltage [V] Current [A] 25°C 125°C Thermochuck induced noise 1.8V
  • 10. I/O ESD architectures SOFICS © 2020 Proprietary & Confidential 10 … Leakage I/O to GND Leakage I/O to VDD Leakage VDD to GND VDD GND I/O VDD GND I/O VDD GND I/O VDD GND I/O
  • 11. Secondary Protection SOFICS © 2020 Proprietary & Confidential 11 • ESD protection implications – Simple architecture  Diodes take most of ESD current  Secondary protection limits voltage – Secondary protection can be small – For smaller design windows – CDM sensitive pins • Signal voltage implications – VI/O > GND - 0.3V – VI/O < VDD + 0.3V Leakage I/O to GND Leakage I/O to VDD VDD GND I/O Leakage VDD to GND
  • 12. Secondary Protection SOFICS © 2020 Proprietary & Confidential 12 • Leakage 1. I/O - > GND:  Path 1: Through reverse junction of diode  Path 2: Through Secondary clamp -> Assume small ggNMOS 2. I/O - > VDD:  Path 1: Through reverse junction of diode  Path 2: Through Secondary clamp -> Assume small ggNMOS 3. VDD -> GND: Determined by power clamp  + Sum of secondary clamps  Typically negligible Leakage I/O to GND Leakage I/O to VDD Leakage VDD to GND VDD GND I/O
  • 13. NMOS in Snapback – one slide explanation SOFICS © 2020 Proprietary & Confidential 13 1. Gate Grounded – Voltage increases – No current flow 2. Breakdown voltage drain-substrate reached – Avalanching at drain – Small current flow from drain to GND 3. Voltage built up over substrate resistance – Substrate- Source reaches 0.7V – NPN turns on – Avalanching voltage lowered  Snapback I V I V I V 1 2 3
  • 14. NMOS in bulk technology – cross section SOFICS © 2020 Proprietary & Confidential 14 • NMOS in bulk technology has a shared p-substrate – Large volume for Heat dissipation – This shared p-substrate will help to trigger all the fingers
  • 15. SOI MOS SOFICS © 2020 Proprietary & Confidential slide 15 • SOI MOS – Less volume for heat dissipation – Body regions are isolated  No body coupling between fingers A A’
  • 16. GGNMOS Measurements SOFICS © 2020 Proprietary & Confidential slide 16 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 current [A] voltage [V] 90nm bulk process It2 ~ 6 mA/um • Bulk NMOS much higher It2 – Bulk: 5-10 mA/um – SOI: 1-3 mA/um • Voltages comparable – SOI devices slightly lower trigger and holding voltage 0 0.5 1 1.5 2 2.5 0 0.5 1 1.5 2 2.5 3 3.5 4 current [A] voltage [V] 90nm SOI process It2 ~ 2.4 mA/um
  • 17. SOI MOS devices - Degradation SOFICS © 2020 Proprietary & Confidential 17 • Often degradation is seen – Don’t use these devices Factor 10 ESD SOI MOS Seen in many MOS devices in SOI
  • 18. SOI MOS Variation SOFICS © 2020 Proprietary & Confidential 18 130nm SOI Foundry ESD Solution Measured over multiple samples Leakage ~few nA or lower
  • 19. I/O ESD architectures SOFICS © 2020 Proprietary & Confidential 19 … Leakage I/O to GND Leakage I/O to VDD Leakage VDD to GND VDD GND I/O VDD GND I/O VDD GND I/O VDD GND I/O
  • 20. I/O signal conditions SOFICS © 2020 Proprietary & Confidential 20 • ESD protection implications – Local Clamp required  Takes all of ESD current  Needs to limit voltage – Local clamp large – For smallest design windows – CDM sensitive pins • Local clamp options – ggNMOS – SCR Leakage I/O to GND Leakage I/O to VDD Leakage VDD to GND VDD GND I/O
  • 21. I/O signal conditions SOFICS © 2020 Proprietary & Confidential 21 • Conditions that require (semi) local protection – VI/O > VDD + 0.3V – Supply can be powered down  Energy Saving mode  Cold Spare – CMRR: no I/O – VDD capacitance allowed • Leakage 1. I/O - > GND:  Path 1: Through reverse junction of diode  Path 2: Through local clamp 2. I/O - > VDD: None 3. VDD -> GND: Determined by power clamp Leakage I/O to GND Leakage I/O to VDD Leakage VDD to GND VDD GND I/O
  • 22. Protection Device Example (1/3) – 1.2V in 90nm SOI Proprietary & Confidential -- Sarnoff © 2005 slide 22 0 0.5 1 1.5 2 0 1 2 3 4 5 6 7 10 -12 10 -11 10 -10 10 -9 10 -8 10 -7 10 -6 voltage [V] leakage current [A] @ 1.32V current[A] W=8x30um Vt1 = 3.2V • SCR based power clamp in SOI – Vhold = 2V – Vmax = 6.4V – Imax=7.5 mA/um – Ron = 586.7 Ohm.um • Leakage ~ 0.5nA/um @ 25°C
  • 23. Protection Device Example (2/3) - 22nm SOI SOFICS © 2020 Proprietary & Confidential 23 • SCR Based clamps for different domains 1.2V-1.8V – 125°C 0.8V - 125°C 0.8V – 25°C 1.2V-1.8V –25°C Leakage ESD performance
  • 24. Protection Device Example (3/3) - 3.3V in 130nm SOI SOFICS © 2020 Proprietary & Confidential 24 • Specialized ggNMOS based clamp – To lower leakage – To avoid variation 11nA, FF, 125°C 200pA, TT, 25°C same process
  • 25. I/O ESD architectures SOFICS © 2020 Proprietary & Confidential 25 … Leakage I/O to GND Leakage I/O to VDD Leakage VDD to GND VDD GND I/O VDD GND I/O VDD GND I/O VDD GND I/O
  • 26. Power protection - Leakage SOFICS © 2020 Proprietary & Confidential 26 • Choice of power clamp is important – Dependent on leakage/power specifications – Dependent on power up/down strategy – Dependent on temperature range 22nm SOI Clamp type 25°C 125°C 0.8V Rail clamp 80nA 6uA 1.8V Rail clamp 100nA uA 0.8V SCR based <0.5nA 20nA 1.8V SCR based <0.5nA 20nA 0.8V ggNMOS 2nA 1.8V ggNMOS 10nA Leakage VDD to GND VDD GND I/O
  • 27. Conclusion - Leakage SOFICS © 2020 Proprietary & Confidential 27 • I/O to GND – Low leakage • I/O to VDD – Low leakage IF Vsignal < VDD at all times • VDD to I/O – Depends on power clamp – < 1nA @ RT possible • I/O to GND – Depends on local clamp – < 1nA @ RT possible • I/O to VDD – Low leakage IF Vsignal < VDD at all times • VDD to I/O – Depends on power clamp – < 1nA @ RT possible • I/O to GND – Depends on local clamp – < 1nA @ RT possible • I/O to VDD – Low leakage IF Vsignal < VDD at all times • VDD to I/O – Depends on power clamp – < 1nA @ RT possible VDD GND I/O VDD GND I/O VDD GND I/O
  • 28. Contact us SOFICS © 2019 Proprietary & Confidential 28 • Sofics contact Koen Verhaege Benjamin Van Camp Bart Keppens info@sofics.com engineering office Sint-Godelievestraat 32 9880 Aalter, Belgium

Notes de l'éditeur

  1. ICSS
  2. ICSS
  3. ICSS