Datasheet of MAX3841 in Japanese

1. 19-2905; Rev 0; 8/03
KIT
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EVALU BLE
AVAILA
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MAX3841
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PIN- PKG.
PART TEMP RANGE
PACKAGE CODE
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MAX3841ETG -40°C to +85°C 24 Thin QFN T2444-1
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1.8V
2.5V 3.3V 1.8V 10Gbps
3.3V 2.5V CDR/SERDES
VCC1OUT VCC VCC2IN ASIC
SDI+ OUT1+ IN2+ SDO+
10Gbps
SERIAL SDI- OUT1- IN2- SDO-
OPTICAL MAX3841
MODULE SDO+ IN1+ OUT2+ SDI+
SDO- IN1- OUT2- SDI-
2.5V 1.8V
VCC1IN VCC2OUT
SEL1 SEL2 ENO1 ENO2 GND
LOOPBACK
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ABSOLUTE MAXIMUM RATINGS
MAX3841
Supply Voltage, VCC..............................................-0.5V to +4.0V Continuous Power Dissipation (TA = +85°C)
CML Supply Voltage (VCC_IN, VCC_OUT)...........-0.5V to +4.0V 24-Pin Thin QFN (derate 20.8mW/°C
Continuous Output Current (OUT1±, OUT2±)...................±25mA above +85°C).............................................................1352mW
CML Input Voltage (IN1±, IN2±)...........-0.5V to (VCC_IN + 0.5V) Operating Temperature Range ...........................-40°C to +85°C
LVCMOS Input Voltage (SEL1, SEL2, Storage Temperature Range .............................-55°C to +150°C
ENO1, ENO2) .........................................-0.5V to (VCC + 0.5V) Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +3.6V, VCC_IN = +1.71V to VCC, VCC_OUT = +1.71V to VCC, TA = -40°C to +85°C. Typical values are at VCC =
+3.3V, VCC_IN = VCC_OUT = 1.8V, TA = +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Core Supply Current ICC Excluding CML termination currents 65 90 mA
Data Rate (Note 1) 0 12.5 Gbps
CML Input Differential VIN AC-coupled or DC-coupled (Note 2) 150 1200 mVP-P
CML Input Common Mode DC-coupled VCC_IN - 0.3 VCC_IN V
CML Input Termination Single ended 42.5 50 57.5 Ω
CML Input Return Loss Up to 10GHz 12 dB
CML Output Differential VOUT (Note 2) 400 500 600 mVP-P
CML Output Termination Single ended 42.5 50 57.5 Ω
CML Output Transition Time tR, tF 20% to 80% (Notes 1, 3) 30 ps
Deterministic Jitter (Notes 1, 4) 10 psP-P
Random Jitter VIN = 150mVP-P (Notes 1, 5) 0.3 0.7 psRMS
Propagation Delay Any input to output (Note 1) 100 140 ps
Channel-to-Channel Skew (Note 1) 12 ps
Output Duty-Cycle Skew 50% input duty cycle (Notes 1, 3) 8 ps
LVCMOS Input Current IIH, IIL -10 +10 µA
LVCMOS Input High Voltage VIH 1.7 V
Note 1: Guaranteed by design and characterization.
Note 2: Differential swing is defined as VIN = (IN_+) - (IN_-) and VOUT = (OUT_+) - (OUT_-). See Figure 1.
Note 3: Measured using a 0000011111 pattern at 12.5Gbps, and VIN = 400mVP-P differential.
Note 4: Measured at 9.953Gbps using a pattern of 100 ones, 27 - 1 PRBS, 100 zeros, 27 - 1 PRBS, and at 12.5Gbps using a ±K28.5
pattern. VCC_IN = VCC_OUT = 1.8V, and VIN = 400mVP-P differential.
Note 5: Refer to Maxim application note HFAN-04.5.1: Measuring Random Jitter on a Digital Sampling Oscilloscope.
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MAX3841
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(VCC = 3.3V, VCC_IN, VCC_OUT = 1.8V, VIN = 500mVP-P, TA = +25°C, unless otherwise noted.)
CORE SUPPLY CURRENT vs. TEMPERATURE SUPPLY CURRENT vs. TEMPERATURE OUTPUT EYE DIAGRAM
(EXCLUDES CML I/O CURRENTS) (CORE PLUS CML I/O CURRENTS) (12.5Gbps, 223 - 1 PRBS)
MAX3841 toc03
140 140
MAX3841 toc02
MAX3841 toc01
130 130
120 120 2 OUTPUTS ENABLE
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
110 0 OUTPUTS ENABLE 110 1 OUTPUT ENABLE
100 1 OUTPUT ENABLE 100
90 90 0 OUTPUTS ENABLE 60mV/div
80 2 OUTPUTS ENABLE 80
70 70
60 60
50 50
CML INPUTS AND OUTPUTS AC-COUPLED
40 40
-40 -15 10 35 60 85 -40 -15 10 35 60 85 14ps/div
TEMPERATURE (°C) TEMPERATURE (°C)
OUTPUT EYE DIAGRAM OUTPUT EYE DIAGRAM OUTPUT EYE DIAGRAM
(10.7Gbps, 223 - 1 PRBS) (6.25Gbps, 223 - 1 PRBS) (622Mbps, 223 - 1 PRBS)
MAX3841 toc04 MAX3841 toc05 MAX3841 toc06
60mV/div 60mV/div 60mV/div
16ps/div 28ps/div 270ps/div
DETERMINISTIC JITTER DIFFERENTIAL OUTPUT SWING
vs. TEMPERATURE vs. TEMPERATURE PROPAGATION DELAY
MAX3841 toc09
16 550
MAX3841 toc08
MAX3841 toc07
7 540
14 2 - 1 PRBS + 100CIDs
AT 10.7Gbps
DIFFERENTIAL OUTPUT (mVP-P)
530
DETERMINISTIC JITTER (ps)
12 IN1
520
10 510
8 500
490
6
480
4 OUT1
470
2 460
±K28.5 AT 12.5Gbps
0 450
-40 -15 10 35 60 85 -40 -15 10 35 60 85 100ps/div
TEMPERATURE (°C) TEMPERATURE (°C)
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MAX3841
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PIN NAME FUNCTION
1, 12 VCC +3.3V Core Supply Voltage
2, 5 VCC1IN Supply Voltage for CML Input IN1. Connect to 1.8V, 2.5V, or 3.3V.
3 IN1+ Positive Serial Data Input 1, CML
4 IN1- Negative Serial Data Input 1, CML
6 SEL1 Output 1 Select, LVCMOS Input. See Table 1.
7 SEL2 Output 2 Select, LVCMOS Input. See Table 1.
8, 11 VCC2IN Supply Voltage for CML Input IN2. Connect to 1.8V, 2.5V, or 3.3V.
9 IN2+ Positive Serial Data Input 2, CML
10 IN2- Negative Serial Data Input 2, CML
13, 24 GND Supply Ground
14, 17 VCC1OUT Supply Voltage for CML Output OUT1. Connect to 1.8V, 2.5V, or 3.3V.
15 OUT1- Negative Serial Data Output 1, CML
16 OUT1+ Positive Serial Data Output 1, CML
18 ENO1 Output 1 Enable, LVCMOS Input. See Table 1.
19 ENO2 Output 2 Enable, LVCMOS Input. See Table 1.
20, 23 VCC2OUT Supply Voltage for CML Output OUT2. Connect to 1.8V, 2.5V, or 3.3V.
21 OUT2- Negative Serial Data Output 2, CML
22 OUT2+ Positive Serial Data Output 2, CML
Ground. The exposed pad must be soldered to the circuit board ground for proper thermal and
EP Exposed Pad
electrical performance.
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2
IN1 CML 1 2
CML OUT1
0
ENO1
SEL1
2
IN2 CML 1 2
CML OUT2
0
Ω Ω ENO2
MAX3841 SEL2
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MAX3841
V-
75mV
MIN ENO1 ENO2 SEL1 SEL2 OUT1 OUT2
600mV
MAX 0 0 0 0 IN2 IN1
0 0 0 1 IN2 IN2
V+
0 0 1 0 IN1 IN1
0 0 1 1 IN1 IN2
150mV 1 1 X X Disabled Disabled
MIN
(V+) - (V-) 1200mV
MAX _________________
VCC_IN
50Ω 50Ω
IN_+
IN_-
MAX3841
VCC_OUT
50Ω 50Ω
OUT_+ Ω
OUT_-
MAX3841
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MAX3841
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TRANSISTOR COUNT: 950
VCC2OUT
VCC2OUT
TOP VIEW PROCESS: SiGe BiCMOS
OUT2+
OUT2-
ENO2
GND
24 23 22 21 20 19
VCC 1 18 ENO1
VCC1IN 2 17 VCC1OUT
IN1+ 3 16 OUT1+
IN1- 4 MAX3841 15 OUT1-
VCC1IN 5 14 VCC1OUT
SEL1 6 13 GND
7 8 9 10 11 12
SEL2
VCC2IN
IN2+
IN2-
VCC2IN
VCC
THIN QFN*
*THE EXPOSED PAD OF THE QFN PACKAGE MUST BE
SOLDERED TO GROUND FOR PROPER THERMAL AND
ELECTRICAL OPERATION.
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MAX3841
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http://japan.maxim-ic.com/packages
24L QFN THIN.EPS
PACKAGE OUTLINE
12,16,20,24L QFN THIN, 4x4x0.8 mm
1
21-0139 B 2
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8. x
MAX3841
___________________________________________________________________
http://japan.maxim-ic.com/packages
PACKAGE OUTLINE
12,16,20,24L QFN THIN, 4x4x0.8 mm
2
21-0139 B 2
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