The shift from stand-alone devices to integrated inertial measurement units and combos will come from optimization of current technologies and the introduction of disruptive approaches. 6 AND 9-AXIS DOF SENSORS ARE CREATING A NEW PARADIGM IN THE COMBOS BUSINESS Current technological developments are motivated by several market drivers. For example, integrators for consumer products apply strong price pressure on component manufacturers, thus motivating die size reduction in order to lower manufacturing costs and change the manufacturing platform. Other industry requirements include low-power consumption for mobile applications, better performance and higher integration of functionalities. These required improvements have been the same for some time now. The difference mainly lies in the way that technology adapts in order to meet these increasingly stringent specifications. Over the past several years, the tendency was to increase the number of axes for stand-alone components while decreasing size. Now, the industry favors complete integration of 9+ axis sensors and platform standardization. Indeed, in term of detection principle, and in terms of physical concepts in general, we haven’t seen many disruptive approaches reach the market, aside from Qualtré BAW-based inertial sensors. Nevertheless, strong efforts have been made to develop standardized platforms - for example, Teledyne DALSA now offers a generic platform for accelerometers and gyroscopes, as does STMicroelectronics via its THELMA process. Moreover, a very innovative approach in terms of standardization can be seen in CEA-LETI’s M&NEMS platform, in which the company intends to use silicon nanogauges as detection principle for their accelerometers, gyroscopes and magnetometers. The concept lies in using nanoscale gauges for detection, thus increasing sensitivity and reducing size, while keeping a microscale mass for better detection reliability. M&NEMS technology allows for the integration of 9-axis sensors with small form factor. This process is expected to enter production through Tronics Microsystems within the next few years. Innovation also comes from back-end processing. Packaging issues had to be leveraged in order to attain the high integration required by advanced inertial combos. Key packaging developments and innovative front-end approaches are analyzed in this report. FOR THE FIRST TIME EVER, OUR ANALYSIS IS ILLUSTRATED BY MORE THAN 40 REVERSE ENGINEERING STUDIES OF DIVERSE COMMERCIAL COMPONENTS! 46+ inertial MEMS components have been reverse engineered to provide insights and data regarding accelerometers, gyros and combos. In our report, a reverse costing simulation of the MEMS, ASIC and packaging parts of these devices has also been made. These tasks were performed by System Plus Consulting, Yole Développement’s sister company. The report compares performance, cost, size (MEMS, ASIC and package)... More information on that report at

1. © 2014
Inertial MEMS Manufacturing Trends 2014
The shift from standalone devices to integrated inertial measurement
units will come through both optimization of current technologies and
introduction of disruptive approaches
SAMPLE REPORT

2. © 2014• 2
Introduction
• The inertial sensor market has been very active in the past few years and innovation is still ongoing. Those
sensors today represent the largest MEMS market – accounting for more than $3.5B in 2012 – and this should not
change in the near future.
• Several market drivers motivate current technological developments.
– For example integrators for consumer products apply a strong price pressure on component manufacturers thus
motivating die size reduction in order to lower manufacturing costs.
– Other industry requirements include low power consumption for mobile applications, better performances and higher
integration of functionalities.
• Those required improvements have not changed for quite some time now. The difference mainly lies in the way
technology adapts in order to meet these more and more stringent specifications. In the past several years, the
tendency was at increasing the number of axis for standalone components while decreasing size; now the
industry looks at complete integration of 9+ axis sensors and standardization of platforms.
• In order to have a comprehensive understanding of the most recent commercial solutions and technical trends,
more than 20 inertial MEMS components have been reverse engineered.
• A reverse costing simulation of the MEMS, ASIC and packaging parts of those devices has also been made.
Those tasks were performed by SYSTEMPlus Consulting which is a sister company from Yole Développement. A
comparison of the results has been made for performances, costs, size (MEMS, ASIC and package), ASIC
lithography node, and manufacturing approach.
• This factual analysis underlines well the previously mentioned trends and permits a concrete visualization of the
current status of different companies in term of integration

3. © 2014• 3
What’s new since 2011 for inertial
MEMS
• Over the past 3 years, we saw interesting technical evolutions for inertial sensors:
– The coming of 9 DOF
– The different approaches of players (STM, Bosch and Invensense) for 6 and 9 DOF:
• For accelero/gyro combos, Bosch and STM use two-dies approach while Invensense uses monolithic
integration
• For 9 axis IMUs, both STM and Invensense use integrated accelerometer and gyro on the same die
– New wafer bonding approaches for higher integration, e.g.:
• AlGe for Invensense
• Gold-Gold bonding for STM
– Players are coming with really innovating approach: e.g. mcube.
• Significant size reduction can be achieved with this new disruptive technology. Mcube has reduced
packaging cost because of no need of bond pads and eutectic bonding for reduced bonding area.
– … and more in our report!

4. © 2014• 4
• Inertial sensors is a $4B market in 2013!
– Growing to $5.4B soon, driven by the growth of the mobile market
• Volumes are booming: 9B units predicted in 2018!
– As combo solutions are adopted in consumer and automotive, the added value of each device is increasing
Inertial MEMS Market Forecast
2 011 2 012 2 013 2 014 2 015 2 016 2 017 2 018
Total $M 3 297 3 565 3 972 4 384 4 743 5 042 5 288 5 420
Total M units 2 553 3 544 4 607 5 709 6 668 7 585 8 398 8 946
0
1 000
2 000
3 000
4 000
5 000
6 000
7 000
8 000
9 000
10 000
0
1000
2000
3000
4000
5000
6000
Market(MUnits)
Market($M)
Global MEMS Inertial Sensor Market - 2011 - 2018 market
Yole développement © Oct. 2013

5. © 2014• 5
Technical solutions adopted in the inertial industry
Divergence of approaches by the main players
Techno solution
Combo sensors
become mainstream
Optimization of
front-end
manufacturing
Very specialized ASICs
New business models:
Bare die, software…
Standardization
initiatives
Market
drivers
Proliferation of
motion sensing
among a wide
range of
applications
 e.g. InvenSense (new
applications emerge with
compact 9-axis solutions
such as wearable
electronics: Google
Glass…)
 e.g. AKM, Melexis (for 9-
axis solutions: InvenSense
partners with AKM and
Melexis for magnetometer
die)
Component
size still
decreasing
 e.g. ST (3x3.5mm² 6-
axis IMU integrated in
Samsung Galaxy S4)
 e.g. ST (gold eutectic
bonding instead of glass
frit for smaller sealing
frame)
 e.g. ICSense (very small
capacitance need to be
detected. ST partners with
ICSense)
Price dropping
quarter after
quarter
 e.g. Murata (ESC
combo now cheaper
than discrete accel +
gyro)
 e.g. ST (smaller
sensing area to have
more sensors per wafer)
 e.g. Kionix / Aichi MI
(new business models as
only few players can
sustain price competition)
 e.g. Qualcomm and
Intel (working on sensor
parameter
standardization for
datasheets)
Low power
consumption
 e.g. Kionix (6-axis e-
compass + software to
simulate the gyro
function with low power)
 e.g. Bosch Sensortec
(intelligent power
management with the
IMUs)
Better inertial
performance
 Dalsa (single crystal
silicon, use of TSV in
MIDIS platform…)
 e.g. Epson (calibrations
for high-end applications)
Sensor fusion
adopted by the
market
 e.g. Bosch Sensortec
(Application Specific
Sensor Nodes include
sensors and sensor
fusion in a single
package)
 e.g. InvenSense (MPU
line of product integrates
smart functions at the ASIC
level)
 e.g. Movea (delivers
software solution for indoor
navigation…)
 e.g. Khronos
(« Stream Input » sensor
fusion API expected to be
offered for augmented
reality)

6. © 2014• 6
Combo sensors become mainstream
Combo sensor roadmap for mobile devices
Level of integration
2011 2012 2013 2014 2015 2016 2017 2018
+ RF
+ sensor fusion
+…

7. © 2014• 7
Accelerometer MEMS size evolution
2008 2009 2010 2011
MEMSSize(mm²)
4
2
3
$0.05-0.075
$0.075-0.1
>$0.1
ST
LIS331DLH
ST LIS3DH
BOSCH
BMA180
BOSCH
BMA250 /
BMC050
Kionix
KXTE9
5
ADI
ADXL346
VTI
CMA3000
n.a.
All are 3-axis accelerometers
US$ values are Production Cost
2007
ST
LIS3L02AE12
2012 2013
ADI
ADXL362
ST LIS302DL
MCube BI3L
BOSCH
SMI540
ST
LSM330 ST
LSM303D
AUTO
CONSUMER

8. © 2014• 8
Combo package size
2010 2011
ComboSize(mm²)
10
15
150
50
SensorDynamics
SD746
InvenSense
MPU-6000
VTI
SCC1300
2012
Bosch
SMI540
InvenSense
MPU-6500
Bosch
Sensortec
BMC050
ST
LSM303D
InvenSense
MPU-9150
ST
LSM333D
ST
LSM330
$0.5
$1
$3
US$ Production Cost
Auto /
Industrial
IMU
6-axis
consumer
IMU
6-axis e-
compass
9-axis

9. © 2014• 9
• Information in this report can be
completed with the companion report
“ Inertial MEMS Manufacturing Trends –
ANALYSIS”.

10. © 2014• 10
InvenSense MPU-9150 9-Axis IMU (2012)
Overview
• Specificities of this component:
– Small package: 4x4mm²
– MEMS part is single chip: single ASIC & MEMS monolithic structure bonded to the
ASIC
– Single die for magnetometer. Rather large: 3.76mm²
– Accelerometer: separate structures for the 3 axis. Gyro: single structure for the 3 axis
(smaller than accel part)
– Advanced ASIC technology node (MEMS): 0.18um
– Rather old ASIC technology node (Magnetometer): 0.35um

11. © 2014• 11
MEMS Cross-Section
• The mechanical layer of the
MEMS accelerometer is
constituted of a silicon layer
fusion bonded on top of the
metal layers of the CMOS IC.
The silicon layer is patterned by
DRIE to form the mechanical
structure.
 MEMS silicon thickness:
30µm
• The electrical connection
between the MEMS silicon layer
and the IC metal layers is
realized with tungsten.
Monolithic CMOS-MEMS Cross-Section – SEM View
mCube single-chip 3D silicon MEMS cross-section (source:
mCube)
IC substrate
(Silicon)
Cap
MEMS Sensor
(Silicon)
W via
IC Metal Layers
Cavity

12. © 2014• 12
Available MEMS Reports
MEMS Cosim+
MEMS Manufacturing
Cost Simulation Tool
Ferro-Electric
Thin Films
MEMS
Microphone
Thin Wafer
Handling
Technology Trends
for Inertials MEMS
RF Filters, PAs,
Antenna Switches &
Tunability for Cellular
Handsets
Trends in MEMS
Manufacturing &
Packaging
Ferro-Electric
Thin Films
Motion Sensors for
Consumer & Mobile
applications
Uncooled Infrared
Imaging Techology &
Market Trends
IMU & Gyro for
Defense, Aerospace
& Industrial
Status of the
CMOS Image
Sensors
New!New!
Sensor fusion of
acceleros, gyros &
magnetometers
Infrared Detectors
Technology &
Market Trends
New!
New!
MEMS Front-End
Manufacturing
Trends
MEMS for Cell
Phones and Tablets
MEMS Pressure
Sensor
Status of the
MEMS Industry
New!
New!
Emerging MEMS
New!

13. © 2014• 13
Yole activities in MEMS
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& Strategy/Patent Investigation/
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www.yole.fr
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News portal/Technology magazines/
Webcasts/Communication services
REPORTS
Market & technology/Patent
Investigation/Reverse costing
Status of the
MEMS Industry

14. © 2014• 14
Our Offices & Contact Information
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• Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178 -
Email: mclaughlin@yole.fr
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15. © 2014• 15
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