STMicroelectronics L3G4IS Dual-Core 3-Axis MEMS Gyroscope REVERSE COSTING ANALYSIS – APRIL 2013 The first dual-core MEMS gyroscope enabling both user interface (UI)and optical image stabilization (OIS) applications simultaneously. Using a new THELMA Process - Extracted from the Nokia Lumia 920. While Digital Still Cameras commonly use MEMS based optical image stabilization, it was not included in smartphones. The Nokia Lumia 920 is the first smartphone featuring an OIS function. Instead of using two dedicated sensors, Nokia chose to integrate a single gyroscope for both gesture recognition and camera image stabilization, allowing cost and board space savings. The L3G4IS is the first two-in-one gyroscope able to sense motion with low noise and high sensitivity for OIS applications and to sense coarse movements with low sensitivity for UI applications. Assembled in the mainstream LGA 4x4mm package, the L3G4IS integrated in the Nokia Lumia 920 includes a MEMS die manufactured with the standard ST's THELMA and glass-frit wafer bonding processes. We also had access to a version of the component including a smaller MEMS die featuring a Gold-Gold thermocompression wafer bonding process and a modified THELMA process manufactured with new materials for the buried polysilicon layer used for the electrical interconnections. More information on that report at http://www.i-micronews.com/reports/STMicroelectronics-L3G4IS-Dual-Core-3-Axis-MEMS-Gyroscope/1/365/

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April 2013 - Version 1
Written by: Romain FRAUX
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic
estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is
made of the contents of this report. The quoted trademarks are property of their owners.

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Table of Contents
Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. STMicroelectronics Company Profile 7
– ST Profile
– ST MEMS Gyroscopes Portfolio
– L3G4IS Characteristics
– ST Business Model
3. Nokia Lumia 920 Teardown 19
– Nokia Lumia 920 Specs
– Nokia Lumia 920 Teardown
4. L3G4IS Physical Analysis 23
– Physical Analysis Methodology
– Package
 Package Characteristics & Markings
 Package Pin-Out
 Package Opening – Main Parts
 Package Opening – Wire Bonding Process
 Package Opening – PCB Layout
 Package Cross-Section
– ASIC
 ASIC Dimensions & Markings
 ASIC Pinout
 ASIC Cross-Section
 ASIC Characteristics
– MEMS
 MEMS Dimensions & Markings
 MEMS bonding pads
 MEMS Cap Opening
 MEMS Cap Getter
 MEMS Sensing Area
 MEMS Cross-section
 MEMS Characteristics
– MEMS Gold-Gold Bonding Version
 Shrinked MEMS die
 Modified THELMA Process
5. Manufacturing Process Flow 79
– Global Overview
– ASIC Process Flow
– Description of the ASIC Wafer Fabrication Unit
– MEMS Process Overview
– MEMS Sensor Process Flow
– MEMS Cap Process Flow
– MEMS Wafer Bonding Process Flow
– Description of the MEMS Wafer Fabrication Unit
– Packaging Process Flow
6. Cost Analysis 97
– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Yields Explanation
– Yields Hypotheses
– ASIC Front-End Cost
– ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
– ASIC Die Cost
– MEMS Front-End Cost
– MEMS Front-End Cost per Process Steps
– MEMS Front-End : Equipment Cost per Family
– MEMS Front-End : Material Cost per Family
– MEMS Back-End 0 : Probe Test & Dicing
– MEMS Die Cost (Front End + Back End 0)
– Back-End : Packaging Cost
– Back-End : Final test & Calibration Cost
– L3G4IS Component Cost (FE + BE 0 + BE 1)
7. Estimated Price Analysis 122
– Definition of Prices
– Manufacturer Financial Ratios
– L3G4IS Estimated Manufacturer Price
– L3G4IS Estimated Selling Price
Contact 128

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Executive Summary
• This full reverse costing study has been conducted to provide insight on technology data, manufacturing
cost and selling price of the STMicroelectronics L3G4IS component.
• The L3G4IS is the first two-in-one three-axis MEMS gyroscope that can simultaneously handle user-
motion recognition and camera image stabilization, allowing cost and board space savings.
• The L3G4IS features a 16-pin 4x4x1mm LGA package and provides accurate output across full-scale
ranges up to ±2000dps (UI) and ±65dps (OIS). It is targeted for mobile applications: Gaming and virtual
reality input devices, Optical image stabilization, Motion control and gesture recognition, GPS navigation
systems.

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What's Surprising in this Device?
• Two versions of the L3G4IS are studied in this report. One was extracted from the Nokia Lumia 920
smartphone and the other was sourced as a single component.
• The version of the L3G4IS inside the Nokia Lumia 920 integrates a MEMS die using a glass-frit wafer
bonding process for the capping of the sensor. The sensor is manufactured with the well known THELMA
process.
• The other version of the L3G4IS integrates a MEMS die featuring a Gold-Gold thermocompression wafer
bonding process which allows for a smaller sealing frame width and thus shrink the MEMS die size of
30%. Moreover, the MEMS sensor of this version is manufactured with a modified version of the
THELMA process. This "new" THELMA process uses a stack of three materials for the buried polysilicon
interconnect layer.

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Nokia Lumia 920 Teardown

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Synthesis of the Physical Analysis

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Package Cross-Section

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ASIC – Markings
• The die markings include the logo of STMicroelectronics and:
2012
V729B
• This lead us to suppose that the mask set origin is 2012.
ASIC Die Markings

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MEMS – Bond Pads (Glass-Frit Version)

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MEMS - Cross-Section (Glass-Frit Version)

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MEMS – Bond Pads (Gold-Gold Version)

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MEMS - Sensor Process Flow 1/2

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ASIC Front-End Cost
Probe Test Cost
Backgrinding & Dicing Cost
• We perform the economic analysis of the ASIC with the IC Price+ software.
• We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software.
Packaging Cost
Final Test & Calibration Cost
Component Cost
MEMS Front-End Cost
Probe Test Cost
Dicing Cost
Main steps of economic analysis
L3G4IS
Back-End 0
Back-End 1
Front-End

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ASIC Die Cost (Front-End + Back-End 0)

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MEMS Front-End Cost

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MEMS FE Cost per Process Steps (1/3)

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MEMS Front-End : Equipment Cost per Family

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L3G4IS Component Cost (FE+BE 0+BE 1)

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L3G4IS Estimated Selling Price (Medium Yield)