Integrated Circuit (IC) Manufacture - Slicing the Silicon ingot - Fabrication of IC’s (Lithography, Sputtering, diffused junction, …) - Testing each IC on the slice - Dicing (cutting each chip out with a diamond saw) - Packaging

1. GLIMPSES
AJAL.A.J

2. Fabrication Equipment
Molecular Beam Epitaxy
(MBE)

3. Fabrication Equipment
Photoresist Spinner Bake-out Ovens

4. Fabrication Equipment
Mask Aligner Reactive Ion Etching (RIE)

5. Fabrication Equipment
Chemical Vapor Deposition
(CVD)
Plasma Quest Sputter

6. Fabrication Equipment
Plasma Sputter Perkin-Elmer MBE

8. Aligned Wafer-Bonding System

13. PCB Manufacture
Types of PCB's
single-side, double-side and multi-layer
Which type to use ?
(a) Circuit complexity
(b) Available space
(c) Cost
Typical PCB
insulated substrate
copper connections
protective covering

14. Packaging
Dual Inline Package and its lead-frame
Steps in Lead Frame Manufacture:
(1) Cut copper strips
(2) Clean in a chemical bath
(3) laminate a layer of photoresist
(4) Expose photoresist through mask
(5) Develop and etch
(6) Remove lamination
(7) Plate internal regions with gold/silver
Dual Inline Package and its lead-frame
Steps in Lead Frame Manufacture:
(1) Cut copper strips
(2) Clean in a chemical bath
(3) laminate a layer of photoresist
(4) Expose photoresist through mask
(5) Develop and etch
(6) Remove lamination
(7) Plate internal regions with gold/silver
- Make leadframe
- Die attachment (chip bonded to leadframe using epoxy)
- Wire bonding (ultrasonic welding)
- Encapsulation (moisture resistant coating)
- Molding (plastic package)
- Marking (chip number, co. name, marked on package [laser, silkscreen])
- DTFS: deflash, trim the leadframe, form the leads, singulate (cut dambars)
- Leadfinishing: electroplating the leads

16. Integrated Circuit (IC) Manufacture
- Slicing the Silicon ingot
- Fabrication of IC’s (Lithography, Sputtering, diffused junction, …)
- Testing each IC on the slice
[source: www.towajapan.co.jp]
- Dicing (cutting each chip out with a diamond saw)
- Packaging

17. Images of the CLEAN ROOM MONITORING
UNIT

18. Schematic of Ion Beam Sculpting Apparatus

19. Sculpting of Nanopores:
Sputtering versus Lateral Mass Transport

20. Fabrication Equipment
Probe Station Scanning Electron
Microscope (SEM)

21. We’re all searchers now…search
smarter, not harder ? ( AJAL.A.J )

22. The ultimate passion of searching…

24. References
• Carter, Ronald. “Lecture 9 – EE 5342” UTA
• Cheung, Nathan “ Lecture 17 – EE 143” UC Berkeley
• http: //et.nmso.edu/ETCLASSES/vlsi/files/CRYSTAL.HTM
• Hastings, Alan “The Art of Analog Layout”, Prentice Hall, New
Jersey, 2001
• Campbell, Stephen A. , “The Science and Engineering of
Microelectronic Fabrication”, Oxford University Press, New York,
2001
• Alvarez, Antonio, “BiCMOS Technology and Applications”, Prentice
Hall, New Jersey, 2001

25. The End