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- 3. HISTORY ▸ Established by state government of Flanders in 1984 ▸ Independent non-profit organization ▸ Worldwide reach ▸ Initial investment: 62M€ ▸ Initial staff: ~70 © IMEC 2012
- 4. MISSION ▸ W ld l di research in World-leading hi nano-electronics ▸ Scientific knowledge with innovative power of global partnerships in ICT, healthcare and energy ▸ Industry-relevant technology solutions ▸ International top talent in a unique high-tech environment committed to provide building blocks for a better life in a sustainable society © IMEC 2012
- 5. FULL ECO SYSTEM Universities Europe IMEC Government Industry y
- 6. FACTS & FIGURES ▸ Total revenue in 2011 of 300M€, a growth of 5% ▸ 1 773 publications R&D 1,773 related in 2011 ▸ 132 patents awarded & p 133 patents submitted in 2011 ▸ Collaboration with 600 companies & 208 universities ▸ 600 residents © IMEC 2012
- 7. Top 5 foreign employees HEADCOUNT 1. 1 The Netherlands (# 159) 2. China (# 87) 3. France (# 86) May 2012: 4. India (# 76) 5. Japan (# 61) ▸ 1,077 Belgians ▸ 72 foreign nationalities 159 160 140 120 100 87 86 80 76 59 61 60 46 43 40 30 31 28 25 16 18 20 13 13 15 10 10 12 7 7 5 8 8 7 4 4 5 4 4 5 6 4 2 5 1 1 3 1 2 2 1 1 1 1 1 1 1 2 1 3 2 1 1 1 2 1 3 1 1 1 1 2 1 2 1 1 1 1 1 0
- 8. IMEC IN THE WORLD The Netherlands Belgium China office US office Japan Taiwan India
- 9. Organic Silicon solar cell 200mm line NERF solar cell lab pilot line line Nano 300mm biolabs pilot line 450mm ready STATE-OF-THE-ART RESEARCH FACILITIES
- 10. 300mm PILOT LINE IMEC TOWER ‣ Expansion of 14,208 m2 14 208 ‣ 16 floors – capacity of 450 people & lab space
- 11. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 12. SCALING ‣ 1965: Lithography enabled scaling ‣ 2002-2003: ~ 90 nm 2002 2003: Materials enabled scaling ‣ ~ 14 nm: 3D enabled scaling © IMEC 2012
- 13. FINFET ‣ 22nm – 14nm ‣ FinFET introduction at 22nm for high-end high end applications ‣ 14nm for foundry processes © IMEC 2012
- 14. LOGIC ‣ High mobility channel ‣ 10 nm – 7nm Ge © IMEC 2012
- 15. LOGIC ‣ High mobility channel InGa As ‣ 10nm – 7nm Ge InP GaAs Ge Si © IMEC 2012
- 16. LOGIC Tunnel FET ‣ New device concepts Pinch-off FET ‣ Tunnel FET ‣ Pinch-off FET ‣ 7nm – 5nm © IMEC 2012
- 17. ReRAM ‣ Resistive RAM ‣ Integration in a vertical concept ‣ In 2011: world’s smallest, fully-functional HfO2-based ReRAM cell, with an area of less than 10 x 10nm² © IMEC 2012
- 18. DRAM ‣ STT RAM as stand alone and for embedded memory <20nm © IMEC 2012
- 19. 3D INTEGRATION ‣ Reducing floor space – small form factor ‣ 3D stacking of memory on logic or RF on interposer © IMEC 2012
- 20. OPTICAL I/O ‣ Extreme high bandwidth I/O in high performance computing ‣ Imec world-first sub- 100nm photonics components on 300mm Si technology with optical lithography li h h © IMEC 2012
- 21. EUV ‣ ASML preproduction scanner NXE:3100 for extreme UV lithography © IMEC 2012
- 22. LITHO POWER ‣ 16nm half pitch ‣ Phenomenal lithographic power can be achieved © IMEC 2012
- 23. DIRECTED SELF ASSEMBLY ‣ Extending optical g p lithography beyond its current limits ‣ Alternative patterning enabling frequency multiplication through use p g of block copolymers © IMEC 2012
- 24. INSITE ‣ Technology insights for gy g SYSTEM DESIGN product roadmaps (Fabless - Fablite) INSITE PROCESS TECHNOLOGY (Foundry) © IMEC 2012
- 25. INSITE Technology Option selection ‣ Linking process technology gp gy & system design Path-finding Technology- Test chips design g Design & co-exploration build Model Measure & characterize © IMEC 2012
- 26. 300mm PILOT LINE ‣ Investment > 1B$ $ ‣ Unique lithography cluster centered around ASML equipment ‣ Advanced equipment and preproduction tools ‣ Ballroom type of cleanroom ‣ 4 800 ² class 1 000 area 4,800m² l 1,000 © IMEC 2012
- 27. 300mm PILOT LINE 300mm PILOT LINE: ‣ Silicon pilot line for (sub-)22nm ‣ Semi-industrial operation - 24/7, process monitoring, short cycle time
- 28. PREPARING 450mm ‣ Funding Flemish g Government ‣ Towards Europe’s innovation engine © IMEC 2012
- 29. GLOBAL NETWORK SYSTEM COMPANIES MEMORY IDM LOGIC IDM FOUNDRIES FABLITE FABLESS EQUIPMENT MATERIAL SOFTWARE SUPPLIERS SUPPLIERS SUPPLIERS
- 30. GLOBAL NETWORK Memory IDM Logic IDM Foundries Fablite Fabless The image cannot be display ed. Your computer may not hav e enough memory to open the image, or the image may hav e been corrupted. Restart y our computer, and then open the file again. If the red x still appears, y ou may hav e to delete the image and then insert it again.
- 31. CORE CMOS PARTNERS The image cannot be display ed. Your computer may not hav e enough memory to open the image, or the image may hav e been corrupted. Restart y our computer, and then open the file again. If the red x still appears, y ou may hav e to delete the image and then insert it again. Lam RESEARCH
- 32. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 34. internet doctor BODY AREA hospital NETWORKS ▸ W Wearable h l h and bl health d comfort monitoring © IMEC 2012
- 35. HEALTH PATCH ▸ M l i parameter: Multi - heartbeat - skin temperature - skin conductance - sweat analysis - chemical sensing g © IMEC 2012
- 36. HEALTH PATCHECG PATCH ▸ Ul l Ultra-low power ECG patch ▸ Bluetooth low energy gy ▸ Embedded algorithm ▸ 30 days autonomy © IMEC 2012
- 37. WIRELESS EEG Applications: A li i ▸ Improving traffic safety through drowsiness g monitoring ▸ Games that adapt to the player s player’s cognitive state ▸ E-learning that adapts to the user’s concentration ▸ Accurate EEG monitoring at home, e.g. epilepsy patients © IMEC 2012
- 38. ULTRA LOW ENERGY DESIGN ▸ Di i l system d i f Digital design for battery operated and harvested devices with 10-100 times less power consumption ▸ Reliable near-threshold near threshold design ▸ Ultra energy efficient biomedical processing bi di l i © IMEC 2012
- 39. MOBILE DIAGNOSTICS ▸ Aff d bl Affordable ▸ Health monitoring to rural environments in developing countries © IMEC 2012
- 40. CMUT 4D RT imaging ▸ C Capacitive Mi i i Micromachined hi d Ultrasonic Transducers technology Mock up ▸ Towards mobile real-time 4D ultrasound ▸ More precise & faster ultrasound scans © IMEC 2012
- 41. CMUT: BASED ON SiGe MEMS ▸ SiG MEMS on top of SiGe f CMOS ▸ Membranes integrated g with electronics ▸ More compact, faster, more sensitive, increasing sensitive pixel density © IMEC 2012
- 43. EARLY DETECTION ▸ E l d Early detection of cancer i f cells ▸ Secondary tumors are y main cause of most cancer deaths ▸ Challenge: detecting one in 5 billion cells © IMEC 2012
- 44. INSPECTION CIRCUITS ▸ Chi with thousands of Chip i h h d f parallel inspection circuits ▸ Each containingg electronics, microfluidics & imaging hardware ▸ Goal: inspect 20 million cells per second with high reliability © IMEC 2012
- 46. STEM CELLS ▸ T Treat diabetes patients by di b i b replacing faulty pancreas cells with new pancreas cells ▸ Reprogrammed on the basis of own stem cells © IMEC 2012
- 47. STEM CELL BIOREACTOR ▸ G Growing cells & tissues on i ll i chips ▸ Two-way communication y between electronics & cells ▸ Expertise in electrode arrays on active CMOS for cell recording of neurons & cardiac cells di ll © IMEC 2012
- 48. PRECISE REPROGRAMMING ▸ Ch ll Challenge: a platform f l f for precise reprogramming and growth of stem cells ▸ Built on expertise in advanced semiconductor equipment & advanced metrology © IMEC 2012
- 49. NERF LAB ▸ I Imec & VIB & KU Leuven L ▸ Unraveling the human brain ▸ Research interests: - sensory integration & processing i the i in h zebrafish brain - neural circuits & behavior - functional assembly of neural circuits l i it © IMEC 2012
- 51. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 52. WIRLESS SENSORS ▸ Improving connectedness ▸ Smarter world: - smart healthcare - smart buildings - smart phone - smart display © IMEC 2012
- 53. WIRELESS COMMUNICATION ▸ Innovative solutions for tomorrow’s wireless communication ▸ By combining advanced IC technology with innovative design strategies & smart software techniques ▸ Fully-integrated energy- efficient solutions with more performance & flexibility y © IMEC 2012
- 54. RECONFIGURABLE RADIOS ▸ Towards low cost & low low-cost low- power reconfigurable radios ▸ Enabling future 4G networks and digital video broadcasting ▸ Reconfigurable analog front- front end ▸ Reconfigurable digital baseband b b d ▸ Spectrum sensing ▸ Record breaking ADCs © IMEC 2012
- 55. mmWAVE SOLUTIONS ‣ Wireless solutions that exploit the bandwidth capacity available at 60GHz for h t 60GH f short-range Gigabit/s communication ‣ Radar & backhaul applications emerging © IMEC 2012
- 56. ULTRA LOW ULTRA-LOW POWER RADIOS ‣ Radios for battery & energy harvested devices with power consumption that i 10 100 times l th t is 10-100 ti lower than conventional low- power systems © IMEC 2012
- 57. PARTNERS W S WIRELESS TECHNOLOGY SS C O OG
- 58. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 59. TARGET MARKETS ▸ Space p ▸ Instrumentation ▸ Machine vision ▸ Medical ▸ Biology © IMEC 2012
- 60. SPECIALIZED IMAGING ▸ Ultra fast ▸ Non-visible light ▸ Enhanced performance ▸ Hyperspectral ▸ Lensless © IMEC 2012
- 61. ULTRA FAST IMAGING Challenge g ▸ Fast readout at low power consumption ▸ Towards million frames/sec Building on imec expertise: ▸ High speed ADCs ▸ Embedded CCD © IMEC 2012
- 62. IMAGING NON VISIBLE LIGHT ▸ Fully qualified EUV sensors yq installed in customer’s product: ASML/3100 lithography tool - EUV Energy sensor to monitor EUV dose - 2 EUV position sensors to calibrate, align and focus lens systems © IMEC 2012
- 63. ENHANCED PERFORMANCE ▸ Backside illumination for: - High quantum efficiency - Broad spectral range from 193nm to 1μm © IMEC 2012
- 64. HYPERSPECTRAL IMAGING Advantages: g ▸ More spectral information (than RGB) ▸ Extreme miniaturization ▸ Low cost ▸ High speed ▸ Wafer-level filter integration © IMEC 2012
- 65. LENSLESS Microscopic imaging over a p g g large area Biomedical applications: ▸ Cell sorting & monitoring (flow cytometry) ▸ Molecular diagnostics (biomarkers assays) 150 µm ▸ DNA sequencing © IMEC 2012
- 66. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 67. APPLICATIONS ‣ Smart buildings g ‣ Preventive maintenance ‣ Logistics ‣ Automotive ‣ Monitoring environmental parameters © IMEC 2012
- 68. SENSOR SYSTEMS ‣ Long-time autonomy g y ‣ Ultra-low power wireless solutions: 10 – 100 times lower than conventional low-power systems p y © IMEC 2012
- 69. MEMS HARVERSTER ‣ Piezoelectric harvesters ‣ MEMS harvester to power intelligent tire ‣ Record output of 489µW © IMEC 2012
- 70. ETHYLENE SENSOR ‣ Sensor in one single chip g p ‣ Monitor fruit ripening ‣ Low detection limits low limits, cost, low power consumption © IMEC 2012
- 71. 2.3/2.4 GHZ TRANSMITTER ‣ Multi-standard transceiver for sensor networks ‣ 2.3/2.4GHz transmitter for wireless sensor applications compliant with 4 wireless standards ‣ 3 to 5 times more power efficient than state-of-the- art Bl Bluetooth LE h © IMEC 2012
- 72. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 73. ENERGY STRATEGY ▸ Solar energy generation ▸ Switching energy ▸ Storing energy ▸ Saving energy © IMEC 2012
- 74. SILICON PV
- 75. COMBINING EXPERTISE ▸ Process steps ▸ Materials ▸ Device/module concepts p Towards world record performance © IMEC 2012
- 76. SILVER REPLACEMENT ▸ 7% of all silver used in PV ▸ A major part of PV cell cost is silver ▸ Replacing silver by copper © IMEC 2012
- 77. Cu PLATED Cu-PLATED Si SOLAR CELL ▸ Copper electroplating ▸ >21% efficiency © IMEC 2012
- 78. INTERDIGITATED BACK-CONTACT Si SOLAR CELL ▸ > 23% efficiency © IMEC 2012
- 79. I MODULE I-MODULE ▸ Cell integration of ultra ultra- thin wafers onto module glass ▸ Integrating additional electronics to module for p power conversion & load optimization © IMEC 2012
- 81. OPV
- 82. ORGANIC CELLS ▸ Towards: - 10% efficiency - 10 years lifetime © IMEC 2012
- 83. INVERTED POLYMER CELL ▸ World record efficiency 8,3% © IMEC 2012
- 84. COMBINING EXPERTISE ▸ Materials and cell architectures ▸ Collaboration between world-class chemical companies, innovative developers & imec d l © IMEC 2012
- 85. GaN on Si GaN-on-Si LEDs ▸ LED on 200mm GaN-on- Si wafers ▸ To make LEDs cheaper © IMEC 2012
- 86. GaN on Si GaN-on-Si LEDs ▸ Process flow fully compatible with 200mm CMOS processing line © IMEC 2012
- 87. GaN ON Si GaN-ON-Si power devices ▸ GaN power devices on 200mm Si substrates © IMEC 2012
- 88. OLED ▸ New flexible OLED lighting program ▸ Economically scalable route to high-volume manufacturing ▸ Low power consumption, high resolution, large area, outdoor readability, flexibility & light weight © IMEC 2012
- 89. GaN PARTNERS 25 year solar cell research
- 90. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 91. CMORE MEMS NANO-PHOTONICS ‣ Turn your silicon concept y p into a product SENSORS POWER-HIGH V-HBT BIO-INTERFACE GaN © IMEC 2012
- 92. CMORE PRO STEP 1 STEP 4 OTOTYPIN - CONCEPT DESIGN - PROTOTYPING - LOW-VOLUME MANUFACTURING AT IMEC ‣ Turn your silicon concept y p NG LOPMENT into a product STEP 2 STEP 5 - PROCESS DEVELOPMENT - TRANSFER O-)DEVEL - PACKAGING - TESTING - RELIABILITY (CO STEP 3 STEP 6 PRODUCTION - PRODUCT - HIGH-VOLUME QUALIFICATION MANUFACTURING AT FOUNDRY PARTNER © IMEC 2012
- 93. EUV SENSORS ‣ High-quality EUV sensors g q y for ASML’s next-generation lithography tools ‣ Main requirements: - superior lifetime - sensitivity to direct and y high doses of EUV irradiation ‣N Next generation: i - NXE:3100 - NXE: 3300 © IMEC 2012
- 94. BIOSENSORS ‣ Biosensor chips for p Genalyte diagnostic & molecular detection equipment ‣ CMORE service making use of imec’s silicon photonic p technology © IMEC 2012
- 95. CMORE PARTNERS
- 96. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 97. SYSTEM ON FOIL Thin-film electronics on flexible plastic foils Applications: ▸ rollable displays for tablet computers or phones p p ▸ electronics printed on objects ▸ intelligent food packaging, or paper with integrated electronics © IMEC 2012
- 98. MICROPROCESSO R ▸ First microprocessor p © IMEC 2012
- 100. BUSINESS MODEL Services Training Spin-offs Transfer & licenses Joint R&D © IMEC 2012
- 101. OPEN INNOVATION IP Risk Ri k Services Training Cost Talent Spin- Transfer & offs licenses Joint R&D Accelerated, cost-effective R&D ff © IMEC 2012
- 102. OPEN Partner INNOVATION A Partner Partner E B Program Services Training Partner Partner Spin- Transfer & D C offs licenses Joint R&D Imec i d t i l affiliation program I industrial ffili ti Customized programs © IMEC 2012
- 103. RESEARCH PROGRAMS System Services Training Fabless Fablite Logic IDM Spin- Transfer & Memory IDM Foundries offs licenses Suppliers Joint Material Equipment R&D Suppliers Suppliers EDA SAT © IMEC 2012
- 104. RESEARCH PROGRAMS FOR FULL INDUSTRY ECO SYSTEM Memory IDM Logic IDM Foundries Fablite Fabless The image cannot be display ed. Your computer may not hav e enough memory to open the image, or the image may hav e been corrupted. Restart y our computer, and then open the file again. If the red x still appears, y ou may hav e to delete the image and then insert it again.
- 105. SERVICES ▸ ASIC services: - Design - Prototyping to low-volume ▸ CMORE platform: - Design Services Training - Process techn. development - Prototyping to low- Spin- Transfer & volume offs licenses ▸ CAMS: - A unique set of reliability and q y Joint characterization services R&D © IMEC 2012
- 106. TRAINING ▸ Imec Academy y ▸ Training for industry & academia on advanced concepts and technologies ▸ Advanced training programs on IC technology Services Training and design and related ▸ E-learning and web-based training ▸ On-line knowledge exchange Spin- Transfer & offs licenses Joint R&D www.imec-academy.be © IMEC 2012
- 107. SPIN OFFS SPIN-OFFS Services Training Spin- Transfer & offs licenses Integrated in Synopsis Inc. Integrated in Cypress g yp Integrated in Agilent Technologies T h l i Joint R&D Integrated in ARM Belgium Integrated in Huawei Alphabit & UCB Electronics integrated in Agilent Technologies Cobrain integrated in Matrix Integrated Systems, Inc. © IMEC 2012
- 108. TRANSFER & LICENSES ▸ Process steps, modules, technologies: 65nm and 28nm CMOS platform ▸ IP blocks: Services Training - ADCs - Software-defined radio - Reconfigurable processor Spin- Transfer & -… offs licenses Joint R&D © IMEC 2012
- 109. IMEC IN FLANDERS
- 110. LEVERAGE TO FLANDERS With a dedicated team stimulating, initiating & coordinating cooperation with Flemish companies & innovation actors Exploration, transfer & consolidation in Flanders Worldwide industrial network of top companies Build-up Build up of technology portfolio in generic R&D Programs
- 111. COOPERATION WITH LOCAL COMPANIES / ACTORS Timely insight Participation in and inputs for LT/MT/ST LT research researchh 1 few Sharing Focussed added value Application of pp technological research results know-how Cooperation with Support for Informing about development of technological local new products d opportunities companies/actors and processes 1 many 1 1 Low threshold High threshold Generic added value Specific added value
- 112. EXPANSION MODEL: MICROELECTRONICS FOR BENEFIT OF OTHER SECTORS Textile Automotive Biomedic Food al Electronic Design Construction Health & Wellness
- 113. IMEC’S IMPACT ON THE LOCAL INDUSTRY EVOLUTION COLLABORATION LOCAL COMPANIES 600 1984 2001: 500 142 local companies 486 464 2002 2011: 447 344 extra local companies, 411 400 >60% SME’s! 381 350 306 300 261 222 200 166 142 127 102 110 86 100 74 57 45 26 32 0 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011
- 114. OUR PARTNERS 3 66 4 10 38 8 11 32 9 15 Hasselt 10 20 8 102 68 24 58 PARTNERS SPREAD OUT OVER FLANDERS
- 115. A SAMPLE OF THE FLEMISH PARTNERS
- 116. COOPERATION IN DIFFERENT SECTORS 2011 WITH LOCAL COMPANIES 22% 34% Microelectronics Non-ICT Textile Automotive Medical Food Graphics Wellness 26% Health H lth Chemical 18% Electronic prod. Construction ICT (others) Domotics