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TM
Where IP Matters
June 2014
ChipStart LLC - CONFIDENTIALVer. 14.2
TM
Mission Statement
ž  To be the leading supplier of integrated,
next-generation semiconductor intellectual
property System-on-Chip subsystems and
silicon solutions, accelerating the
implementation and realization of our
customers products
18 July 2014 ChipStart LLC - CONFIDENTIAL
We Differentiate Your
Core Competence
TM
Chipstart Management
ChipStart LLC - CONFIDENTIAL
Director Position Background
Howard Pakosh President & CEO Virage Logic, Magma Design Automation, Synopsys and TEAM
Corporation
Former co-founder of Xentec, a startup focusing on
semiconductor IP sold to InSilicon (December 2000), then
acquired by Synopsys (March 2002)
Mark De Souza Executive VP & COO Virage Logic, Ikos Systems, ST Microelectronics and De Beers
Former co-founder of Atinec, a VC-funded EDA Startup
focusing on simulation acceleration
Chris Keil VP Business Development RMI, Virage Logic, Novocell Semiconductor, LSI Logic and
TEAM Corporation
Jim Fleury Director, Architectural BU Intel, MIPS, ARC, Sonics, VAST Systems and Tensilica
TM
ChipStart
Global
Northeast/Canada
Boston, Toronto,
Ottawa
Silicon Valley
San Jose
Santa Clara
Northwest
Portland, Vancouver
Central
Austin, Dallas,
Colorado Springs
Israel
Haifa, Tel Aviv
North
UK , Scandinavia
South
France , Italy, BeNeLux
Central
Germany, Austria
4
ChipStart Offices
Key Customer Centers
China
Key centers: Beijing,
Shanghai, Shenzhen
Taiwan
Key centers:
Hsinshu
Japan
Key centers: Tokyo,
Yokohama
Korea
Key centers: Seoul
North America
Europe
Asia
SSM R&D Center
Irvine, CA
Memory R&D
Center
Kiev
TM
ChipStart
Strategic Solution Initiatives
ž  Objectives
—  Offer “Best-in-Class” solutions to its customers
—  Differentiated from other manufacturers reps
because ChipStart is adding value to each
customer engagement
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
ChipStart
Strategic Solution Initiatives
MemStart
Memory Subsystem Solution
TekStart©
Sales & Marketing Development
Services
HMCC
Hybrid Memory Cube Controller
MemGen
Low Voltage/Low Power
Memory Compiler Solutions
ChipStart LLC - CONFIDENTIAL
SSM©
SoC System Manager
InterStart
Interface Subsystem Solution
TM
Architecture Tape OutRTL Design
Physical
Layout
Architectural IP
§ System-level management
§ Processors
§ Register management
§ Bus fabric selection
Typical Design Cycle
ChipStart LLC - CONFIDENTIAL
Verification
Finalize Foundry Selection
Digital / Security IP
§ RTL macros
§ Digital audio and/or video subsystems
§ Protocol selection
§ Various controllers
§ Memory scheduling and arbitration
Foundation or Physical IP
§ Standard cells, embedded memories
and various I/O
§ High-speed I/O
§ PLL/DLL
§ PHYs or SERDES
§ Various analog/mixed-signal macros
Wherever IP is selected at various
points in the design cycle…
ChipStart is there!
As an IP Developer, ChipStart
enters the sales cycle here.
As an IP Integrator, ChipStart
enters the sales cycle here.
As an IP Aggregator, ChipStart can
enter the sales cycle anywhere.
TM
ChipStart IP Portfolio
DDR or
HMC
PHY
PLL
Digital
IP
Foundation
IP
Architectural IPInterface
IP
ADC
DAC
AFE
DDR Memory
Scheduler
FEC/
LDPC
SoC
System
Manager
AXI/AHBBusFabric/Interconnect
H.264
HEVC
VP9
SRAM
OTP
TCAM/
BCAM
Low Power
SRAM
HDMI/
HDP HDMI PHY
PCI
MIPI
MIPI
PHY
SATA
USB
Multiprotocol
PHY
DDR or
HMC
Re-Configurable
or Hardened
Processors
Embedded
FPGA
Security IP
TM
Semiconductor IP Platforms
Memories
Logic
I/O
Other
Digital or Physical
IP Components
Portable &
Handheld
Consumer
Computer &
Graphics
Communications
& Networking
Single Source for Best-in-Class
Semiconductor IP Components
TM
Integrated Subsystem Solutions
Controller & PHY VIP
HMC Late Q3/14
DDR 2/3/4 Available
PCI II/III Semi-Integrated
MIPI Semi-Integrated
SATA II/III
Semi-Integrated
USB II/III Available
TM
Subsystem Solution Map
Controller PHY Verification
HMC
a. TekStart
b. Northwest Logic
a.  Avago
b.  OmniPHY
Pico
DDR 2/3/4
a. Uniquify
b. Northwest Logic
a.  Uniquify
b.  Dolphin
c.  SilabTech
Avery Design
PCI II/III Northwest Logic
a.  Mixel
b.  SilabTech
Avery Design
MIPI Northwest Logic
a.  Mixel
b.  SilabTech
SmartDV
SATA II/III
a.  ASICS WS
b.  Faraday
a.  SilabTech
b.  Terminus Circuits
SmartDV
USB II/III
a.  ASICS WS
b.  Faraday
a.  Faraday (UMC)
b.  SilabTech
c.  Terminus Circuits
Avery Design
TM
ChipStart Partner Map
18 July 2014 ChipStart LLC - CONFIDENTIAL
Architectural
SSM
• A2
• Adveda
• Argon Design
• Digital Core Design
•  8-bit (8051)
•  16-bit
•  Peripherals
Digital/Soft IP
SecureStart
• ADICSYS
• Aizyc Technology
• Coreworks
• Chips&Media
• IP Cores
• Memoir Systems
• Northwest Logic
• Ocean Logic
• Performance-IP
• TekStart HMC
Physical/Hard IP
MemStart
TestStart
Analog IP EcoSystem
• Berkeley Design
• Chipus
• Dolphin Technology
• DXCorr
• Mixel
• Moortec
• nSilition
• Sankalp Semi
• SilabTech
• Silicon Basis
• SOFICS
• Terminus Circuits
• Uniquify
• Vivid Engineering
Services
IP Integration
Physical Design
Verification
• Avery Design Systems
• ChipStart Services
•  Memory Design
• DELTA Microelectronics
•  Turnkey Services
•  Foundry
• SmartDV
• TeamEDA
* 2014 Featured
TM
ChipStart Strategic Solution Partners
ChipStart LLC - CONFIDENTIAL
SANKALP
s e m i c o n d u c t o r
avery
design systems
Berkeley Analog
ocean logic!
TM
14
Single License Agreement
ChipStart LLC CONFIDENTIAL
ž  Selling IP on technical merit only ½ the job
ž  License negotiation is PAINFUL for both buyer and seller
—  Warranty
—  Indemnification
—  Liabilities
ž  Insurance Broker Comparison
—  Do you buy car, home, life and medical insurance from 4 different underwriters?
—  Most choose to work with a broker
○  Broker’s value: Combining policies to create a lower price in a fraction of the time
it would take to negotiate all separately
ž  By combining multiple IP’s on one agreement Chipstart offers:
—  Multi-product discount
—  Majority of ChipStart vendor partners participate
—  License Agreement underwritten by industry-leading insurance underwriter
—  Customer allowed to mitigate risk by adding higher liability amounts
Our Number 1 Value-Add!
TM
IP Cores and Embedded Software
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
2014 – Embedded Solutions
ž  High-Performance HMC Controller
ž  Memory Request Optimizer
ž  L2+ Cache
ž  High-Performance DMA Controller
ž  Processors and Peripherals
—  Low Power 8051
—  Configurable, royalty-free 16- and 32-bit CPUs
—  Low cost ARM-compatible CPU’s
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
2014 - Micron HMC Memory
Comparison to DDR4/3
ChipStart LLC - CONFIDENTIAL
TM
2014 - TekStart HMC Controller Core
ž  Availability
—  FPGA version
○  Available Now
—  Full ASIC release
○  Available October 2014
ž  Validated on the Pico
FPGA platform
—  Xilinx Ultrascale E800 Pico
Computing Board
—  Altera Stratix-V EX-800 Pico
Computing Board
ChipStart LLC - CONFIDENTIAL
TM
2014 - HMC Solution
ž  Complete ASIC (digital) core solution
ž  PHY Partners include:
—  Avago (available today)
—  OmniPHY (Q1 2015)
ChipStart LLC - CONFIDENTIAL
TM
2014 - HMC Key Features
ž  HMC Spec Compliant
—  Full-width Link and Half-width Link support
—  10, 12.5, 15 Gbit/s lane support
ž  ASIC & FPGA support
—  Delivered integrated with target PHY
ž  1024 and 512 bit Core Width options
—  Enables clock frequency to be tailored to target technology,
easing timing closure
ž  MultiPort AXI-4 Interface option
—  AXI-4 widths: 1024, 512, 256, 128, 64 bits
—  Up to 32 ports
—  AXI-3 Support provided with wrapper file
ChipStart LLC - CONFIDENTIAL
TM
2014 - HMC Spec Compliance
ž  All HMC Controller Abstraction
Layers
—  Transaction Layer
—  Link Layer
—  Logical Sub-block of Physical layer
ž  Link initialization and training
ž  Retries
ž  CRC generation and checking
ž  Link management and monitoring
ž  Link layer flow control
ž  Support for HMC device chaining
ž  Low power mode support
ž  Atomic command support
ž  Bit write commands
ChipStart LLC - CONFIDENTIAL
Target	
  Clock	
  Frequencies	
  (ASIC)	
  
Link	
  
Lane	
  Rate	
  (GB/
s)	
  
Core	
  Width	
  
(Bits)	
   Core	
  Freq	
  (MHz)	
  
	
  	
   	
  	
   	
  	
   	
  	
  
Full	
   15	
   1024	
   234	
  
Full	
   10	
   1024	
   156	
  
	
  	
   	
  	
   	
  	
   	
  	
  
Full	
   15	
   512	
   469	
  
Full	
   10	
   512	
   313	
  
Half	
   15	
   512	
   234	
  
Half	
   10	
   512	
   156	
  
TM
2014 - HMC PHY Support
ž  Third-party PHYs supporting HMC
—  Avago (30GB/s), available today
—  OmniPHY (30GB/s), available Q1/2015
ž  HMCC is fully integrated and validated with the
specified PHY
—  Licensing options available upon request
ž  Support & Maintenance
—  TekStart provides full support for the controller or the
integrated controller/PHY solution
—  PHY vendor collaboration ensures all customer questions
are addressed
ChipStart LLC - CONFIDENTIAL
TM
www.Performance-IP.com – Company Confidential
– NDA Required
2014 - Memory Request Optimizer
●  Reduces Latency
●  Reduces Bandwidth
●  Works with multiple clients
●  Widely divergent requests
●  Programmable Optimization
●  None, Low, Moderate, & Aggressive
●  Dramatic reduction in read latency across
all applications and all MRO modes
●  Resulted in an increase in CPU IPC
MRO
Optimization
% of IPC Improvement
App1 App2
MP3
Decode
Mode 1 11.1 14.0 8.8
Mode 2 13.0 14.0 14.1
Mode 3 14.4 15.5 15.7
TM
2014 - L2+ Cache
ž  Features:
—  Configurable Level2 Cache
○  Cache Size
○  Number of Ways
○  Cache Line Size
—  Memory Tracker TechnologyTM
—  Control Registers accessed via
Processor I/F
—  Fully synchronous design, push
button synthesis and static timing
analysis
—  Written in Verilog-2001
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
2014 - DMA Controller
ž  Features:
—  8 Independent DMA Channels
○  Support AXI4 Protocol
○  Configurable AXI Bus Width
○  32b, 64b, or 128b widths supported
○  Supported DMA Transfers
○  Memory to Memory
○  Memory to Peripheral
○  Peripheral to Memory
○  Peripheral to Peripheral
—  Processor Interrupt Support
—  Channel arbiter with two level round-robin arbitration
—  Integrated RAM Buffer
—  Control Registers accessed via AXI4-Lite I/F
—  Fully synchronous design, push button synthesis and static timing
analysis
—  Written in Verilog-2001
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
2014 – Low Leakage Memories
ž  70% Lower Power
—  Includes both active (switching) & standby (leakage)
—  Bit cell is optimized for leakage in a given area target
ž  Enables Single-Rail Design
—  Vmin= Vlogic_min
—  No process cheats
○  Logic rules design
○  No waivers
○  Standard logic process
—  No additional DC-DC converters
ž  Robust Bit Cell
—  Only 2 compilers required (Single-Port, Dual-Port)
○  SP + DP = SP + DP + 1PRF + 2PRF + 2P
ž  Faster Performance Than Foundry HS Bit Cell
ž  Area Efficient
ž  Improved Yield
—  Variation tolerant, highly manufacturable
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
2014 - Hardware/Software
Development Platform
ž  Allows true multicore design
ž  Any number of CPU’s from any number of
CPU vendors
18 July 2014 ChipStart LLC - CONFIDENTIAL
Single or Multiple
Processors
+ Modeled environment+ peripherals (RTL or Model)
Subsystem
TM
2014 - Hardware/Software
Development Platform
ž  Features
—  Unified SW/HW co-verification in single environment
—  Fast cycle-accurate Instruction Set Simulators
—  Simultaneous multi-core simulations in single environment
—  Combining processors of different manufacturers
—  Ultra Fast Verilog & VHDL RTL simulation
—  Cycle-based RTL simulators
—  Static & Dynamic profiler and HDL design navigator
—  Start SW/HW co-verification without hardware target
ž  Benefits
—  Reduction of development time by 30%
—  Increasing “First time right” chance by 80%
—  Software & hardware engineers use the same tool
—  Mutual development and use of SW/HW test benches
—  New (and customer specific) processor types fit in the same tool
—  Splendid return on investment
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
2014 - New Interface IP Solutions
ž  Interface Solutions
—  SD (Secure Digital) Controllers
○  SD4.0 Device (Host in 2014)
○  SDXC3.0
○  SD3.0 Host
○  SD2.0 Host & Device
—  PCIe Controllers
○  PCIe4.0
○  PCIe3.0
○  PCIe2.0
—  USB Controllers
○  USB3.0 Device
○  USB2.0 Host, Device and OTG
18 July 2014 ChipStart LLC - CONFIDENTIAL
ž  Interface Solutions
—  HDCP Security Controllers
○  HDCP2.2 (2014)
○  HDCP2.0
—  MIPI Controllers
○  MIPI SLIMBUS (2014)
ž  Memory Interface Solutions
—  Under NDA
DDR4
—  DDR3
—  DDR2
—  LPDDR4
—  LPDDR3/2
—  Mobile DDR
—  RLDRAM 3
—  RLDRAM 2
—  MRAM
TM
2014 – SerDes/PHY IP Solutions
18 July 2014 ChipStart LLC - CONFIDENTIAL
Segment Standard Data Rate (Gbps)
PCIe
– Graphics, embedded IO’s
•  PCI Express Gen 2
•  PCI Express Gen 3
•  5 Gbps
•  8 Gbps
CEI
– LR, SR
•  CEI 6.4G LR/SR •  6.25Gbps
XFI / SFI •  Optical communications
•  XFI: Specifications at the interface
between SERDES and XFP module
(electro-optical module)
•  SFI: Specifications at the interface
between SERDES and SFF module
(electro-optical module)
•  9.95Gbps to 10.55Gbps
Fibre Channel
– Storage Area Network
•  4GFC
•  8GFC
•  4.25 Gbps
•  8.5 Gbps
Ethernet
– Local and Wide Area Network
•  XAUI
•  KR4: backplane applications
•  10G Ethernet
•  KR: backplane applications
•  CR: copper cable interconnect
•  4x 3.125Gbps . 10GBase-X
•  10.3125Gbps . 10GBase-R
SATA •  SATA G2/G3 •  3 Gbps
•  6 Gbps
SAS •  SAS 6.0G
•  SAS 3.0G
•  6 Gbps
•  3 Gbps
TM
2014 – SerDes/PHY IP Solutions
ž  High-Speed I/O
—  2.5GB / 5GB serdes/PHY
—  6GB / 10GB / 12.5GBPS Multi-protocol serdes/PHY
—  Multi-foundry support
18 July 2014 ChipStart LLC - CONFIDENTIAL
TRANSMITTER
C
O
N
C
O
N
20dB loss 2-connector
TX
PKG
RECEIVER
f
C
P /2
/N
FREF
FREQ
PLL
RX
PKG
FF
E
8:
2 DRV
CL
K
VGA
/
PKA
MP
DFE5
2:8 De-
Ser
CDRPI
TM
2014 – Embedded Sensors
ž  Embedded Temperature Die Sensor
—  Temperature sensing an issue due to
○  Transistor leakage at low geometries
○  High gate densities
○  High clock frequencies
○  Wide process variations across wafer
—  Uses
○  Performance optimization
○  Thermal management
○  Silicon characterization and management
○  Failure management
—  Foundry Support
○  TSMC
—  65LP, 40LP, 40G, 28HP and 28HPM
—  20nm SOI (coming soon)
○  Global Foundries
—  GF28SLP
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
2014 – Embedded FPGA
ž  Why Use eFPGA?
—  Embed programmable functions targeting
functions of limited complexity
—  Prototyping
—  ECO’s or metal/mask fixes
ž  Benefits
—  Reduce costs
—  Reduce system chip count/board area
—  Reduce power consumption
—  Increase performance
—  Maintain cost effective Field
Programmability in production volumes
18 July 2014 ChipStart LLC - CONFIDENTIAL
Equivalent and
re-programmable
RTL block
Prog.
block
bitstream
+
Soft IP
re-useSoft IP re-use
Soft IP re-use
New HDL block
Hard
IP
Hard IP Hard IP
ASIC
Prog.
block
Prog.
block
TM
2014 – PLL Solutions
ž  High-Speed Digital PLL
—  Silicon proven (TSMC 65nm and 40nm)
—  Totally-integrated clock-driver and clock-multiplying-unit IP block
○  No off-chip components
○  Fractional-N division included for non-integer clock multiplication and
spreading
○  Intended for applications such as:
—  CMU in a SERDES block at data rates as high as +15 GBPS
—  Clock-driver applications where the frequencies are not integrally related
—  Specs
○  Frequency: 200MHz and 7.5GHz over process corners
○  Temperature: -40 to 125 degrees C
○  Power: 32mW (@ 5GHz output)
○  Jitter: 1.0pS (accumulated) @ 5GHz
○  Area: 0.11 mm^2
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
2014 – DDR Subsystem Solutions
ž  Integrated DDR
Controller & PHY
—  DDR Controller
○  Includes Patented Self-
Calibrating Logic (SCL)
○  Guarantees the best possible
system-level timing margin
○  Ease of timing closure at high
speed
○  Configures all system level
timing parameters on the fly
—  SCL logic configures all necessary timing
parameters every time system is reset
○  Increases chip/system yield at
production
18 July 2014 ChipStart LLC - CONFIDENTIAL
SSTL/HSTL	
  	
  I/O
SCL/DSCL
TM
2014 – DDR Subsystem Solutions
—  DDR PHY
○  Ultra low power design
○  Eliminates tough DDR timing
issues such as data skew, clock
skew, and setup/hold time
○  Highly automated porting process
—  Port time to new process nodes is 4-6
weeks
○  Reduces risk by eliminating
variability across different byte-
lanes
○  Highly configurable/flexible
—  Compiler is tuned for Industry standard
library set
—  Supports rectilinear shapes
○  Supports industry standard 3rd
party DDR SSTL I/O’s
18 July 2014 ChipStart LLC - CONFIDENTIAL
Tech Process (nm)
Speed
(MHz)
DRAM
type
DRAM Vendor Status
GF 65 G 400 DDR2 Micron Silicon Proven
GF 65 G 800 DDR3 Tapeout in Oct 2011
GF 65 G 600 DDR3 Tapeout Q3 2012
GF 65 G (Emerald) 400 DDR2 Silicon Proven
GF 65G ? LPDDR2
SMIC 533 DDR3 Tapeout Date TBD
SMIC 90 G 400 DDR2 Silicon Proven
TSMC 28HPM 1066 DDR3
Test chip tapeout June
2012
TSMC 28HPM 666 DDR3 Tapeout Q1 2014
TSMC 40 G 900 DDR3 Tapeout in Q4 2012
TSMC 40 G
666 DDR3 Hynix Tapeout in May 2012
2.5V IO oxide
TSMC 40 LP 800 DDR3 Hynix Silicon Proven
TSMC 40G 1.8V IO
oxide
1066 DDR3 Tapeout June 2012
TSMC 40LP 933 DDR3
TSMC 40LP 800 DDR3 Tapeout Q3 2012
TSMC 65 G 533 DDR3 Silicon Proven
TSMC 65G 340 DDR3 Tapeout Date TBD
TSMC 65G 800 DDR3 Silicon Q3 2012
TSMC 65G 800 DDR3
TSMC 65G 800 DDR3
TSMC 65nm LP 166 LPDDR Silicon Proven
TSMC 90 G 800 DDR3
Micron /
Samsung
Silicon Proven
TSMC 90 G (Topaz) 400 DDR2 Etron / Winbond Silicon Proven
TSMC 90LP 333 DDR2 Tapeout Date TBD
UMC 90 LP 166 LPDDR Micron Silicon Proven
TM
2014 – Custom Memory Design
ž  SRAM Memories
—  Great demand for low leakage memories or
memories that operate at lower voltages
—  Optimized for standby power
○  Uses standard Vt and high Vt MOSFETs
—  Deep sleep mode shuts down the power to
all peripheral circuitry and to selected banks
of SRAM cells
—  Conventional row-column physical decoding
—  Segmented bitline architecture used to
improve speed and reduce active power
consumption
—  Foundry Support:
○  TSMC 0.18um down to 28nm HPM
○  GF 0.25um down to 28nm
○  Others available upon request
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
2014 – CAM’s
18 July 2014 ChipStart LLC - CONFIDENTIAL
ž  Industry-leading compilable CAM at advanced process
nodes
—  Allows customers to generate ANY size CAM
○  40Mb monolithic TCAM done for a large networking chip
○  Near-custom CAM at minimal implementation cost
○  Various options
—  Multi-bank,
pipeline and
integrated 2-
cycle CAM-RAM
(lookup)
○  Multiple
architectural
trade-offs to
achieve required
PPA
TM
2014 – Turnkey Design by Delta
ž  Design services
§  Interface at any level from specification to GDSII
§  Experienced team (in-house and partners)
§  Flexible business model
§  IP sourcing and integration
ž  Manufacturing
§  Prototype and high volume test in-house
§  Wafer procurement and production at leading
foundries
§  Package engineering and production at top
assembly houses
§  Failure analysis and qualification
§  Logistics and supply chain management all from
one source
18 July 2014 ChipStart LLC - CONFIDENTIAL
ž  Complete Turnkey Services
—  Total ASIC solutions
—  Design and development
—  Packaging solutions
—  Production & component supply
—  Test development & production testing
—  Component qualification
—  Materials & component technology
—  Complete Sensor solutions
TM
IP Cores and Embedded Software
18 July 2014 ChipStart LLC - CONFIDENTIAL
TM
Optimizing System Management
in the Platform SoC Era
ChipStart Embedded Solutions
TM
Today’s Performance SoCs Require
Complex System Management
Samsung Apps Processor (iPhone3) OMAP 4
4+ Compute Engines 4-5 Memory Interfaces
More than 1000 Applications
How Do You Guarantee Proper
Hardware State Changes for +1000 Applications?
TM
System Management Complexity
Rises Exponentially with Logic Growth
Source: Advance Tech Marketing
SystemManagement
Complexity
High
Low
Basic
SoC Type
Value Performance
SSM Adoption Range
Based on Complexity
(circa 2011)
TM
System Management Complexity
Has Past a Key Threshold
IP Block (functional test)
Interconnect/Dataflow
(Performance Testing)
Single Application
Sequencing
(Simple H/W State Changes)
Multiple Application
Sequencing
(Complex (aka random)
H/W state changes)
1995
2000
2005
2010
System Operation Verification Complexity
(Logarithmic)
Limited System Management for Multi-
sequencing Means Complex System
Operation Verification and
High Risk Cost/TTM Tradeoffs
When Using Traditional Methods
10X 100X 1000X
Source: Advance Tech Marketing
SoC System Operation
Verification Tasks
TM
High Risk Cost/TTM Tradeoffs Now Driven
By Inadequate SoC Architecture
ž  TradiConal	
  (Host	
  CPU	
  acts	
  as	
  System	
  Manager)	
  
ž  Interconnect	
  Based	
  (Adding	
  Control	
  to	
  Data	
  Flows)	
  
These Approaches Were Not Designed to Manage
1000+ Applications Using the Same Device
Host
CPU
IP
Core
IP
Core
I/O
IP
Core
IP
Core
Host CPU no longer has adequate visibility and control
For complex Multicore SoCs
Control functions complicate global interconnect design,
experience execution delays, and degrades efficiency
Of high performance data flows
Host
CPU
IP
Core
IP
Core
I/O
TM
Control Plan Architectures
Reduce Complexity and Ease Tradeoffs
System
Controller
Low
Speed
I/O
Media
Engine
High
Speed
I/O
DRAM
Controller
DSPCPU
Global Interconnect
Control Plane
System
Controller
Low
Speed
I/O
Media
Engine
High
Speed
I/O
DRAM
Controller
DSPCPU
Global Interconnect
Control Plane
• Separation of control and data planes
make BOTH more efficient
• Independent controller has
adequate visibility for effective
control
• Programmable state management
delivers new levels of software/hardware
coupling and implementation flexibility
required for high numbers of applications
• Subsystem IP approach delivers new abstraction layers that
enables system management development acceleration and high
reuse
TM
Semico Forecasts High System
Management IP Growth
$0
$20
$40
$60
$80
$100
$120
$140
$160
$180
2010* 2011* 2012* 2013* 2014* 2015*
MDollars
$0
$100
$200
$300
$400
$500
$600
$700
$800
$900
$1,000
TotalMDollars
Multi Media System Resource Mgmt. Memory Security Computing Communications Video Total
TM
Transforming SoC Architecture Using
System Management Subsystem IP
ž  Complexity	
  levels	
  now	
  dictate	
  that	
  System	
  Management	
  
become	
  an	
  architecture	
  element	
  not	
  an	
  implementaCon	
  
aKerthought	
  
ž  Control	
  plane	
  architectures	
  introduce	
  new	
  flexibility	
  that	
  
improves	
  	
  system	
  management	
  effecCveness	
  and	
  promotes	
  
high	
  reuse	
  
ž  Subsystem	
  IP	
  approach	
  introduces	
  the	
  abstracCon	
  layers	
  
needed	
  to	
  cost	
  effecCvely	
  manage	
  the	
  system	
  operaCon	
  
complexity	
  explosion	
  
Make vs. Buy Rapidly Favoring Outsourcing
TM
49
SSM Advantages
ž  Simplifies accessibility and control of all managed IP
blocks
ž  Guaranteed synchronization between hardware and
software while executing complex sequences
ž  Virtualization of system management functions
—  Compartmentalizes instantiation dependencies
—  Improves software’s ability to control hardware
Saves Time and Money
Offers SoC Architecture Consistency
TM
50
SSM Subsystem Components
ž  Hardware (Soft IP)
—  SSM Controller
—  SSM Register bus connection
ž  Software
—  Microkernel API
—  Request translator
—  Drivers
TM
51
SSM Addresses Key System Issues
ž  Standardizes Management of Key System Functions
—  Power, security, error recovery, boot sequencing
ž  Eases Hardware Software Integration
ž  Provides A Reusable Architecture Across Many SoCs
A Subsystem Suited for Universal Adoption
TM
ChipStart Overall Summary
ž  ChipStart is the only, independent, one-stop semiconductor
IP solution alternative to ARM and Synopsys
ž  Delivering value as an IP Developer
—  System Level Management IP Solutions
—  Low voltage/Low power Memory Compilers
—  Integrated, On-Chip Voltage Regulators
ž  Delivering value as an IP Integrator
—  Subsystem Solutions oriented
ž  Delivering value as an IP Aggregator
—  Single License Agreement for IP Solutions
ž  Talented team
—  >350 years semiconductor IP experience
TM
ChipStart Contact Page
www.chip-start.com
ChipStart LLC
228 Hamilton Avenue 3rd Floor
Palo Alto, CA 94301
Toll-Free: (855) IP-MATTERS
International: +1.650.204.7883
Email: info@chip-start.com
ChipStart UK
Maidenhead, Berkshire SL6 4LZ
Office: +44 16 2856 6596
Eastern USA/Canada
Oakville, ON L6J 0A2
Office: +1.905.634.6688
Fax: +1.905.592.2048
Northwest USA
Evergreen, CO 80439
Office: +1. 303.506.1088
ChipStart France
91570 Bievres
Office: +33 6 82 65 28 08
ChipStart Japan
Suite 405, 1296-2 Suenaga, Takatsu-ku Kawasaki
Kanagawa 213-0013
Office: +81 90 3222 3085
ChipStart China - Shenzhen
15-18B, Hai Yin Chang Cheng, Nanshan District
Shenzhen, 518048 China P.R.C.
Office: +86 186 0300 6982
ChipStart Taiwan
5, No. 2, Lane 37, Jieyun Rd. Sanchong District
New Taipei City 241, Taiwan R.O.C.
Office: +886-955062842
ChipStart China - Shanghai
608R, building 6th, No.1050, WuZhing Rd.
Shanghai, 201103 China P.R.C.
Office: +86 13817105679
ChipStart Korea
1310,Daejong Bldg.143-48 Samseong-Dong
Gangnam-Gu
Seoul 139-090, South Korea
Office: +82 10 2205 3760

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ChipStart Corporate Overview

  • 1. TM Where IP Matters June 2014 ChipStart LLC - CONFIDENTIALVer. 14.2
  • 2. TM Mission Statement ž  To be the leading supplier of integrated, next-generation semiconductor intellectual property System-on-Chip subsystems and silicon solutions, accelerating the implementation and realization of our customers products 18 July 2014 ChipStart LLC - CONFIDENTIAL We Differentiate Your Core Competence
  • 3. TM Chipstart Management ChipStart LLC - CONFIDENTIAL Director Position Background Howard Pakosh President & CEO Virage Logic, Magma Design Automation, Synopsys and TEAM Corporation Former co-founder of Xentec, a startup focusing on semiconductor IP sold to InSilicon (December 2000), then acquired by Synopsys (March 2002) Mark De Souza Executive VP & COO Virage Logic, Ikos Systems, ST Microelectronics and De Beers Former co-founder of Atinec, a VC-funded EDA Startup focusing on simulation acceleration Chris Keil VP Business Development RMI, Virage Logic, Novocell Semiconductor, LSI Logic and TEAM Corporation Jim Fleury Director, Architectural BU Intel, MIPS, ARC, Sonics, VAST Systems and Tensilica
  • 4. TM ChipStart Global Northeast/Canada Boston, Toronto, Ottawa Silicon Valley San Jose Santa Clara Northwest Portland, Vancouver Central Austin, Dallas, Colorado Springs Israel Haifa, Tel Aviv North UK , Scandinavia South France , Italy, BeNeLux Central Germany, Austria 4 ChipStart Offices Key Customer Centers China Key centers: Beijing, Shanghai, Shenzhen Taiwan Key centers: Hsinshu Japan Key centers: Tokyo, Yokohama Korea Key centers: Seoul North America Europe Asia SSM R&D Center Irvine, CA Memory R&D Center Kiev
  • 5. TM ChipStart Strategic Solution Initiatives ž  Objectives —  Offer “Best-in-Class” solutions to its customers —  Differentiated from other manufacturers reps because ChipStart is adding value to each customer engagement 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 6. TM ChipStart Strategic Solution Initiatives MemStart Memory Subsystem Solution TekStart© Sales & Marketing Development Services HMCC Hybrid Memory Cube Controller MemGen Low Voltage/Low Power Memory Compiler Solutions ChipStart LLC - CONFIDENTIAL SSM© SoC System Manager InterStart Interface Subsystem Solution
  • 7. TM Architecture Tape OutRTL Design Physical Layout Architectural IP § System-level management § Processors § Register management § Bus fabric selection Typical Design Cycle ChipStart LLC - CONFIDENTIAL Verification Finalize Foundry Selection Digital / Security IP § RTL macros § Digital audio and/or video subsystems § Protocol selection § Various controllers § Memory scheduling and arbitration Foundation or Physical IP § Standard cells, embedded memories and various I/O § High-speed I/O § PLL/DLL § PHYs or SERDES § Various analog/mixed-signal macros Wherever IP is selected at various points in the design cycle… ChipStart is there! As an IP Developer, ChipStart enters the sales cycle here. As an IP Integrator, ChipStart enters the sales cycle here. As an IP Aggregator, ChipStart can enter the sales cycle anywhere.
  • 8. TM ChipStart IP Portfolio DDR or HMC PHY PLL Digital IP Foundation IP Architectural IPInterface IP ADC DAC AFE DDR Memory Scheduler FEC/ LDPC SoC System Manager AXI/AHBBusFabric/Interconnect H.264 HEVC VP9 SRAM OTP TCAM/ BCAM Low Power SRAM HDMI/ HDP HDMI PHY PCI MIPI MIPI PHY SATA USB Multiprotocol PHY DDR or HMC Re-Configurable or Hardened Processors Embedded FPGA Security IP
  • 9. TM Semiconductor IP Platforms Memories Logic I/O Other Digital or Physical IP Components Portable & Handheld Consumer Computer & Graphics Communications & Networking Single Source for Best-in-Class Semiconductor IP Components
  • 10. TM Integrated Subsystem Solutions Controller & PHY VIP HMC Late Q3/14 DDR 2/3/4 Available PCI II/III Semi-Integrated MIPI Semi-Integrated SATA II/III Semi-Integrated USB II/III Available
  • 11. TM Subsystem Solution Map Controller PHY Verification HMC a. TekStart b. Northwest Logic a.  Avago b.  OmniPHY Pico DDR 2/3/4 a. Uniquify b. Northwest Logic a.  Uniquify b.  Dolphin c.  SilabTech Avery Design PCI II/III Northwest Logic a.  Mixel b.  SilabTech Avery Design MIPI Northwest Logic a.  Mixel b.  SilabTech SmartDV SATA II/III a.  ASICS WS b.  Faraday a.  SilabTech b.  Terminus Circuits SmartDV USB II/III a.  ASICS WS b.  Faraday a.  Faraday (UMC) b.  SilabTech c.  Terminus Circuits Avery Design
  • 12. TM ChipStart Partner Map 18 July 2014 ChipStart LLC - CONFIDENTIAL Architectural SSM • A2 • Adveda • Argon Design • Digital Core Design •  8-bit (8051) •  16-bit •  Peripherals Digital/Soft IP SecureStart • ADICSYS • Aizyc Technology • Coreworks • Chips&Media • IP Cores • Memoir Systems • Northwest Logic • Ocean Logic • Performance-IP • TekStart HMC Physical/Hard IP MemStart TestStart Analog IP EcoSystem • Berkeley Design • Chipus • Dolphin Technology • DXCorr • Mixel • Moortec • nSilition • Sankalp Semi • SilabTech • Silicon Basis • SOFICS • Terminus Circuits • Uniquify • Vivid Engineering Services IP Integration Physical Design Verification • Avery Design Systems • ChipStart Services •  Memory Design • DELTA Microelectronics •  Turnkey Services •  Foundry • SmartDV • TeamEDA * 2014 Featured
  • 13. TM ChipStart Strategic Solution Partners ChipStart LLC - CONFIDENTIAL SANKALP s e m i c o n d u c t o r avery design systems Berkeley Analog ocean logic!
  • 14. TM 14 Single License Agreement ChipStart LLC CONFIDENTIAL ž  Selling IP on technical merit only ½ the job ž  License negotiation is PAINFUL for both buyer and seller —  Warranty —  Indemnification —  Liabilities ž  Insurance Broker Comparison —  Do you buy car, home, life and medical insurance from 4 different underwriters? —  Most choose to work with a broker ○  Broker’s value: Combining policies to create a lower price in a fraction of the time it would take to negotiate all separately ž  By combining multiple IP’s on one agreement Chipstart offers: —  Multi-product discount —  Majority of ChipStart vendor partners participate —  License Agreement underwritten by industry-leading insurance underwriter —  Customer allowed to mitigate risk by adding higher liability amounts Our Number 1 Value-Add!
  • 15. TM IP Cores and Embedded Software 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 16. TM 2014 – Embedded Solutions ž  High-Performance HMC Controller ž  Memory Request Optimizer ž  L2+ Cache ž  High-Performance DMA Controller ž  Processors and Peripherals —  Low Power 8051 —  Configurable, royalty-free 16- and 32-bit CPUs —  Low cost ARM-compatible CPU’s 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 17. TM 2014 - Micron HMC Memory Comparison to DDR4/3 ChipStart LLC - CONFIDENTIAL
  • 18. TM 2014 - TekStart HMC Controller Core ž  Availability —  FPGA version ○  Available Now —  Full ASIC release ○  Available October 2014 ž  Validated on the Pico FPGA platform —  Xilinx Ultrascale E800 Pico Computing Board —  Altera Stratix-V EX-800 Pico Computing Board ChipStart LLC - CONFIDENTIAL
  • 19. TM 2014 - HMC Solution ž  Complete ASIC (digital) core solution ž  PHY Partners include: —  Avago (available today) —  OmniPHY (Q1 2015) ChipStart LLC - CONFIDENTIAL
  • 20. TM 2014 - HMC Key Features ž  HMC Spec Compliant —  Full-width Link and Half-width Link support —  10, 12.5, 15 Gbit/s lane support ž  ASIC & FPGA support —  Delivered integrated with target PHY ž  1024 and 512 bit Core Width options —  Enables clock frequency to be tailored to target technology, easing timing closure ž  MultiPort AXI-4 Interface option —  AXI-4 widths: 1024, 512, 256, 128, 64 bits —  Up to 32 ports —  AXI-3 Support provided with wrapper file ChipStart LLC - CONFIDENTIAL
  • 21. TM 2014 - HMC Spec Compliance ž  All HMC Controller Abstraction Layers —  Transaction Layer —  Link Layer —  Logical Sub-block of Physical layer ž  Link initialization and training ž  Retries ž  CRC generation and checking ž  Link management and monitoring ž  Link layer flow control ž  Support for HMC device chaining ž  Low power mode support ž  Atomic command support ž  Bit write commands ChipStart LLC - CONFIDENTIAL Target  Clock  Frequencies  (ASIC)   Link   Lane  Rate  (GB/ s)   Core  Width   (Bits)   Core  Freq  (MHz)                   Full   15   1024   234   Full   10   1024   156                   Full   15   512   469   Full   10   512   313   Half   15   512   234   Half   10   512   156  
  • 22. TM 2014 - HMC PHY Support ž  Third-party PHYs supporting HMC —  Avago (30GB/s), available today —  OmniPHY (30GB/s), available Q1/2015 ž  HMCC is fully integrated and validated with the specified PHY —  Licensing options available upon request ž  Support & Maintenance —  TekStart provides full support for the controller or the integrated controller/PHY solution —  PHY vendor collaboration ensures all customer questions are addressed ChipStart LLC - CONFIDENTIAL
  • 23. TM www.Performance-IP.com – Company Confidential – NDA Required 2014 - Memory Request Optimizer ●  Reduces Latency ●  Reduces Bandwidth ●  Works with multiple clients ●  Widely divergent requests ●  Programmable Optimization ●  None, Low, Moderate, & Aggressive ●  Dramatic reduction in read latency across all applications and all MRO modes ●  Resulted in an increase in CPU IPC MRO Optimization % of IPC Improvement App1 App2 MP3 Decode Mode 1 11.1 14.0 8.8 Mode 2 13.0 14.0 14.1 Mode 3 14.4 15.5 15.7
  • 24. TM 2014 - L2+ Cache ž  Features: —  Configurable Level2 Cache ○  Cache Size ○  Number of Ways ○  Cache Line Size —  Memory Tracker TechnologyTM —  Control Registers accessed via Processor I/F —  Fully synchronous design, push button synthesis and static timing analysis —  Written in Verilog-2001 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 25. TM 2014 - DMA Controller ž  Features: —  8 Independent DMA Channels ○  Support AXI4 Protocol ○  Configurable AXI Bus Width ○  32b, 64b, or 128b widths supported ○  Supported DMA Transfers ○  Memory to Memory ○  Memory to Peripheral ○  Peripheral to Memory ○  Peripheral to Peripheral —  Processor Interrupt Support —  Channel arbiter with two level round-robin arbitration —  Integrated RAM Buffer —  Control Registers accessed via AXI4-Lite I/F —  Fully synchronous design, push button synthesis and static timing analysis —  Written in Verilog-2001 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 26. TM 2014 – Low Leakage Memories ž  70% Lower Power —  Includes both active (switching) & standby (leakage) —  Bit cell is optimized for leakage in a given area target ž  Enables Single-Rail Design —  Vmin= Vlogic_min —  No process cheats ○  Logic rules design ○  No waivers ○  Standard logic process —  No additional DC-DC converters ž  Robust Bit Cell —  Only 2 compilers required (Single-Port, Dual-Port) ○  SP + DP = SP + DP + 1PRF + 2PRF + 2P ž  Faster Performance Than Foundry HS Bit Cell ž  Area Efficient ž  Improved Yield —  Variation tolerant, highly manufacturable 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 27. TM 2014 - Hardware/Software Development Platform ž  Allows true multicore design ž  Any number of CPU’s from any number of CPU vendors 18 July 2014 ChipStart LLC - CONFIDENTIAL Single or Multiple Processors + Modeled environment+ peripherals (RTL or Model) Subsystem
  • 28. TM 2014 - Hardware/Software Development Platform ž  Features —  Unified SW/HW co-verification in single environment —  Fast cycle-accurate Instruction Set Simulators —  Simultaneous multi-core simulations in single environment —  Combining processors of different manufacturers —  Ultra Fast Verilog & VHDL RTL simulation —  Cycle-based RTL simulators —  Static & Dynamic profiler and HDL design navigator —  Start SW/HW co-verification without hardware target ž  Benefits —  Reduction of development time by 30% —  Increasing “First time right” chance by 80% —  Software & hardware engineers use the same tool —  Mutual development and use of SW/HW test benches —  New (and customer specific) processor types fit in the same tool —  Splendid return on investment 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 29. TM 2014 - New Interface IP Solutions ž  Interface Solutions —  SD (Secure Digital) Controllers ○  SD4.0 Device (Host in 2014) ○  SDXC3.0 ○  SD3.0 Host ○  SD2.0 Host & Device —  PCIe Controllers ○  PCIe4.0 ○  PCIe3.0 ○  PCIe2.0 —  USB Controllers ○  USB3.0 Device ○  USB2.0 Host, Device and OTG 18 July 2014 ChipStart LLC - CONFIDENTIAL ž  Interface Solutions —  HDCP Security Controllers ○  HDCP2.2 (2014) ○  HDCP2.0 —  MIPI Controllers ○  MIPI SLIMBUS (2014) ž  Memory Interface Solutions —  Under NDA DDR4 —  DDR3 —  DDR2 —  LPDDR4 —  LPDDR3/2 —  Mobile DDR —  RLDRAM 3 —  RLDRAM 2 —  MRAM
  • 30. TM 2014 – SerDes/PHY IP Solutions 18 July 2014 ChipStart LLC - CONFIDENTIAL Segment Standard Data Rate (Gbps) PCIe – Graphics, embedded IO’s •  PCI Express Gen 2 •  PCI Express Gen 3 •  5 Gbps •  8 Gbps CEI – LR, SR •  CEI 6.4G LR/SR •  6.25Gbps XFI / SFI •  Optical communications •  XFI: Specifications at the interface between SERDES and XFP module (electro-optical module) •  SFI: Specifications at the interface between SERDES and SFF module (electro-optical module) •  9.95Gbps to 10.55Gbps Fibre Channel – Storage Area Network •  4GFC •  8GFC •  4.25 Gbps •  8.5 Gbps Ethernet – Local and Wide Area Network •  XAUI •  KR4: backplane applications •  10G Ethernet •  KR: backplane applications •  CR: copper cable interconnect •  4x 3.125Gbps . 10GBase-X •  10.3125Gbps . 10GBase-R SATA •  SATA G2/G3 •  3 Gbps •  6 Gbps SAS •  SAS 6.0G •  SAS 3.0G •  6 Gbps •  3 Gbps
  • 31. TM 2014 – SerDes/PHY IP Solutions ž  High-Speed I/O —  2.5GB / 5GB serdes/PHY —  6GB / 10GB / 12.5GBPS Multi-protocol serdes/PHY —  Multi-foundry support 18 July 2014 ChipStart LLC - CONFIDENTIAL TRANSMITTER C O N C O N 20dB loss 2-connector TX PKG RECEIVER f C P /2 /N FREF FREQ PLL RX PKG FF E 8: 2 DRV CL K VGA / PKA MP DFE5 2:8 De- Ser CDRPI
  • 32. TM 2014 – Embedded Sensors ž  Embedded Temperature Die Sensor —  Temperature sensing an issue due to ○  Transistor leakage at low geometries ○  High gate densities ○  High clock frequencies ○  Wide process variations across wafer —  Uses ○  Performance optimization ○  Thermal management ○  Silicon characterization and management ○  Failure management —  Foundry Support ○  TSMC —  65LP, 40LP, 40G, 28HP and 28HPM —  20nm SOI (coming soon) ○  Global Foundries —  GF28SLP 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 33. TM 2014 – Embedded FPGA ž  Why Use eFPGA? —  Embed programmable functions targeting functions of limited complexity —  Prototyping —  ECO’s or metal/mask fixes ž  Benefits —  Reduce costs —  Reduce system chip count/board area —  Reduce power consumption —  Increase performance —  Maintain cost effective Field Programmability in production volumes 18 July 2014 ChipStart LLC - CONFIDENTIAL Equivalent and re-programmable RTL block Prog. block bitstream + Soft IP re-useSoft IP re-use Soft IP re-use New HDL block Hard IP Hard IP Hard IP ASIC Prog. block Prog. block
  • 34. TM 2014 – PLL Solutions ž  High-Speed Digital PLL —  Silicon proven (TSMC 65nm and 40nm) —  Totally-integrated clock-driver and clock-multiplying-unit IP block ○  No off-chip components ○  Fractional-N division included for non-integer clock multiplication and spreading ○  Intended for applications such as: —  CMU in a SERDES block at data rates as high as +15 GBPS —  Clock-driver applications where the frequencies are not integrally related —  Specs ○  Frequency: 200MHz and 7.5GHz over process corners ○  Temperature: -40 to 125 degrees C ○  Power: 32mW (@ 5GHz output) ○  Jitter: 1.0pS (accumulated) @ 5GHz ○  Area: 0.11 mm^2 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 35. TM 2014 – DDR Subsystem Solutions ž  Integrated DDR Controller & PHY —  DDR Controller ○  Includes Patented Self- Calibrating Logic (SCL) ○  Guarantees the best possible system-level timing margin ○  Ease of timing closure at high speed ○  Configures all system level timing parameters on the fly —  SCL logic configures all necessary timing parameters every time system is reset ○  Increases chip/system yield at production 18 July 2014 ChipStart LLC - CONFIDENTIAL SSTL/HSTL    I/O SCL/DSCL
  • 36. TM 2014 – DDR Subsystem Solutions —  DDR PHY ○  Ultra low power design ○  Eliminates tough DDR timing issues such as data skew, clock skew, and setup/hold time ○  Highly automated porting process —  Port time to new process nodes is 4-6 weeks ○  Reduces risk by eliminating variability across different byte- lanes ○  Highly configurable/flexible —  Compiler is tuned for Industry standard library set —  Supports rectilinear shapes ○  Supports industry standard 3rd party DDR SSTL I/O’s 18 July 2014 ChipStart LLC - CONFIDENTIAL Tech Process (nm) Speed (MHz) DRAM type DRAM Vendor Status GF 65 G 400 DDR2 Micron Silicon Proven GF 65 G 800 DDR3 Tapeout in Oct 2011 GF 65 G 600 DDR3 Tapeout Q3 2012 GF 65 G (Emerald) 400 DDR2 Silicon Proven GF 65G ? LPDDR2 SMIC 533 DDR3 Tapeout Date TBD SMIC 90 G 400 DDR2 Silicon Proven TSMC 28HPM 1066 DDR3 Test chip tapeout June 2012 TSMC 28HPM 666 DDR3 Tapeout Q1 2014 TSMC 40 G 900 DDR3 Tapeout in Q4 2012 TSMC 40 G 666 DDR3 Hynix Tapeout in May 2012 2.5V IO oxide TSMC 40 LP 800 DDR3 Hynix Silicon Proven TSMC 40G 1.8V IO oxide 1066 DDR3 Tapeout June 2012 TSMC 40LP 933 DDR3 TSMC 40LP 800 DDR3 Tapeout Q3 2012 TSMC 65 G 533 DDR3 Silicon Proven TSMC 65G 340 DDR3 Tapeout Date TBD TSMC 65G 800 DDR3 Silicon Q3 2012 TSMC 65G 800 DDR3 TSMC 65G 800 DDR3 TSMC 65nm LP 166 LPDDR Silicon Proven TSMC 90 G 800 DDR3 Micron / Samsung Silicon Proven TSMC 90 G (Topaz) 400 DDR2 Etron / Winbond Silicon Proven TSMC 90LP 333 DDR2 Tapeout Date TBD UMC 90 LP 166 LPDDR Micron Silicon Proven
  • 37. TM 2014 – Custom Memory Design ž  SRAM Memories —  Great demand for low leakage memories or memories that operate at lower voltages —  Optimized for standby power ○  Uses standard Vt and high Vt MOSFETs —  Deep sleep mode shuts down the power to all peripheral circuitry and to selected banks of SRAM cells —  Conventional row-column physical decoding —  Segmented bitline architecture used to improve speed and reduce active power consumption —  Foundry Support: ○  TSMC 0.18um down to 28nm HPM ○  GF 0.25um down to 28nm ○  Others available upon request 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 38. TM 2014 – CAM’s 18 July 2014 ChipStart LLC - CONFIDENTIAL ž  Industry-leading compilable CAM at advanced process nodes —  Allows customers to generate ANY size CAM ○  40Mb monolithic TCAM done for a large networking chip ○  Near-custom CAM at minimal implementation cost ○  Various options —  Multi-bank, pipeline and integrated 2- cycle CAM-RAM (lookup) ○  Multiple architectural trade-offs to achieve required PPA
  • 39. TM 2014 – Turnkey Design by Delta ž  Design services §  Interface at any level from specification to GDSII §  Experienced team (in-house and partners) §  Flexible business model §  IP sourcing and integration ž  Manufacturing §  Prototype and high volume test in-house §  Wafer procurement and production at leading foundries §  Package engineering and production at top assembly houses §  Failure analysis and qualification §  Logistics and supply chain management all from one source 18 July 2014 ChipStart LLC - CONFIDENTIAL ž  Complete Turnkey Services —  Total ASIC solutions —  Design and development —  Packaging solutions —  Production & component supply —  Test development & production testing —  Component qualification —  Materials & component technology —  Complete Sensor solutions
  • 40. TM IP Cores and Embedded Software 18 July 2014 ChipStart LLC - CONFIDENTIAL
  • 41. TM Optimizing System Management in the Platform SoC Era ChipStart Embedded Solutions
  • 42. TM Today’s Performance SoCs Require Complex System Management Samsung Apps Processor (iPhone3) OMAP 4 4+ Compute Engines 4-5 Memory Interfaces More than 1000 Applications How Do You Guarantee Proper Hardware State Changes for +1000 Applications?
  • 43. TM System Management Complexity Rises Exponentially with Logic Growth Source: Advance Tech Marketing SystemManagement Complexity High Low Basic SoC Type Value Performance SSM Adoption Range Based on Complexity (circa 2011)
  • 44. TM System Management Complexity Has Past a Key Threshold IP Block (functional test) Interconnect/Dataflow (Performance Testing) Single Application Sequencing (Simple H/W State Changes) Multiple Application Sequencing (Complex (aka random) H/W state changes) 1995 2000 2005 2010 System Operation Verification Complexity (Logarithmic) Limited System Management for Multi- sequencing Means Complex System Operation Verification and High Risk Cost/TTM Tradeoffs When Using Traditional Methods 10X 100X 1000X Source: Advance Tech Marketing SoC System Operation Verification Tasks
  • 45. TM High Risk Cost/TTM Tradeoffs Now Driven By Inadequate SoC Architecture ž  TradiConal  (Host  CPU  acts  as  System  Manager)   ž  Interconnect  Based  (Adding  Control  to  Data  Flows)   These Approaches Were Not Designed to Manage 1000+ Applications Using the Same Device Host CPU IP Core IP Core I/O IP Core IP Core Host CPU no longer has adequate visibility and control For complex Multicore SoCs Control functions complicate global interconnect design, experience execution delays, and degrades efficiency Of high performance data flows Host CPU IP Core IP Core I/O
  • 46. TM Control Plan Architectures Reduce Complexity and Ease Tradeoffs System Controller Low Speed I/O Media Engine High Speed I/O DRAM Controller DSPCPU Global Interconnect Control Plane System Controller Low Speed I/O Media Engine High Speed I/O DRAM Controller DSPCPU Global Interconnect Control Plane • Separation of control and data planes make BOTH more efficient • Independent controller has adequate visibility for effective control • Programmable state management delivers new levels of software/hardware coupling and implementation flexibility required for high numbers of applications • Subsystem IP approach delivers new abstraction layers that enables system management development acceleration and high reuse
  • 47. TM Semico Forecasts High System Management IP Growth $0 $20 $40 $60 $80 $100 $120 $140 $160 $180 2010* 2011* 2012* 2013* 2014* 2015* MDollars $0 $100 $200 $300 $400 $500 $600 $700 $800 $900 $1,000 TotalMDollars Multi Media System Resource Mgmt. Memory Security Computing Communications Video Total
  • 48. TM Transforming SoC Architecture Using System Management Subsystem IP ž  Complexity  levels  now  dictate  that  System  Management   become  an  architecture  element  not  an  implementaCon   aKerthought   ž  Control  plane  architectures  introduce  new  flexibility  that   improves    system  management  effecCveness  and  promotes   high  reuse   ž  Subsystem  IP  approach  introduces  the  abstracCon  layers   needed  to  cost  effecCvely  manage  the  system  operaCon   complexity  explosion   Make vs. Buy Rapidly Favoring Outsourcing
  • 49. TM 49 SSM Advantages ž  Simplifies accessibility and control of all managed IP blocks ž  Guaranteed synchronization between hardware and software while executing complex sequences ž  Virtualization of system management functions —  Compartmentalizes instantiation dependencies —  Improves software’s ability to control hardware Saves Time and Money Offers SoC Architecture Consistency
  • 50. TM 50 SSM Subsystem Components ž  Hardware (Soft IP) —  SSM Controller —  SSM Register bus connection ž  Software —  Microkernel API —  Request translator —  Drivers
  • 51. TM 51 SSM Addresses Key System Issues ž  Standardizes Management of Key System Functions —  Power, security, error recovery, boot sequencing ž  Eases Hardware Software Integration ž  Provides A Reusable Architecture Across Many SoCs A Subsystem Suited for Universal Adoption
  • 52. TM ChipStart Overall Summary ž  ChipStart is the only, independent, one-stop semiconductor IP solution alternative to ARM and Synopsys ž  Delivering value as an IP Developer —  System Level Management IP Solutions —  Low voltage/Low power Memory Compilers —  Integrated, On-Chip Voltage Regulators ž  Delivering value as an IP Integrator —  Subsystem Solutions oriented ž  Delivering value as an IP Aggregator —  Single License Agreement for IP Solutions ž  Talented team —  >350 years semiconductor IP experience
  • 53. TM ChipStart Contact Page www.chip-start.com ChipStart LLC 228 Hamilton Avenue 3rd Floor Palo Alto, CA 94301 Toll-Free: (855) IP-MATTERS International: +1.650.204.7883 Email: info@chip-start.com ChipStart UK Maidenhead, Berkshire SL6 4LZ Office: +44 16 2856 6596 Eastern USA/Canada Oakville, ON L6J 0A2 Office: +1.905.634.6688 Fax: +1.905.592.2048 Northwest USA Evergreen, CO 80439 Office: +1. 303.506.1088 ChipStart France 91570 Bievres Office: +33 6 82 65 28 08 ChipStart Japan Suite 405, 1296-2 Suenaga, Takatsu-ku Kawasaki Kanagawa 213-0013 Office: +81 90 3222 3085 ChipStart China - Shenzhen 15-18B, Hai Yin Chang Cheng, Nanshan District Shenzhen, 518048 China P.R.C. Office: +86 186 0300 6982 ChipStart Taiwan 5, No. 2, Lane 37, Jieyun Rd. Sanchong District New Taipei City 241, Taiwan R.O.C. Office: +886-955062842 ChipStart China - Shanghai 608R, building 6th, No.1050, WuZhing Rd. Shanghai, 201103 China P.R.C. Office: +86 13817105679 ChipStart Korea 1310,Daejong Bldg.143-48 Samseong-Dong Gangnam-Gu Seoul 139-090, South Korea Office: +82 10 2205 3760

Notes de l'éditeur

  1. On 45-nm will be better