1. Unisinos
SEMICONDUCTOR
RESEARCH
INSTITUTE
October 19th, 2011
2. Semiconductor
Production Chain in Rio Grande do Sul
DESIGN FRONT END BACK END
CEITEC/SMDH CEITEC HT Micron
UFRGS-PUC-UFSM UFRGS -------------
3. Semiconductor
Production Chain in Rio Grande do Sul and Brazil
DESIGN FRONT END BACK END
CEITEC/SMDH CEITEC HT Micron
UFRGS/PUC UFRGS -------------
22 Design
Centers HT Micron
2 Training CEITEC Smart
Centers &
6 Universities Commercial
IC Brazil Scale
Program
4. Fulfilling the Chain
DESIGN FRONT END BACK END
CEITEC/SMDH CEITEC HT Micron
UFRGS/PUC UFRGS UNISINOS
22 Design
Centers HT Micron
2 Training CEITEC Smart
Centers &
6 Universities Commercial
IC Brazil Scale
Program
5. Why Packaging?
• Ht Micron Plant at Unisinos
• CEITEC installation in Porto Alegre
• IC Brazil Program
• Absence of Local Institution in R&D and Training
• Relatively low risk
• Federal Incentives (PADIS Law)
• Possibility of developing research in next generation of
packaging (Flip Chip,3D, TSV, PoP, ...)
• Electronics market in Brazil is growing and represents
about USD 35 billion
7. Main Objective
• To create, in Rio Grande do Sul, a Centre of
Excellence in R&D&I to support local Industry,
focusing on semiconductors packaging and test .
• Priorities
- HR training
- Technological Support
- Research
• Main characteristics
– Environment for the generation, transfer and application of knowledge produced
in universities and research centers in the area of semiconductor packaging and
test (back end)
– Integrated with the productive sector, creating a nuclear cluster of
semiconductor companies
– Promoter of sustainable development of a strategic industry
8. Strategy
In Brazil: Partners and Customers
HT Micron
Research Institutes
& Universities
Unisinos
Semiconductor
Institute
CEITEC & Electro-
Electronic
IC Brazil Brazilian
Program Companies
9. Strategy: The 2+2 Model
Brazil-Korea S&T cooperation agreements
S&T policies including government financial support
South Korea Brazil
Research Institute / Research Institute /
University University
Private company Private company
Partnership
Internal / Global market
10. Strategy: The 2+2 Model
Goal 1
------------------------------------------
Semiconductor Back End Manufacturing Line
HT Micron
Altus (Parit) Hana Micron
Brazilian Company Partnership Korean Company
UNISINOS Korean Research
Partnership
Brazilian Research Institutes / Universities
Institute / University (SKKU)
Brazilian Science & Technology Policies Korean
Government and Cooperation Agreements Government
11. Semiconductor Institute
Modular Structure
Long
Term Graduate
Techincal Courses
Courses
Design Short
Term
Technical Undergra-
Courses HR Training duate
Courses
Software
Proto- Drivers
typing
SMT
Software, Electrica
l Test
Modeling
& Test
Photo- Electrical,
voltaic Unisinos Mechanic
Energy Semiconductor al and
Thermal
Institute Modeling
Polymer
Electro-
nics
Packa-
Reliability
ging
& Failure Reliabi
Analysis lity
Flip MEMS Tests
Chip
IC Materials Failure
Packaging Characte- Structur Analysis
COB rization & Electrical
al
SiP Measurem
Develop Charact ents
ment erization
Chemical,
6 topics
Thermal
Nano and
materials Physical
Charact.
12. Unisinos
Semiconductor Institute Long Term
Techincal
Courses
Graduate
Courses
Design
Short Term
Technical Undergra-
Courses HR
duate
Training Courses
Software
Proto- Drivers
typing
SMT
Software, Electrical
Test
Modeling
Totals & Test
Photo- Electrical,
voltaic
Energy
•Area = 2,000 m²
Unisinos Mechanic
al and
Semiconductor
•Technicians Institute
= 10 Thermal
Modeling
Polymer
Electro-
•Engineers = 14
nics
Packa- •Professors/Researchers = 19
Reliability
ging •Administrative = 2 & Failure
• Total = 45 people
Reliability
Analysis Tests
Flip MEMS
Chip
IC Materials Failure
Packaging Characte- Analysis
COB Structural Electrical
SiP
rization &
Character Measurem
Develop ization ents
ment
Chemical,
Thermal
Nano and
materials Physical
Charact.
15. Priorities - 1
Long
Term Graduate
Techincal Courses
Courses
Design Short
Term
Undergra-
Technical HR duate
Courses
Training Courses
Software
Proto- Drivers
typing
SMT
Software, Electrica
l Test
Modeling
& Test
Photo- Electrical,
voltaic Unisinos Mechanic
Energy Semiconductor al and
Thermal
Institute Modeling
Polymer
Electro-
nics
Packa-
Reliability
ging
& Failure Reliabili
Analysis ty
Flip Tests
MEMS
Chip
IC Materials Failure
Packaging Characte- Structur
Analysis
COB Electrical
SiP
rization & al Measurem
Develop Character ents
ization
ment
Chemical,
Thermal
Nano and
materials Physical
Charact.
16. Priorities - 2 Long
Term Graduate
Techincal Courses
Courses
PCB Short
Design Term
Undergra
Technical HR
Courses
-duate
Training Courses Software
Proto- Drivers
typing
SMT
Software, Electric
Modeling al Test
& Test
Photo- Electrical,
voltaic Unisinos Mechanic
Energy Semiconductor al and
Thermal
Institute Modeling
Polymer
Electro-
nics
Packa-
Reliability
ging
& Failure Reliabili
Analysis ty
Flip MEMS Tests
Chip
IC
Packaging Materials Failure
COB Characte- Structur
Analysis
SiP rization & Electrical
al
Measure
Develop Charact
ments
ment erization
Chemical,
Thermal
Nano and
materials Physical
Charact.
17. HR Training
Training Team Long
Graduate
Term
Techincal Courses
Courses
• Engineers,
• Professors/Researchers Short Undergra-
Term HR duate
Technical Courses
Courses Training
Short Term Courses
• Focused on specific processes or Reliability and Failure Analysis
steps (2011)
•‘Hands on’ or ‘Informative’
• < 80 h Materials and Processes:
Ready to Start Packaging and SMT
Long Term Courses
Infraestructure and
Semiconductors
Process Control:
and Electronic
• Focused on managerial or technician Clean Rooms and
SPC
Technology
training (2012)
•~ 360 h
18. HR Training
Long
Term Graduate
Techincal Courses
Courses
Short Undergra
Term HR -duate
Technical Courses
Courses Training
Graduate Courses
• Changes on graduate curricula (2012)
• Mechanical Engineering
• Production Engineering
• Applied Computing
• New Master Program (2013)
• Electrical/Electronics Engineering
• Double certification (Brazil and Korea)
Undergraduate Courses
• Changes on undergraduate curricula (2012)
• Electrical Engineering
• Mechanical Engineering
• Production Engineering
• Automation Engineering
• Environmental Engineering
• Software Engineering
• Computational Science
19. Reliability & Failure Analysis
Area
• Labs = 2 x 60 m2
• Research Offices = 2 x 40m2
Research Team
• Technician = 2 Reliability
Tests
• Engineers = 2
• Professors/Researchers = 2 Reliability &
Failure
Analysis Failure
Analysis &
Electrical
Measurem
ents
20. Reliability & Failure Analysis
Reliability Lab
• Reliability Analysis tester Reliabili
• Environmental test ty
Tests
• Thermal shock Reliability
& Failure
• Thermal cycling Analysis Electric
• Burn in Measu-
rements
• HAST Analysis
• Salt spray
• Pressure Cooker
• Mechanical test
• Vibration (shaker)
28. Packaging
Area
• Labs = 5 x 60 m2
• Research Offices = 5 x 40 m2 + 1 x 50 m2
Research Team
• Technician = 3
• Engineers = 3
Photo-
voltaic • Professors/Researchers = 5
Energy
Polymer
Electro
nics
Packa-
ging
Flip MEMS
Chip
IC
Packaging
COB
SiP
29. Packaging Lab
COB, SiP
• COB – Chip On Board Prototyping
• Open cavity prototyping
• Packaging Development
Photo-
voltaic
Energy
Polymer
Electro
nics
Packa-
ging
Flip MEMS
Chip
IC
Packaging
COB
SiP
30. Packaging Lab
COB, SiP - equipment
Photo-
voltaic
Energy
•Die Attach Machine
Polymer
• Cure Oven
Electro
nics • Plasma Cleaning
Packa-
ging • Ball and Wedge Al/Au Wire Bonder
• Dispense Molding Machine
Flip
Chip
MEMS • Pull and Shear Test
IC
Packaging
• Optical Microscope
COB
SiP
•Single Wafer Back Grinding Machine
• Wafer Saw
31. Embedded Software, Modeling & Test
Area
• Labs = 1 x 60 m2
• Research Offices = 1 x 40 m2 + 1 x 50 m2
Research Team Software
Drivers
• Technician = 1 Electrica
• Engineers = 4 l Test
• Professors/Researchers = 5 Software,
Modeling
& Test Electrical,
Mechanic
al and
Thermal
Modeling
32. Software, Modeling & Test
Software
Embedded Software Lab Drivers
Electrical
•Embedded Software Development Test
for Electronic Modules Software,
• Pendrives Modeling
& Test Electrical,
• SSDs
Mechanic
al and
Thermal
• SD cards Modeling
• etc.
33. Software, Modeling & Test
Electrical, Thermal & Mechanical Modeling Lab
Software
• Packaging Electrical Modeling Drivers
• Packaging Thermal Modeling
Electrical
• Packaging Mechanical Modeling Test
Software,
Modeling
Tools & Test Electrical,
• Mentor FloTHERM
Mechanic
al and
Thermal
• Abaqus Modeling
• Spice
• Matlab
34. Embedded Software & Test
Modules & IC Test Lab
• Prototypes Test Software
Drivers
•Test Routines Optimization and Development
• DFT Electrical
Test
Software,
Equipment (future) Modeling
Electrical,
& Test
Mechanic
al and
• Mixed Signal Tester (ATE) + Handlers Thermal
Modeling
35. Packaging
Photovoltaic Energy Lab.
•Training
• Cells and Modules Qualification
• System design and application
• R&D
Photo-
voltaic
Energy
Polymer
Electro
nics
Packa-
ging
Flip MEMS
Chip
IC
Packaging
COB
SiP
36. Packaging
Photovoltaic Energy Lab
Equipment
• Piranometer and pyrheliometer
• Spectroradiometer
• Standard solar cells
• Solar PV simulators
• PV simulator power source
• Spectral response equipment
• Climatic and thermal chambers for solar panels
• Thermographical camera
• Power sources
Photo-
voltaic • Irradiance and temperature reference standards
Energy • Electrical isolation tester
Polymer
• I-V curve tracers up to 100 kW
Electro • Electric network simulator and oscilloscope
nics
Packa- • Battery bank, DC sources, variable loads
ging
Flip MEMS
Chip
IC
Packaging
COB
SiP
37. Packaging
Flip Chip Lab (future)
• Flip Chip Prototyping
• Flip Chip Process Development
• Flip Chip Products Development
Photo-
voltaic
Energy
Polymer
Electro
nics
Packa-
ging
Flip MEMS
Chip
IC
Packaging
COB
SiP
38. Unisinos Semiconductor Institute
Specialties
Packaging Lab
Flip Chip – equipment (future)
• Flip Chip Bonding Machine
• Cure Oven
• Electroless Ni Plating
• Sputtering (may share with MEMS)
• Aligner/Stepper (share with MEMS)
Photo-
• Wafer Track (share with MEMS)
voltaic
Energy
Polymer
Electro
nics
Packa-
ging
Flip MEMS
Chip
IC
Packaging
COB
SiP
39. Unisinos Semiconductor Institute
Specialties
Packaging Lab
Polymer Electronics (future)
• Polymer Electronics R&D
• Polymer Electronics Product Prototyping
Photo-
voltaic
Energy
Polymer
Electro
nics
Packa-
ging
Flip MEMS
Chip
IC
Packaging
COB
SiP
