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Thermal Management for XP and MX XLAMP LEDs ,[object Object]
Introduction ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
High Power LED Advantages Very energy efficient Available up to 130 lumens/watt and still increasing High-quality light No compromise between efficacy and CRI Directional No wasted light; any pattern possible Extremely long lifetime 70% lumen maintenance; up to 50,000 hours Inherently rugged No filament to break Instant on Reaches full brightness in nanoseconds Environmentally friendly Contains no mercury, lead or other heavy metals Infinitely controllable Enables new lighting fixtures and energy-saving techniques Low-temperature-friendly No issues starting in cold environments
MX Series XLamp ®  LEDs ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
XP Series XLamp ®  LEDs  ,[object Object],[object Object],[object Object],[object Object],XP-G XP-E XP-C Max Current 1500 mA 700 mA 500 mA Viewing Angle 125 º 115 º 110 º Color Cool white, Outdoor white, Neutral white, Warm white Cool white, Outdoor white, Neutral white, Warm white, Royal blue, Blue, Green, Amber, Red-orange, Red Cool white, white, Neutral white, Warm white, Royal blue, Blue, Green, Amber, Red-orange, Red Package Size 3.45mm x 3.45mm 3.45mm x 3.45mm 3.45mm x 3.45mm
Temperature Influence Increasing forward current, increases flux Higher forward current, increases Vf & power Higher power dissipation raises Tj and reduces light output Flux Vf Flux
General Guidelines for Thermal Management ,[object Object],[object Object],[object Object],[object Object],[object Object]
XLamp Thermal Characteristics ,[object Object],[object Object],[object Object]
Adding Thermal Vias for FR-4 PCB ,[object Object],[object Object],[object Object],[object Object],Top layer Cu FR4 Dielectric Bottom layer Cu Thermal pad Solder mask HASL Heat Source FR-4 cross-sectional geometry  Thermal vias
Thermal Simulations ,[object Object],[object Object],[object Object],Thermal resistance for FR-4 PCB with no vias with varying thermal pad size Length/Width of top trace (mm) Thermal Resistance ( ºC/W ) 0.8mm thick FR4 no Vias 1.6mm thick FR4 no Vias Via Diameter (mm) Thermal Resistance ( ºC/W ) 70 60 50 40 30 20 10 30 25 20 15 10 5 FR-4 PCB with various via diameters and numbers of vias
Recommended Board Layout ,[object Object],[object Object],[object Object],[object Object],Cree recommends creating areas of 10-mil (0.254 mm) vias set up on a rectilinear grid of 25 mil (0.635 mm).
Additional Resource ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Newark 1 Farnell  Newark 2

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Thermal Management for XP and MX XLAMP LEDs

  • 1.
  • 2.
  • 3. High Power LED Advantages Very energy efficient Available up to 130 lumens/watt and still increasing High-quality light No compromise between efficacy and CRI Directional No wasted light; any pattern possible Extremely long lifetime 70% lumen maintenance; up to 50,000 hours Inherently rugged No filament to break Instant on Reaches full brightness in nanoseconds Environmentally friendly Contains no mercury, lead or other heavy metals Infinitely controllable Enables new lighting fixtures and energy-saving techniques Low-temperature-friendly No issues starting in cold environments
  • 4.
  • 5.
  • 6. Temperature Influence Increasing forward current, increases flux Higher forward current, increases Vf & power Higher power dissipation raises Tj and reduces light output Flux Vf Flux
  • 7.
  • 8.
  • 9.
  • 10.
  • 11.
  • 12.