3. Зак Мура:
Закон Мура: количество транзисторов на
Закон
кристалле удваивается каждые два года
Relative Performance
1980 1985 1990 1995 2000 2005
3
4. Производительность памяти отстает от
производительности процессоров
10000
2x Every
CPU Frequency
Two Years
Relative Performance
DRAM Speeds
1000
Gap
100
10
2x Every
Six Years
1 1980 1985 1990 1995 2000 2005
4
5. Однопотоковые вычисления
Up to 85% Cycles Waiting for Memory
HURRY
Single Threaded UP AND
Performance WAIT!
Typical Processor
Utilization:15–25%
Thread
C M C M C M
T
Memory Latency Compute ime
5
6. Многопотоковость
или“Прохладные потоки” -
CoolThreads
Single Threaded
Performance Chip Multi-threaded
(CMT) Performance
Processor Utilization:
Up to 85%
Thread
4 C M C M C M
Thread
3 C M C M C M
Thread
2 C M C M C M
Thread
1 C M C M C M
T
Memory Latency Compute ime
6
9. SPARC Enterprise
Click to edit the title text format • Extreme Rackmount Density
T1000 > 1RU chassis, 19” depth
Network Infrastructure Workhorse > Up to 16 GB DDR2 memory
• UltraSPARC T1 processor
> 6 or 8 cores @ 1 Ghz
> 4 Gb Ethernet ports
Expansive web access tier: • Simple, Reliable Design
Web Server > 1 S-ATA 3.5” disk drive
Identity/Directory Server > 1 PCI-E expansion slot
Portal Server, • Low Cost/High Efficiency
App Integration, > Under 180 watts typical
Index, Search, > Diskless configs available
Edge / Network Node > Single power supply
9
10. • UltraSPARC T1 @ 1.2 or 1.4 Ghz
SPARCthe title text format
Click to edit Enterprise > 4, 6 or 8 core versions
T2000 • Rackmount Dense
> 2RU chassis, 24.4” depth
The Application Engine > Up to 64* GB DDR-2 Memory
• High Reliability
> Hot Plug, Redundant Power
Supplies & Fans
> RAID
• Expandable
> 3 PCI-E, 1 or 2 PCI-X slots
> 4x SAS/SATA 2.5” disk drives with
Java Application Servers, Enterprise RAID 0,1
Application Servers (ERP, CRM), Web > Optional DVD drive
Tier Consolidation > 2 USB ports
– • Low Power/ Low TCO
> <325 watts power typical
10
11. Новый технологический процесс –
еще больше много потоков на ядро
• Up to 8 cores @1.2GHz or 1.4GHz
FB DIMM FB DIMM FB DIMM FB DIMM
• Up to 64 threads per CPU
FB DIMM FB DIMM FB DIMM FB DIMM • Up to 16 FB-DIMMs, 4 memory
controllers
Relative Performance
> Up to 64GB memory (4GB DIMMs)
MC MC MC MC
U U U U > 2.5x memory BW of UltraSPARC T1
L2$ L2$ L2$ L2$ L2$ L2$ L2$ L2$ • 8 x fully pipelined Floating Point units /
Full Cross Bar
core, 1 per core
C0 C1 C2 C3 C4 C5 C6 C7 • Dual 10Gbit Ethernet and PCI-E
FPU FPU FPU FPU FPU FPU FPU FPU integrated onto chip
MAU MAU MAU MAU MAU MAU MAU MAU
DMA Sub-System
• 4MB L2 (8 banks) 16 way associative
• Enhanced MAU/Security co-processor
NIU Sys I/F per core
PCI-E
(E-net+) Buffer Switch Core • Advanced Power saving features
Power ~95W
<1.5W/thread
• 65nm process technology
2x 10GE Ethernet
11
12. SPARC edit the title text format
Click to Enterprise T5120 • 1 chassis, 26.5” depth
• Up to 8 cores @1.4GHz
> Up to 64 threads
• 16 FB-DIMM memory slots
> 128GB of memory, (8GB DIMMs)
• 4 hot plug SATA/SAS 2.5” disk
• Optimized for best price / drive (Raid 0,1)
performance & performance / watt • Redundant, hot-swappable PSUs
and Fans
• Scale-Out of web & network • 3 PCI-E expansion slots
infrastructure (2 x 10 GBE I/0 slots)
• 4 x 1GbE Ethernet as standard
• Direct replacement of
• 4 USB ports
T1000/T2000
12
13. SPARC edit the title text format
Click to Enterprise T5220 • 2 RU chassis, 26.5” depth
• Up to 8 cores @1.4GHz
> Up to 64 threads
• 16 FB-DIMM memory slots
> 128GB of memory, (8GB DIMMs)
• 8 hot plug SATA/SAS 2.5” disk
drive (Raid 0,1)
• Optimized for best price / • Redundant, hot-swappable PSUs
performance & performance / watt and Fans
• Scale-Out of web & network • 6 PCI-E expansion slots
(2 x 10 GBE I/0 slots)
infrastructure • 4 x 1GbE Ethernet as standard
• Direct replacement of • 4 USB ports
T1000/T2000
13
14. Each Coherency Link 6.4GBytes/s per direction, 12.8GB/s total
•
Click to edit the title text format Per Socket
4 x Coherency links give Snoop bandwidth of 51.2GB/s
> Up to 8 cores @1.2GHz or
1.4GHz
FB-DIMM FB-DIMM FB-DIMM FB-DIMM
> Up to 64 Threads per socket
4x
FB-DIMM FB-DIMM FB-DIMM FB-DIMM
Coherency
> 4MB L2$ 8 banks x 16 Way SA
Links > Up to 8 FPU's, 1 per core
MCU MCU > Up to 8 Crypto cores, 1 per core
CU CU CU CU
> 2 memory Controllers, 16 DIMMS
L2$ L2$ L2$ L2$ L2$ L2$ L2$ L2$
> 25Read+13WriteGB/s Memory BW
Full Cross Bar
> One x8 PCIe interface
CO C1 C2 C3 C4 C5 C6 C7
FPU FPU FPU FPU FPU FPU FPU FPU
• Per system
MAU MAU MAU MAU MAU MAU MAU MAU > 2 sockets glue-less
> 4 sockets using UST2 Plus XBR
System I/F PCI-Express > 16 or 32 PCIe lanes on 2 or 4
x8 @2.5GHz
Socket systems
SSI
Bus Power ~105W 4GBytes/s • 65nm process technology
<1.5W/thread bi-directional
14
15. Sun SPARC Enterprise
T5140/T5240 Continues to offer N2/T5120/T5220
values:
• Security – embedded crypto
• Networking – on-board 10GbE (not on-
chip)
• Floating Point – FPU per core
• High Reliability – hot-plug HDD,
• Expanding the CMT line to include redundant/hot-swap PSU and fans, low
total part count
multi-processor systems New features include:
• First Victoria Falls based platform • More capacity:
> 2 VF processors per system
• 4/6/8 cores per CPU - Up to 128 > More PCI-E IO lanes (all slots x8)
threads > 8-disk 1U and 16-disk 2U configs
available
• Twice the threads of T5120/T5220 in > Up to 32 DIMMs in the 2U
the same footprint • Enhanced Virtualization:
> 128 isolated OS instances utilizing
• Memory capacity at RR of up to 64GB LDOMs
(1U) or 128GB (2U), FB-DIMM
15
16. Sun SPARC Enterprise New features include:
T5440 • More capacity:
> 4 VF processors per system
> 1.2 and 1.4 GHz offerings
> 6 or 8 cores per CPU
> 8 PCI-E slots (all slots x8)
> Scaling CMT to New Heights > Two intended for graphics
> 4 sockets / 256 threads > Two shared with XAUI
> Up to 512GB Memory > Up to 64 DIMMs slots
> Up to 28 x PCI-E slots (with 2 I/O > 256 GB with 4 GB DIMMs
Boxes) • Enhanced Virtualization:
> 128 isolated OS instances
> Extends T5120/T5220 and utilizing LDOMs
T5140/T5240 proposals
> Electronic Prognostics
> Monitors internal sensors to
anticipate failures
16
17. Sun и Intel – родственность
технологий
• многоядерные процессоры
• многопроцессорные системы
• контроллер оперативной памяти на одном
кристалле с процессором
• скоростная шина обмена данными
• встроенная поддержка технологий
виртуализации
17
19. Sun Blade 6000
Click to edit the title text format • Chassis
> 10 RU, 24” deep
> 6000W (N+N grid redundant)
> Service Processor/CMM
> 2 PCI-E Express modules/blade
> 2 NEMs
• Up to 10 Blades
> AMD Opteron dual socket
> Intel Xeon dual/quad socket
> Niagara T2 single socket
19
20. Passive Midplane
Front – Server Module Rear – NEM, EM and
and Power Supply Connectors Rear Fan Module Connectors
PCI-E ExpressModule Connectors to Server
Server Module power connectors
Front Panel LED control board
●
Server Module I/O connectors ●
Network Express Module connectors
●
Network Express Modules ●
Each NEM provides:
●
Two PCI Express x8 interfaces or CMM connector ●
To every Server Module
●
Two XAUI interfaces (GbE, FC or IB) ●
PCI Express x8 interface or
●
Serial Attached SCSI links (4 total) ●
XAUI interface (GbE, FC or IB)
●
Gigabit Ethernet links (2 total)
Serial Attached SCSI links (2 total)
Modules
●
●
PCI ExpressModules ●
Gigabit Ethernet link (1 total)
●
Two PCI Express x8 interfaces ●
CMM Ethernet link
●
Service Processor Ethernet link ●
I2C Network
20
●
I2C Network
21. 21
Passive Midplane Data Interfaces
thernet E
rocessor
E x8
Service P
PCI-
x8
-E
AUI
I
PC
or X net
E x8 r
PCI- bit Ethe
a
Gig SAS
AUI
o r X net
E x8 r
PCI- bit Ethe
a
Gig AS
S
22. CMT Blades
Best for Business Infrastructure
Free Virtualization and
Wire-Speed Encryption
• Sun Blade T6320
• 3x more I/O throughput T6320 T6340
than IBM
Sockets 1 2
• 2x more memory than IBM 8 Core 2X UltraSPARC T2+
CPU
• Sun Blade T6340 UltraSPARC T2 with 16 Core
Memory Up to 128 GB Up to 256 GB
• 5x more core density
than HP On-Chip 10 GbE Yes No
2X PCIe 1.0 X8, 2X PCIe 1.0 X8,
• 2x more memory than HP PCle I/O 2X Pcle X4 2X Pcle X4
• Industry’s most flexible I/O
• Pre-installed cost free
Solaris 10 and LDom
22
23. AMD Blades
Best Business Virtualization Platform
• Sun Blade X6240
• Ideal blade for core IT
infrastructure apps
• 2.7x more I/O throughput X6240 X6440
and 2x more memory Sockets 2 4
than HP
Six-Core or Quad-core Six-Core or Quad-core
CPU
• Sun Blade X6440 AMD Opterons AMD Opterons
• Ideal blade for core business Memory Up to 128 GB Up to 256 GB
applications requiring I/O
virtualization Throughput
142 Gb/s 142 Gb/s
• Industry’s leading I/O
throughput and leading
memory capacity
23
24. Intel Blades
Best Scalability and Compute Density
• Sun Blade X6270:
●
Best business blades, ideal
for single demanding or
multiple virtualized
business workloads
X6270 X6275
●
Up to 2x more hot plug storage
●
Up to 4x the I/O throughput Sockets 2 2 per node/4 total
(270Gb/s) Four-Core Intel® Xeon® Four-Core Intel® Xeon®
CPU Processor 5500 Series Processor 5500 Series
• Sun Blade X6275:
●
On-board IB or standard Ethernet Memory
Up to 144 GB
(18 DDR3 DIMMs)
Up to 96 GB per node/
192 GB total (24 DDR3 DIMMs)
●
Industry TOP HPC blade with
I/O
unmatched capabilities Throughput
Up to 270 Gb/s Up to 129 Gb/s per node
●
Up to 9 TFLOPS peak performance
●
Leading density - 2x compute
nodes in a single blade
●
End-to-End Quad Data Rate IB
24
25. Gigabit Ethernet Pass-through NEM
Midplane connectors
The Gigabit Ethernet
Blade 9
Blade 7
Blade 2
Blade 1
Blade 8
Blade 6
Blade 5
Blade 4
Blade 3
Blade 0
pass-through NEM
provides connectivity to
external network switches
which allow Server
Module communications
to the outside
External Network Ports
25
26. PCI Express ExpressModules
• EMs available from Sun: • Future EMs:
> Dual-port GbE EM > Quad-port Gb EM
> Dual-port 4Gbps > 10GbE EM
FiberChannel EM > Quad-port FC-AL
> Dual-port 4X InfiniBand EM
26
40. Industry Leading Server Virtualization
Hard Partitions Virtual Machines OS Virtualization Resource Management
App
Server
Database
Identity
Server
File
Server
Web
Server
Mail
Server
Calendar
Server
Database
Web
Server
SunRay
Server
Database
App
Server
App
OS
Server
Multiple OSs Single OS
Trend to flexibility Trend to isolation
Dynamic System Solaris Resource
Sun xVM Solaris Containers
Domains (Zones + SRM) Manager
> Very High RAS (LDoms and Xen) (SRM)
> Very Scalable VMware Solaris Trusted
> Very scalable and low overhead
> Mature Technology Microsoft Extensions
> Single OS to manage
> Ability to run different Virtual Server Solaris Containers for
Linux Applications > Fine grained resource
OS versions management
40
41. Logical Domains Technology
• Virtualization and partitioning of machine resources
> Each domain is a full virtual machine, with a dynamically
reconfigurable sub-set of machine resources, and its own
independent OS
> Protection & isolation via SPARC hardware and hypervisor
firmware
LDom A LDom B LDom C LDom D
OS
Environment
of choice Linux FreeBSD
LDoms Manager
Hypervisor
CPU CPU CPU CPU CPU CPU CPU CPU
Platform Memory Memory Memory Memory
Hardware I/O I/O
41
42. Driving Innovation at Every Level:
UltraSPARC® T2 Plus Processor
Third-generation CMT Processors Pack 128 Systems into a single 4RU
package
Sun started the multithreaded
revolution in 2005, and is still the
industry leader, with more threads
per core than anyone else
42
43. Click to edit the title text format
Новый взгляд
на современные
системы
Владимир Овчинников
Системный инженер
Sun Microsystems
43
