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IJRET: International Journal of Research in Engineering and Technology eISSN: 2319-1163 | pISSN: 2321-7308
__________________________________________________________________________________________________
Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org 780
A NOVEL MODEL OF RF MEMS SHUNT SWITCH
Beneya. L1
, Praveen Kumar. S2
1
PG Scholar, Electronics and Communication Engineering, Saveetha Engineering College, Tamil Nadu, India
2
Associate Professor, Electronics and Communication Engineering, Saveetha Engineering College, Tamil Nadu, India
Abstract
The advancement in the Radio Frequency Micro- Electro Mechanical Systems (RF MEMS) switch has enabled new technologies for
microwave switching applications. It is the method used for reduction of material used which in turn decreases the cost and the power
dissipation. The RF MEMS shunt switch is constructed for high frequency microwave switching. The switch is driven by electrostatic
actuation. The contact line and the RF signal line behaves as the parallel plate capacitor. The Switch provides a good isolation in the
off state and less insertion loss. The geometry parameters of the switch is chosen such that the switch can be easily integrated. The
Switch Niobium metal is used for the contact lines as it has good superconducting characteristics in cryogenic temperature. The
performance of the switch is analyzed and the result shows the deformation of the switch with low actuation voltage.
Keywords: RF MEMS, Shunt switch, Superconducting, and Cryogenic.
-----------------------------------------------------------------------***----------------------------------------------------------------------
1. INTRODUCTION
The RF MEMS switch is a miniature model which shows
good broadband performance. It is constructed for
broadcasting of RF signal [1] which will connect the antenna
to the transmitter or receiver. By using electrostatic actuation
the RF MEMS switch is actuated where as the traditional
switches depend on the impedance of the semiconductor
device that is actuated by the electric field. The shunt switch
has fixed beams where the movable area toggles the switch
between the input and the output of the RF signal line.
The Shunt switch is also known as the capacitive switch which
is constructed using fixed beams. The principle mechanism of
the switch is to make the contact line to toggle with the RF
signal line. When the electrostatic force is applied the contact
line undergoes a mechanical deformation that will get contact
with the RF signal line. When the force is cutoff, due to the
elastic property of the material it gains its original shape. In
the off state the switch is open circuit and it provides a good
isolation for the switch. The isolation of the switch reduces the
leakage of RF power in the device. In the on state the switch is
short circuit in which the voltage flows through the device that
make the contact line to deform to get contact with the signal
line.
The geometrical parameter of the switch such as the air gap
between the contact line and the signal line provides a good
isolation for the device. The RF Power leakage is reduced due
to the isolation of the device in the OFF state. The switch does
not consume current as the DC voltage required for the switch
is very low, hence there is less Power dissipation. The basic
switching parameter includes the isolation of the device and
the insertion loss with fast switching technique in terms of
nano seconds. Since there is no pn junction used the device
has less distortion with high linearity. The niobium metal is
used for the contact lines as it has superconducting
characteristics in cryogenic temperature. These advantages
makes the device more suitable for switching application.
2. DESIGN DESCRIPTION
2.1 Equivalent Model of Shunt Switch
The shunt switch is also known as capacitive switch. The
contact line and the RF signal line behaves as the parallel plate
capacitor. Hence the electrostatic force generated in the
parallel plate is given by
Where, S - Area of Electrode = 30000µm2
,
Ɛ0 - Dielectric coefficient of vacuum
= 8.854X10-12
F/m
Ɛr - Dielectric coefficient of surrounding air.
The electrostatic force thus obtained is 118µN. Beyond this
value the metal will lose its elastic property. The force thus
obtained makes the metal contact line to snap down unto the
RF signal line. This makes the switch to toggle between the
ON state and the OFF state. The electrostatic force makes the
contact line to snap down on the RF signal line. The elastic
property of the metal makes the contact line to gain its original
position once when the supply is cutoff. The equivalent circuit
of the shunt switch is shown in Fig 1.
IJRET: International Journal of Research in Engineering and Technology eISSN: 2319-1163 | pISSN: 2321-7308
__________________________________________________________________________________________________
Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org 781
Fig -1: Equivalent Circuit diagram of shunt switch.
The capacitance of the capacitor in the shunt switch is shown
in equation (2).
Where C- Capacitance of the shunt switch (pF),
A- Area of the signal line = 10000µm2
,
t- thickness of the signal line = 2µm,
Thus a capacitance of 44 pF is obtained. The LC resonant
frequency of the shunt switch is given in the equation (3)
Whereas the range of inductance is in the order of nH and the
capacitance of the shunt switch that operates in the microwave
frequency is in the range of 44 pF. The resonating frequency is
3.6 GHz.
2.2 Mechanical Model of Shunt Switch
The shunt switch has fixed - fixed beam in which the contact
mechanism of the switch rely on the mechanical deformation
of the contact line. Due to the elastic property of the switch it
gains its original shape. Typically the contact mechanism
requires some voltage for the electrostatic actuation. The
theoretical representation of the amount of voltage required is
expressed in equation (4).
V=
8𝑘
27𝜀0𝑊𝑤
g03 --------- (4)
Where k is the spring constant, Ɛ0 is the Permittivity of free
space, W is the width of the RF signal line (µm) and w is the
width of the contact line (µm). g0 is the air gap between the
contact line and the signal line. Theoretically the value of
actuation voltage thus obtained is 2.012V. The spring
constant is given in equation (5).
k= 32Ew(
𝑡
𝑙
)3
-------- (5)
Where t- thickness of the beam = 2µm;
l- length of the beam = 200µm;
E- Young's modulus of Nb = 105 GPa;
From equation (5) it is to be noted that the spring constant
depends on the t thickness of the beam. Hence the spring
constant k is a function of the thickness t. The increase in the
beam thickness will increase the voltage drastically. The
typical value of spring constant is 0.504 N/m.
The switching speed of the capacitive switch can be obtained
from equation (6)
Where ω0 is the angular frequency; ω0= 2πf0 which is in the
range of 376.99Hz. The switching speed thus obtained is 9.8
ns. Hence a fast switching performance is obtained. The skin
depth can be calculated from equation (7)
Where µ - permeability of Nb = 4πx10-7
H/m,
σ- electrical conductivity of Nb= 7.1x 10-6
S/m
Hence the skin depth is 0.3 µm. The S parameter for which the
return loss can be calculated using equation (8)
Where Z0 is the impedance = 50Ώm and the value of S11= -
13.6dB. The increase in the width of the bridge thus increases
the magnitude of S11 and decreases S11 in decibel. Hence the
width should be greater than 100µm.
3. GEOMETRICAL DESCRIPTION
IJRET: International Journal of Research in Engineering and Technology eISSN: 2319-1163 | pISSN: 2321-7308
__________________________________________________________________________________________________
Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org 782
Fig -2: Schematic Structure of Capacitive Switch
The geometrical parameter of the switch is constructed using
comsol 4.2a software. In the mechanical structure the solid
mechanics is selected. The mechanical structure is studied and
the stationary analysis is done to determine the deformation of
the device for the required voltage. The dimension of the
signal line according to G/W/G is of 60/100/60 µm
respectively. The width, height and the thickness of the beam
is 150, 200 and 2 µm respectively. A superconducting metal,
niobium is used for the contact line.
Fig -3: Design description of Capacitive Switch
Once the structure is designed, the material are chosen for all
the domain. For the contact line of the capacitive switch
niobium metal is chosen. Then the structure is meshed. The
meshed structure is shown in Fig - 4.
Fig -4: Meshed Structure of Capacitive Switch
4. STATIC AND MODAL ANALYSIS
The meshed structure is analyzed by applying the force on the
boundary of the contact line. From equation (1) the force
exerted on the contact line is 118µN. The static study
determines the voltage required for the deformation and the
spring constants. From equation (2) 3V is obtained. The modal
analysis determines the frequency of the switch.
Fig -5: Displacement of the contact line of Capacitive Switch
IJRET: International Journal of Research in Engineering and Technology eISSN: 2319-1163 | pISSN: 2321-7308
__________________________________________________________________________________________________
Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org 783
5. RESULTS
Fig -6: Displacement Vs Voltage Curve
The result shows the deformation of the switch for the applied
voltage. A graphical representation of the displacement Vs
voltage curve is shown in Fig-6. Hence a linear displacement
is obtained for the applied voltage. The simulated result thus
obtained determines the actuation voltage of 2V which is
proved in the equation (4).
6. CONCLUSIONS
The designed capacitive switch has high linearity hence can be
easily integrated with superconducting micro electronics
technology. The shunt switch shows high performance in
cryogenic temperature and it has a low actuation voltage in the
order of 2.012V. The frequency is 3.6GHz which is used to
switch Bluetooth devices. The shunt switch exhibits excellent
broadband performance and fast switching action by reducing
the power consumption.
REFERENCES
[1] Aditi Sharma; Vivek K. Dwivedi; and G. Singh; "THz
Rectangular Microstrip Patch Antenna on Multilayered
Substrate for Advance Wireless Communication
Systems", Progress In Electromagnetics Research
Symposium, Beijing, China, March 23-27, 2009
[2] Baskar.S; Chanemouga priya; Saraswathi.D; hailesh.V;
“A Novel Cram of Reconfigurable Patch Antenna using
RF MEMS”, IEEE International Conference Digital
Object Identifier, 2013.
[3] Brusa E; De Pasuquale G; Soma A; “Experimental
Characterization of Electro–Thermo–Mechanical
Coupling in Gold RF Microswitches”, IEEE journals &
magazines, IEEE transactions on Volume: 22, Issue:4,
2013.
[4] Elsherbeni A.Z; Fan Yang; kai- Fong Lee; Khidre A;
“Wide Band Dual-Beam U-Slot Microstrip Antenna”,
IEEE journals & magazines, IEEE transactions on
Digital Object Identifier, volume 61, issue: 3, 2013.
[5] Raafat R. Mansour; Sara S. Attar, “Low Temperature
Superconducting RF MEMS Devices”, IEEE journals
& magazines, IEEE transactions on Volume: 23,
Issue:3, 2013.
[6] Bedri A. Cetiner; Jofre L; Mopidevi H; Rodrigo D;
Unlu M; Zohur A; "RF MEMS Reconfigurable Two-
Band Antenna", IEEE antennas and wireless
propagation letters, Volume 12, 2013
[7] Verma K.K; Vishwakama R.K; “Electromagnetically
coupled square microstrip antenna for dual-band
operation ” , IEEE International Conference Digital
Object Identifier, 2013.
[8] Jie-Ying Tang, Lei Han, Li-Feng Wang, Qing-An
Huang, and Yan-Qing Zhu Senior Member, IEEE, “A
Novel Three-State RF MEMS Switch for
Ultrabroadband (DC-40GHz) Applications” 2013 IEEE
electron device letters.
BIOGRAPHIES
L. Beneya has received the B.E. degree in
Electricals and Electronics Engineering in the
year 2012 and pursuing M.E. degree in VLSI
Design in Saveetha Engineering College. Her
area of interest include MEMS and VLSI
Design.
S. Praveen Kumar, M.E.,(Ph.D) Specialized
in Applied Electronic . Have 6 years of
teaching experience. His Area of interest
includes MEMS, BIO-MEMS, WIRELESS
SENSORS, Digital Image Processing, VLSI
and Wireless Communication.

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A novel model of rf mems shunt switch

  • 1. IJRET: International Journal of Research in Engineering and Technology eISSN: 2319-1163 | pISSN: 2321-7308 __________________________________________________________________________________________________ Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org 780 A NOVEL MODEL OF RF MEMS SHUNT SWITCH Beneya. L1 , Praveen Kumar. S2 1 PG Scholar, Electronics and Communication Engineering, Saveetha Engineering College, Tamil Nadu, India 2 Associate Professor, Electronics and Communication Engineering, Saveetha Engineering College, Tamil Nadu, India Abstract The advancement in the Radio Frequency Micro- Electro Mechanical Systems (RF MEMS) switch has enabled new technologies for microwave switching applications. It is the method used for reduction of material used which in turn decreases the cost and the power dissipation. The RF MEMS shunt switch is constructed for high frequency microwave switching. The switch is driven by electrostatic actuation. The contact line and the RF signal line behaves as the parallel plate capacitor. The Switch provides a good isolation in the off state and less insertion loss. The geometry parameters of the switch is chosen such that the switch can be easily integrated. The Switch Niobium metal is used for the contact lines as it has good superconducting characteristics in cryogenic temperature. The performance of the switch is analyzed and the result shows the deformation of the switch with low actuation voltage. Keywords: RF MEMS, Shunt switch, Superconducting, and Cryogenic. -----------------------------------------------------------------------***---------------------------------------------------------------------- 1. INTRODUCTION The RF MEMS switch is a miniature model which shows good broadband performance. It is constructed for broadcasting of RF signal [1] which will connect the antenna to the transmitter or receiver. By using electrostatic actuation the RF MEMS switch is actuated where as the traditional switches depend on the impedance of the semiconductor device that is actuated by the electric field. The shunt switch has fixed beams where the movable area toggles the switch between the input and the output of the RF signal line. The Shunt switch is also known as the capacitive switch which is constructed using fixed beams. The principle mechanism of the switch is to make the contact line to toggle with the RF signal line. When the electrostatic force is applied the contact line undergoes a mechanical deformation that will get contact with the RF signal line. When the force is cutoff, due to the elastic property of the material it gains its original shape. In the off state the switch is open circuit and it provides a good isolation for the switch. The isolation of the switch reduces the leakage of RF power in the device. In the on state the switch is short circuit in which the voltage flows through the device that make the contact line to deform to get contact with the signal line. The geometrical parameter of the switch such as the air gap between the contact line and the signal line provides a good isolation for the device. The RF Power leakage is reduced due to the isolation of the device in the OFF state. The switch does not consume current as the DC voltage required for the switch is very low, hence there is less Power dissipation. The basic switching parameter includes the isolation of the device and the insertion loss with fast switching technique in terms of nano seconds. Since there is no pn junction used the device has less distortion with high linearity. The niobium metal is used for the contact lines as it has superconducting characteristics in cryogenic temperature. These advantages makes the device more suitable for switching application. 2. DESIGN DESCRIPTION 2.1 Equivalent Model of Shunt Switch The shunt switch is also known as capacitive switch. The contact line and the RF signal line behaves as the parallel plate capacitor. Hence the electrostatic force generated in the parallel plate is given by Where, S - Area of Electrode = 30000µm2 , Ɛ0 - Dielectric coefficient of vacuum = 8.854X10-12 F/m Ɛr - Dielectric coefficient of surrounding air. The electrostatic force thus obtained is 118µN. Beyond this value the metal will lose its elastic property. The force thus obtained makes the metal contact line to snap down unto the RF signal line. This makes the switch to toggle between the ON state and the OFF state. The electrostatic force makes the contact line to snap down on the RF signal line. The elastic property of the metal makes the contact line to gain its original position once when the supply is cutoff. The equivalent circuit of the shunt switch is shown in Fig 1.
  • 2. IJRET: International Journal of Research in Engineering and Technology eISSN: 2319-1163 | pISSN: 2321-7308 __________________________________________________________________________________________________ Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org 781 Fig -1: Equivalent Circuit diagram of shunt switch. The capacitance of the capacitor in the shunt switch is shown in equation (2). Where C- Capacitance of the shunt switch (pF), A- Area of the signal line = 10000µm2 , t- thickness of the signal line = 2µm, Thus a capacitance of 44 pF is obtained. The LC resonant frequency of the shunt switch is given in the equation (3) Whereas the range of inductance is in the order of nH and the capacitance of the shunt switch that operates in the microwave frequency is in the range of 44 pF. The resonating frequency is 3.6 GHz. 2.2 Mechanical Model of Shunt Switch The shunt switch has fixed - fixed beam in which the contact mechanism of the switch rely on the mechanical deformation of the contact line. Due to the elastic property of the switch it gains its original shape. Typically the contact mechanism requires some voltage for the electrostatic actuation. The theoretical representation of the amount of voltage required is expressed in equation (4). V= 8𝑘 27𝜀0𝑊𝑤 g03 --------- (4) Where k is the spring constant, Ɛ0 is the Permittivity of free space, W is the width of the RF signal line (µm) and w is the width of the contact line (µm). g0 is the air gap between the contact line and the signal line. Theoretically the value of actuation voltage thus obtained is 2.012V. The spring constant is given in equation (5). k= 32Ew( 𝑡 𝑙 )3 -------- (5) Where t- thickness of the beam = 2µm; l- length of the beam = 200µm; E- Young's modulus of Nb = 105 GPa; From equation (5) it is to be noted that the spring constant depends on the t thickness of the beam. Hence the spring constant k is a function of the thickness t. The increase in the beam thickness will increase the voltage drastically. The typical value of spring constant is 0.504 N/m. The switching speed of the capacitive switch can be obtained from equation (6) Where ω0 is the angular frequency; ω0= 2πf0 which is in the range of 376.99Hz. The switching speed thus obtained is 9.8 ns. Hence a fast switching performance is obtained. The skin depth can be calculated from equation (7) Where µ - permeability of Nb = 4πx10-7 H/m, σ- electrical conductivity of Nb= 7.1x 10-6 S/m Hence the skin depth is 0.3 µm. The S parameter for which the return loss can be calculated using equation (8) Where Z0 is the impedance = 50Ώm and the value of S11= - 13.6dB. The increase in the width of the bridge thus increases the magnitude of S11 and decreases S11 in decibel. Hence the width should be greater than 100µm. 3. GEOMETRICAL DESCRIPTION
  • 3. IJRET: International Journal of Research in Engineering and Technology eISSN: 2319-1163 | pISSN: 2321-7308 __________________________________________________________________________________________________ Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org 782 Fig -2: Schematic Structure of Capacitive Switch The geometrical parameter of the switch is constructed using comsol 4.2a software. In the mechanical structure the solid mechanics is selected. The mechanical structure is studied and the stationary analysis is done to determine the deformation of the device for the required voltage. The dimension of the signal line according to G/W/G is of 60/100/60 µm respectively. The width, height and the thickness of the beam is 150, 200 and 2 µm respectively. A superconducting metal, niobium is used for the contact line. Fig -3: Design description of Capacitive Switch Once the structure is designed, the material are chosen for all the domain. For the contact line of the capacitive switch niobium metal is chosen. Then the structure is meshed. The meshed structure is shown in Fig - 4. Fig -4: Meshed Structure of Capacitive Switch 4. STATIC AND MODAL ANALYSIS The meshed structure is analyzed by applying the force on the boundary of the contact line. From equation (1) the force exerted on the contact line is 118µN. The static study determines the voltage required for the deformation and the spring constants. From equation (2) 3V is obtained. The modal analysis determines the frequency of the switch. Fig -5: Displacement of the contact line of Capacitive Switch
  • 4. IJRET: International Journal of Research in Engineering and Technology eISSN: 2319-1163 | pISSN: 2321-7308 __________________________________________________________________________________________________ Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org 783 5. RESULTS Fig -6: Displacement Vs Voltage Curve The result shows the deformation of the switch for the applied voltage. A graphical representation of the displacement Vs voltage curve is shown in Fig-6. Hence a linear displacement is obtained for the applied voltage. The simulated result thus obtained determines the actuation voltage of 2V which is proved in the equation (4). 6. CONCLUSIONS The designed capacitive switch has high linearity hence can be easily integrated with superconducting micro electronics technology. The shunt switch shows high performance in cryogenic temperature and it has a low actuation voltage in the order of 2.012V. The frequency is 3.6GHz which is used to switch Bluetooth devices. The shunt switch exhibits excellent broadband performance and fast switching action by reducing the power consumption. REFERENCES [1] Aditi Sharma; Vivek K. Dwivedi; and G. Singh; "THz Rectangular Microstrip Patch Antenna on Multilayered Substrate for Advance Wireless Communication Systems", Progress In Electromagnetics Research Symposium, Beijing, China, March 23-27, 2009 [2] Baskar.S; Chanemouga priya; Saraswathi.D; hailesh.V; “A Novel Cram of Reconfigurable Patch Antenna using RF MEMS”, IEEE International Conference Digital Object Identifier, 2013. [3] Brusa E; De Pasuquale G; Soma A; “Experimental Characterization of Electro–Thermo–Mechanical Coupling in Gold RF Microswitches”, IEEE journals & magazines, IEEE transactions on Volume: 22, Issue:4, 2013. [4] Elsherbeni A.Z; Fan Yang; kai- Fong Lee; Khidre A; “Wide Band Dual-Beam U-Slot Microstrip Antenna”, IEEE journals & magazines, IEEE transactions on Digital Object Identifier, volume 61, issue: 3, 2013. [5] Raafat R. Mansour; Sara S. Attar, “Low Temperature Superconducting RF MEMS Devices”, IEEE journals & magazines, IEEE transactions on Volume: 23, Issue:3, 2013. [6] Bedri A. Cetiner; Jofre L; Mopidevi H; Rodrigo D; Unlu M; Zohur A; "RF MEMS Reconfigurable Two- Band Antenna", IEEE antennas and wireless propagation letters, Volume 12, 2013 [7] Verma K.K; Vishwakama R.K; “Electromagnetically coupled square microstrip antenna for dual-band operation ” , IEEE International Conference Digital Object Identifier, 2013. [8] Jie-Ying Tang, Lei Han, Li-Feng Wang, Qing-An Huang, and Yan-Qing Zhu Senior Member, IEEE, “A Novel Three-State RF MEMS Switch for Ultrabroadband (DC-40GHz) Applications” 2013 IEEE electron device letters. BIOGRAPHIES L. Beneya has received the B.E. degree in Electricals and Electronics Engineering in the year 2012 and pursuing M.E. degree in VLSI Design in Saveetha Engineering College. Her area of interest include MEMS and VLSI Design. S. Praveen Kumar, M.E.,(Ph.D) Specialized in Applied Electronic . Have 6 years of teaching experience. His Area of interest includes MEMS, BIO-MEMS, WIRELESS SENSORS, Digital Image Processing, VLSI and Wireless Communication.