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INDIA: a fab-less wonder: case of
              SMDP

                                       A.S.Rao
                    indiainvents@hotmail.com
   ( This paper is based on project `Impact of
       SMDP-II’ sponsored by Department of
  Information Technology (DIT) on CIIE-IIMA)
Techno-Nationalism on slippery
                ground
• "Chinese President Hu Jintao had dinner at the
  White House with President Obama and first lady
  Michelle. They were going to exchange gifts from
  the two countries, but unfortunately everything
  in our country is now made in their country, so
  they couldn't do any exchanging." –Jay Leno
• India to showcase Aakash tablet at United
  Nations on November 28th. The initiative would
  highlight the country's innovation. Media reports
  the computer was a cheap Chinese import and
  not an Indian innovation as was claimed.

                                                      2
SEMICONDUCTOR CAPABILITIES- STATE OF NATIONS



• The development and manufacturing of chips
  involve three primary activities in the value chain:
  design, fabrication, test and assembly.
• Prior to 1980s, the semiconductor industry was
  vertically integrated. Semiconductor companies
  owned and operated their own silicon wafer
  fabrication facilities and developed their own
  process technology for manufacturing their chips.
  These companies also carried out the fabrication,
  assembly and testing of their chips.

                                                     3
Value Chain

        Design                  Fabrication                 Assembly



                          Huge fixed investment
                          (currently on the order      Requires expensive
                          of $2 billion) to build a       equipment
    Skill intensive         plant (called a fab)


                            Plant holds a wide
                                                      Lower overall costs of
                           variety of expensive
                                                      plant and equipment
                                equipment

Requires expensive EDA
   (electronic design       Plant has to meet
 automation) software,                                  Low average skill
                          extreme requirements
                                                         requirements
                              of cleanliness.

                                                                            4
Emergence of independent Fabs
• Investment in Fabs (1995-2006) in USD billions:
• USA- 74
• Japan- 66
• Taiwan- 72 (Foundry production is the largest
  segment of Taiwan’s domestic industry; in 1999,
  foundry related business accounted for almost 60
  percent of Taiwan’s total industrial revenue.)
• China-26
• India- nil

                                                 5
Fabless IC suppliers
• Total Fabless: $62.50 billion (2010)
• U.S. companies occupy eight of the top ten
  slots by sales volume. Qualcomm tops the list
  of Fabless suppliers.
Indian score on:
• Integrated Fabs: NIL
• Independent Fab : Nil
• Fabless IC production: NIL
                                                  6
Emergence of fabless semi- conductor
           design firms




                                       7
Special Manpower Development Program in VLSI Design and
           Related Software ,Phase-II (SMDP-II)
                        Establishing
                        State-of-the-
                             art
                        VLSI Design
                           Labs
                                        Generation of
        SMDP-II VLSI                    Manpower at
         Website & 7                    various levels
         sites at RCs                    in the VLSI
                                         Design Area

                          Major
                        Elements
                          of the
                        Program
                                          Instruction
                                        Enhancement
         India Chip
                                        Program (IEP)
          Program
                                        for faculties of
                                              PIs

                         Workshops
                             with
                        International
                            Guest
                          Faculties                        8
Primary Objective

To train special manpower in the area of VLSI
Design and related software at M.E./M.Tech
level (Type-II manpower). In addition to this,
generation of Type-III manpower i.e.
M.E./M.Tech in other areas of electronics etc.
with at least two courses on VLSI design will
also be undertaken.



                                                 9
Secondary Objective

To train Type-IV manpower i.e. B.E./B.Tech in
electronics etc. with graduate level courses on
VLSI Design. However, the program will not
only be limited to generation of Type-II, III &
IV manpower but would endeavour to
generate Ph.D in various aspects of VLSI
design/microelectronics (Type-I manpower)
manpower as well. The establishment of VLSI
design laboratories at RCs would also
strengthen their academic program.
                                              10
Implementing Organizations

• 7 Resource Centers : 5 IITs, IISc Bangalore,
  CEERI Pilani
• 25 Participating Institutes : 16 NITs, 9 other
  institutions.
• Total Outlay - Rs.49.98 Crores




                                                   11
Achievements
• Establishing State–of-the art VLSI Design Laboratories
  at 32 institutes.
• Generation of manpower in VLSI Design area at
  various levels :a total of 20,114 engineering graduates
  in Electronics/ Communication/ Computer Science/
  Instrumentation etc had taken a graduate level course
  in VLSI design. At PG level, 4,395 students had taken at
  least two courses in various aspects of VLSI Design and
  CAD. An addition 2,701 PG students had their
  specialization at ME/MTech in VLSI design & CAD.
  Further PhDs were awarded to 255 researchers in
  various aspects of VLSI design & CAD.

                                                         12
Chip Layout views of integrated designs under India
                Chip Programme




                                                      13
India Design Centers
• Top 18 of 20 Top US semiconductor firms
  established Design Centers in India.
• List includes:
• Intel, TI, Freescale, AMD, IBM, QUALCOMM,
  Broadcom, Analog Devices, SanDisk, National,
  Agilent, ATI, etc



                                             14
Why India matters in Chip design

• Skilled manpower: Credit goes to a large
  extent to SMDP initiative.
• Preference to work with MNCs:
• Fear of Chinese clones:




                                             15
The future: System on Chip
Challenges:

• Getting our hands dirty in IP Trading
• Move from R&L ( Research and learning) to
  R&D ( Research and Development)




                                              16
Thanks




         17

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India: A Fab-Less Wonder: Case of SMDP

  • 1. INDIA: a fab-less wonder: case of SMDP A.S.Rao indiainvents@hotmail.com ( This paper is based on project `Impact of SMDP-II’ sponsored by Department of Information Technology (DIT) on CIIE-IIMA)
  • 2. Techno-Nationalism on slippery ground • "Chinese President Hu Jintao had dinner at the White House with President Obama and first lady Michelle. They were going to exchange gifts from the two countries, but unfortunately everything in our country is now made in their country, so they couldn't do any exchanging." –Jay Leno • India to showcase Aakash tablet at United Nations on November 28th. The initiative would highlight the country's innovation. Media reports the computer was a cheap Chinese import and not an Indian innovation as was claimed. 2
  • 3. SEMICONDUCTOR CAPABILITIES- STATE OF NATIONS • The development and manufacturing of chips involve three primary activities in the value chain: design, fabrication, test and assembly. • Prior to 1980s, the semiconductor industry was vertically integrated. Semiconductor companies owned and operated their own silicon wafer fabrication facilities and developed their own process technology for manufacturing their chips. These companies also carried out the fabrication, assembly and testing of their chips. 3
  • 4. Value Chain Design Fabrication Assembly Huge fixed investment (currently on the order Requires expensive of $2 billion) to build a equipment Skill intensive plant (called a fab) Plant holds a wide Lower overall costs of variety of expensive plant and equipment equipment Requires expensive EDA (electronic design Plant has to meet automation) software, Low average skill extreme requirements requirements of cleanliness. 4
  • 5. Emergence of independent Fabs • Investment in Fabs (1995-2006) in USD billions: • USA- 74 • Japan- 66 • Taiwan- 72 (Foundry production is the largest segment of Taiwan’s domestic industry; in 1999, foundry related business accounted for almost 60 percent of Taiwan’s total industrial revenue.) • China-26 • India- nil 5
  • 6. Fabless IC suppliers • Total Fabless: $62.50 billion (2010) • U.S. companies occupy eight of the top ten slots by sales volume. Qualcomm tops the list of Fabless suppliers. Indian score on: • Integrated Fabs: NIL • Independent Fab : Nil • Fabless IC production: NIL 6
  • 7. Emergence of fabless semi- conductor design firms 7
  • 8. Special Manpower Development Program in VLSI Design and Related Software ,Phase-II (SMDP-II) Establishing State-of-the- art VLSI Design Labs Generation of SMDP-II VLSI Manpower at Website & 7 various levels sites at RCs in the VLSI Design Area Major Elements of the Program Instruction Enhancement India Chip Program (IEP) Program for faculties of PIs Workshops with International Guest Faculties 8
  • 9. Primary Objective To train special manpower in the area of VLSI Design and related software at M.E./M.Tech level (Type-II manpower). In addition to this, generation of Type-III manpower i.e. M.E./M.Tech in other areas of electronics etc. with at least two courses on VLSI design will also be undertaken. 9
  • 10. Secondary Objective To train Type-IV manpower i.e. B.E./B.Tech in electronics etc. with graduate level courses on VLSI Design. However, the program will not only be limited to generation of Type-II, III & IV manpower but would endeavour to generate Ph.D in various aspects of VLSI design/microelectronics (Type-I manpower) manpower as well. The establishment of VLSI design laboratories at RCs would also strengthen their academic program. 10
  • 11. Implementing Organizations • 7 Resource Centers : 5 IITs, IISc Bangalore, CEERI Pilani • 25 Participating Institutes : 16 NITs, 9 other institutions. • Total Outlay - Rs.49.98 Crores 11
  • 12. Achievements • Establishing State–of-the art VLSI Design Laboratories at 32 institutes. • Generation of manpower in VLSI Design area at various levels :a total of 20,114 engineering graduates in Electronics/ Communication/ Computer Science/ Instrumentation etc had taken a graduate level course in VLSI design. At PG level, 4,395 students had taken at least two courses in various aspects of VLSI Design and CAD. An addition 2,701 PG students had their specialization at ME/MTech in VLSI design & CAD. Further PhDs were awarded to 255 researchers in various aspects of VLSI design & CAD. 12
  • 13. Chip Layout views of integrated designs under India Chip Programme 13
  • 14. India Design Centers • Top 18 of 20 Top US semiconductor firms established Design Centers in India. • List includes: • Intel, TI, Freescale, AMD, IBM, QUALCOMM, Broadcom, Analog Devices, SanDisk, National, Agilent, ATI, etc 14
  • 15. Why India matters in Chip design • Skilled manpower: Credit goes to a large extent to SMDP initiative. • Preference to work with MNCs: • Fear of Chinese clones: 15
  • 16. The future: System on Chip Challenges: • Getting our hands dirty in IP Trading • Move from R&L ( Research and learning) to R&D ( Research and Development) 16
  • 17. Thanks 17