Buy the report "Thermal Interface Materials: Technologies, Applications and Global Markets" at US $5450 for a Single User PDF License from RnR Market Research Reports Library. An overview of the global market for thermal interface materials, which have experienced growing demand with the increased need for thermal management technologies.

1. RnR Market Research Offers “Thermal Interface Materials: Technologies, Applications
and Global Markets” Report at US$ 5450 Single User License. The report got published in
Apr 2013 & Contains 140 Pages.
This report provides:
- An overview of the global market for thermal interface materials, which have experienced growing
demand with the increased need for thermal management technologies
- Analyses of global market trends, with data from 2011 and 2012, and projections of compound annual
growth rates (CAGRs) through 2017
- Identification of thermal interface materials (TIM) technologies and products with the greatest
commercial potential in the near to mid-term, and of companies that are best positioned to meet this
demand because of proprietary technologies, strategic alliances, or other advantages
- Discussion of TIM products, such as thermal greases, thermal compounds, thermal pads, adhesive films
and tapes, epoxies, and phase-change materials
- Applications and end users
- Industry structure and competition
- Patent analysis
- Comprehensive company profiles of developers and suppliers.
Introduction
Study Background
In recent years, tremendous progress, both technologically and in terms of demand, has been made in
electronic devices and systems. The technological progress has come on two main fronts: increased
functionality on a single-device unit and miniaturization of each unit. Both of these developments have
increased the need for thermal management technologies, including thermal interface materials (TIM).
In the thermal management of microelectronics, the interface material layer between a chip and heat
spreader presents the single largest barrier to heat flow in the packaging of high-power dissipation
devices. The selection of a suitable material to fill the interface between a chip and a heat spreader is
critical to the performance and reliability of the semiconductor device. For this reason, continuous effort
has been made to develop new thermal interface technologies.
BCC Research has published a report on the market for all types of thermal management technologies
(SMC024G The Market for Thermal Management Technologies, now in its seventh edition). BCC
Research, however, believes that the importance of TIM materials and the high rate of innovation merit
more detailed analysis in a report of their own.
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technologies-applications-and-global-markets-market-report.html
Study Goals And Objectives
The goal of this report is to provide an up-to-date analysis of recent developments and current trends in
the global TIM materials market. Specific objectives include:
- Identifying TIM technologies and products with the greatest commercial potential in the near to mid-term
(2010–2016).
- Analyzing the key drivers and constraints that will shape the market for TIM technologies over the next
five years.
- Estimating the current and future demand for TIM technologies and products.

2. - Ascertaining which companies are best positioned to meet this demand because of their proprietary
technologies, strategic alliances or other advantages.
Intended Audience
This report is intended especially for suppliers of TIM and others with a need to understand the status and
dynamics of the market for these products. The report is organized around specific technologies, but it is
largely nontechnical in nature and coverage, meaning it is concerned less with theory and jargon than
with identifying technologies that work, projecting the amount of the latter the market is likely to purchase
and estimating the price that is likely to be paid.
As such, the report’s main audience is executive management, business development, marketing
departments and financial analysts. It is not written specifically for scientists and technologists, although
its findings measure and analyze the market for their work, including the availability of government and
corporate research funding for different technologies and applications.
Scope And Format
The report addresses the global market for thermal interface materials products during the period from
2011 through 2017, including:
- Thermal greases.
- Thermal compounds.
- Thermal pads.
- Adhesive films and tapes.
- Epoxies.
- Phase-change materials.
- Metal-based TIM.
The report format includes these major elements:
- Executive summary.
- TIM overview.
- TIM technologies and products.
- Applications and end users.
- Developers and suppliers.
- Market estimates and projections.
- Industry structure and competition.
- Patent analysis.
The geographic scope for this report is the global market.
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Information Sources And Methodology
The findings and conclusions of this report are based on information gathered using both primary and
secondary research methodologies from various sources. The primary sources of information were
Internet searches and industry association data, along with interviews conducted with thermal interface
material suppliers, custom engineering companies and manufacturers of representative
applications. Secondary sources included industry journals and publications, product literature, white
papers and technical journals, and financial reports for industry suppliers.
The base year for analysis and projection is 2011. At the time this report was prepared (February 2013),

3. 2012 data were not yet available for all sectors. Therefore, with 2011 as a baseline, market projections
were developed for the period from 2012 to 2017. These projections are based on a combination of a
consensus among the primary contacts combined with BCC’s understanding of the key market drivers
and their impact from a historical and analytical perspective. The analytical methodologies used to
generate the market estimates are described in detail in the market analysis.
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Table Of Contents
Chapter 1 Introduction 2
Study Background 2
Study Goals And Objectives 2
Intended Audience 2
Scope And Format 3
Information Sources And Methodology 3
Analyst Credentials 4
Related BCC Research Reports 4
BCC On-Line Services 5
Disclaimer 5
Chapter 2 Executive Summary 7
Summary Table Global Consumption Of Thermal Interface Materials 2011-2017 ($ Millions) 7
Summary Figure Global Thermal Interface Material Market By Type, 2011-2017 (%) 7
Chapter 3 Overview 10
General Description Of Thermal Interface Materials 10
Definition 10
Properties 10
Table 1 Thermal Interface Material Properties 10
Thickness 11
Viscosity 11
Dielectric Strength 11
Thermal Conductivity 11
Thermal Contact Resistance 11
Thermal Impedance 12
Modulus 12
Thermal Expansion Coefficient 13
Operating Temperature 13
Thermal Interface Material Types 13
Table 2 Thermal Interface Material Types 13
Thermal Greases 13
Thermal Compounds 14
Thermal Pads 15
Thermal Tapes 15
Epoxies 16
Phase-Change Materials 16
Other Materials 16
End Uses 17
Chapter 4 Importance Of Thermal Management Importance 38
Figure 18 Causes Of Electronic Failure (% Of Occurrences) 38
Environmental And Regulatory Factors In Thermal Management 41
Global And Regional Thermal Management Market Trends 41
Chapter 5 Thermal Interface Materials 46

4. Polymer Composites 46
Polymers 46
Silicone 47
Polyurethane 47
Acrylates 47
Epoxy 48
Fillers 48
Table 10 Thermal Interface Filler Material Properties 48
Ceramics 49
Alumina 49
Aluminum Nitride 49
Beryllium Oxide 50
Other Ceramic Fillers 50
Chapter 6 Thermal Greases 62
Summary 62
Figure 21 Global Thermal Greases Market, 2011-2017 ($ Millions) 62
Technologies 62
General Description 62
Materials 63
Matrix Materials 63
Filler Materials 64
Ceramics 64
Chapter 7 Thermal Compounds 75
Summary 75
Figure 28 Global Thermal Compound Market, 2011-2017 ($ Millions) 75
Technologies 76
General Description 76
Thermal Compound Types 76
Applications And End Uses 76
Chapter 8 Thermal Pads 84
Summary 84
Figure 33 Global Thermal Pad Market, 2011-2017 ($ Millions) 84
Technologies 84
General Description 84
Materials 85
Elastomers 85
Fillers 85
Matrix Materials 85
Using Thermal Pads 85
Applications And End Users 86
Figure 34 Thermal Pad Market By End Use, 2011 (%) 86
Suppliers 87
Chapter 9 Thermal Adhesive Tapes 94
Summary 94
Figure 38 Global Thermal Adhesive Tape Market, 2011-2017 ($ Millions) 94
Technologies 94
General Description 94
Materials 95
Carbon Nanotube Tapes 95
Thermal Adhesive Tape Use 96
Applications And End Uses 96
Chapter 10 Epoxy Thermal Interface Materials 103

5. Summary 103
Figure 43 Global Epoxy Thermal Interface Material Market, 2011-2017 ($ Millions) 103
Technologies 104
General Description 104
Materials 104
Resins And Hardeners 104
Fillers 105
Other Ingredients 105
Thermal Epoxy Application 105
Applications 105
Chapter 11 Phase-Change Materials 113
Summary 113
Figure 48 Global Phase-Change Thermal Interface Material Market, 2011-2017 ($ Millions) 113
Technologies 113
General Description 113
Materials 114
Applications And End Uses 114
Chapter 12 Metallic Thermal Interface Materials 121
Summary 121
Technologies 121
Solder 121
Materials 122
Application 122
Reflow Soldering 122
Solder Preforms 122
Metal-Matrix Composites 122
Materials 123
Aluminum-Matrix Composites 123
Copper-Matrix Composites 123
Other Metal Interface Materials 123
Liquid Metals 124
Soft-Metal Alloys 124
Applications And End Uses 124
Chapter 13 Industry Structure 133
Market Shares 133
Chapter 14 Company Profiles 136
3M Co. 136
Aavid Thermalloy LLC 136
Aegis Technology 136
AI Technology 136
Akasa Corp. 137
Chapter 15 Patent Analysis 151
Thermal Interface Material Types 151
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