The document provides specifications and guidelines for various processes in surface mount technology production including shipping, storage, solder paste, stencil printing, statistical process control, automated optical inspection, reflow soldering, manual soldering, underfilling, and placement processes. Key parameters and requirements are defined for storage conditions of components and materials, paste specifications, stencil and squeegee specifications, printing process parameters, reflow profile specifications, and inspection criteria.

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CONTENTS
1. SHIPPING, STORAGE and PRODUCTION ENVIRONMENT..............................................................2
1.1 General shipping and storage conditions..........................................................................................2
1.2 Storage and handling conditions for solder paste............................................................................2
1.3 Storage conditions for underfill epoxy materials...............................................................................3
1.4 Storage and handling conditions for printed wiring boards [PWBs]..............................................4
1.5 Shelf life time for different component categories............................................................................5
1.6 Drying (baking) moisture sensitive devices.......................................................................................6
2. PASTE SPECIFICATIONS......................................................................................................................... 7
3. STENCIL PRINTING PROCESS SPECIFICATIONS.............................................................................8
3.1 Squeegee............................................................................................................................................... 8
3.2 Stencil......................................................................................................................................................8
3.3 Support tables........................................................................................................................................9
3.4 Printing process parameters (stencil printing)................................................................................10
4. STATISTICAL PRINTING PROCESS CONTROL, SPPC...................................................................11
4.1 Alarm and control limit settings.........................................................................................................11
4.2 Actions when the machine alarms....................................................................................................12
4.3 Handling of statistical process information......................................................................................12
5. AUTOMATED OPTICAL INSPECTION, AOI.........................................................................................12
5.1 Location of the machine in the production line...............................................................................12
5.2 Utilisation of inspection results..........................................................................................................12
5.3 Component and paste alarm limits...................................................................................................12
6. REFLOW SOLDERING PROCESS SPECIFICATION........................................................................ 13
6.1 Profile measurement equipment.......................................................................................................13
6.2 Reflow profile measurement method............................................................................................... 13
6.3 Reflow profile specification................................................................................................................14
6.4 Recommended reflow oven settings................................................................................................15
7. MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA............................................15
7.1 Manual and semi-automatic hot gas soldering and rework..........................................................15
7.2 Manual soldering and rework using soldering iron........................................................................ 16
7.3 CSP rework..........................................................................................................................................16
7.4 Specifications for visual inspection; error criteria, faults classification and training material..17
8. UNDERFILL PROCESS............................................................................................................................17
8.1 General................................................................................................................................................. 17
8.2 Dispencing pattern for CSP components........................................................................................18
9. PLACEMENT PROCESS SPECIFICATIONS.......................................................................................19
9.1 Nozzles................................................................................................................................................. 19
9.2 Feeders.................................................................................................................................................19
9.3 NC-Programs.......................................................................................................................................19
9.4 Part Data / Vision processing............................................................................................................20
9.5 Placement process management data compatibility table........................................................... 20

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1. SHIPPING, STORAGE AND PRODUCTION ENVIRONMENT
1.1 General shipping and storage conditions
Expected shipping conditions (components and materials)
Relative humidity RH 15 % - 70%
Temperature -5°C...+40°C
NMP Storage conditions
Relative humidity RH 15%-60%
Temperature Temperature 25°C  5°C
Component packing level Components must be at least in the first level delivery
packing:
- MBB (Moisture Barrier Bag) for humidity
sensitive components
- ESD (Electro Static Discharge) protective
packing
- Air flow preventive plastic packing (vacuum
or not)
- Cardboard box if nothing of above mentioned
packing are used
General storage
requirements
Materials are not allowed to be stored:
- in direct sun shine, not even through
windows
- close to heater/cooler/humidifier/light source
- close to outdoors so that
temperature/humidity limits are repeatedly
exceeded
NMP production conditions
Relative humidity 40%-70%
Temperature 23.5°C  3°C
1.2 Storage and handling conditions for solder paste
Storage temperature Refrigerator, 10 – 15 C
Shelf storage time 3 months
Storage time in room temperature 4 weeks
Stabilisation time before usage 4 hours
Environment in shipping Temperature +5…+25 C
Preferred delivery package Cartridge
Do not store cartridges in the same position
more than 4 weeks.

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Do not store cartridges nozzle-end up
1.3 Storage conditions for underfill epoxy materials
Material name and
type
Loctite 3566 Namics Ohmcoat 1572
Max transportation
time
Goods must be received
within 4 days after shipment
Goods must be received
within 4 days after shipment
Package type Syringe, EFD compatible 50
cc or 6oz,
173cc Semco
Syringe, EFD compatible 50
cc or 6oz,
173cc Semco
Storage condition Syringes must be transferred
immediately from
transportation package to
intermediate storage (freezer,
-40 C)
Following items must be
recorded:
- product type, package size
- color (white) without
deformation
- lot number
- date of shipment
- amount of dry ice
Syringes must be transferred
immediately from
transportation package to
intermediate storage
(freezer, -40 C)
Following items must be
recorded:
- product type, package size
- color (black) without
deformation
- lot number
- date of shipment
- amount of dry ice
Max storage time 6 months @ -40C 12 months @ -40C or
6 months @ -20 C from
manufacturing date and kept
in closed syringes
Pot life Once opened syringe must be
used within 8-12 hours
Once opened syringe must
be used within 24 hours
Special attention This is flammable liquid.
Keep out of ignition sources.
Cured waste is harmless.
Uncured, liquid epoxy is
hazardous waste. Read
"Material Safety Data Sheet"
and wear protective clothing
and face mask.
This is flammable liquid.
Keep out of ignition sources.
Cured waste is harmless.
Uncured epoxy is hazardous
waste. Read "Material
Safety Data Sheet" and
wear protective clothing and
face mask.

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1.4 Storage and handling conditions for printed wiring boards [PWBs]
Standard PWBs Micro via and Aramid (ALIVH) PWBs
Delivery
package and
storage
Air evacuated plastic
packing
50 panels/bag from
same manufacturing lot
HIC and desiccant
optional
Air evacuated Moisture Barrier Bag
(MBB) according EIA-583 class 2, 50
panels/bag, all from same
manufacturing lot
Humidity Indicator Card (HIC),
5 levels, on the top of PWB stack
Desiccant optional
Incoming
inspection
Check that MBB is not broken or HIC
reading is 40% RH
Actions if NOK:
-return to vendor or
-bake in 60 C, 5 hours, RH 5%,
soldering within 24 hours
Shelf time Look table below
(see section 1.5)
Look table below
(see section 1.5)
Open time Soldering within 168
hours
Soldering within 48 hours
Cleaning/
washing
Not allowed Not allowed

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1.5 Shelf life time for different component categories
Component type Solderable finish Min first level packing in
shipping and storage
Max shelf
life
Discrete passive
components or electro
mechanical parts
SnPb or equivalent
(Sn) on Ni
Open shelf, cardboard box 12 months
Discrete passive
components or electro
mechanical parts
Au on Ni Open shelf, cardboard box 12 months
Discrete passive
components or electro
mechanical parts
Ag, AgPd, AgPt Vacuum pack and drier 6 months
usage within
168 h
Discrete passive
components or electro
mechanical parts
Ag, AgPd, AgPt Airtight pack and drier 3 months,
usage within
168h
Discrete semiconductors
and ICs (not moisture
sensitive classified)
SnPb, Pd or equivalent
on Ni
Open shelf, cardboard box 12 months
Moisture sensitive
devices(
*, JEDEC levels
from 3 to 5
SnPb, Pd or equivalent
on Ni
Vacuum pack, desiccant
drier and humidity indicator
12 months
Module type components
(duplexers, power modules,
etc.)
SnPb, Pd or equivalent
on Ni
Cardboard box or cabinet if
not otherwise stated
12 months
Standard PWBs Immersion Au on Ni or
OSP
According EIA 583 class 2
and/or part code specific
instructions
6 months
Micro via PWBs Au on Ni or OSP According EIA 583 class 2
and/or part code specific
instructions
6 months
*) Moisture sensitivity levels:
LEVEL FLOOR LIFE
Time Conditions
1 Unlimited 30C/85% RH
2 1 year 30C/60% RH
2a 4 weeks 30C/60% RH
3 168 hours 30C/60% RH
4 72 hours 30C/60% RH
5 48 hours 30C/60% RH
5a 24 hours 30C/60% RH
6 Time on Label (TOL) 30C/60% RH

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1.6 Drying (baking) moisture sensitive devices
The components that typically are moisture sensitive are all PWBs having microvias on
pads or having Aramid fibre reinforcement, most QFP components with lead count higher
than 50, all CSP components regardless of ball count, most optical devices based on
acrylic plastics (IR modules, all LEDs), special plastic integrates structures (plastic power
devices including polyimide tape or equivalent interfaces).
The purpose of NMP baking is to decrease amount of water from plastic packages prior
soldering. As absorbed water vaporise in reflow, internal cracks and failures may be
created.
Note standards and instructions for moisture sensitive components regarding
protective packing in shipping and storage together with this specification.
Moisture sensitive component
unprotected exposure time in ambient
Preventative action required
More than 48, but less than 168 hours,
In case JEDEC class 5a or 6, more than
24 h
bake condition: 12 (+10,-2)h @60 5C,
RH 5%
More than 168 hours bake condition: 168h@605C, RH 5%
Note! Prevent direct contact of reels to drying chamber side and bottom walls,
since these may be at significantly higher temperature than oven controller
indicates. Verify feasibility of drying oven to component moisture removal and
effect of various loading conditions by careful study of oven temperature control
system.

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2. PASTE SPECIFICATIONS
Solder paste Multicore Solders
Sn62RP11ABS89.5
NMP code 7600017 (650 g cartridge)
7600015 (500 g jar)
Delivery package 650 g Semco cartridge
500 g jar
Solder alloy Sn62Pb36Ag2
Particle size ABS (53-25 um)
Metal content 89.5% (+0.3%, -0.6%)
Flux activity
classification
(J-STD-004)
ROL1
Viscosity (Malcom
PCU-205 @ 25°C):*
TI 0.62  10%
10 rpm 1700 P  10%
*) Note:
Viscosity specification for reference only. Considerable differences can exist between
individual measuring equipment.
Thixotropic Index 






)18(cos
)8.1(cos
log
rpmityvis
rpmityvis
TI

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3. STENCIL PRINTING PROCESS SPECIFICATIONS
3.1 Squeegee
Property Specification
Squeegee blade material
Corrosion protected spring steel, stainless steel or
titanium coated with adequate stiffness for high
speed printing
Print angle* (critical parameter) 57.5°  2.5°
Squeegee width for DEK&MPM
and equivalent printers
Panel length rounded up to closest std width
Paste retainers
Required, adjust close to stencil surface, but
retainers must not touch stencil during printing
operations if not spring loaded
Recommended squeegee types
- MPM: 8" or 12" MPM squeegee assembly
- DEK: 200 mm or 250 mm DEK
squeegee assembly
- ICL Omni Print 8" or 12" squeegee
assembly with spring loaded paste
retainers
- Titano UP-8, 8" titanium coated blades
Note! Squeegee flexural strength is a critical parameter.
*) Method of measurement: Bevel protractor
3.2 Stencil
Property Specification
Stencil frame coplanarity measured at the
bottom surface
Max 1mm, remove possible
adhesive residues
Screen material
Normal grade polyester screen 55T-
66T (140-167 mesh/inch), equivalent
stainless steel accepted, but not
recommended
Screen tension (measurements on stencil
foil will give erroneous, but indicative
results) after stencil attachment at any
point*
min 25N/cm
Stencil aperture opening dimensional max  10 m or  5% deviation

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variation maximum
Stencil thickness (DCT4 products, 0201pad
geometry, 0.5mm CSP pitch)
0.10mm  0.01mm
Stencil thickness (0402 or min 0.4mm pitch
QFP, min 0.75mm pitch CSP)
0.12mm  0.01mm
Stencil material
Electro formed nickel or
laser cut stainless steel
Recommended stencil area of frame inner
area
60%  10%
Stencil rejection criteria by tension in
production measured at screen at any
point*
20N/cm or less
Fiducials
2x1mm dia sphere etched half-way
on stencil
*) Method of measurement: Fabric Tension Gauge, for example ZBF Tetkomat, CH-8803
Rüschlikon, Switzerland, fax. 01/724 15 25, or equivalent.
3.3 Support tables
Property Specification
Material Machined construction metal as steel or anodized Al
alloy. High friction surface on the top recommended.
Support table parallelity to stencil frame
clamps
Max 0.2mm
Supporting surface smoothness  0.025mm on whole area
Machining depth* Max component height + min 5 mm
Module edge support* Module edge supported 1.5mm  0.5mm from edge
towards module center, max edge span around
critical areas without support max 15mm
Module inner area support (support
pins)*
Max PWB span without support 35mm
Support pins* Machined in dedicated workholder, M3x15 set
screws or equivalent
Vacuum holes on support table Primarily locate at non-printable area and prevent
vacuum leakage to print area. If vacuum can be
limited to 100-200 mbar reliably, vacuum assistance
over whole area may be possible with careful
process adjustment.
*) Side2 support table only

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3.4 Printing process parameters (stencil printing)
Parameter Setting
Print speed 100mm/s recommended, min 70mm/s, max
120mm/s
Note: Under non-conforming situations caused
by technical problems, lower than specified
speeds are temporarily accepted.
Squeegee pressure for 200mm wide
squeegee** in constant force mode
(force automatically adjusted, print head
floating)
minimum pressure that will wipe stencil
surface clean +5N as safety margin, normally
between 40 – 50 N
Squeegee adjustment for MPM printers
(constant squeegee distance (negative)
from PWB surface, force against down
stops)
Minimal adjustment that will wipe stencil
surface clean +0.5mm as safety margin
Snap-off distance -0.5 - 0.0mm on whole panel area (negative
snap-off recommended to give margin against
machine misadjustments)
Separation speed Max. 20 mm/sec until stencil has released,
then maximum speed.
Automatic wipe rate After every 10  5 prints Note: Under non-
conforming situations caused by temporary
technical problems more frequent wipe may
be applied.
Wipe cycle recommendation 1 dry with vacuum or 1 dam followed by 1 dry
for printers without vacuum option
Recommended cleaning fluid for printer
automatic wiping
Multicore Prozone SC-01 or equivalent high
flash point solvent officially accepted by printer
manufacturer. Use of isopropanol (IPA) or
equivalent solvents is not recommended due
to fire safety.
Recommended cleaning fluid for
cleaning of misprinted boards
Multicore Prozone SC-02 is preferred (SC-02
will attack slightly acrylics and some rubbers
used in protective gloves)
Use of isopropanol (IPA) is allowed but not
recommended. Waste must be handled
properly.
Note! Components that are not designed for
liquid cleaning process, have to be removed
and changed after cleaning.
PWB with laser (micro) vias, OSP plating or
which are totally or partly Aramid based, ARE
NOT ALLOWED TO BE WASHED! Cleaning
solvent traps into PWB structures and reduces
esp. CSP components joint reliability.

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Support table vacuum OFF while printing, unless dedicated
workholder is of such construction that no
vacuum is created between PWB and stencil
OR vacuum is limited to 100-200mbar.
Vacuum ON during loading and table
movements (activate special 1043 in AP-25
SW 6.1 or later).
Kneading1 8 kneads after every 20min or longer pause in
printing process and recommended after
addition of paste. Otherwise not needed.
Solder paste amount on stencil 150 – 160 g + paste attached to squeeze
(200mm )
Printing accuracy +/- 0.05 mm
*) Sometimes referred as ”squeegee pressure” and force given in KGs, 1kg=9.81N
**) Depends linearly on squeegee width
1)
Automatic procedure to soften paste and dissolve partly dried paste residues at stencil
aperture opening edges instead of stencil manual cleaning. The panel used for kneading
can be fed to production line as normally printed board. After pauses beyond 120min
careful stencil cleaning in dedicated cleaner is recommended.
4. STATISTICAL - PRINTING - PROCESS CONTROL, SPPC
4.1 Alarm and control limit settings
In order to determine alarm and control limits for the SPPC machine at least 5.000 boards
must be measured in normal process conditions. Successive boards must be processed
as subgroups of about 10 pcs. Ideally subgroups should match with a board batch printed
between stencil cleaning. Alarm limits for Area and Bridge parameters equal to 3 x
standard deviation of collected data (5.000 boards).
Control limit Specification
Control limit for Area 3Area
Control limit for Bridge 3Bridge
In order to make sure that too low value isn't accepted as a control limit following minimum
values are requested for both Area and Bridge.
Minimum values for each limit are:
Control limit for Area 70%
Control limit for Bridge 60%

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The acquired data can be analysed and limits defined by the software called SPC-PC-IV
which is included in system software package of SPPC equipment.
4.2 Actions when the machine alarms
When the SPPC machine alarms the paste printing process must be verified immediately
by checking board – stencil alignment, amount of paste and condition of stencil. More
detailed troubleshooting information is available from local process support team. When a
problem is fixed the alarm will be automatically reset after 5 to 10 boards.
4.3 Handling of statistical process information
Reports from SPPC system must be printed out and analysed on weekly basis.
Corrective actions must be agreed and implemented when remarkable deviations from
nominal values exist.
5. AUTOMATED OPTICAL INSPECTION, AOI
5.1 Location of the machine in the production line
In most cases the best location for AOI machine is after high speed placement machines.
In this stage all chip components are placed and paste deposites of integrated circuits are
still visible.
5.2 Utilisation of inspection results
Primary purpose of use of AOI machines is monitoring of paste printing and placement
processes. This can be done by using the SPC software package delivered with the
machine or by supplying inspection results to dedicated process monitoring software if
available.
It is also possible to rationalise rework by sending AOI failure information to rework station.
5.3 Component and paste alarm limits
Next table describes recommended alarm limit values for different component types and
for paste printing. The objective is to detect placement errors that can't be fixed by self
aligment during reflow process and to avoid unnecessary alarms.
Component type Placement alarm limit specification
0402  150 m for X and Y, 10 for Theta
0603 and bigger chip components  200 m for X and Y, 10 for Theta
Leaded components  150 m for X and Y,  5 for Theta
Paste printing accuracy  50 m for X and Y
Paste printing Area coverage 70 - 125% of nominal value

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6. REFLOW SOLDERING PROCESS SPECIFICATION
6.1 Profile measurement equipment
Reflow profile shall be measured using a temperature measurement equipment
specifically designed for pass-through reflow profile measurements.
Recommended profiling equipment are:
Multicore SlimLine SoldaPro
Datapaq 9000
SlimKIC
The profiling equipment shall be calibrated regularly according to the maintenance
instructions by the supplier.
Only the thermocouples recommended and approved by the measurement equipment
supplier shall be used.
6.2 Reflow profile measurement method
Item Oven calibration and verification
Purpose To evaluate oven functionality to specified profile and settings
(preventive maintenance)
Measurement
frequency
Once in two weeks, after every major maintenance or whenever
deviation is suspected
Measurement piece Plain PWB
100x100x1 mm plain FR4 laminate recommended
Number of
thermocouples
2
Position of
thermocouples
1 thermocouple attached to PWB (PWB temperature). This profile shall
conform to specification in section 6.3.
1 thermocouple 2…3 mm above the PWB surface (air temperature near
the PWB).
Thermocouple
attachment method
PWB thermocouple shall be attached reliably by glue, screw or high
melting point solder.
Repeatability and Reproducibility (Gage R&R) of thermocouple
attachment shall be verified when taking new thermocouples in use.
Critical parameters are time above 179°C (ref. 5), peak temperature (ref.
6) and temperature gradients in preheat (ref. 1) and reflow (ref. 4)

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6.3 Reflow profile specification
Ref Parameter Specification
Method of heat transfer Forced convection
Measurement method Oven calibration method (section)
1 Average temperature gradient in preheat (T=
40…140°C)
2…3 °C/s
Max temperature gradient in preheat 10 °C/s
2 Soak time in preheat (T= 140…170°C) 60…80 s
3 Max temperature in preheat 175°C
4 Average temperature gradient in reflow (T=
175…200°C)
1.3…2 °C/s
Max temperature gradient in reflow 5°C/s
5 Time above 179°C 40…60 s
Time above 200°C 25…45 s
6 Peak temperature in reflow 215…225°C
7 Average temperature gradient in cooling
(T=200…120°C)
-1.5…-3°C/s
Max temperature gradient in cooling -5°C/s
Total length of profile Max 300 s
Time/s
Temperature/C
1
2
3
4
5
6
7
Figure 1. Illustration of critical reflow process parameters.

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6.4 Recommended reflow oven settings
The following settings shall verified for each oven using oven calibration method (section
6.2) and settings shall be adjusted if necessary to achieve a profile within the specification
in section 6.3.
ERSA Hotflow 7
Zone 1 2 Reflow Cooling
Top 170°C 180°C 245°C Additional cooling unit
TOP switched OFF
Bottom 170°C 180°C 245°C
Conveyor speed 0.85 m/min
Blower speed 70% 70%
BTU VIP98
Zone 1 2 3 4 5 6 7 Cooling
Top 120°C 135°C 150°C 165°C 175°C 215°C 245°C
Bottom 120°C 135°C 150°C 165°C 175°C 215°C 245°C
Conveyor speed 0.78 m/min
Static pressure 1.2
7. MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA
7.1 Manual and semi-automatic hot gas soldering and rework
Parameter Specification
Max air temperature measured
at PWB surface
+260°C
Recommended method of air
temperature calibration
Use light weight NiCr/Ni thermocouple or calibrator such as
ERSA DTM100* or equivalent
Max air velocity 10m/s
Max exposure time 30s
Nozzle size and shape
Select according to application to create selective heating
at joint areas. Especially for larger components, a
dedicated nozzle has to be used.
Warning! A visual change in PWB surface characteristics during heating is a sign
of too high a temperature and/or too long exposure time and must result in
rejection of module.

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7.2 Manual soldering and rework using soldering iron
Parameter Specification
Tip diameter Selected to fit application
Recommended tip temperature
for soldering SMD components
+260°C  10°C (tip in contact with soldering point)
Recommended tip temperature
for soldering mechanical parts
as shields, spring clips, coax
tubes etc on PWB
+300°C +10°C -40°C
Recommended method of tip
temperature calibration
Use lightweight NiCr/Ni thermocouple or calibrator such as
ERSA DTM100* or equivalent. Use a lot of solder in tip to
assist in heat transfer
Antistatic protection Required
Maximum exposure time 3s
Recommended solder wire for
SMD
Multicore Solders Crystal 502 Sn62
Recommended diameters: 0.23, 0.32, 0.56, 0.7mm
Recommended solder wire for
soldering Ni stripes and non-
critical mechanical parts
Multicore Solders Crystal 511, Savbit.6 alloy, dia 1.0mm
Recommended rework flux (final
application method under
development)
Multicore Solders Multifix 425-01 in 30cc syringes
Recommended solder-wick Multicore No Clean Desoldering Wick or equivalent
* ERSA Löttechnik GmbH, fax. +49-9342-800-100
7.3 CSP rework
Materials and equipment
Approved rework station Zevac DRS-24, OK International BGA-
3000
Flux Multicore Multifix 450-01, NMP code
7540021
Solder iron tip Mini WaveTM
tip or similar
Component specific nozzles
Product specific support jig
Component specific rework programmes must be used according work instructions.
Maximum temperatures and exposure times are not allowed to be exceeded.

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7.4 Specifications for visual inspection; error criteria, faults classification and training
material
Applicable international
standard
ANSI/IPC-A-610B, class 2, telecommunications
Error criteria and fault
classification
“SMD Workmanship Standard”, MES00055.
Training package NMP training package “SMD Workmanship Standard”,
MES00055 or equivalent training material conforming
to ANSI/IPC-A-610B.
8. UNDERFILL PROCESS
8.1 General
Process phase Specification
Method of application: Dispensing; positive displacement pump
type valve is recommended.
Automatic dispenser: Asymtek M-600 or Cam/alot 3700
Needle: Gage 21 or 22, ¼" or ½" long needle.
Preheat of PWB: PWB surface temperature 40..70C
depending on underfill material and
dispensing pattern. Note: Loctite 3566
underfill material requires 60 - 70 C
PWB surface temperature for better
capillary flow and fill
Temperature of PWB and underfill: PWB: 50..70C. Note: Too high
temperature might cause gelling.
Underfill: 20..40C. Note: If the
temperature too high the viscosity inside
syringe starts to rise too fast.
Postheat of PWB: PWB temperature 40..70C. Note:
Postheat is not required if PWB goes
directly to curing oven after dispensing
process
Flow rate: 9..35mg/sec depending on dispensing
pattern
Dispensing speed: Max. 25mm/sec.
Fiducials: Two fiducial marks from PWB need to be
used.
Height sense: Two measurements need to be done to
make sure that the needle is on right

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height. Measurements need to be done
from first and third blocks. If the tooling is
not straight enough the height sense
needs to be done from all four blocks.
Needle height: 0.5mm from the PWB surface for 0.8mm
pitch CSP's (0.5mm bumps)
0.3mm from the PWB surface for 0.5mm
pitch CSP's (0.3mm bumps)
Note: If some 0402 or 0201 components
are closer that 1.1mm from the CSP
component the needle height must be
0.7mm.
Right fill If underfill can be seen from all four
sides.
MAD: 52-54mg (Note: Variation between
different PWB's causes variation to
required amount of underfill.)
Curing 150C/3min for Namics Ohmcoat 1572
and 150C/5min for Loctite 3566.
Note: Time is minimum time. Must not be
less, otherwise insufficient cure.
8.2 Dispencing pattern for CSP components
From process cycle time point of view it is recommended to use L-patterns. To avoid voids
the pattern needs to start and end 1.3mm from the corner (picture 3.). This way the risk of
voids is little and the dispensing speed is as fast as possible.
Picture 3. L-pattern for dispensing underfill.
1.3mm
1.3mm
Dispensing
pattern

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9. PLACEMENT PROCESS SPECIFICATIONS
9.1 Nozzles
Recommended nozzle sizes for some package types:
0201 (0603) Fuji CP series: 0.4 mm circular nozzle
Panasert MV2V: type SX
Siplace: type 702
0402 (1005) Fuji CP series: 0.7 mm circular nozzle
Panasert MV2 RSS mininozzles, part no 1022
4781 86 and MSH2: special small nozzles, part
no M1023 8-10-500-00
Siplace: type 901 or 925
Odd-shape components
(connectors, duplexers, power
modules, etc.)
As large nozzle as possible shall be used (usually
min diameter 5mm /area min 20mm 2
) in order to
maintain placing speed and accuracy
9.2 Feeders
High Speed machines 7” Tape&Reel is a standard for both Fuji and
Panasert. 13” reels can be used for 0402 resistors
and capacitors (13” with paper tape, blister tape
not allowed).
For Siplace 13" and 15" Tape&Reel can be used.
Low Speed machines 13” Tape&Reel is a standard, 7” and 15” may also
be used. Sticks and trays are not allowed.
9.3 NC-Programs
Placing sequence of 0402 In high-speed machines it is generally
recommended to assembly first all low parts
(0402 resistors 0.3mm), then parts, the height of
which is 0.3 - 0.5 mm (usually 0402 capacitors)
and then the rest of the components.
Independent / connected feeder
tables
It is always recommended to use feeder tables
independently in high-speed machines, thus
eliminating undesirable stoppages when a part
runs out. If connected tables must be used, it is
advisable to use “Next Device” or “Master Z-
Number” functions or/and 13” reels to decrease
component shortages of “high-runner” codes
NC-program optimization / All
modules mixed
This is usually the fastest way to assembly a
panel (all modules assembled mixed at the same
time as one big PCB) and is thus recommended.
NC-program optimization / Step
and repeat
If “step and repeat” mode (offset) is used, then
every other module must be assembled using
reverse placement sequence, so that the feeder
table doesn’t have to move unnecessarily from
left to right at each offset.

20. www.smthelp.com
9.4 Part Data / Vision processing
Chip components Fuji CP-series uses binary vision processing, Panasert
uses gray scale for 0402 chips. This is due to the actual
nozzle size behind the component body. With smaller
nozzles Panasert can use both. Binary vision is
recommended.
IC-type components Every lead shall be checked for pitch and lead length.
CSP components As general recommendation use outermost balls for
component alignment.
Complex connectors As general recommendation use outermost leads for
component alignment. Pls, check “lead insertion depth
tolerance” from component’s specifications, since this
affects in positioning of component body.
Placing speed 100 % placing speed is always the target. This can be
achieved with most package types by selecting the
proper nozzle (see 11.1, Nozzles).
9.5 Placement process management data compatibility table
Fuji Readings from F4G (Production Data -> Analyzer ->
Device) shall be used to manually generate following
rates:
Pick-up Rate = 1- Total Errors / Total Parts
Mount Rate = 1- Total Errors / (Total Parts - Total
Errors)
Panasert Rates from “Production Control Data”:
Pick-up Numbers = Total Number of Pick-ups
Mount Numbers = Pick-up Numbers - Total Errors
Pick-up Rate= 1- (Pick-up Error Numbers + Pick-up
Miss Numbers) / Pick-up Numbers
Mount Rate= 1-  (Pick-up Error N. + Pick-up Miss N. +
Parts Recog Errors + Shape Errors) / Mount Numbers
Siplace Rates from the line computer MaDaMaS system:
Comp. ok = Total count – id. err. – vac. err
Mount Rate = Comp. ok