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Snapdragon 800

Snapdragon 600

Snapdragon 400

Snapdragon 200

CPU

Up to 2.3 GHz Quad Krait 400 CPU

Up to 1.9 GHz Quad Krait 300 CPU

Up to 1.7 GHz Dual Krait 300 CPU

Up to 1.4 GHz Quad Cortex A5 CPU

GPU

Adreno 330 GPU

Adreno 320 GPU

Adreno 305 GPU

Adreno 203 GPU

DSP

Hexagon, QDSP6V5A, 600MHz

Hexagon, QDSP6V4, 500MHz

Hexagon, QDSP6V4, 500MHz

QDSP5, 384MHz

Video

4k x 2k UHD video capture/playback

1080p HD video

1080p HD video

720p HD Video (30/15 fps)

Modem

3G/4G World/multimode LTE on 
select processors

No modem

3G/4G World/multimode LTE on 
select processors

3G CDMA/UMTS/GSM on select 
processors

Camera

Up to 55MP, Stereoscopic 3D, Dual 
ISP

Up to 21MP, Stereoscopic 3D

Up to 13.5MP, Stereoscopic 3D on 
select processors

Up to 8MP

GPS

IZat Gen8B

IZat Gen8A

IZat Gen8A

IZat Gen7A

USB

USB 3.0/2.0

USB 2.0

USB 2.0

USB 2.0

Bluetooth

BT4.0 Integrated digital core†

BT4.0 Integrated digital core†

BT4.0 Integrated digital core†

BT4.0 Integrated digital core†

WiFi

802.11n/ac (2.4/5GHz) Integrated 
digital core†

802.11n/ac (2.4/5GHz) Integrated 
digital core†

802.11n/ac (2.4/5GHz) Integrated 
digital core†

802.11n/ac (2.4/5GHz) Integrated 
digital core†

Process 
Technology

28nm HPm

28nm LP

28nm LP

45nm LP

Individual 
Chipsets

8974(LTE)
• 8274 (HSPA+) 
• 8674 (CDMA)
• 8074 (No Modem)

8064T

 8930 (LTE)
• 8230 (HSPA+)
• 8630 (CDMA)
• 8930AB (LTE)
• 8230AB (HSPA+)
• 8630AB(CDMA)
• 8030AB(No Modem)
• 8226 (UMTS)
• 8626 (CDMA)







8225Q
8625
Snapdragon 600 Processor
Snapdragon 600 Specs
Processing

28nm LP quad core Krait 300 CPU at up to 1.9GHz per core
LP‐DDR3 memory for high performance and low latency

GPU

Speed enhanced Adreno 320 GPU delivers over 300% increase in graphics processing performance
Support for advanced graphic and compute APIs, including OpenGL ES 3.0, DirectX, OpenCL, Renderscript Compute and FlexRender™

Power 
Management

Energy efficient LP process and dynamic GPU clock and voltage scaling
Asymmetrical Multi‐Processing (aSMP) dynamic CPU power control for power‐optimized performance
Qualcomm Quick Charge 1.0 integrated for up to 40% faster battery charging

DSP

Hexagon, QDSP6
Hexagon DSP enables ultra‐low power operation for a variety of applications like music playback, enhanced audio effects, computer vision 
processing and still and video image enhancements

USB

USB 2.0

Bluetooth

BT4.0 + Integrated digital core

WiFi

802.11ac Wi‐Fi for peak Wi‐Fi performance + Integrated digital core

GPS

IZAT location technology features GNSS for accurate auto and pedestrian navigation and Indoor Location capabilities for advanced location‐
based services

Video/Audio

Capture and playback video at 1080p HD
HD multichannel sound with DTS‐HD and Dolby Digital Plus

Camera

Up to 21 Megapixel, stereoscopic 3D
Take high‐resolution, 3D photos with 21 Megapixel stereoscopic camera support

Display

Enjoy your photos, videos and games on large, high‐resolution display devices (up to 2048x1536) and even on 1080p external displays

Process 
Technology

28nm LP
FEATURES

MDM8215/M
28nm

Process Tech.

MDM9215/M
28nm

Package

10x10mm – MDM8215
9x9mm – MDM8215M

424 NSP 10x10mm – MDM9215
383 NSP 9x9mm – MDM9215M

Processor

ARMv7 Cortex‐A5 550MHz
Dual QDSP6‐TBDMHz

ARMv7 Cortex‐A5 550MHz
Dual QDSP6‐TBDMHz

MODEM

Release 8 DC‐HSPA+
GSM/EGPRS

Release 9 DC‐HSPA+
Release 9 LTE
TD‐SCDMA
GSM/GPRS/EDGE

Peak Data Rates
UL/DL

DC‐HSPA+: DL 42Mbps /
UL 5.76Mbps

EGPRS ‐ FL/RL: 236.8 / 236.8kbps
(MSC12)
DC‐HSPA+ ‐ FL/RL: 42 / 5.76 Mbps
LTE FDD ‐ FL/RL: 100 / 50 Mbps
(Cat 3)
LTE TDD ‐ FL/RL: 68 / 17 Mbps
(Cat 3)

Modem
Enhancements

UMTS: RxD, EQ, SCH‐IC,
Q‐ICE (Type 3i), 2x2 DL
MIMO
GSM: SAIC

UMTS: RxD, EQ, SCH‐IC, Q‐ICE
(Type 3i), 2x2 DL MIMO, HDOn
LTE: 2x2 DL SU‐MIMO
GSM: SAIC

Voice support

Integrated

Integrated

Frequency
Support

UMTS: 3GPP: 700 MHz,
800 MHz, 850 MHz, 900
MHz, 1700 MHz, 1800 MHz, 1900 MHz, 2100 MHz, 2300MHz, 2600 MHz
GSM: QB EGPRS (850,
900,1800, 1900)

UMTS: 3GPP: 700 MHz, 800 MHz, 850 MHz, 900 MHz, 1700 MHz, 1800 
MHz, 1900 MHz, 2100 MHz, 2300MHz, 2600MHz
GSM: QB EGPRS (850, 900,1800, 1900)

RF+PMIC chipset

WTR1605 + PM8018

WTR1605L + PM8018

WLAN

Soft AP support (AR6003)

Soft AP support (AR6003)

USB
GPS

USB 2.0 All Speed Peripheral or Host
Gen 8A with Glonass
Standalone, Assisted, XTRA, 3dB improvement vs. Gen 7

USB 2.0 All Speed Peripheral or Host
Gen 8A with Glonass
Standalone, Assisted, XTRA, 3dB improvement vs. Gen 7
With a sleek aluminum body, a live home screen that 
streams all of your favorite content, a photo gallery 
that comes to life, and dual frontal stereo speakers, 
the new HTC One is ready to reshape your smartphone
experience.
 Qualcomm PM8018 PMIC
 Qualcomm PM8821 PMIC
 Qualcomm PM8921 PMIC

 Synaptics S32028 touch screen controller
 Silicon Image Sil9244 MHL transmitter
 Qualcomm SnapDragon
 Elpida

600, PoP package

16Gb LPDDR2, PoP package

 SAMSUNG eMMC, 16/32/64GB
 STMicroelectronics Package Marking: 0100 9QRV304
 Qualcomm WCD9310 audio codec
 Bosch BMA200, Accelerometer

AKM AK8963, compass
 STMicroelectronics H3G2, Gyroscope 

 Qualcomm WTR‐1605L


AVAGO ACPM‐5020



Avago ACPM‐5007

TriQuint

TQM7M9023
 SKYWORKS SKY77762
 SKYWORKS SKY77764
 AVAGO ACPM‐5508
 Qualcomm MDM9215M

 Skyworks 85302‐11 
 Broadcom BCM4335
 NXP PN544, NFC controller
Manufacturer

Device

Function

Qualcomm Snapdragon 600(Package Marking: APQ8064)

1.7GHz, Quad‐core/Krait core/1MB L2, Adreno 320 GFx

BA164B1PF‐1D‐F

Dual‐channel, x32, 16Gb LPDDR2, LPDDR2‐1066

SAMSUNG

THGBM5G6A2JBAIR

SAMSUNG 16/32/64GB eMMC
32GB eMMC: KLMBG4GE2A 

Qualcomm

PM8921

▼Processor
Qualcomm
▼Memory
Elpida

▼PMIC

PM8821

PMIC for Qualcomm APQ8064

PM8018

PMIC for Qualcomm MDM9215M

WCD9310

SLIMbus/I2S Audio codec; 6+ channel

Synaptics

S32028

Touch screen controller

AKM

AK8963

Electronic compass

Bosch

BMA220

Accelerometer 

H3G2

Gyroscope 

IDG‐2021(Package markings: 1Y21 3009E1L1250)

Gyroscope for motion stabilization for Rear camera

SiI9244

HDMI‐to‐MHL™ Transmitter

Package Marking: 0100 9QRV304

Unknown

58698A

4M pixel camera, rear camera

OV2A9BA

2M pixel camera, front camera

▼Audio
Qualcomm
▼Touch Screen Controller

▼MEMs

STMicroelectronics
Invensense
▼Video
Silicon Image
STMicroelectronics

OmniVision
Manufacturer

Device

Function

Broadcom

BCM4335

‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.0
‧FM Receiver

Skyworks

85302‐11

2.4 GHz, 256 QAM WLAN/Bluetooth® Front‐End Module

MDM9215M

Baseband processor
‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)
‧Rel 9 DCHSPA+(42/5.76Mbps)
‧TD‐SCDMA(4.2/2.2Mbps)
‧QICE
‧Integrated Memory

WTR1605L

Multi‐band* plus 700/1500/2600/B41 GPS+Glonass

TQM7M9023

Multi‐Mode, Multi‐Band Power Amplifier (MMPA) with Quad‐Band 
GMSK / EDGE and Dual‐Band WCDMA
•Quad‐band Linear GSM / EDGE
•UMTS B1 and B5/B8
•Input power controlled ‐ GMSK and 8PSK
•GSM LB has 3 modes ‐ HP, MP, LP
•GSM HB has 2 modes ‐ HP, LP
•WCDMA has 3 modes ‐ HP, MP, LP
•HBT / PHEMT / CuFlip™ PA Technology

A5508

UMTS amd GSM/EDGE Power amplifiers for UMTS Band 5 

A5020

Power amplifiers for LTE Band 20

A5007

Power amplifiers for LTE Band 7

SKY77764

Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/ 
LTE – Bands III, IV, IX (1710 MHz–1785 MHz)

SKY77762

Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/ 
LTE – Band II (1850‐1910 MHz)

PN544

NFC controller

▼Radio Frequency

Qualcomm

TriQuint

Avago

Skyworks

NXP Semiconductor
Life companion
Make your life richer, simpler, and more fun.
As a real life companion, the new Samsung GALAXY S4 helps bring us
closer and captures those fun moments when we are together.
Each feature was designed to simplify our daily lives.
Furthermore, it cares enough to monitor our health and well‐being.
To put it simply, the Samsung GALAXY S4 is there for you. 
Galaxy S® 4 LTE


Atmel UC128L5



Audience eS325A

 Qualcomm WCD9310
 Qualcomm PM8018 PMIC
 Qualcomm MDM9215M

 Fujitsu MBG965H

 Broadcom BCM4335

 Qualcomm PM8917 PMIC
 Qualcomm SnapDragon

600

SAMSUNG K3QF2F200C‐XGCE
 eMMC, 16GB/32GB/64GB

16GB: Toshiba THGBM5G7A4JBA4W
 STMicroelectronics LSM330
Galaxy S® 4 LTE

 MAXIM MAX77803
 Broadcom BCM20794
 Silicon Image Sil8240


Yamaha YAS532B

 Qualcomm WTR1605L

 SWA GNF09
 Skyworks SKY77737
 Skyworks SKY77619‐12

 RFMD RF7307
 Qualcomm PM8821 PMIC
Rear facing camera, 13MP

Galaxy S® 4 LTE
Synaptics

Fujitsu
MBG965H

Silicon
Image

ALS

S5000B

STM

MHL

5",1920*1080
AMOLED

Front facing camera, 2MP

SiI8240

I2C/SPI

HDMI

LSM330DLC

x32 LPDDR3
Yamaha

I2C/SPI

YAS532B

x32 LPDDR3

IR sensors

K3QF2F200E‐XGCE
16Gb LPDDR3
PoP Package

ATMEL
UC128L5

eMMC
Sensirion

SAMSUNG

Snapdragon 600

I2C

SHTC1

Toshiba
16/32/64GB 
eMMC

SDIO
Bosch

Broadcom 

I2C
UART

BMP182

BCM4335

Qualcomm
Audience

eS325A

Qualcomm
WCD9310

MDM9215M

SLIMBus
USB

Qualcomm
WTR1605L

SKYWORKS
SKY77737

SDIO

Qualcomm
PM8018

RFMD
RF7307

Broadcom
BCM20794

NFC

Qualcomm
PM8917

Qualcomm
PM8821

MAXIM
MAX77803
Galaxy S® 4 LTE
Manufacturer

Device

Function

Qualcomm

Qualcomm Snapdragon 600
Package Marking: APQ8064

1.7GHz, Quad‐core/Krait core/1MB L2, Adreno 320 GFx

SAMSUNG

K3QF2F200E

Dual‐channel, x32, 16Gb LPDDR2, LPDDR3

THGBM5G7A4JBA4W

16/32/64GB eMMC
16GB eMMC: Toshiba THGBM5G7A4JBA4W

BCM4335

‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.0
‧FM Receiver

BCM20794

NFC controller

MDM9215M

Baseband processor
‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)
‧Rel 9 DCHSPA+(42/5.76Mbps)
‧TD‐SCDMA(4.2/2.2Mbps)
‧QICE
‧Integrated Memory

WTR1605L

Multi‐band* plus 700/1500/2600/B41 GPS+Glonass

SKY77619

Multiband Multimode Power Amplifier Module for Quad‐Band GSM / EDGE and 
Penta‐Band (Bands I, II, IV, V, VIII) WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE

SKY77737

Power Amplifier Module for LTE Bands 12/17 (698‐716 MHz)

SKY85303‐11

2.4 GHz QAM WLAN/BT front end module.

RF7307

Power Amplifier for LTE band 7

RF1119

Antenna control

▼Processor

▼Memory

Toshiba
▼Radio Frequency
Broadcom

Qualcomm

Skyworks

RFMD
Galaxy S® 4 LTE
Manufacturer

Device

Function

▼PMIC
Qualcomm

PM8917
PM8821

PMIC for Qualcomm  Snapdragon 600

PM8018

PMIC for Qualcomm MDM9215M

WCD9310

SLIMbus/I2S Audio codec; 6+ channel

eS325A

Voice processor

Synaptics

S5000B

Touch screen controller

STMicroelectronics

LSM330

3D accelerometer and 3D gyroscope

Yamaha

YAS532B

Electronic compass

Bosch Sensortec

BMP182

Barometer

MBG965H

Image Processor

IMX135

13 Mp, rear‐facing image sensor.

S5K6B2YX03

2 MP sensor, front sensor

SiI8240

HDMI‐to‐MHL™ Transmitter

SHTC1

Humidity and temperature sensor

MAX77803

Battery charger IC

▼Audio
Qualcomm
Audience
▼Touch Screen Controller

▼MEMs

▼Video
Fujitsu
SONY
Samsung
Silicon Image
▼Others
Sensirion
MAXIM
Manufacturer

Device

Function

Qualcomm Snapdragon 600

1.7GHz, Quad‐core/Krait core/1MB L2, Adreno 320 GFx

BA164B1PF

Dual‐channel, 16Gb LPDDR2, LPDDR2

THGBM5G8A4JBAIR

Toshiba 4.4/4.41 eMMC
16GB eMMC: THGBM5G8A4JBAIR

WCN3660

‧802.11 a/b/g/n Wi‐Fi
‧Bluetooth

MDM8215M

Baseband processor
‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)
‧Rel 9 DCHSPA+(42/5.76Mbps)
‧TD‐SCDMA(4.2/2.2Mbps)
‧QICE
‧Integrated Memory

WTR1605

Multi‐band* plus 700/1500/2600/B41 GPS+Glonass

ACPM‐7051

Quad‐Band GSM/EDGE and Dual‐Band UMTS (B1/B5)
• Quad Band GSM/EDGE (GSM850/900, DCS1800/PCS1900)
• UMTS Dual‐Band (Band1 – UMTS & LTE & CDMA BC6 and Band5 UMTS & LTE & CDMA 
BC0)

ACPM‐A5002

Multimode PA ‐ UMTS Band2, LTE Band25 and CDMA PCS

▼Processor
Qualcomm
▼Memory
Elpida
Toshiba
▼Radio Frequency
Qualcomm

AVAGO

▼PMIC
Qualcomm

PM8921
PM8821
PM8018

PMIC for Qualcomm APQ8064
PMIC for Qualcomm MDM8215M
Manufacturer

Device

Function

WCD9310

SLIMbus/I2S Audio codec; 6+ channel

eS310B 

Audio Processor

TPA2015D1 

Audio Amplifier 

MXT336S

Touch screen controller

AK8963

Electronic compass

C3H

3‐axis MEMS accelerometer

L3G4200D

3‐axis MEMS gyroscope

SiI9244BO

MHL™ Transmitter 

IMX145

8M pixel camera

OV2A9BA

2M pixel camera

▼Audio
Qualcomm
Audience
Texas Instruments
▼Touch Screen Controller
Atmel
▼MEMs
AKM
Bosch
STMicroelectronics
▼Video
Silicon Image
Sony
OmniVision
Optional

MHL

Image 
Processor

Display
Touch 
Screen 
Controller

ALS

MIPI‐CSI

Front facing camera

MHL 
Trasmitter

MIPI‐CSI

MIPI‐DSI
Humidity 
Temperature 
sensor

Rear facing camera

HDMI

I2C/SPI

x32

x32
Proximity
Sensor

I2C/SPI

LPDDR2/LPDDR3
PoP Package

I2C/SPI

Accelerom
eter

Dual‐channel 

eMMC

eMMC

Snapdragon 600
Gyroscope

I2C/SPI

SDIO
UART

WiFi/BT 
SoC

2

Compass

I C/SPI

Qualcomm
Barometer

MDMxxxx 
Modem

I2C/SPI

USB

Audio 
Processor

Qualcomm
Audio Codec

SLIMBus/I2S

NFC 
Controller

Optional

NFC

Qualcomm
PMIC for 
MDM modem

Qualcomm
PMIC

Qualcomm
PMIC

Qualcomm
RF 
Transceiver

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