Contenu connexe Similaire à Qualcomm Snapdragon 600-based SmartPhone Similaire à Qualcomm Snapdragon 600-based SmartPhone (20) Qualcomm Snapdragon 600-based SmartPhone3. Snapdragon 800
Snapdragon 600
Snapdragon 400
Snapdragon 200
CPU
Up to 2.3 GHz Quad Krait 400 CPU
Up to 1.9 GHz Quad Krait 300 CPU
Up to 1.7 GHz Dual Krait 300 CPU
Up to 1.4 GHz Quad Cortex A5 CPU
GPU
Adreno 330 GPU
Adreno 320 GPU
Adreno 305 GPU
Adreno 203 GPU
DSP
Hexagon, QDSP6V5A, 600MHz
Hexagon, QDSP6V4, 500MHz
Hexagon, QDSP6V4, 500MHz
QDSP5, 384MHz
Video
4k x 2k UHD video capture/playback
1080p HD video
1080p HD video
720p HD Video (30/15 fps)
Modem
3G/4G World/multimode LTE on
select processors
No modem
3G/4G World/multimode LTE on
select processors
3G CDMA/UMTS/GSM on select
processors
Camera
Up to 55MP, Stereoscopic 3D, Dual
ISP
Up to 21MP, Stereoscopic 3D
Up to 13.5MP, Stereoscopic 3D on
select processors
Up to 8MP
GPS
IZat Gen8B
IZat Gen8A
IZat Gen8A
IZat Gen7A
USB
USB 3.0/2.0
USB 2.0
USB 2.0
USB 2.0
Bluetooth
BT4.0 Integrated digital core†
BT4.0 Integrated digital core†
BT4.0 Integrated digital core†
BT4.0 Integrated digital core†
WiFi
802.11n/ac (2.4/5GHz) Integrated
digital core†
802.11n/ac (2.4/5GHz) Integrated
digital core†
802.11n/ac (2.4/5GHz) Integrated
digital core†
802.11n/ac (2.4/5GHz) Integrated
digital core†
Process
Technology
28nm HPm
28nm LP
28nm LP
45nm LP
Individual
Chipsets
8974(LTE)
• 8274 (HSPA+)
• 8674 (CDMA)
• 8074 (No Modem)
8064T
8930 (LTE)
• 8230 (HSPA+)
• 8630 (CDMA)
• 8930AB (LTE)
• 8230AB (HSPA+)
• 8630AB(CDMA)
• 8030AB(No Modem)
• 8226 (UMTS)
• 8626 (CDMA)
8225Q
8625
6. Snapdragon 600 Specs
Processing
28nm LP quad core Krait 300 CPU at up to 1.9GHz per core
LP‐DDR3 memory for high performance and low latency
GPU
Speed enhanced Adreno 320 GPU delivers over 300% increase in graphics processing performance
Support for advanced graphic and compute APIs, including OpenGL ES 3.0, DirectX, OpenCL, Renderscript Compute and FlexRender™
Power
Management
Energy efficient LP process and dynamic GPU clock and voltage scaling
Asymmetrical Multi‐Processing (aSMP) dynamic CPU power control for power‐optimized performance
Qualcomm Quick Charge 1.0 integrated for up to 40% faster battery charging
DSP
Hexagon, QDSP6
Hexagon DSP enables ultra‐low power operation for a variety of applications like music playback, enhanced audio effects, computer vision
processing and still and video image enhancements
USB
USB 2.0
Bluetooth
BT4.0 + Integrated digital core
WiFi
802.11ac Wi‐Fi for peak Wi‐Fi performance + Integrated digital core
GPS
IZAT location technology features GNSS for accurate auto and pedestrian navigation and Indoor Location capabilities for advanced location‐
based services
Video/Audio
Capture and playback video at 1080p HD
HD multichannel sound with DTS‐HD and Dolby Digital Plus
Camera
Up to 21 Megapixel, stereoscopic 3D
Take high‐resolution, 3D photos with 21 Megapixel stereoscopic camera support
Display
Enjoy your photos, videos and games on large, high‐resolution display devices (up to 2048x1536) and even on 1080p external displays
Process
Technology
28nm LP
7. FEATURES
MDM8215/M
28nm
Process Tech.
MDM9215/M
28nm
Package
10x10mm – MDM8215
9x9mm – MDM8215M
424 NSP 10x10mm – MDM9215
383 NSP 9x9mm – MDM9215M
Processor
ARMv7 Cortex‐A5 550MHz
Dual QDSP6‐TBDMHz
ARMv7 Cortex‐A5 550MHz
Dual QDSP6‐TBDMHz
MODEM
Release 8 DC‐HSPA+
GSM/EGPRS
Release 9 DC‐HSPA+
Release 9 LTE
TD‐SCDMA
GSM/GPRS/EDGE
Peak Data Rates
UL/DL
DC‐HSPA+: DL 42Mbps /
UL 5.76Mbps
EGPRS ‐ FL/RL: 236.8 / 236.8kbps
(MSC12)
DC‐HSPA+ ‐ FL/RL: 42 / 5.76 Mbps
LTE FDD ‐ FL/RL: 100 / 50 Mbps
(Cat 3)
LTE TDD ‐ FL/RL: 68 / 17 Mbps
(Cat 3)
Modem
Enhancements
UMTS: RxD, EQ, SCH‐IC,
Q‐ICE (Type 3i), 2x2 DL
MIMO
GSM: SAIC
UMTS: RxD, EQ, SCH‐IC, Q‐ICE
(Type 3i), 2x2 DL MIMO, HDOn
LTE: 2x2 DL SU‐MIMO
GSM: SAIC
Voice support
Integrated
Integrated
Frequency
Support
UMTS: 3GPP: 700 MHz,
800 MHz, 850 MHz, 900
MHz, 1700 MHz, 1800 MHz, 1900 MHz, 2100 MHz, 2300MHz, 2600 MHz
GSM: QB EGPRS (850,
900,1800, 1900)
UMTS: 3GPP: 700 MHz, 800 MHz, 850 MHz, 900 MHz, 1700 MHz, 1800
MHz, 1900 MHz, 2100 MHz, 2300MHz, 2600MHz
GSM: QB EGPRS (850, 900,1800, 1900)
RF+PMIC chipset
WTR1605 + PM8018
WTR1605L + PM8018
WLAN
Soft AP support (AR6003)
Soft AP support (AR6003)
USB
GPS
USB 2.0 All Speed Peripheral or Host
Gen 8A with Glonass
Standalone, Assisted, XTRA, 3dB improvement vs. Gen 7
USB 2.0 All Speed Peripheral or Host
Gen 8A with Glonass
Standalone, Assisted, XTRA, 3dB improvement vs. Gen 7
11. Qualcomm PM8018 PMIC
Qualcomm PM8821 PMIC
Qualcomm PM8921 PMIC
Synaptics S32028 touch screen controller
Silicon Image Sil9244 MHL transmitter
Qualcomm SnapDragon
Elpida
600, PoP package
16Gb LPDDR2, PoP package
SAMSUNG eMMC, 16/32/64GB
STMicroelectronics Package Marking: 0100 9QRV304
Qualcomm WCD9310 audio codec
Bosch BMA200, Accelerometer
AKM AK8963, compass
STMicroelectronics H3G2, Gyroscope
15. Manufacturer
Device
Function
Broadcom
BCM4335
‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.0
‧FM Receiver
Skyworks
85302‐11
2.4 GHz, 256 QAM WLAN/Bluetooth® Front‐End Module
MDM9215M
Baseband processor
‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)
‧Rel 9 DCHSPA+(42/5.76Mbps)
‧TD‐SCDMA(4.2/2.2Mbps)
‧QICE
‧Integrated Memory
WTR1605L
Multi‐band* plus 700/1500/2600/B41 GPS+Glonass
TQM7M9023
Multi‐Mode, Multi‐Band Power Amplifier (MMPA) with Quad‐Band
GMSK / EDGE and Dual‐Band WCDMA
•Quad‐band Linear GSM / EDGE
•UMTS B1 and B5/B8
•Input power controlled ‐ GMSK and 8PSK
•GSM LB has 3 modes ‐ HP, MP, LP
•GSM HB has 2 modes ‐ HP, LP
•WCDMA has 3 modes ‐ HP, MP, LP
•HBT / PHEMT / CuFlip™ PA Technology
A5508
UMTS amd GSM/EDGE Power amplifiers for UMTS Band 5
A5020
Power amplifiers for LTE Band 20
A5007
Power amplifiers for LTE Band 7
SKY77764
Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/
LTE – Bands III, IV, IX (1710 MHz–1785 MHz)
SKY77762
Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/
LTE – Band II (1850‐1910 MHz)
PN544
NFC controller
▼Radio Frequency
Qualcomm
TriQuint
Avago
Skyworks
NXP Semiconductor
19. Galaxy S® 4 LTE
MAXIM MAX77803
Broadcom BCM20794
Silicon Image Sil8240
Yamaha YAS532B
Qualcomm WTR1605L
SWA GNF09
Skyworks SKY77737
Skyworks SKY77619‐12
RFMD RF7307
Qualcomm PM8821 PMIC
20. Rear facing camera, 13MP
Galaxy S® 4 LTE
Synaptics
Fujitsu
MBG965H
Silicon
Image
ALS
S5000B
STM
MHL
5",1920*1080
AMOLED
Front facing camera, 2MP
SiI8240
I2C/SPI
HDMI
LSM330DLC
x32 LPDDR3
Yamaha
I2C/SPI
YAS532B
x32 LPDDR3
IR sensors
K3QF2F200E‐XGCE
16Gb LPDDR3
PoP Package
ATMEL
UC128L5
eMMC
Sensirion
SAMSUNG
Snapdragon 600
I2C
SHTC1
Toshiba
16/32/64GB
eMMC
SDIO
Bosch
Broadcom
I2C
UART
BMP182
BCM4335
Qualcomm
Audience
eS325A
Qualcomm
WCD9310
MDM9215M
SLIMBus
USB
Qualcomm
WTR1605L
SKYWORKS
SKY77737
SDIO
Qualcomm
PM8018
RFMD
RF7307
Broadcom
BCM20794
NFC
Qualcomm
PM8917
Qualcomm
PM8821
MAXIM
MAX77803