GLOBALFOUNDRIES is the only pure-play foundry currently producing chips using the 32nm HKMG process. They are ramping production of the "Llano" chip, the first HKMG product in the industry, which can be seen in laptop demos at their booth and in stores that month. GLOBALFOUNDRIES is leading the industry in ramping HKMG production volume ahead of other foundries and offers two 28nm platforms - 28nm-SLP for low power needs and 28nm-HPP for high performance. They are providing extensive design enablement including design kits and a multi-project wafer program to drive the 28nm transition and define their 20nm technology and production plans.

1. GLOBALFOUNDRIES Leading Edge Technology 6-9th June 2011 DAC 2011 Update

2. Only Pure-Play Foundry in HKMG Production32nm “Llano” Yields Climb as Production Ramps - Lot Yield Averages Do = 0.13 Prime Die Yield See “Llano” Demos in our Booth #1517 “Llano” is the first HKMG Product in the Foundry Industry See “Llano”-powered Laptops in Stores this Month! Q4 2010 - Q1 2011 2

3. Leading the Foundry Ramp in HKMG Ramping HKMG in volume ahead of others* Other leading foundries * Data based on customers’ and GLOBALFOUNDRIES projections. Comparison done for pure play foundries only. 3

4. Forget the FUD - Here are the FACTS * Based on GLOBALFOUNDRIES simulation results and assumptions (TT condition) 4

5. > 3GHz Understanding and Delivering Market Needs HIGH PERFORMANCE Watts Games Networking 1-3GHz Laptop, Netbooks Graphics MOBILE COMPUTING DTV Up to ‘00s mW DIGITAL CONSUMER Mobile Desktop Tablets Up to 1GHz STB LOW POWER Feature phones Smartphones Up to ‘0s mW Wireless Connectivity Performance 5

6. Two Platforms to Cover Your Needs 28nm-HPP > 3GHz HIGH PERFORMANCE Stressors added for > 3.1Ghz Watts Games Networking 1-3GHz UHVt + LLSRAM for power mgmt 28nm-SLP Laptop, Netbooks Graphics MOBILE COMPUTING DTV Up to ‘00s mW DIGITAL CONSUMER Mobile Desktop Tablets Up to 1GHz STB LOW POWER Low maskcount, no stress engineering for lowest cost Feature phones Smartphones Up to ‘0s mW Wireless Connectivity Performance 6 SLVT, OD option for > 2.3GHz

7. Example of typical implementation of a Low Power product With HP/HPM technology 28nm-SLP “Gate First” 28nm Die Size Advantage Up to 5-10 % additional increase with UHVt and power management Up to 10% going to gate last Up to 20% die size advantage with 28nm-SLP vs other foundries  superior GHz product costs/form factor 7

8. 28nm-SLP: Best Performance at Low Cost 28nm-SLP has up to 30%cost benefit over HPM 3.0 28nm HPP Other foundry 28HPM CPU Clock (GHz) 28nm SLP 2.0 + 5-10% (area overhead for power management, larger UHVt device) +10% (area scaling disadvantage of gate last HKMG) +10% (mask adders due to stressors) 1.0 1.0 1.1 1.2 1.3 Increasing Cost (arb. units) 8

9. Enablement is Structured to Provide Comprehensive and Differentiated Solutions Collaboration with customers & ecosystem partners to optimize customers’ product performance, leakage and yields Design Enablement Operations Tapeout Operation Data delivery portal Quality conformance Design Solutions IP Eco-System DesignInfrastructure TechnologySolutions SoCEnablement Foundation IP Differentiated IP Design services Tech filesand PDK Design Interface Cultivation of Eco-System Test Vehiclesand Shuttles Reference EDA flow Technology Services Design enabling ecosystem with Reference Flows, DEM/DFM, PDKs and IPs flowing from multiple industry leaders DFM Technology IP 9

12. Targeted for mobile computing, digital consumer and certain segments of computing/networking10

13. GLOBALFOUNDRIES 28nm Fabs 28nm manufacturing will be available in both Fab1 Germany and Fab8 New York Dresden, Germany Munich, Germany London, UK Yokohama,Japan Saratoga, NY Shanghai,China Headquarters Si Valley, CA East Fishkill, NY Hsinchu,Taiwan Austin, TX Singapore Plus, Added Flexibility with Common Platform FabSync – IBM, SEC Manufacturing sites Sales and Support Offices 11

15. Brings total output to 80,000 wafers per month

16. Completely 45/40nm and below technology12

18. 60,000 wafer starts per month once fully ramped

19. Construction started in July 2009 with production expected to come online in 2012

20. Campus accommodates up to 2 more fabs13

21. Enabling 28nm IP Silicon validation with MPW Program MPW0305 4 shuttles in 2011 MPW0309 and MPW0310 fully subscribed 28nm-HPP supported from MPW0311 onwards 4 shuttles planned for 2012 MPW0306 MPW0308 MPW0309 MPW0307 14

23. Single technology platform with multi Vt and multi Lg support

24. >30% performance over 28nm

25. Silicon-based PDK available

26. Innovative MOL, BEOL for cost/density optimization

27. First MPW in 4Q2011LOW POWER Extreme low power & cost sensitive 20LPM Cost Low power GHz applications, cost optimized Low Power HIGH PERFORMANCE MOBILE , HIGH PERFORMANCE Mobile, high end applications > 3GHz Wired, desktop applications High Performance 20SHP High performance to extreme high performance (>4GHz) (additional perf option) 15

28. Summary 16