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Using silicon photonics to address the
tradeoffs of cost, power, speed, and
complexity
Arlon Martin
arlonm@mellanox.com
Constraint: How do we fit
100G in QSFP?

Mellanox SX6036 – Example of 36 QSFP Ports Switch

•
•
•
•
•

QSFP is the most popular 4-channel form factor
Enables 36 ports in a 1ru switch
Physical size requires intensive optical integration
Max power consumption of 3.5W
Must support reaches of >2 km
Examples of silicon photonics
Tx and Rx chips
Integration: 100 Gb/s Tx and Rx chips
Simple FTTH style laser
Single laser for 4 channels
Integrated modulators and detectors

Santa Clara, CA USA
October 2013

Splitter

Lasers
Modulators

Ge PDs
Silicon photonics cost tradeoffs
√ Use CMOS where ever possible
√ No WDM specific lasers, no laser sub-assembly (no
isolators, beam collimators, lens cap, etc.)
√ Flip-chip laser array bonding
√ No hermetic packages
√ No active laser alignment
√ No detector sub assembly
√ No TEC
√ No WDM assembly
√ Die attach driver array
√ Die attach TIA array
Santa Clara, CA USA
October 2013

4
Silicon photonics enables
100G in QSFP

• Implements the best tradeoffs for data center
applications
• Fits in standard QSFP
• Supports reaches of > 2km
• Consumes < 3.5W of power
• Incorporates a host of low-cost techniques

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Using Silicon Photonics to Address Tradeoffs of Cost, Power, Speed & Complexity

  • 1. Using silicon photonics to address the tradeoffs of cost, power, speed, and complexity Arlon Martin arlonm@mellanox.com
  • 2. Constraint: How do we fit 100G in QSFP? Mellanox SX6036 – Example of 36 QSFP Ports Switch • • • • • QSFP is the most popular 4-channel form factor Enables 36 ports in a 1ru switch Physical size requires intensive optical integration Max power consumption of 3.5W Must support reaches of >2 km
  • 3. Examples of silicon photonics Tx and Rx chips Integration: 100 Gb/s Tx and Rx chips Simple FTTH style laser Single laser for 4 channels Integrated modulators and detectors Santa Clara, CA USA October 2013 Splitter Lasers Modulators Ge PDs
  • 4. Silicon photonics cost tradeoffs √ Use CMOS where ever possible √ No WDM specific lasers, no laser sub-assembly (no isolators, beam collimators, lens cap, etc.) √ Flip-chip laser array bonding √ No hermetic packages √ No active laser alignment √ No detector sub assembly √ No TEC √ No WDM assembly √ Die attach driver array √ Die attach TIA array Santa Clara, CA USA October 2013 4
  • 5. Silicon photonics enables 100G in QSFP • Implements the best tradeoffs for data center applications • Fits in standard QSFP • Supports reaches of > 2km • Consumes < 3.5W of power • Incorporates a host of low-cost techniques