This document discusses packaging for electronic goods. It introduces the nature of electronic goods and hazards during transit and storage, such as being fragile, corrodible, and susceptible to electromagnetic fields and climate. It then discusses hazards like shocks, vibrations, corrosion, dust and temperature changes. Next, it covers materials used for packaging that provide protection from these hazards, especially electrostatic discharge, like conductive plastics and foams. Finally, it concludes there is significant potential and future for developing packaging materials to protect electronic products.
2. INTRODUCTION THERE ARE ABOUT 2500 UNITS ENGAGAED IN PRODUCTION OF ELECTRONIC GOODS IN THE COUNTRY. WITH THE GROWING DEMAND OF ELECTRONIC GOODS, WE NEED A PACKAGING SYSTEM.
3. PACKAGING THE OBJECTIVE OF PACKAGING OF ELECTRONIC PRODUCTS, IS TO ENSURE THAT WITHIN THE MINIMUM EXPENSES, THE PACKAGE ARTICLE SHALL REACH IT DESTINATION. THUS PACKAGING SHOULD PROVIDE THE PROTECTION FROM ALL HAZARDS ENCOUNTERED DURING TRANSIT AND STROAGE.
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6. MECHANICAL HAZARDS SHOCKS – AN IMPACT, CHARACTERISED BY SUDDEN AND SUBSTANTIAL CHANGE OF VELOCITY. BY DROPPING AND ROLLING OF PACKAGE. VIBRACTION – AN OSSILLATION OR MOTION ABOUT A FIXED REFERENCE POINT. COMPRESSION – LOAD THAT TRIES TO REPTURE THE PACKAGE DURING STACKING AND SHIPPING.
7. CLIMATIC HAZARDS CORROSION – PROPERTY OF METAL TO FORM ITS OXIDE IN CONTACT OF WATER AND ATMOSPHERIC OXYGEN . DUST - CAN CHANGE THE CONNECTION BETWWEN TWO ELETRONIC COMPONENTS. TEMPRETURE - EFFECT THE RESISTANCE OF CONDUCTORS. MOISTURE – IT MAY SHORT THE CIRCUIT.
10. ESD’s EFFECTS ON PRODUCT HIGH CHARGE PRODUCED DUE TO PACKAGING MATERIAL EASILY CAUSE SHORTENING OF CIRCUIT. THE STATIC DISCHARGE CAN ALSO CAUSE PARTICLE DEGRADTION OF CIRCUIT. MOST IMPORTANT IS THAT EFFECT OF SATAIC DISCHARGE IS IRREVISIBLE.
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14. CONCLUSION HENCE, IT IS UNDERSTOOD THAT THERE IS A GREAT POTENTIAL FOR APPLICATION OF VARIOUS TYPES OF PACKAGING MATERIALS IN THE GROWING MARKET OF ELECTRONIC PROCDUCTS. THEREFORE THERE EXISTS A TREMENDOUS SCOPE AND FUTURE FOR THE DEVELOPMENT OF PACKAGING MATERIALS FOR ELECTRONIC GOODS PROTECTION.
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