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An overview and applications
Presented by:
Khatib Minajoddin Alimoddin
TE (Mech)
UCOER
 MEMS: Micro Electro Mechanical System
 Combination of mechanical function (sensing, motion,
heating) and electric function (switching, deciding) to
produce component on micro scale.
 Thickness of component is less than
human hair…
 1889-Discovery of semiconductor
 1958-discovery of IC by Jack Kilby
 1974-Ultra Large Scale Integration Technology
(ULSI)
 1988-Micromachining Technology discovered
 Mechatronics does not bother about size of component
 Size of component in MEMS limited to ‘Micro scale
only’
 MEMS can combine with number of branches
like BIO, COMPUTER, ROBOTICS etc.
 Sensor: Device experience external change in
parameter
 Transducer: Energy convertor
 Actuator: Other form of energy to mechanical
convertor
 Semiconductor:
 Silicon, polonium
 Polymer:
 Metal:
 Gold, nickel, silver, titanium etc.
 High reliability
 Deposited by electroplating, evaporation
Three basic steps are:
 Deposition process
 Photo-lithography
 Etching
Deposition of thin film of material on substrates
 Thickness of film from nanometer to 100 millimeter
Two types are:
1)Physical deposition process
 Physical vapour deposition
 Casting
2)Chemical deposition process
 Chemical vapour deposition
 Electro deposition
 Thermal oxidation
 Defining the shape of micro machine
 Shape to the substrate given by image transfer
by Ultraviolet Light
 Two types are:
1)Positive resist transfer
2)Negative resist transfer
Etching process
• Formation of functional MEMS structure on
substrate
Two types are:
1)Dry etching
Material dissolved in chemical solution by reactive
ion or vapour phase etchant
2)Wet etching
 Material is dissolved in chemical solution itself
 Joining of different component together to function as single
unit
Some technique are:
 Bulk micromachining
 Surface micromachining
 Micro molding
3-d micro machined structure
Linear rack gear reduction drive
Application of MEMS
 Bio-MEMS
 Lab-on-chip
 Micro total analysis
 Microfluidics
 Micro drug
delivery
 Smart pill
 Accelerometer
 Pressure sensor
 MEMS gyroscope
 Micro engine
 Advanced memory
 Devices
Application
ADVANTAGES DISADVANTAGES
1)Minimize energy and
material used in
manufacturing
1)Farm establishment require
huge investment
2)Improved reproducibility 2)Very complex design
procedure
3)Cost and performance
advantages
3)Prior knowledge is needed
for integration of MEMS
devices
4)Higher accuracy, sensitivity,
selectivity
4)Market value of component
are high
 MEMS application will be driven by enabling higher
functionality
 Combining different areas of research
i.e. Bio MEMS, microfludics, NEMS ,etc
 Future product involve higher level of electro
mechanical product with complex integration
and more intimate interaction with physical world
 Online Resources
 BSAC http://www-bsac.eecs.berkeley.edu/
 DARPA MTO http://www.darpa.mil/mto/
 IEEE Explore http://ieeexplore.ieee.org/Explore/DynWel.jsp
 Introduction to Microengineeringhttp://www.dbanks.demon.co.uk/ueng/
 MEMS Clearinghouse http://www.memsnet.org/
 MEMS Exchange http://www.mems-exchange.org/
 MEMS Industry Group http://www.memsindustrygroup.org/
 Journals
 Journal of Micromechanical Systems
 journal of Micromechanics and Micro engineering
 Micromachine Devices
 Sensors Magazine
MEMS an overview and application

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MEMS an overview and application

  • 1. An overview and applications Presented by: Khatib Minajoddin Alimoddin TE (Mech) UCOER
  • 2.  MEMS: Micro Electro Mechanical System  Combination of mechanical function (sensing, motion, heating) and electric function (switching, deciding) to produce component on micro scale.  Thickness of component is less than human hair…
  • 3.  1889-Discovery of semiconductor  1958-discovery of IC by Jack Kilby  1974-Ultra Large Scale Integration Technology (ULSI)  1988-Micromachining Technology discovered
  • 4.  Mechatronics does not bother about size of component  Size of component in MEMS limited to ‘Micro scale only’  MEMS can combine with number of branches like BIO, COMPUTER, ROBOTICS etc.
  • 5.  Sensor: Device experience external change in parameter  Transducer: Energy convertor  Actuator: Other form of energy to mechanical convertor
  • 6.  Semiconductor:  Silicon, polonium  Polymer:  Metal:  Gold, nickel, silver, titanium etc.  High reliability  Deposited by electroplating, evaporation
  • 7. Three basic steps are:  Deposition process  Photo-lithography  Etching
  • 8. Deposition of thin film of material on substrates  Thickness of film from nanometer to 100 millimeter Two types are: 1)Physical deposition process  Physical vapour deposition  Casting 2)Chemical deposition process  Chemical vapour deposition  Electro deposition  Thermal oxidation
  • 9.  Defining the shape of micro machine  Shape to the substrate given by image transfer by Ultraviolet Light  Two types are: 1)Positive resist transfer 2)Negative resist transfer
  • 10. Etching process • Formation of functional MEMS structure on substrate Two types are: 1)Dry etching Material dissolved in chemical solution by reactive ion or vapour phase etchant 2)Wet etching  Material is dissolved in chemical solution itself
  • 11.  Joining of different component together to function as single unit Some technique are:  Bulk micromachining  Surface micromachining  Micro molding 3-d micro machined structure Linear rack gear reduction drive
  • 12. Application of MEMS  Bio-MEMS  Lab-on-chip  Micro total analysis  Microfluidics  Micro drug delivery  Smart pill
  • 13.  Accelerometer  Pressure sensor  MEMS gyroscope  Micro engine  Advanced memory  Devices
  • 15. ADVANTAGES DISADVANTAGES 1)Minimize energy and material used in manufacturing 1)Farm establishment require huge investment 2)Improved reproducibility 2)Very complex design procedure 3)Cost and performance advantages 3)Prior knowledge is needed for integration of MEMS devices 4)Higher accuracy, sensitivity, selectivity 4)Market value of component are high
  • 16.  MEMS application will be driven by enabling higher functionality  Combining different areas of research i.e. Bio MEMS, microfludics, NEMS ,etc  Future product involve higher level of electro mechanical product with complex integration and more intimate interaction with physical world
  • 17.  Online Resources  BSAC http://www-bsac.eecs.berkeley.edu/  DARPA MTO http://www.darpa.mil/mto/  IEEE Explore http://ieeexplore.ieee.org/Explore/DynWel.jsp  Introduction to Microengineeringhttp://www.dbanks.demon.co.uk/ueng/  MEMS Clearinghouse http://www.memsnet.org/  MEMS Exchange http://www.mems-exchange.org/  MEMS Industry Group http://www.memsindustrygroup.org/  Journals  Journal of Micromechanical Systems  journal of Micromechanics and Micro engineering  Micromachine Devices  Sensors Magazine