3. Deposition
Applying a thin film on a surface ranges from nano
meters to micro meters.
Thin film is deposited on Substrates.
Different techniques are used for deposition PVD,
CVD, sputtering, electroplating & coating.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST
4. Physical vapor deposition
Physical coating process involve,
condensation & evaporation of material
PVD is used for high melting point & low
vapor pressure materials.
PVD is carried out at high temperature and
vacuum.
In contrary to PVD, CVD is a method in which
chemical adhesion or chemical deposition occurs.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST
5. High temperature
is required to
vaporize the material
Vacuum of different
ranges is used which
depends on the mean
free path required in
the system.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST
6. PVD methods are commonly used in followings:
Circuit & IC fabrications.
Aerospace in TBC & transparent coatings.
Reflectors and optics
MUHAMMAD ALI ASGHAR
VC&ML NINVAST
8. Evaporative deposition
Resistive heating method is used.
deposition is performed at high
temperature & low vacuum
Vacuum decreases the content
of Contamination
Voltage & current is manually
controlled.
Material is kept in boats.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST
10. Electron beam is generated
by tungsten filament.
Material is placed in
Graphite or tungsten crucible
Deposition mechanism is same
deposition is carried out
under high vacuum.
Deposition is controlled, and
Uniform
MUHAMMAD ALI ASGHAR
VC&ML NINVAST
12. Pulsed laser deposition
High power laser is used for deposition.
Argon or neon is used for inert atmosphere.
High vacuum is formed
laser is focused by lens, target decides the position of
the deposition .
MUHAMMAD ALI ASGHAR
VC&ML NINVAST
13. Sputter deposition
Sputtering works on the bases of momentum principle,
formed by the collision of the atoms and molecules.
Plasma glow, ion accelerator or radioactive emitting is
used to evaporate material.
argon gas is used for inert atmosphere.
Types of sputtering
Chemical and etching sputtering
Electronic sputtering
Potential sputtering
MUHAMMAD ALI ASGHAR
VC&ML NINVAST
14. In this process ions are deposited
on the substrates.
This process is used for IC
fabrication, micro circuit printing
nano printing or pattering . &
lithography.
It will be discussed in detail with
nano pattering.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST
15. PVD advantages & Disadvantages
Environment friendly then Cooling systems are required.
paint & electroplating.
Mostly high temperature and
more than one PVD
vacuum control needs skill &
technique can be used for
experience.
coating.
PVD coated materials has no
Usually topcoats are not
chemical interaction with the
required.
surface that
Good strength and
durability.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST
