MEI 2015 Technology Roadmap

1. Marcel Electronics International
Orange, CA
2015
Partnering with our customers since 1979

2. 42,000 Sq. Ft. Facility
Privately Owned
150 Employees
AS9100C
ISO-9001:2008
IPC-6012 Class 3 & 3A
IPC-6016 (HDI)
IPC-6018 (RF)
ITAR
Small Business Listing

3. Communications
RF MicrowaveSatellite
Weapons
Systems
Defense and Aerospace
Lockheed Martin
BAE Electronics
Exelis Inc
Ball Aerospace
Sandia Labs
L-3 Communications
DRS
Cubic Defense
MIT Lincoln Laboratory
Boeing
Cobham
Draper Labs
General Dynamics
Harris Corp.
Defense & Aerospace represents 53% MEI’s revenues

4. Commercial Segments
Commercial represents 47% of MEI’s revenues
Wireless
ATE
Medical
Storage
Networking
Broadcom
LSI
Analog Devices
Motorola
Texas Instruments
General Electric
Micron
Intel
Maxim
Fujitsu
Teradyne
Cisco

5. Phase 2
• 25:1 Aspect Ratio
• Precision Back Drilling
• Panasonic Laminates
• Copper Filled µVias
• Heat Sink Application
• Ticer Resistor Material
Phase 3
• RF Focused
• Multiple “Z Wrap”
• Teflon/Duroid Materials
• 10 Stacked u Vias
• .004 Mech. Drill thru
.093
• IST Testing
Phase 4
• Z-Axis Interconnect
Ormet/Rogers 2929
• Zeta Laminates
• High Speed Digital materials
• Precision CNC –
Routing/Milling to etched
features
• RF Cavity Structures
Phase 5
• LDI
• Sintering
Technology
2009 2010 2011 2012 2013 2014 2015….
MEI Technology Curve

6. IPC Wrap
DFM Review
Impedance Modeling
HDI Packaging
Signal Integrity
Embedded Passives
Material Selection
Thermal Management
Power Distribution
RF Featured Designs
Engineering Partnership
Cost Avoidance

7. Technology Roadmap
Parameters Standard Advanced R&D Comments
IL line and space 0.5 oz. copper 4/4 3/3 2/2
OL line and space 0.375 oz. copper 4/4 3/3 2/2.5
OL line and space 0.5 oz. base copper 5/5 4/4 3/3
Smallest drilled thru via - .062” brd. thickness .008” .005” .004”
Smallest drilled thru via - .093” brd. thickness .010” .006” .004”
Smallest drilled thru via - .115” brd. thickness .012” .010” .005”
Smallest drilled thru via - .250” brd. thickness .020” .014” .012”
Class 2 design annular ring (over drill size) .005” .004” .002”
Class 3 design annular ring (over drill size) .007” .006” See Eng.
Antipad (over drill size) .018” .012” .009”
Maximum aspect ratio – w/ .010” drilled hole - Class 2 12:1 18:1 30:1
Maximum aspect ratio-w/.010” drilled hole-Class 3 10:1 15:1 20:1
Microvia laser drill size .006” .004” .003”
Pad size over microvia drill size .005” .003” .002”
Stacked Micro Vias 2 3 *4+
*Need to discuss
reliability
Maximum aspect ratio - microvias 0.8:1 0.8:1 See Eng.
Not recommended to
go higher than 1:1
MEI is proud to announce our submittal to PCQR² and listings as CAT Code “G16”, “F27”, “H34”, “I20”, “I45”, “J20”, “K37”. “L11”, “N10”

8. Technology Roadmap
Parameters Standard Advanced R&D Comments
Press fit hole tolerance +/- .002” +/- .002” +/- .002”
SMD soldermask web width - mils .004” .003” See Eng.
SMD soldermask clearance – mils (over pad) .005” .002” .001”
Soldermask registration tolerance .003” .0015” See Eng.
Impedance control – single ended +/- % +/-10% +/- 5% See Eng.
Impedance control – edge coupled diff. +/- % +/- 10% +/- 7% See Eng.
Impedance control – broad side differential +/- % +/ 10% +/- 7% See Eng.
Board thickness – Min./Max. .020” / .240” .016” / .300” .010” / .300”
Maximum layer count 32 48 50+
Layer count is only
limited by total
thickness
Average layer count 16
Maximum panel size 18 x24 & 21x24 20”X 26” N/A
Maximum bow and twist - %
(balanced construction)
<0.75% <0.75% <0.5%
Minimum copper to edge clearance .012” .018” .005”
Min. positional tol. – feature to feature +/- .005” +/- .003” +/- .001”
Layer to layer registration tolerance +/- .005” +/- .003” +/- .001”
Minimum core thickness .002” .001” .001”

9. Technology Roadmap
Parameters Standard Advanced R&D Comments
Surface Finishes Offered
Immersion Silver In House
ENIG (Electroless NI / Immersion Au) In House
ENEPIG (Electroless Nickel / Electroless
Palladium / Immersion Gold
Outside
Superior
Processing
OSP – Entek Plus HT In House
Immersion Tin In House
HASL (Tin / Lead) & Tin Lead Reflow Outside
Full Body & Selective Electrolytic Ni / Au In House
Soft Gold Outside
Gold Edge Connector In House
Other Capabilities
Laser Direct Imaging (LDI) Yes
Sequential Lamination 3 Sublams 5 Sublams See Eng. Any Layer Any Via
Ormet Conductive Paste Yes
Copper Filled Vias Yes
Epoxy Filled Vias Yes
Embedded Capacitance & Resistance Yes Yes Yes
ZBC2000, HK 04, Ticer
& Ohmega-Ply
Mixed Dielectric Construction Yes Yes Yes
Back-Drilling Depth Tolerances +/- .006” .004” .002”

10. Technology Roadmap
Parameters Standard
Other Capabilities
Cavity & Heat Sink Designs Yes Yes See Eng
Pigmented Soldermask
(Red, Blue, Black, Purple, Clear, White)
Yes
Photo Imageable Legend Yes
Jump Scoring Yes
Edge Milling Yes
Plated Edge Launch Capabilities Yes
Counter Bores / Slot Milling Yes
Edge Plating Yes
Valor ODB++ Yes
Industry Certifications
UL 94V-0 Yes
ISO 9001:2008 Yes
IPC-6012C Class 2, 3, 3/A, -6016, -6018 Yes
IPC-9151 / PCQR² Benchmark Data CAT CODE F27, G16, H34, I20, I45, J20, K37, L11, N10
AS9100C Yes
Cert # 10000386
ASH09
ITAR Registered Yes Cert # M20467
RoHS & Conflict Minerals Compliant Yes

11. Supplier Construction Td (°C) Dk Df CTE (X/Y/Z,ppm°C) Typ. Tg
Rogers RO4003C Hydrocarbon Ceramic Woven
Glass
425 3.38 +/- 0.05 @ 10 GHz 0.0027 @ 10 GHz 11/14/46
Rogers RO4003C LoPro Thermoset Hydrocarbon 425 3.38 +/- 0.05 @ 10 GHz 0.0027 @ 10 GHz 11/14/46
Rogers RO4350B Hydrocarbon Ceramic Woven
Glass
390 3.48 +/- 0.05 @ 10 GHz 0.0037 @ 10 GHz 10/12/32
Rogers RO4350B LoPro Thermoset Hydrocarbon 390 3.48 +/- 0.05 @ 10 GHz 0.0037 @ 10 GHz 14/16/35
Rogers RO4360G2 Hydrocarbon Ceramic Woven
Glass
407 6.15 +/-0.15 @ 10 GHz 0.0038 @ 10 GHz 13/14/28
Isola FR408HR Modified Filled Epoxy 360 3.65 @ 10 GHz 0.0095 @ 10 GHz 16/16/55
Isola 408HRIS Modified Filled Epoxy 360 3.37 @ 10 GHz 0.0092 @ 10 GHz 16/16/55
Isola I-Speed Modified Filled Epoxy 360 3.63 @ 10 GHz 0.0071 @ 10 GHz 16/16/60
Isola I-Speed IS Modified Filled Epoxy 360 3.27 @ 10 GHz 0.0064 @ 10 GHz 16/16/60
Isola GigaSync Modified Filled Epoxy 360 4.13 @ 10 GHz 0.0066 @ 10 GHz 16/16/60
Isola I-Tera MT Modified Filled Epoxy 360 3.45 +/-0.05 @ 10 GHz 0.0031 @ 10 GHz 12/12 X/Y
Isola Tachyon Advanced Modified Filled Epoxy 380 3.02 @ 10 GHz 0.0021 @ 10 GHz 15/15/55
Isola Tachyon-100G Advanced Epoxy for 100 Gbps+ 380 3.02 @ 10 GHz 0.0021 @ 10 GHz 15/15/45
Panasonic Megtron 7 Advanced Epoxy 400 3.35 @ 12 GHz
Low Dk glass
0.002 @ 12 GHz
Low Dk glass
14-16 (X/Y). 42 (Z)
Panasonic Megtron 6 Enhanced Epoxy 410 3.61 @ 10 GHz 0.0054@ 10 GHz 14-16 (X/Y). 45 (Z)
Panasonic Megtron 4 Enhanced Epoxy 360 3.8 @ 1 GHz 0.005 @ 1 GHz 12-14 (X/Y). 35 (Z)
Hitachi MCL-HE-679 FG(S) Previously called Rogers Theta 370-390 4.3 – 4.5 @ 1 GHz 0.006-0.008 @ 1 GHz
Nelco N4000-13EP Enhanced Epoxy 350 3.6 @ 10 GHz 0.009 @ 10 GHz 10-14 (X/Y), 65 (Z)
Nelco N4000 13EPSI Enhanced Epoxy 350 3.2 @ 10 GHz 0.008 @ 10 GHz 9-13 (X/Y), 65 (Z)
Signal Integrity Laminates

12. Supplier Construction Td (°C) Dk Df CTE (X/Y/Z,ppm°C) Typ. Tg
Rogers RO3003 PTFE Ceramic 500 3.0 +/- 0.04 @ 10GHz 0.0011 @ 10 GHz 17/16/25
Rogers RO3006 PTFE Ceramic 500 6.15 +/- 0.15 @ 10 GHz 0.0020 @ 10 GHz 17/17/24
Rogers RO3010 PTFE Ceramic 500 10.2 +/- .030 @ 10 GHz 0.0022 @ 10 GHz 13/11/16
Rogers RO3203 PTFE Ceramic Woven Glass
Reinforced
500 3.02 +/-0.04 @ 10 GHz 0.0016 @ 10 GHz 13/13/58
Rogers RO3206 PTFE Ceramic Woven Glass
Reinforced
500 6.15 +/- 0.15 @ 10 GHz 0.0027 @ 10 GHz 13/13/34
Rogers RO3210 PTFE Ceramic Woven Glass
Reinforced
500 10.2 +/- 0.50 @ 10 GHz 0.0027 @ 10 GHz 13/13/34
Rogers Ultralam 3850 Liquid Crystalline Polymer
(LCP)
2.9 @ 10 GHz 0.0025 @ 10 GHz 17/17/150
Rogers RO4835 Hydrocarbon Ceramic
Woven Glass
390 3.48 +/-0.05@ 10 GHz 0.0037 @ 10 GHz 10/12/31
Rogers RO4835 LoPro Hydrocarbon Ceramic 390 3.48 +/-0.05@ 10 GHz 0.0037 @ 10 GHz 11/14/24
Rogers RT/duroid 5870 PTFE Random Glass Fiber 500 2.33 +/- 0.002 @ 10 GHz 0.0012 @ 10 GHz 22/28/173
Rogers RT/duroid 5880 PTFE Random Glass Fiber 500 2.20 +/- 0.02 @ 10 GHz 0.0009 @ 10 GHz 31/48/237
Rogers RT/duroid 5880LZ Filled PTFE Composite 1.96 +/- 0.04 @ 10 GHz 0.0019 @ 10 GHz 44/43/42
Rogers RT/duroid 6002 PTFE Ceramic 500 2.94 +/- 0.04 @ 10 GHz 0.0012 @ 10 GHz 16/16/24
Rogers RT/duroid 6006 Ceramic PTFE Composite 500 6.15 +/- 0.15 @ 10 GHz 0.0027 @ 10 GHz 47/34/117
Rogers RT/duroid 6010.2LM Ceramic PTFE Composite 500 10.2 +/- 0.25 @ 10 GHz 0.0023@ 10 GHz 24/24/47
Rogers RT/duroid 6202 PTFE Ceramic Woven Glass
Reinforced
500 2.90 - 3.06 +/- 0.04 @ 10 GHz 0.0015 @ 10 GHz 15/15/30
Rogers RT/duroid 6035HTC PTFE Ceramic 3.50 +/- 0.05 @ 10 GHz 0.0013 @ 10 GHz 19/19/39
RF / Microwave Laminates

13. Supplier Construction Td (°C) Dk Df CTE (X/Y/Z,ppm°C) Typ. Tg
Rogers TTM
(Variable Dk Values)
Hydrocarbon Ceramic 425 3.27 – 12.85
(see Rogers Data Sheets)
0.0019 – 0.0023
(see Rogers Data Sheets)
(see Rogers Data Sheets)
Rogers XT/duroid 8000 Thermoplastic 3.23 +/- 0.05 @ 10GHz 0.0035 @ 10 GHz 18/23/68
Rogers XT/duroid 8100 Woven Glass Reinforced
Thermoplastic
3.32 +/- 0.05 @ 10 GHz
0.004” thickness
0.0038 @ 10 GHz
0.004” thickness
19/21/76
Rogers RO4500 Series
Rogers RO4700 Series
Cost Performance Antenna
Grade Laminates
3.3 – 3.5
2.55 – 3.0
0.0025 – 0.0037
0.0026 – 0.0027
See Rogers Data Sheets for
Product Specifics
Isola I-Tera MT RF Modified Filled Epoxy 360 3.50 - 3.56 @ 10 GHz
(based on core thickness)
0.0032 – 0.0035 @ 10 GHz
(based on core thickness)
12/12 X/Y
Isola IS680
(Variable Dk Values)
Advanced Modified Filled
Epoxy
2.8 – 3.45
(see Isola Data Sheets)
0.0025 – 0.0035
(see Isola Data Sheets)
(see Isola Data Sheets)
Isola Astra MT Advanced Modified Filled
Epoxy
360 3.0 +/- 0.05 @ 2 GHz 0.0017 @ 2 GHz 12/12/44.7
Arlon TC600 Glass, PTFE, Micro dispersed
ceramic
512 6.15 @ 10 GHz 0.0020 @ 10 GHz 9/9/35
Arlon TC350 Glass, PTFE, Micro dispersed
ceramic
520 3.50 @ 10 GHz 0.0020 @ 10 GHz 7/7/23
Arlon CLTE Ceramic/PTFE Composite 493 2.98 @ 10 GHz 0.0023 @ 10 GHz 10/12/34
Arlon CLTE-XT Ceramic/PTFE Microwave
Composite
501 2.94 @ 10 GHz 0.0012 @ 10 GHz 8/8/20
Arlon CLTE-AT Ceramic/PTFE Microwave
Composite
487 3.0 @ 10 GHz 0.0013 @ 10 GHz 8/8/20
Arlon 25FR Ceramic Hydrocarbon 3.58 @ 10 GHz 0.0035 @ 10 GHZ 16/18/59
Arlon CuClad Series Woven Fiberglass, PTFE See data sheets, Available in 3 different Dk values. CuClad 217, CuClad 233 and CuClad 250
Arlon DiClad 880 Woven Fiberglass Reinforced
PTFE
See Data Sheets. Available in 4 different versions. DiClad 522/527, DiClad 870, DiCLad 880
RF / Microwave Laminates

14. Supplier Construction Td (°C) Dk Df CTE (X/Y/Z,ppm°C) Typ. Tg
Rogers 4450B Bond-ply Hydrocarbon/Ceramic/
Woven Glass/Prepreg
390 3.30 +/- 0.05 0.004 Film Adhesive System for multi layer
boards using RO4003C, RO4350B and
RO4000 LoPro laminates
Rogers 4450F Bond-ply Hydrocarbon/Ceramic/
Woven Glass/Prepreg
390 3.54 +/- 0.05 0.004 Film Adhesive System for multi layer
boards using RO4003C, RO4350B and
RO4000 LoPro laminates
Rogers 2929 Bond-ply Unreinforced Thermoset
Hydrocarbon Film
400 2.94 +/-0.05 @ 10 GHz 0.003 @ 10 GHz Film Adhesive System for multi layer
boards using RT/duroid 6000, RO4000
and RO3000 laminates
Zeta Lam Polyimide Film Based 500 3.0 @ 2 GHz 0.010 @ 2 GHz High performance Copper/Dielectric for
laser via formation and “Any Layer” HDI
Rogers 3001 Bonding Film Thermoplastic Bonding Film 2.28 0.003 @ 10 GHz Bonding film for low Dk / low Df
laminates, including PTFE
Rogers RO3003 Bond-ply Ceramic PTFE Bondply 3.0 +/- 0.04 0.0013 17/16/25
Rogers RO3006 Bond-ply Ceramic PTFE Bondply 6.15 +/- 0.15 0.0020 17/17/24
Rogers RO3010 Bond-ply Ceramic PTFE Bondply 10.2 +/- 0.30 0.0022 13/11/16
Rogers RT/duroid 6002 Bond-
ply
Ceramic PTFE Bondply 2.94 +/- 0.04 0.0012 16/16/24
Rogers Ultralam 3980 Bond-
ply
LCP Bonding Film 2.9 0.0025 @ 10 GHz Can be used with Ultralam 3850 Liquid
Crystalline Polymer (LCP)
Arlon GenClad 280 Thermoset Bond-Ply 420 2.8 @ 10 GHz 0.0020 @ 10 GHz 26/26/50
Arlon CLTE-P Pre-Preg Bonding Layer 2.94 @ 10 GHz 0.0025 @ 10 GHz 10/12/35
CuClad 6250 Bonding Film 2.32 @ 10 GHz 0.0013 @ 10 GHz Film Adhesive used with CuClad and
other PTFE based laminates
CuClad 6700 Bonding FIlm 2.35 @ 10 GHz 0.0025 @ 10 GHz Film Adhesive used with CuClad and
other PTFE based laminates
DuPont Teflon FEP Thermoplastic Film 255 2.0 @ 1 MHz 0.0005 @ 1 MHz Fluoroplastic (Thermoset) Film Adhesive
used for bonding dissimilar laminates
Rogers Coolspan TECA Silver Filled Adhesive Film Non FR N/A N/A Thermally and Electrically Conductive
Adhesive film used to bond circuit
boards to metal backplanes, heat sinks,
coins and RF module housings
Pre-Pregs & Bonding Films

15. Supplier Construction Td (°C) Dk Df CTE (X/Y/Z,ppm°C) Typ. Tg
Isola FR406 Epoxy 300 3.92 @ 10 GHZ 0.0172 @ 10 GHZ 13/13/60
Isola FR408 Epoxy 360 3.65 @ 10 GHz 0.0125 @ 10 GHz 13/13/60
Isola FR370HR Epoxy 340 3.92 @ 10 GHz 0.025 @ 10 GHz 13/14/45
Grace GA-170-LL Epoxy 340 4.38 @ 1 GHz 0.0154 @ 1 GHz 14/16/240
Nan Ya NP-175FTL Epoxy 351 3.9-4.1 @ 1 GHz 0.012-0.014 @ 1 GHz 250-270 (Z)
Nelco N4000-6 Epoxy 325 4.0 @ 2.5 GHZ 0.022 @ 2.5 GHz 12/15 X/Y
Thermal Reliable Laminates
Polyimide
Supplier Construction Td (°C) Dk Df CTE (X/Y/Z,ppm°C) Typ. Tg
Isola P96 (V-0) Polyimide 396 3.73 @ 10 GHz 0.021 @ 10 GHz 13/14/55
Nelco N7000-2V0 Polyimide 390 3.8 @ 10 GHz 0.010 @ 10 GHz 10/12 X/Y
Nelco N7000-2HT Polyimide 376 3.5 @ 10 GHz 0.015 @ 10 GHz 9-12 X/Y
Halogen Free Laminates
Supplier Construction Td (°C) Dk Df CTE (X/Y/Z,ppm°C) Typ. Tg
Hitachi MCL-HE-679 FG(S) 370-390 3.6-3.8 @ 10 GHz 0.007-0.09 @ 10 GHz 12-15 (X)
30-40 (Z)
Nan Ya NPG-170TL 3.9-4.1 @ 1 GHZ 0.012-0.014 @ 1 GHZ 9/13/200-230
Mitsubishi CCL-HL832NS BT Resin 4.3 @ 10 GHz 0.008 @ 10 GHz 10/3 (X/Y)

16. A Time Critical PCB Manufacturer
Thank You!
speed | vision | attitude
Marcel Electronics International
130 W. Bristol Lane
Orange, CA 92865
Tel. (714) 974-8590
www.mei4pcbs.com