*(PPT was prepared for a 15 min presentation) The topic "Photonic Integrated circuit technology" is in itself very vast that it cant be explained completely in a matter of minutes, so it is better to focus on a particular type of PIC throughout the presentation .(because,based on substrate material,the technology changes and it is always important to maintain a flow throughout the presentation). Research well on the topic,do your best and leave the rest :)

2. INTRODUCTION
PHOTONIC IC VS ELECTRONIC IC
Basic components
CLASSIFICATION
FABRICATION
PIC – AN EXAMPLE
EVaLUATION OF a PIC
APPLICATIONS
CURRENT ASPECTS
FUTURE PROSPECTS
REFERENCES

3. INTRODUCTION
 Technology introduced -1970’s
 Optical equivalent of electronic IC
 Involves integration of optical
functions into a single chip
 High speed data rates
 Small size, reduced power
consumption

4. PHOTONIC IC VS ELECTRONIC IC
FEATURES PIC EIC
Data Carrier Photons Electrons
Type of components Functional optical
devices
Transistors
No. of components
integrated
Limited to a few
hundred
Range into millions
 Substrate materials Many different
materials in a single
chip
Fits nicely onto Silicon

5. BASIC COMPONENTS
PASSIVE
• Waveguides/Couplers
• Switches (optical
interconnect,
wavelength selective
switches)
• Filters (add-drop
filters, MUX/DEMUX)
• Dispersion
compensators
• Attenuator
• Gain equalizer
• Isolators/Circulators
ACTIVE
• Amplifiers
• Lasers
• LED
• Modulators
• Detectors
• Wavelength
Converters

7. a)
b)
c)
a)Array Waveguide Grating(AWG)
b)Multimode Interference
Couplers (MMI)
c)Mach-Zehnder
Interferometers(MZI)

8. CLASSIFICATION
 Based on integration :
- Monolithic Integration
- Hybrid Integration
- Modular Integration
 Based on type of substrate material :
- Indium Phosphide (InP)
- Gallium Arsenide (GaAs)
- Lithium Niobate
- Silicon (Si)
- Silica-on-Silicon
- Silicon on Insulator

10. FABRICATION
• Structural strategy for the fabrication of PICs onto an
InP substrate
• Basic steps :
- Epitaxial growth
- Waveguide etching
- Passivation and planarization
- Metallization and interconnect

11. Four active-passive integration schemes:
(a) vertical twin-guide integration
(b) vertical single guide integration
(c) quantum well intermixing (and selective area growth)
(d) butt-joint integration

12. Cross section of the wafer structure after the 4 processes:

13. PIC – AN EXAMPLE
WDM chip :
Integration of multiple wavelengths onto single
transmitter and reciever chips

14. EVALUATION OF A PIC
 Merits :
 Demerits :
Compared with EICs Compared to discrete
optical components
• Increased Bandwidth and
lower power consumption
• Smaller size, lower power
consumption
• High Reliability • Improved optical alignment
• Data Transparency • Immunity to vibration
• High cost for developing new fabrication technology

15. APPLICATIONS
• Fiber Optics
• Bio-Photonics
• Sensors
• Photonic Computing
• Nano Photonics

16. CURRENT ASPECTS
• WDM system on a chip
• Match discrete components in performance
• Unmatched space ,power and reliability
• Deliver lowest cost/bit
• High spectral efficiency

17. FUTURE PROSPECTS
• Complex packages that support advanced modulation
schemes and receiver designs
• Integration of electronics and optics

18. Optical Fiber Communications – Principles and Practice by John M. Senior
www.infinera.com
http://en.wikipedia.org
http://iopscience.iop.org
http://www.sciencedirect.com
http://www.vlcphotonics.com
http://www.photonics.com
http://ieeexplore.ieee.org
http://www.researchgate.net
http://photonicswiki.org
http://www.onechipphotonics.com
www.circuitstoday.com

19. Thank You