The document provides an overview of the SPARC T3-4 system from Oracle. It describes the key features including the SPARC T3 CPU with 16 cores and 512 threads, up to 512GB of DDR3 RAM, 16 PCIe expansion slots, optional 10GbE networking, RAID storage, and hot-swappable redundant power and cooling components. The 5U system is aimed at enterprise workloads and succeeds Oracle's SPARC T5440 server.

1. © 2010 Oracle Corporation – Proprietary and
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SPARC T3-4 System Technical Overview
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The following is intended to outline our general
product direction. It is intended for information
purposes only, and may not be incorporated into any
contract. It is not a commitment to deliver any
material, code, or functionality, and should not be
relied upon in making purchasing decisions. The
development, release, and timing of any features or
functionality described for Oracle’s products remains
at the sole discretion of Oracle.

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SPARC T3-4 System
• Compute
• 2x or 4x SPARC T3 16-core CPU (256/512 threads)
• 64x DDR3 DIMMs (512GB max, 8GB DIMMs)
• I/O and Storage
• 16x Express Module PCIe Gen2 x8 slots
• 8x 10GbE optional XAUI ports (QSFP connectors)
• 8x 2.5” hot-swap SAS-2 disks
• Availability and Management
• RAID 0/1
• Hot-swap fans, disks & PSUs
• ILOM Service Processor
• Electronic Prognostics 1.1
4-Socket, 5RU Enterprise-Class Datacenter Server

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T3-4 System Highlights
• Successor to T5440, SPARC T2 Plus system
• Uses Express Modules for PCIe
• New 5U enclosure with PCIe Generation 2.0 and
SAS2 Disk Drives
• New Service Processor module
• Solaris 10 Update 9
• Oracle VM Server for SPARC 2.0 (Logical Domains)
• Wire Speed Cryptography: 12 popular algorithms
implemented in hardware SPU (1 per core)

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T3-4 Comparison to T5440
Feature SPARCT3-4 SPARCEnterpriseT5440
FormFactor 5RU,28”deep 4RU,28”deep
CPU
4xSPARCT3
1.65GHz 512threads
4xUltraSPARCT2Plus
1.4/1.6GHz64-256threads
Memory
DDR3,512GBMAX
64xSlots
FB-DIMM,512GBMAX
64xslots
Network
4x1 GbE+8x10GbE(XAUI)
Requires2SeparateQSFPConnectors
4x1GbE,
Upto2x10GbE(uses2PCIeslots)
InternalStorage
Upto8x2.5”SAS
(SSDsupportTBD)
Upto4x2.5”SAS,canuseupto
4xSATASSD's,hot-swap
RemovableMedia 1x DVD-RW(viarKVMS;notlocal) 1x DVD-RW
Serial 1xRS-232, 4xUSB 1xRS-232, 4xUSB
PCIExpressslots 16xx8slots(ExpressModuleslots,Gen2) 8x(lowprofile,Gen1)
PowerSupply
4x2060WattAC,N+N
Redundant/Hot-Swap
4x1100WAC/2x1200WattDC
Redundant/Hot-Swap
Fans 5xRedundantHot-Swap 4xRedundant/Hot-Swap

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T3-4 System Key Features
• SPARC T3 CPU
• T3 based on T2 Plus/T2/T1 Family
2X T2 Plus cores, dual 10 Gbps Ethernet, dual PCI Express Gen2
• 2x or 4x T3 processors per system, 16 cores x 8 threads →
512 threads
• Core frequency of 1.65 GHz
• T3 chip is socketed, but not field-replaceable
• Memory – DDR3 DIMMs
• 64 sockets on 2 Processor Modules Boards → up to 512
GB (w/ 8 GB DIMMs)
• 4 GB, and 8 GB sizes
• Registered, ECC DIMMs operating at 1066 MT/s
• Buffers-on-Board (BoB) between CPU and DIMMs

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T3-4 System Key Features
• Software
• Solaris 10 Update 9
• LDOMs 2.0
• Service Processor (SP)
• New SP module, shared across T3-based platforms
• AST2200 CPU, with local Flash and memory
• ILOM 3.0
• Electronic Prognostics 1.1
• Parallel Boot
• Host and SP boot in parallel → faster boot time
• Support for “degraded” modes:
• with failed Service Processor
• with failed T3 Processor(s)

9. © 2010 Oracle Corporation – Proprietary and Confidential Page 9© 2010 Oracle Corporation – Proprietary and Confidential Page 9
SPARC T3 Systems I/O Subsystem
• PCI-E Gen 2.0 with 2 x8 lane physical ports per SPARC T3
• Full bandwidth per port with Generation 2 speeds
• PCI-E 2.0 to PCI-E 1.0 autonegotiation
• SDIO supported now, Single Root IOV planned for OVMSS 3.1
• 4 GB/s each direction, total of 16 GB/s bandwidth per SPARC T3
• Lane width autonegotiation
• 256 byte maximum packet size
• Uses latest PCI-E switch chips from IDT

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SPARC T3 Systems I/O Subsystem
• 3rd Generation Virtual to Physical Address Translation
• Allows Guest OS’s to manage translations without hypervisor
• Hypervisor has its own Virtual to Physical mapping
• 4X I/O throughput of T5440
• 2 PCI-e root complexes (vs. 1 on UltraSPARC T2 Plus)
• PCI-e Generation 2 (vs. Generation 1 on UltraSPARC T2 Plus)
• Enhanced Translation Ordering
• Relaxed Ordering
• Device-based Ordering

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T3-4 System Key Features
• I/O – Networking
• 1 Gb Ethernet
• 4 on-board ports, 10/100/1000 Mbps
• Two Intel Kawela dual-port MAC+PHY
• On-board ports also support NC-SI to Service Processor
• 10 Gb Ethernet
• Up to 8x 10 GbE XAUI links from SPARC T3
• XAUI ports operate independently of on-board ports
• XAUI requires QSFP connections, entire 10GbE Board is
optional

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T3-4 System Key Features
• I/O – Storage
• HDDs/SSDs (SSDs available post-RR in spring)
• Dual LSI SAS2008 8port SAS2/SATA2 controllers,
RAID 0/1
• No DVD on T3-4; use rKVMS

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T3-4 System Key Features
• I/O – Expansion
• 2 PCI Express Gen2 switches, each directly accessible from
two SPARC T3s, one from each of the two Processor
Modules
• 16 Express Module PCIe expansion slots
• All slots accept x8 PCI Express Module cards, Gen1 or
Gen2
• USB2.0
• Internal storage device port, 2 front ports, 2 rear ports
• SIS buttons/LEDs, Service Processor Serial/Ethernet ports,
VGA port

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T3-4 Front Panel
DISK 0
DISK 1
DISK 2
DISK 3
DISK 4
DISK 5 DISK 7
DISK 6
Dual USB 2.0
Ports
HD-15 VGA
Port
SP Serial
Port
Processor
Module 1
PSU Status
LEDs
PSU 0 PSU 1 PSU 2 PSU 3
RFID/Serial
Number
Main Module &
SP Status LEDs
Power
Button
Status
LED
Fault
LED
Locator
LED/Button
Processor Module 0
Status LEDs
Over Temp
Indicator
Rear Fan/EM
Indicator
Processor
Module 0
Processor Module 1
Status LEDs
Main Module
(Entire Board)

15. © 2010 Oracle Corporation – Proprietary and
Confidential
T3-4 Rear Panel

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T3-4 Block Diagram

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T3-4 System Chassis
• New 5U system chassis
• 5 fan modules each front-to-back fans
• New Main Module board, contains HDDs, SP
• New Processor Module board, containing SPARC T3 CPUs
(cooling via copper heat sinks) and memory
• Uses same Power Supplies as T3-2 server

18. © 2010 Oracle Corporation – Proprietary and Confidential 18
T3-4 Rear Chassis Assembly
Midplane, Express
Backplane, PDB,
AC and DC Busbars
(part of Rear Chassis
Assembly)
Rear Chassis Sheet metal
sleeve, Fan and Card Guides
System Chassis

19. © 2010 Oracle Corporation – Proprietary and Confidential 19
T3-4 Rear Chassis Assembly
Midplane, Express
Backplane, PDB,
AC and DC Busbars
(part of Rear Chassis
Assembly)
Rear Chassis Sheet metal
sleeve, Fan and Card Guides
Rear Chassis
Sub-Assembly
Entire assembly serviced
from rear
System Chassis

20. © 2010 Oracle Corporation – Proprietary and
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T3-4 System Power
• New AC Power Supply
• “2U” (78 mm) A239
• 2060W @ 240 VAC
• Gold+ efficiency
• N+N Redundant, Hot-swap
• 4 Power Supplies
• New DC/DC Voltage Converters
• D219 for DDR3 memory – 1.5 V Vdd, 0.75 V Vtt
• D220 for CPU – 1.05 V (nom.) Vdd, Vnw, Vsb
• Shared with all T3 platforms

21. © 2010 Oracle Corporation – Proprietary and Confidential 21
T3-4 PSU and System Power
PSU (A239)
• A minimum of two A239 PSU's are required for
each system (2060 W each)
• They may be placed in any Power Supply Bay
(front of system)
• T3-4 will only ship to customers as 200-240V
(high-line) system, but PSU's support 100-
120V (low-line) as long as all four line cords
are used to handle the excessive current.
• AC cords (4) plug into rear.

22. © 2010 Oracle Corporation – Proprietary and Confidential 22
T3-4 System Service processor
• Common service processor card for all systems
• Aspeed AST2200 processor
• 266MHz ARM processor
• DDR2
• PCIe video device PCIe 1.0 x1
• USB
• Provides rKVMS
• 10/100Mbps network interface and serial console
• ILOM 3.0

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T3-4 Service Processor

Service processor is separate FRU

Requires removal of Main Module from
chassis, then removal of mezzanine-like
board from Main Module

24. © 2010 Oracle Corporation – Proprietary and
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T3-4 Main Module Internal View
Service
Processor
C
C o
h n
a n
s e
s c
i t
s o
r
s
System
Configuration
Card (SCC)
EEPROM
8x 2.5 “
300GB
10,000 RPM
HDDs
REM0 and
REM1 Raid 0/1
Cards
PCIe Gen2
Switches

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T3-4 Processor Module w/DIMMs & Fillers
DDR3
DDR3
DDR3
DDR3
DDR3
DDR3
DDR3
DDR3
SPARC
T3MODULE
SPARC
T3MODULE
C
C o
h n
a n
s e
s c
i t
s o
r
s
Buffers-on-
Board (BoB)
Chips

26. © 2010 Oracle Corporation – Proprietary and
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T3-4 Processor Module w/out DIMMs
DDR3
DDR3
DDR3
DDR3
DDR3
DDR3
DDR3
DDR3
SPARC
T3MODULE
SPARC
T3MODULE
C
C o
h n
a n
s e
s c
i t
s o
r
s

27. © 2010 Oracle Corporation – Proprietary and
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T3-4 Basic Memory Layout
• Each SPARC T3 CPU
contains 2 memory
controllers
• MCU0 and MCU1
• Each controller has
interfaces to 2 Buffers
on Board (BoBs)
• 2 DDR3 channels
• 2 DIMMs per channel
• 16 DIMMs per CPU
• Memory bus speed
limited to 1066 MHz for
all platforms

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Processor Module Physical Memory Layout

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Memory Configuration Rules
• Minimum of 16 DIMMs per Processor Module, 4GB
and 8GB DIMMs are supported
• 8 DIMM configurations are recommended to provide
full memory bandwidth and optimal performance
• Mixing of DIMMS is supported – with caveats
– 16GB DIMMs possibly available post-RR
• Minimum capacity: 64 GB
• Maximum capacity: 512 GB (1 TB post-RR)
• All DIMMs run at 1066 MHz, no clocking down
• Please refer to Appendix entitled Servicing DIMMs for
a full description of rules

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T3-4 10GbE XAUI Option
• Direct interface via 10GbE ports on SPARC T3
• Order RIO Board with QSFP connectors:
• SE5Y5RM1Z (ATO from, factory)
or
• SE5X5RM1Z (X-Option)
and
• 2124A (ATO Option): Sun 10Gb QSFP Transceiver
• Note: this option will be available post-RR

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T3-4 Disk Drives
• Disk drives are 2.5” form factor
• New 5U Chassis
• Chassis supports SAS2
• Up to 8 SAS drives
• 300GB @ 10K RPM
Ready to
Remove
Fault
Status
Disk LED's

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T3-4 Disk Controller Options
• T3-4 has Dual LSI SAS2008 8port SAS2/SATA2 controllers
• Support for RAID 0 (striping) and RAID 1 (mirroring) using
'radictl'

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T3-4 Rack Mounting
• Only one rack mounting solution – std with base chassis
• Rail slide kit for rack mounting (factory installation)
• Order # (Base Chassis Part Number): SE5ASY11Z

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T3-4 Rear I/O Module (RIO)
• Two 'flavors', each of which is orderable via ATO or X-
option
• Flavor 1:
• SE5Y5RM1Z: Snap-in RIO Module (native: 4 x
10/100/1000 MbE, SP-Network, SP-Serial, 2 x USB 2.0)
• Flavor 2:
• SE5Y5RM2Z: Snap-in RIO Module (native: 4 x
10/100/1000 MbE, SP-Network, SP-Serial, 2 x USB 2.0),
8 x 10GbE XAUI ports via 2 QSFP connectors
• Note: Flavor 2 available post-RR

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T3-4 System RAS Overview
• Designed to minimize part count and operating
temperature to enhance reliability
• End-to-end data protection detecting and correcting
errors throughout server – ECC everywhere
• Processor and Memory protection
• CPU core and thread off-lining
• Memory with ECC, page retirement, and lane failover
• Off-lining/Failover of on-chip crypto units
• Major components redundant & hot-replaceable
• Fan, Power Supply, and internal disks
• RAID capability for internal disks

36. © 2010 Oracle Corporation – Proprietary and
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37. © 2010 Oracle Corporation – Proprietary and
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Oracle VM Server for SPARC 2.0
New Features and Capabilities
• New Hardware Support
• SPARC T3 servers with Oracle Solaris 10 9/10
• PCIe direct I/O (SDIO) – available post-RR
• Assign individual PCI cards to guest domains
• Remove the restriction to only assign an entire
PCI bus – more configuration flexibility
• Provide native I/O throughput – maximum IO
performance in a virtual machine for the most
demanding IO intensive workloads

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PCIe Switch
(virtualized)
PCIe Switch
(virtualized)
Example view of a slot assigned via SDIO
PrimaryI/O Domain
Operating
System
Operating
System
Hypervisor
pci@4
00
pci@4
00
PCIe SwitchPCIe Switch
On-board devicePCIE1PCIE2PCIE3
pci@400
(virtualized)
pci@400
(virtualized)
PCIe Switch
virtualized

39. © 2010 Oracle Corporation – Proprietary and
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Oracle VM Server for SPARC 2.0
New Features and Capabilities
• Logical Domain Migration Enhancements
• A set of enhancements in Oracle Solaris 10 9/10
• Eliminates restrictions preventing migrations in prior
releases
• Customers gain more operational flexibility by
allowing migration of a guest domain in a broader
range of circumstances.

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Oracle ILOM Key Functions
• Management Interfaces
• CLI, BUI, IPMI, SNMP
• Firmware Updates
• Remote Host Management
• Inventory and Component Management
• System Monitoring and Alert/Fault Management
• User Account Management
• Power Consumption Management

41. © 2010 Oracle Corporation – Proprietary and Confidential 41
ILOM fdd diagnosis

ILOM fault management uses 'fdd' diagnosis

Currently supported on x64 Nehalem platforms

All ILOM diagnosed problems will have a Message-ID

All ILOM diagnosed problems will have a Knowledge Article

42. © 2010 Oracle Corporation – Proprietary and Confidential 42
Fault Management
New for T3-4
• Knowledge Articles in MOS
• ILOM fdd Diagnosis
• Faults and Alerts
• No ALOM Compatibility
• ILOM FMA Captive Shell
• Sideband Service Processor Network Connection
• New ILOM Fault Notification (SNMP Trap)
• ASR Support

43. © 2010 Oracle Corporation – Proprietary and Confidential 43
No ALOM Compatibility

ALOM functions not supported from ILOM CLI are
supported in Service or Escalation mode.

44. © 2010 Oracle Corporation – Proprietary and Confidential 44
ILOM FMA Captive Shell

Enter from ILOM CLI

Display ILOM fdd diagnosed problems

Display ereports from host FMA diagnosis

Repair ILOM fdd diagnosed problems

45. © 2010 Oracle Corporation – Proprietary and Confidential 45
ASR Support
• T3-4 will be supported by ASR (Automatic Service
Request) at release
• First platform to use new sunHwTrapFaultDiagnosed
SNMP notification
• Telemetry for ILOM fdd diagnosis
• Supports platform and FRU identity
• Supports multi-suspect list

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Side-band Management
• 3 Remote Management Communication Channels
• Out-of-band management = communicate with the SP over a
dedicated media (Ethernet/Serial)
• In-band management = communicate with the SP through
Solaris via agents
• Side-band management = communicate with the SP over a
shared media (the host’s data network interface)
• Side-band interface is Disabled by default (as shipped
from Factory)
• Can be enabled on any of the 4 on-board GigE Interfaces
• Configured from ILOM Web, CLI Interface or BIOS Setup Utility

47. © 2010 Oracle Corporation – Proprietary and
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48. © 2010 Oracle Corporation – Proprietary and
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49. © 2010 Oracle Corporation – Proprietary and
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50. © 2010 Oracle Corporation – Proprietary and
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Version Date Author Comments
1.0 12/29/10 KW Initial Release
Revision History