2. FEATURES & BENEFITS
Available in 2 through 4 rows - Offers maximum design flexibility
Tested and qualified to MIL-C-28859 and MIL-C-28754 - Confirms the product meets specific performance requirements
Tuning fork and blade contact system - A proven technology for high reliability
Low insertion force (2.25oz/contact) - For easy mating
Rugged machined aluminum frames - Ensures excellent performance in harsh environments
Compliant pin press-fit, through-hole and flex circuit termination styles available - Support a variety of design application requirements
Originally co-developed with the U.S. Navy, the NAFI Connector product
line includes multi-row, through-hole solder blade connectors and press
fit tuning fork backplane connectors. The highlight of the NAFI backplane
technology is its solderless “Dynamic Retention” gas tight, press-fit tuning
fork contact design. Rugged, metal header bodies are machined and
finished with chromate. Available in two, three, or four rows of contacts,
NAFI Connectors offer a high degree of design flexibility in order to meet
specific density and layout requirements.
Tuning Fork and Blade
Contact System:
A proven technology for
high reliability.
Connector patterns containing multiple rows of contacts are easily
produced and can include standard NAFI-style features such as guide
pins and D-shaped polarizing keys. The mating backplane connectors
feature solderless press-fit tuning fork contacts arranged
on a 0.100” x 0.100” grid.
NAFI
3. ENVIRONMENTAL CHARACTERISTICS
Salt Spray (corrosion) MIL-STD-1344 Method 1001, Test Condition B
Thermal Shock MIL-STD-1344 Method 1003, -55°C to +125°C
Humidity MIL-STD-810 Method 507, Procedure 1
Physical Shock MIL-STD-202 Method 213
Vibration (random) MIL-STD-1344 Method 2005, 10-2000 Hz, 15g Peak
Temperature Range -65°C to +125°C
Current Rating
(individual contact)
3 Amps DC at 25°C
Current Rating
(multiple contacts)
1 Amp DC at °C
Dielectric Withstanding
Voltage (DWV)
600 V (RMS) at 60 Hz
Insulation Resistance (min.) 10,000 MΩ
Contact Resistance (max.) 30 MΩ
Contact-to-Backplane
Retention Force (min.)
3.0 lbs.
Contact Life (durability) 500 cycles
Contact Engagement Force 2.25 oz max. average
Contact Normal Force 1.0 N (3.53 oz-f) average
Contact Wipe Length (min.) 0.053 in.
MATERIALS & FINISHES
OPERATING CHARACTERISTICS
Frame Material Aluminum Alloy
Frame Finish Gold Chromate per MIL-C-5541
Module Contact Material Brass
Module Contact Tails Pre-tinned using Sn63 (from end of
contact to mounting surface min.)
Module Contact Finish 50µ” min. Gold over 10µ” min. Nickel
Backplane Contact Material Beryllium Copper
Backplane Contact Finish 50µ” min. Gold over 10µ” min. Nickel
Module Insulator High-temperature Nylon 6-6
Backplane Insulator Polyester, 30% glass-filled (UL 94V-0)
Module Marking Includes Amphenol part number, logo and
date code
Polarizing Keys and Bushings Stainless Steel, Passivated
NAFI TECHNICAL REFERENCES
4. Daughtercard
Connector
No. Contacts Mating Backplane
Connector Kit
K M N P
M1001-12927 60 552-2583-000 29 2.930 2.940 2.960
M1001-12928 80 552-2584-000 39 3.930 3.940 3.960
M1001-12929 100 552-2585-000 49 4.930 4.940 4.960
M1001-12930 120 552-2586-000 59 5.930 5.940 5.960
.174 (4.42)
.140 (3.56)
.240 [6.10]
.140 [3.56]
(.037 [0.94])CONTACT
TO MOUNTING SURFACE
DETAIL C
CONTACT ORIENTATION
DETAIL D
PIN ORIENTATION
(SHOWN IN POSITION A)
STANDARD
ORIENTATION
.142 [3.61]
.015[0.38]-.019[0.48]
DIAMETER TYPICAL
.050 [1.27]
SEE DETAIL D
.470 [11.94]
2 PL
.580 [14.73]
2 PL
.100 [2.54]
SEE DETAIL C
.150 [3.81]
K EQ SP @ .100[2.54], centered on N
P
N
M
Marking located approximately
where shown
2 PL
.100 [2.54]
.200 [5.08]
.052 [1.32]
2 PL
Ø.097 [Ø2.46]
2PL
.093 [2.36]
.286 [7.26]
X
X
SECTION X-X
ROTATED 90° CCW
NAFI TWO ROW
5. NAFI THREE ROW
Daughtercard
Connector
No. Contacts Mating Backplane
Connector Kit
K M N P
M1001-12931 66 552-2587-000 21 2.130 2.140 2.160
M1001-12932 99 552-2588-000 32 3.230 3.240 3.260
M1001-12933 120 552-2589-000 39 3.930 3.940 3.960
M1001-12934 150 552-2590-000 49 4.930 4.940 4.960
.175 (4.45)
.140 (3.56)
SECTION X-X
ROTATED 90° CCW
.142 [3.61]
DETAIL C
CONTACT ORIENTATION
STANDARD
ORIENTATION
DETAIL D
PIN ORIENTATION
(SHOWN IN POSITION A)
(.040 [1.02]) CONTACT
TO MOUNTING SURFACE
.140 [3.56]
.240 [6.10]
.340 [8.64]
.015[0.38]-.019[0.48]
DIAMETER TYPICAL
X
X
K EQ SP @ .100[2.54], centered on N
P
N
M
.052 [1.32]
2 PL
.200 [5.08]
Ø.097 [Ø2.46] 2 PL
Marking located approximately
where shown
.580 [14.73]
2 PL
.100 [2.54]
.150 [3.81]
SEE DETAIL D
.050 [1.27]
2 PL
SEE DETAIL C
.100 [2.54]
.386 [9.80]
.193 [4.90]
.470 [11.94]
2 PL
*All dimensions for reference only
6. Daughtercard
Connector
No. Contacts Mating Backplane
Connector Kit
K M N P
M1001-12935 100 552-2591-000 24 2.430 2.440 2.460
M1001-12936 140 552-2592-000 34 3.430 3.440 3.460
M1001-12937 180 552-2593-000 44 4.430 4.440 4.460
M1001-12938 200 552-2594-000 49 4.930 4.940 4.960
.175 (4.45)
.140 (3.56)
.142 [3.61]
DETAIL C
CONTACT ORIENTATION
DETAIL D
PIN ORIENTATION
(SHOWN IN POSITION A)
STANDARD
ORIENTATION
(.040 [1.02]) CONTACT
TO MOUNTING SURFACE
.140 [3.56]
.240 [6.10]
.340 [8.64]
.440 [11.18]
.015[0.38]-.019[0.48]
DIAMETER TYPICAL
X
X
K EQ SP @ .100[2.54], centered on N
P
N
M
.100 [2.54]
.580 [14.73]
2 PL
.470[11.94]
2 PL
Marking located approximately
where shown
Ø.097 [Ø2.46] 2 PL
.200 [5.08]
.200 [5.08]
.093 [2.35]
.485 [12.32]
.300 [7.62]
.100 [2.54]
SEE DETAIL C
SEE DETAIL D
.050 [1.27]
.150 [3.81]
2 PL
.052 [1.32]
2 PL
SECTION X-X
ROTATED 90° CCW
NAFI FOUR ROW
7. 2 ROW INSULATOR 3 ROW INSULATOR 4 ROW INSULATOR
Backplane
Connector Kit
No. of
Contacts
Mating
Daughtercard
Connector
Backplane
Connector Kit
No. of
Contacts
Mating
Daughtercard
Connector
Backplane
Connector Kit
No. of
Contacts
Mating
Daughtercard
Connector
552-2583-000 60 M1001-12927 552-2587-000 66 M1001-12931 552-2591-000 100 M1001-12935
552-2584-000 80 M1001-12928 552-2588-000 99 M1001-12932 552-2592-000 140 M1001-12936
552-2585-000 100 M1001-12929 552-2589-000 120 M1001-12933 552-2593-000 180 M1001-12937
552-2586-000 120 M1001-12930 552-2590-000 150 M1001-12934 552-2594-000 200 M1001-12938
NAFI BACKPLANE CONNECTOR KITS
2 ROW W/O NAFI VERSION
(BOTTOM VIEW)
2 ROW RIGHT NAFI VERSION
(BOTTOM VIEW)
2 ROW LEFT NAFI VERSION
(BOTTOM VIEW)
.100
.220 .199.1004 ROW LEFT VERSION
(BOTTOM VIEW)
3 ROW LEFT VERSION
(BOTTOM VIEW)
3 ROW RIGHT VERSION
(BOTTOM VIEW)
3 ROW W/O NAFI VERSION
(BOTTOM VIEW)
4 ROW RIGHT VERSION
(BOTTOM VIEW)
4 ROW W/O NAFI VERSION
(BOTTOM VIEW)
4 ROW LEFT VERSION
(BOTTOM VIEW)
3 ROW LEFT VERSION
(BOTTOM VIEW)
3 ROW RIGHT VERSION
(BOTTOM VIEW)
3 ROW W/O NAFI VERSION
(BOTTOM VIEW)
4 ROW RIGHT VERSION
(BOTTOM VIEW)
4 ROW W/O NAFI VERSION
(BOTTOM VIEW)
8. FEATURES & BENEFITS
0.100” x 0.050” staggered grid - High density optimizes trace routing through the backplane
Compliant press-fit termination of backplane connectors - Provides a gas-tight interface with the printed circuit backplane without
the need for soldering
Tuning fork and blade contact system - A proven technology for high reliability
Low insertion force (2.25oz/contact) - For easy mating
Daughtercard connectors feature surface mount termination via rigid pins or flex circuit - Maximum design flexibility depending on
the application requirements
Rugged machined aluminum frames - Ensures excellent performance in harsh environments
The Ultra High Density (UHD) interconnect is a high reliability packaging
solution for airborne, space, shipboard, and ground-based applications.
With 80 contacts per linear inch, the UHD connector is tested and qualified
to DSCC 89065. These connectors feature up to 396 surface-mount
contacts in the SEM-E (Standard Electronic Module) format and up to 556
pins in the 10 SU configurations. The mating backplane connectors feature
solderless compliant press-fit tuning fork contacts arranged on a staggered
eight row 0.100” x 0.050” grid for optimized trace routing through the
backplane.
Low Insertion Force
(2.25oz/contact):
For easy mating.
The module connectors are surface mounted to the module using rigid
pin or flex circuit terminations. Designers faced with unique packaging
requirements will appreciate the design flexibility of the UHD connector. A
modular approach allows for straightforward incorporation of signal, power,
coax, and fiber-optic inserts, as well as EMI shielding, all within the same
connector footprint. The design also enables the production of connectors
that are either longer or shorter than the basic SEM-E format. The UHD
connector is designed to provide signal integrity and interconnect density
to meet today’s advanced system-level requirements while maintaining a
robust design.
UHD
9. MATERIALS & FINISHES
OPERATING CHARACTERISTICS
ENVIRONMENTAL CHARACTERISTICS
Additional configurations also available. Visit www.amphenol-abs.com or email nafi_uhd@amphenol-abs.com for more information.
Frame Material Aluminum Alloy
Frame Finish Electroless Nickel
Module Contact Material Brass
Module Contact Finish 50µ" min. Gold over 50µ" min. Nickel
Solderable per MIL-STD-208, Solder coated
tail, 60/40 Tin-Lead"
Backplane Contact Material Beryllium Copper
Backplane Contact Finish 50µ” min. Gold over 50µ” min. Nickel
Module Insulator Polyphenylene Sulfide (PPS), 40% glass-
filled
Terminal Guide Liquid Crystal Polymer
Backplane Insulator Polyester, 30% glass-filled (UL 94V-0)
Polarizing Keys and Bushings Stainless Steel, Passivated
Guide Pin Adhesive 3M Scotch-Weld, DP-190 (gray)
Temperature Range -65°C to +125°C
Current Rating
(individual contact)
3 Amps DC at 25°C
Current Rating
(multiple contacts)
1 Amp DC at °C
Dielectric Withstanding
Voltage (DWV)
600 V (RMS) at 60 Hz
Insulation Resistance (min.) 10,000 MΩ
Contact Resistance (max.) 30 MΩ
Contact-to-Backplane
Retention Force (min.)
3.0 lbs.
Contact Life (durability) 500 cycles
Contact Engagement Force 2.25 oz max. average
Contact Normal Force 1.0 N (3.53 oz-f) average
Contact Wipe Length (min.) 0.053 in.
Salt Fog MIL-STD-810 Method 509, Procedure 1
Thermal Shock MIL-STD-202 Method 107, Test Condition B
Humidity MIL-STD-1344 Method 1002
Physical Shock MIL-STD-202 Method 213, Test Condition C
Resistance to Solder Heat EIA-364-56 Procedures 3 & 4
Vibration (sinusoidal) MIL-DTL-202 Method 204, Test Condition G
Vibration (random) MIL-DTL-202 Method 214, Test Condition I, Letter E
UHD TECHNICAL REFERENCES
10. Daughtercard
Connector
No. Contacts Mating
Backplane
Connector Kit
M1050-00639 232 552-2595-000
M1050-00640 300 552-2596-000
M1050-00641 372 552-2597-000
M1050-00642 556 552-2598-000
.684
.610
5.355
5.195
3X .160
300X .010
4X TIE BAR
3X CENTER CORE
MOUNTING HOLES
6X COVER
ATTACHMENT HOLES
2.735
2.598
.200 TYP
M1050-00640
M1050-00641
.100 TYP
3X .390
3X .180
INTERFACE PLANE
F/O MATING PLANE
300X .00720
AMPHENOL M1050-XXXXX
4.380
.106
5.150
5.36
.200 TYP
2.735
5.355
5.195
2.598
.100 TYP
3X .160 4X TIE BAR
.080
.080
372X
3X CENTER CORE
MOUNTING HOLES
6X COVER
ATTACHMENT HOLES
3X .390
INTERFACE PLANE
372X .0360
AMPHENOL M1050-XXXXX
3X .180
46X (.050) (=2.30)
2 PLACES
M1050-00642
3X .165
3X .390
556X .0360
4X TIE BARS
4.000
7.625
5.150
5.36
.200 TYP
.100 TYP
556X .010
3X (.086-56 THREADED INSERT)
INSTALL FROM FAR SIDE
MARK PIN NUMBERS
APPROX WHERE SHOWN
3.812
.44
.083
3.755
7.510
7.724
Z
Z
552-2598-000
552-2596-000
552-2597-000
.684
.610
5.355
5.195
3X .160
300X .010
4X TIE BAR
3X CENTER CORE
MOUNTING HOLES
6X COVER
ATTACHMENT HOLES
2.735
2.598
.200 TYP
M1050-00640
M1050-00641
.100 TYP
3X .390
3X .180
INTERFACE PLANE
F/O MATING PLANE
300X .00720
AMPHENOL M1050-XXXXX
4.380
.106
5.150
5.36
.200 TYP
2.735
5.355
5.195
2.598
.100 TYP
3X .160 4X TIE BAR
.080
.080
372X
3X CENTER CORE
MOUNTING HOLES
6X COVER
ATTACHMENT HOLES
3X .390
INTERFACE PLANE
372X .0360
AMPHENOL M1050-XXXXX
3X .180
46X (.050) (=2.30)
2 PLACES
M1050-00642
3X .165
3X .390
556X .0360
4X TIE BARS
4.000
7.625
5.150
5.36
.200 TYP
.100 TYP
556X .010
3X (.086-56 THREADED INSERT)
INSTALL FROM FAR SIDE
MARK PIN NUMBERS
APPROX WHERE SHOWN
3.812
.44
.083
3.755
7.510
7.724
Z
Z
552-2598-000
552-2596-000
552-2597-000
.684
.610
5.355
5.195
3X .160
300X .010
4X TIE BAR
3X CENTER CORE
MOUNTING HOLES
6X COVER
ATTACHMENT HOLES
2.735
2.598
.200 TYP
M1050-00640
M1050-00641
.100 TYP
3X .390
3X .180
INTERFACE PLANE
F/O MATING PLANE
300X .00720
AMPHENOL M1050-XXXXX
4.380
.106
5.150
5.36
.200 TYP
2.735
5.355
5.195
2.598
.100 TYP
3X .160 4X TIE BAR
.080
.080
372X
3X CENTER CORE
MOUNTING HOLES
6X COVER
ATTACHMENT HOLES
3X .390
INTERFACE PLANE
372X .0360
AMPHENOL M1050-XXXXX
3X .180
46X (.050) (=2.30)
2 PLACES
M1050-00642
3X .165
3X .390
556X .0360
4X TIE BARS
4.000
7.625
5.150
5.36
.200 TYP
.100 TYP
556X .010
3X (.086-56 THREADED INSERT)
INSTALL FROM FAR SIDE
MARK PIN NUMBERS
APPROX WHERE SHOWN
3.812
.44
.083
3.755
7.510
7.724
Z
Z
552-2598-000
552-2596-000
552-2597-000
2X .390
3.355
2X CENTER CORE
MOUNTING HOLES
4X COVER
ATTACHMENT HOLES
(SHOWN INSTALLED IN PCB)
ROTATED 90° CW
SECTION Y-Y
1.438
7X .050 (=.875)
232X .045
.538
.500
.565
.471
(.08)
1.250
.070
.100
.500
.683
.425
.103
INTERFACE PLANE
.68
.480
3.195
2X .180
232X .036
INTERFACE PLANE
.160
(3.362)
3.150
ALPHA END BETA END
.600
.045
.025
(.400)
2 PLACES
VIEW FROM TOP SIDE OF CONNECTOR
CONNECTOR PIN ASSIGNMENTS
57X (.050) (=2.850)
BOARD SHOWN
FOR ILLUSTRATION
M1050-00639
552-2595-000
Z
Z
SECTION Z-Z
232X .010
2X CENTER CORE
MOUNTING HOLES
4X COVER
ATTACHMENT HOLES
(SHOWN INSTALLED IN PCB)
ROTATED 90° CW
SECTION Y-Y
1.438
7X .050 (=.875)
232X .045
.538
.500
.565
.471
(.08)
1.250
.070
.100
.500
.683
.425
.103
INTERFACE PLANE
.68
.480
BETA END
.600
.045
.025
(.400)
SECTION Z-Z
10
UHD DAUGHTERCARD
11. UHD BACKPLANE CONNECTOR KITS
Backplane
Connector Kit
No. Contacts Mating
Daughtercard
Connector
552-2595-000 232 M1050-00639
552-2596-000 300 M1050-00640
552-2597-000 372 M1050-00641
552-2598-000 556 M1050-00642
(SHOWN INSTALLED IN PCB)
ROTATED 90° CW
SECTION Y-Y
1.438
7X .050 (=.875)
232X .045
.538
.500
.683
.425
.480
(3.362)
3.150
ALPHA END BETA END
.600
.045
.025
(.400)
2 PLACES
VIEW FROM TOP SIDE OF CONNECTOR
CONNECTOR PIN ASSIGNMENTS
57X (.050) (=2.850)
BOARD SHOWN
FOR ILLUSTRATION
552-2595-000
2X CENTER CORE
MOUNTING HOLES
4X COVER
ATTACHMENT HOLES
(SHOWN INSTALLED IN PCB)
ROTATED 90° CW
SECTION Y-Y
1.438
7X .050 (=.875)
232X .045
.538
.500
.565
.471
(.08)
1.250
.070
.100
.500
.683
.425
.103
INTERFACE PLANE
.68
.480
A END
.600
.045
.025
(.400)
SECTION Z-Z
.684
.610
3X .160
300X .010
4X TIE BAR
3X CENTER CORE
MOUNTING HOLES
6X COVER
ATTACHMENT HOLES
2.735
2.598
.200 TYP
M1050-00641
.100 TYP
3X .390
3X .180
INTERFACE PLANE
F/O MATING PLANE
300X .00720
AMPHENOL M1050-XXXXX
4.380
.106
5.150
5.36
.200 TYP
2.735
5.355
5.195
2.598
.100 TYP
3X .160 4X TIE BAR
INTERF
.080
.080
372X
3X CENTER CORE
MOUNTING HOLES
6X COVER
ATTACHMENT HOLES
3X .390
INTERFACE PLANE
372X .0360
AMPHENOL M1050-XXXXX
3X .180
46X (.050) (=2.30)
2 PLACES
M1050-00642
3X .165
3X .390
556X .0360
4X TIE BARS
4.000
7.625
5.150
5.36
.200 TYP
.100 TYP
556X .010
3X (.086-56 THREADED INSERT)
INSTALL FROM FAR SIDE
ALPH
MARK PIN NUMBERS
APPROX WHERE SHOWN
3.812
.44
.083
3.755
7.510
7.724
Z
Z
552-2598-000
552-2596-000
552-2597-000
M1050-00641
.106
5.150
5.36
.200 TYP
2.735
5.355
5.195
2.598
.100 TYP
3X .160 4X TIE BAR
.080 372X
3X CENTER CORE
MOUNTING HOLES
6X COVER
ATTACHMENT HOLES
3X .390
INTERFACE PLANE
372X .0360
AMPHENOL M1050-XXXXX
3X .180
46X (.050) (=2.30)
2 PLACES
M1050-00642
3X .165
3X .390
556X .0360
4X TIE BARS
4.000
7.625
5.150
5.36
.200 TYP
.100 TYP
556X .010
3X (.086-56 THREADED INSERT)
INSTALL FROM FAR SIDE
MARK PIN NUMBERS
APPROX WHERE SHOWN
3.812
.44
.083
3.755
7.510
7.724
Z
Z
552-2598-000
552-2597-000
.200 TYP
2.735
2.598
.100 TYP
3X .160 4X TIE BAR
.080 372X
3X CENTER CORE
MOUNTING HOLES
6X COVER
ATTACHMENT HOLES
3X .390
INTERFACE PLANE
372X .0360
AMPHENOL M1050-XXXXX
3X .180
M1050-00642
3X .165
3X .390
556X .0360
4X TIE BARS
4.000
7.625
5.150
5.36
.200 TYP
.100 TYP
556X .010
3X (.086-56 THREADED INSERT)
INSTALL FROM FAR SIDE
MARK PIN NUMBERS
APPROX WHERE SHOWN
3.812
.44
.083
3.755
7.510
7.724
Z
Z
552-2598-000
552-2597-000
