Cheryl Tulkoff

cheryl tulkoff electronics reliability reliability pcb printed circuit board wearable electronics smta pb-free flexure dfr solutions immersion oil sherlock ada wearable reliability smtai glass style copper dissolution thermal cycling coefficient of thermal expansion immersion oil cooling data center physics of failure ecm electrochemical migration nanocoating cheryl tulkoff. asq reliability division wearable technology server innovation uv exposure wearable medical wearable tech use environment design for manufacturing flexure warpage. cte qfn rohs sac sac305 vibration lead free shock ipc-tr-579 pof reliability prediction tg cte btc ict ipc 9704 immersion technology liquid immersion cooling reliability modeling failure analysis printed board corrosion hydrophobicity medical electronics counterfeit electronics risk electronics quality risk management privacy medical apps healthcare ehealth healthcare apps security ehealth apps fitness tracker mobile health health tracker health app digital health advocate innovate selling ideas john daly advocacy ctea central texas electronics association sweat liquid flux cored solder wire surface finish manual soldering hand cleaning sir hand soldering surface insulation resistance standoff height mcc mlp son mlf lga ipc-7093 bottom termination component modulus of elasticity thermo-mechanical reliability fatigue temperature cycling market validation brett cornwell innovation commercialization rob adams asq innovation conference mstc electronic medical devices degradation capacitance delamination moisture sensitivity pb-free reflow moisture absorption process audit fabrication supply chain frequency observability severity detectability rpn risk priority number failure modes and effects analysis fmea asq failure inducing loads test plan development wicking drilling silane conductive anodic filament caf mixed soldering ipc soldering dfm compressive stress whisker whisker mitigation tin whisker fr-4 ipc-dr-579 ptv plated through via pth. plated through hole potting coating mixed assembly lead-free sac405 creep ada randy schueller automated design analysis nate blattau underfill low-k dielectric pop tmv package on package semi sae as5553 ndaa idea iacc gidep erai counterfeit anti-counterfeit counterfeit detection counterfeit prevention medical device regulation fda medical devices mttf. mtbf mil-hdbk-217 jim lance telcordia sr-332 ipc-hdbk-830 j-std-001 ipc2221 silicone urethane epoxy acrylic glass transition temperature conformal coating laminate cracking trace fracture strain bga pad cratering charged device model charged board event human body model hbm cbe cbm electrical overstress cdm ted dangelmayer dangelmayer associates esd electrostatic discharge eol in circuit test acoustic emissions ipc 9702 ipc 9708 strain gage test hot bump pull cold bump pull transient bending pad crater design failure mode and effects analysis dfmea oil cooling dielectric oil atomic layer deposition multi layer barrier films ald lotus leaf hydrophobic hermiticity accelerated testing auto reliability step stress root cause analysis highly accelerated reliability test reliability test halt pb-free hasl electroless palladium enig enepig immersion silver osp cleaning processes cleanliness dendritic growth dendrites contamination super hydrophobic coating medical device component storage long term storage obsolescence die banking non-functional pads non functional pads nfp