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© 2014 IBM Corporation
IBM Power Systems
Power Systems Hardware:
Today and Tomorrow
Jan, 2015
Mark Olson
olsonm@us.ibm.com
© 2014 IBM Corporation
IBM Power Systems
2
Processor Technology Roadmap
POWER8
22 nm
POWER5
130 nm
POWER6
65 nm
POWER7
45 nm
POWER10
Or whatever it is
named
2004 2007 2010
Starting
2014
Future
POWER9
Or whatever it is
named
© 2014 IBM Corporation
IBM Power Systems
3
Processor Chip Comparisons
POWER5
2004
POWER6
2007
POWER7
2010
POWER7+
2012
130nm SOI 65nm SOI
45nm SOI
eDRAM
32nm SOI
eDRAM
2
SMT2
2
SMT2
8
SMT4
8
SMT4
1.9MB (L2)
36MB (L3)
8MB (L2)
32MB (L3)
2 + 32MB (L2+3)
None
2 + 80MB (L2+3)
None
15GB/s
6GB/s
30GB/s
20GB/s
100GB/s
40GB/s
100GB/s
40GB/s
Technology
Compute
Cores
Threads
Caching
On-chip
Off-chip
Bandwidth
Sust. Mem.
Peak I/O
POWER8
22nm SOI
eDRAM
12
SMT8
6 + 96MB (L2+3)
128MB (L4)
230GB/s
96GB/s
© 2014 IBM Corporation
IBM Power Systems
5
Innovation Drives Performance
0%
20%
40%
60%
80%
100%
180 nm 130 nm 90 nm 65 nm 45 nm 32 nm 22 nm
Gain by Technology Scaling Gain by Innovation
Relative %
of Improvement
IBM plans for future 22 nm technology are subject to change.
© 2014 IBM Corporation
IBM Power Systems
6
POWER8 Chip Packaging
Bus Interfaces
• Integrated PCIe Gen3
• SMP Interconnect
• CAPI
Accelerators
• Crypto & memory expansion
• Transactional Memory
• Data Move / VM Mobility
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
L3 Cache & Chip Interconnect
8M L3
Region
Mem. Ctrl.Mem. Ctrl.
SMPLinks
Accelerators
SMPLinks
PCIe
Caches
• 64K Data cache (L1)
• 512 KB SRAM L2 / core
• 96 MB eDRAM shared L3
• Up to 128 MB eDRAM L4 (off-chip)
Cores
• 12 cores (SMT8)
• 8 dispatch, 10 issue, 16 exec pipe
• 2X internal data flows/queues
• Enhanced prefetching
Memory
• Dual memory Controllers
• 230 GB/sec Sustained bandwidth
Energy Management
• On-chip Power Management Micro-controller
• Integrated Per-core VRM
• Critical Path Monitors
Technology
• 22nm SOI, eDRAM, 650mm2
• 15-layers = great bandwidth
© 2014 IBM Corporation
IBM Power Systems
7
Memory
Buffer
DRAM
Chips
Intelligence Moved into Memory
• Previously on POWER7+ chip onto buffer
Processor Interface
• High speed interface
Performance Value
POWER8 Memory Buffer Chip
“L4 cache”
© 2014 IBM Corporation
IBM Power Systems
8
Memory Bandwidth per Socket
0 10 20 30 40 50 60 70
POWER5
POWER6
POWER7
POWER8
GB/Sec
© 2014 IBM Corporation
IBM Power Systems
9
Memory Bandwidth per Socket
0 50 100 150 200
POWER5
POWER6
POWER7
POWER8
GB/Sec
Reset the scale
© 2014 IBM Corporation
IBM Power Systems
10
POWER8 Memory Bandwidth per Socket
0 50 100 150 200 250
POWER5
POWER6
POWER7
POWER8
GB/Sec
© 2014 IBM Corporation
IBM Power Systems
11
POWER7
Chip
I/O
Bridge
GX
Bus
PCIe Gen2
PCI
Devices
PCIe Gen3
PCI
Device
POWER8
Chip
POWER8 Integrated PCI Gen 3
© 2014 IBM Corporation
IBM Power Systems
15
IO Bandwidth Comparing 2-Socket Servers
0 10 20 30 40 50 60
POWER6
POWER7
POWER7+
GB/Sec
© 2014 IBM Corporation
IBM Power Systems
16
IO Bandwidth Comparing 2-Socket Servers
0 50 100 150 200
POWER6
POWER7
POWER7+
POWER8
GB/Sec
Reset the scale
© 2014 IBM Corporation
IBM Power Systems
17
POWER8 IO Bandwidth Comparing 2-Socket Servers
0 50 100 150 200
POWER6
POWER7
POWER7+
POWER8
GB/Sec
© 2014 IBM Corporation
IBM Power Systems
18
POWER8
Coherence Bus
FPGA or ASIC
Customizable Hardware / Application Accelerator
• Specific system SW, middleware, or user application
• Written to durable interface
POWER8
PCIe Gen3
Transport for encapsulated messages
POWER8 CAPI (Coherent Accelerator Processor Interface)
Like an “extra” core for
the POWER8 chip
© 2014 IBM Corporation
IBM Power Systems
19
Example: CAPI Attached Flash Optimization
Pin buffers,
Translate,
Map DMA,
Start I/O
Application
LVM
Disk & Adapter DD
Read/Write
Syscall
strategy() iodone()
FileSystem
strategy() iodone()
Interrupt,
unmap,
unpin,Iodone
scheduling
20K
Instructions
© 2014 IBM Corporation
IBM Power Systems
20
Example: CAPI Attached Flash Optimization
 Issues Read/Write Commands from applications to eliminate 97% of
instruction path length CAPI Flash controller Operates in User Space
 Saves 10 Cores per 1M IOPs
Pin buffers,
Translate,
Map DMA,
Start I/O
Application
LVM
Disk & Adapter DD
Read/Write
Syscall
strategy() iodone()
FileSystem
strategy() iodone()
Interrupt,
unmap,
unpin,Iodone
scheduling
< 500
Instructions
Application
Posix Async
I/O Style API
User Library
Shared
Memory
Work Queue
aio_read()
aio_write()
20K
Instructions
Attach flash memory to POWER8
via CAPI coherent Attach
© 2014 IBM Corporation
IBM Power Systems
21
POWER8 Leapfrogs
0 50 100 150 200
POWER5
POWER6
POWER7
POWER8
PCIe Gen3
0 50 100 150 200
POWER6
POWER7
POWER7+
POWER8
Memory Bandwidth I/O Bandwidth
PCIe Gen3
PCI
Device
POWER8
POWER7
I/O
Bridge
GX
Bus
PCIe Gen2
PCI
Devices
PLUS ….
CAPI
Accelerators
Transactional Memory
Scaleability
Smart use of energy
… and more
© 2014 IBM Corporation
IBM Power Systems
22
Scale-out CPW Comparisons
S824 (1 or 2 socket)
– 6-core 3.8 GHz 72,000
– 12-core 3.8 GHz 130,000
– 8-core 4.1 GHz 94,500
– 16-core 4.1 GHz 173,500
– 12-core 1-socket not offered
– 24-core 3.5 GHz 230,500
S814 (1 socket)
– 4-core 3.0 GHz 39,500
– 6-core 3.0 GHz 59,500
– 8-core 3.7 GHz 85,500
740 POWER7+ (1 or 2 socket)
– 6-core 4.2 GHz 49,000
– 12-core 4.2 GHz 91,700
– 8-core 3.6 GHz 56,300
– 16-core 3.6 GHz 106,500
– 8-core 4.2 GHz 64,500
– 16-core 4.2 GHz 120,000
720 POWER7+ (1 socket)
– 4-core 3.6 GHz 28,400
– 6-core 3.6 GHz 42,400
– 8-core 3.6 GHz 56,300
+50% ~ GHz
+40%
+40%
+60%
+90%
© 2014 IBM Corporation
IBM Power Systems
23
CPW
E880
– 32-core 4.35 GHz 381,000
– 64-core 4.35 GHz 755,000
– 96-core 4.35 GHz 1,114,000** (2015)
– 128-core 4.35 GHz 1,495,000** (2015)
E870
– 32-core 4.02 GHz 359,000
– 64-core 4.02 GHz 711,000
– 40-core 4.19 GHz 460,000
– 80-core 4.19 GHz 911,000 Measured using
SMT8
SMT4 would be
somewhat lower
* planned to be published closer to their GA date. Early estimates can
be provided under nondisclosure agreements if needed
** estimated value, not measured
© 2014 IBM Corporation
IBM Power Systems
24
Performance per Core Moves Up with POWER8
24
595
5GHz
770
3.5GHz
780
4.14GHz
TurboCore
rPerf performance estimate for fully configured systems divided by number of cores
795
4.25GHz
TurboCore
770
4.2GHz
780
4.4GHz
E870
4.19GHz
E880
4.35GHz
…up to 1.5X over POWER7+
up to 2X over POWER7
up to 2.5X over fastest POWER6
rPerfPer-core(CPWsamestory)
© 2014 IBM Corporation
IBM Power Systems
25
SAP SD Standard Application Benchmark Results, 2-Tier: SD Benchmark Users
SAP enhancement package 5 for SAP ERP 6.0
Source: http//www.sap.com/solutions/benchmark/sd2tier.epx
Fujitsu PQ 2800E
Intel E7-8890 v2,
120c/240t
Power E870 outperforms all other 8-socket systems
(best Intel Xeon and best Oracle SPARC)
1.6X more users than Ivybridge-EX v2
Nearly 2X more users than Oracle T5-8
with 1/3 less cores!
Oracle T5-8
T5, 128c/1024t
IBM x3950 X6
Intel E7-8890 v2
120c/240t
IBM Power 780
POWER7+
96c/384t
IBM Power E870
POWER8
80c/640t
128c
120c 120c
96c
80c
(1) IBM Power System E870 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 80 cores / 640 threads, POWER8; 4.19GHz, 2048GB memory, 79,750 SD benchmark users, running AIX® 7.1 and DB2® 10.5, dialog
response: 0.97 seconds, line items/hour:8,722,000, dialog steps/hour: 26,166,000 SAPS: 436,100 database response time (dialog/update): 0.013 sec / 0.026 sec, CPU utilization: 99%, Certification #: 2014033 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark.
(2) IBM Power System 780 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 96 cores / 384 threads, POWER7+; 3.72GHz, 1536GB memory, 57024 SD benchmark users, running AIX® 7.1 and DB2® 10, dialog
response: 0.98 seconds, line items/hour: 6,234,330, dialog steps/hour: 18,703,000 SAPS: 311,720 database response time (dialog/update): 0.009 sec / 0.014 sec, CPU utilization: 99%, Certification #: 2014024 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark.
(3) IBM System x3950 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 120 cores / 240 threads, Intel Xeon Processor E7-8890 v2; 2.80GHz, 1024GB memory, 49,000 SD benchmark users, running Windows
Server 2012 Standard Edition and DB2® 10, dialog response: 0.85 seconds, line items/hour: 5,421,670, dialog steps/hour: 16,265,000 SAPS: 271,080; database response time (dialog/update): 0.0083 sec / 0.022 sec, CPU utilization: 98%, Certification #: 2014024 Results valid as of 10/3/14. Source:
http://www.sap.com/benchmark.
(4) Fujitsu PRIMEQUEST 2800E on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 120 cores / 240 threads, Intel Xeon Processor E7-8890 v2; 2.80GHz, 1024GB memory, 49,000 SD benchmark users, running
Windows Server 2012 Standard Edition and SQL Server 12, dialog response: 0.97 seconds, line items/hour: 5,193,670, dialog steps/hour: 15,581,000 SAPS: 259,680; database response time (dialog/update): 0.015 sec / 0.030 sec, CPU utilization: 99%, Certification #: 2014003 Results valid as of
10/3/14. Source: http://www.sap.com/benchmark.
(5) (5) Oracle SPARC Server T5-8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors/128 cores/1024 threads, SPARC T5; 3.60 GHz, 2,048 GB memory; 40,000 SD benchmark users, running Solaris® 11 and
Oracle 11g; Certification # 2012013008. Results valid as of 10/3/14. Source: http://www.sap.com/benchmark.
SAP and all SAP logos are trademarks or registered trademarks of SAP AG in Germany and in several other countries. All other product and service names mentioned are the trademarks of their respective companies.
© 2014 IBM Corporation
IBM Power Systems
26
Over twice the ERP users per core with Power E870/E880 than the
best Intel Xeon and best Oracle SPARC results
Nearly 1000 Users per Core with POWER8 based E870
26
SDBenchmarkUsersperCore
SAP SD Standard Application Benchmark Results, 2-Tier: SD Benchmark Users per Core
SAP enhancement package 5 for SAP ERP 6.0 As of April 28, 2014
Source: http//www.sap.com/solutions/benchmark/sd2tier.epx
IBM E870
POWER8
80c/640t
Oracle M5-32
M5
192c/1536t
HP DL580
E7-4890 v2
60c/120t
Oracle T5-8
T5
128c/1024t
(1) IBM Power System E870 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 80 cores / 640 threads, POWER8; 4.19GHz, 2048GB memory, 79,750 SD benchmark users, running AIX® 7.1 and DB2® 10.5, dialog
response: 0.97 seconds, line items/hour:8,722,000, dialog steps/hour: 26,166,000 SAPS: 436,100 database response time (dialog/update): 0.013 sec / 0.026 sec, CPU utilization: 99%, Certification #: 2014033 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark.
(2) HP ProLiant DL380 Gen9, on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors/36 cores/72 threads, Intel Xeon Processor 2699v3; 2.30 GHz, 256 GB memory; 16,101 SD benchmark users, running RHEL 6.5 and SAP
ASE; Certification # 2014032. Results valid as of September 8, 2014. Source: http://www.sap.com/benchmark.
(3) Oracle SPARC Server M5-32 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 32 processors/192 cores/1536 threads, SPARC M5; 3.60 GHz, 4,096 GB memory; 85,050 SD benchmark users, running Solaris® 11 and Oracle
11g; Certification # 2012013009. Results valid as of April 28, 2014. Source: http://www.sap.com/benchmark.
(4) HP ProLiant DL580 Gen8on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 4 processors/60 cores/120 threads, Intel Xeon Processor 4890 v2; 2.80 GHz, 1024 GB memory; 24,450 SD benchmark users, running Windows Server
2012 Standard Edition and SQL Server 2012; Certification # 2043004. Results valid as of April 28, 2014. Source: http://www.sap.com/benchmark.
(5) Oracle SPARC Server T5-8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors/128 cores/1024 threads, SPARC T5; 3.60 GHz, 2,048 GB memory; 40,000 SD benchmark users, running Solaris® 11 and Oracle 11g;
Certification # 2012013008. Results valid as of April 28, 2014. Source: http://www.sap.com/benchmark.
SAP and all SAP logos are trademarks or registered trademarks of SAP AG in Germany and in several other countries. All other product and service names mentioned are the trademarks of their respective companies.
HP DL 380p
E5-2699 v3
36c/72t
2.2Xmore users per core than
the best competitors!
© 2014 IBM Corporation
IBM Power Systems
27
SAP Sales & Distribution 2-Tier ERP 6 Benchmarks
IBM Power System S824 using DB2 10.5 vs. Competition
Over 2 times better 24 core performance than nearest Intel competitive
results
Up to 2 times greater performance than previous Power generation
Cisco UCS
C240 M3
Fujitsu
RX300 S8
HP ProLiant
BL460c
IBM Power
S824
IBM Power
S824
IBM
p270
IBM
p260
(1.0) IBM Power System S824 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 4 processors / 24 cores / 192 threads, POWER8;
3.52GHz, 512 GB memory, 21,212 SD benchmark users, running AIX® 7.1 and DB2® 10.5, dialog response: 0.98 seconds, line items/hour: 2,317,330, dialog steps/hour: 6.952,000 SAPS: 115,870 database
response time (dialog/update): 0.011 sec / 0.019sec, CPU utilization: 99%, Certification #: 2014016 Results valid as of 3/24/14. Source: http://www.sap.com/benchmark.
(1.1) Fujitsu RX300 S8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 24 cores / 48 threads. Intel Xeon E5-2697
processor 2.70 GHz, 256 GB memory, 10.240 SD benchmark users, running Windows Server 2012 SE and SQL Server 2012, Certification #: 2013024
(1.2) Cisco UCS c240 M3 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 24c ores / 48 threads. Intel Xeon E5-2697
processor 2.70 GHz, 256 GB memory, 10.045 SD benchmark users, running Windows Server 2012 DE and SQL Server 2012, Certification #: 2013038
(1.3) HP ProLiant BL460c Gen8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 24 cores / 48 threads. Intel Xeon E5-
2697 processor 2.70 GHz, 256 GB memory, 10.025 SD benchmark users, running Windows Server 2012 DE and SQL Server 2012, Certification #: 2013025
(2.1 IBM Flex System p270 Compute Node on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 4 processors / 24 cores / 96 threads,
POWER7+; 3.4GHz, 256 GB memory, 12.528 SD benchmark users, running AIX® 7.1 and DB2® 10 .5 Certification #: 3012019 Source: http://www.sap.com/benchmark.
(1.1)IBM Flex System p260 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 16 cores / 64 threads, POWER7+; 4.1GHz,
256 GB memory, 10,000 SD benchmark users, running AIX® 7.1 and DB2® 10, Certification #: 2012035
2Xmore users
© 2014 IBM Corporation
IBM Power Systems
28
IBM Power System S824 delivers Best of Breed
eBS 12.1.3 Payroll performance
Over 2 times more performance per-core than Cisco result
with higher overall through-put on few cores
Cisco UCS
C240 M3
24-core
Oracle
BL460c
16-core
IBM Power
S824
12-core
2X !
• All results use Oracle eBS 12.1.3 Payroll Batch Extra Large Kit and are current as of 3/24/2014.
 For more information go to http://www.oracle.com/us/solutions/benchmark/apps-benchmark/results-166922.html
Cisco UCS
C240 M3
24-core
Oracle
BL460c
16-core
IBM Power
S824
12-core
© 2014 IBM Corporation
IBM Power Systems
29
IBM Power System S824 delivers New High-water
Siebel CRM Release 8.1.1.4 performance
Over 3 times the DB performance per-core than previous results
Highest overall users supported on fewer cores!
Oracle
SPRAC T4-2
16-core
Cisco
UCS B200 M3
16-core
IBM Power
S824
6-core
3.3 X
(1) All results use Siebel 8.1.1.4 PSPP Kit and are current as of 3/24/2014. For more information go to http://www.oracle.com/us/solutions/benchmark/white-
papers/siebel-167484.html
New #1
Oracle
SPRAC T4-2
16-core
Cisco
UCS B200 M3
16-core
IBM Power
S824
6-core
© 2014 IBM Corporation
IBM Power Systems
30
“Single-thread-oriented” Workloads and POWER8 Technology
Good news
Compared to POWER7/POWER7+, POWER8 chips
with similar GHz run 20-25% faster from a wall clock
perspective …… ASSUMING NOT I/O BOUND
time
POWER7
POWER8
20-25% reduction
© 2014 IBM Corporation
IBM Power Systems
31
A New Generation of IBM Power Systems
Designed for Big Data
Superior Cloud Economics
Open Innovation Platform
Open Innovation to
put data to work
© 2014 IBM Corporation
IBM Power Systems
32
Collaborative innovation for highly advanced systems
Produce open hardware, software, firmware and tools
Expand industry skills and investment for Power
ecosystem
Provide alternative architectures
OpenPOWER Consortium
IBM
Google
NVIDIA
TYAN
Mellanox
Open
Innovation
© 2014 IBM Corporation
IBM Power Systems
33
Google® Mother Board using POWER8 Technology
Development board previewed by Google at April 2014 POWER8
announcement
© 2014 IBM Corporation
IBM Power Systems
34
Building collaboration and innovation at all levels
Boards / Systems
I/O / Storage / Acceleration
Chip / SOC
System / Software / Services
Implementation / HPC / Research
Complete member list at
www.openpowerfoundation.org
© 2014 IBM Corporation
IBM Power Systems
35
Power
770+
Power
780+
Power
750+ / 760+
Power
710+/730+
Power
720+/740+
P460+
1Q 2014 Portfolio: POWER7/POWER7+
IBM PureFlex
System
p260+
p24L
PowerLinux
7R4+
PowerLinux
7R1+ / 7R2+
Power
795
© 2014 IBM Corporation
IBM Power Systems
36
Power
770+
Power
780+
Power
750+ / 760+
Power
710+/730+
Power
720+/740+
P460+
2Q 2014 Portfolio: POWER8/POWER7/POWER7+
IBM PureFlex
System
p260+
p24L
PowerLinux
7R4+
PowerLinux
7R1+ / 7R2+
Power
795
© 2014 IBM Corporation
IBM Power Systems
37
Power
770+
Power
780+
Power
750+ / 760+
Power
710+/730+
Power
720+/740+
P460+
4Q 2014 Portfolio: POWER8/POWER7/POWER7+
IBM PureFlex
System
p260+
p24L
PowerLinux
7R4+
PowerLinux
7R1+ / 7R2+
Power
795
© 2014 IBM Corporation
IBM Power Systems
38
Scale-out
© 2014 IBM Corporation
IBM Power Systems
39
Scale-out Servers (with POWER8 technology)
S824 (2 socket, 4U)
S814 (1 socket, 4U)
S822 (2 socket, 2U)
S812L (1 socket, 2U) Linux-only
S822L (2 socket, 2U) Linux-only
S824L not shown – Linux Ubuntu only for GPU currently
© 2014 IBM Corporation
IBM Power Systems
40
Scale-out Servers (with IBM i or AIX or Linux support)
S814 (1 socket, 4U)
– 6 or 8 core (P10 IBM i software tier)
– 4 core (P05 IBM i software tier)
S824 (2 socket, 4U)
– 6/12 or 8/16 or 24 core
– P20 IBM i software tier
© 2014 IBM Corporation
IBM Power Systems
41
POWER8 1S4U Scale-out System
Power S814
 Form Factor: 4U or Tower
 Single Socket
 Cores: 4 (3.0 GHz), 6 (3.0 GHz) or 8 (3.7 GHz)
 Memory: Up to 512 GB
 Slots: 7 PCIe Gen3 Full-high (Hotplug)
 Ethernet: Quad 1 Gbt in PCIe slot
 Integrated ports: USB (4/5), Serial (1), HMC (2)
 Internal Storage
 DVD
 12 SFF Bays -- Split Backplane: 6 + 6
 or 18 SFF Bays with 7GB write cache
 Hypervisor: PowerVM
 OS: AIX, IBM i 7.1 or later (P10 software tier), Linux
3 Yr Warranty
© 2014 IBM Corporation
IBM Power Systems
42
POWER8 2S4U Scale-out System
Power S824
 Single Socket populated
 Cores: 6 (3.8 GHz) or 8 (4.1 GHz)
 Memory: Up to 512 GB (Up to 1TB Nov annc)
 Slots: 7 PCIe Gen3 full-high (Hotplug)
 Both Sockets populated
 Cores: 12 (3.8 GHz), 16 (4.1 GHz), or 24 (3.5 GHz)
 Memory: Up to 1 TB (Up to 2TB Nov annc)
 Slots: 11 PCIe Gen3 full-high (Hotplug)
 Ethernet: Quad 1 Gbt in PCIe slot
 Integrated ports: USB (4/5), Serial (1), HMC (2)
 Internal Storage
 DVD
 12 SFF Bays -- Split Backplane: 6 + 6
 or 18 SFF bays & 8 SSD bays with 7GB write cache
 Hypervisor: PowerVM
 OS: AIX, IBM i 7.1 or later (P20 software tier), Linux
3 Yr Warranty
© 2014 IBM Corporation
IBM Power Systems
45
Enterprise
© 2014 IBM Corporation
IBM Power Systems
46
No Primary Node
Midplane
 Service Processors
 Clocks
 Oscillators
Large Memory
19” Rack
Modular design
Up to 4 CEC drawers
Blindswap IO Adapters
POWER8 Enterprise Solutions
Midplan
e
© 2014 IBM Corporation
IBM Power Systems
48
Power E880: 1, 2, 3 or 4 Nodes
Node
Node
Node
Node
MidPlane
22U in 19” rack
3- and 4-node configurations planned availability June 2015
© 2014 IBM Corporation
IBM Power Systems
49
Power E870: 1 or 2 Nodes
Node
Node
MidPlane
12U in 19” rack
© 2014 IBM Corporation
IBM Power Systems
50
Power Scale Perspective
Power 770
Power 780 Power 795
50
© 2014 IBM Corporation
IBM Power Systems
51
Power E870 & E880 servers
• 8 to 128 cores @ 4.35 GHz
• Up to 192 cores* in 2015
• 256 to 16TB Memory
• 1 to 4 nodes
• Built-in initial Elastic CoD days
*Statement of Direction to support up to 8TB memory on E870 and up to 4 PCIe I/O Expansion Drawers per node on Power E870 & E880 in 2015.
Initial GA in 4Q14 supports 4TB maximum on E870 and 0 or 2 PCIe I/O drawers per node on E870 & E880.
 Increased performance and scale
 Built-in PowerVM Enterprise Edition
 Enterprise RAS
 Active Memory Mirroring for Hypervisor
 More performance per-watt
 Capacity on Demand
 Share resources in Power Enterprise
Pool
 Medium Software tier
 24x7 Warranty
Power E880Power E870
• 8 to 80 cores @ 4.19 GHz
• 8 to 64 cores @ 4.0 GHz
• 256 to 4TB Memory (8TB SOD*)
• 1 or 2 nodes
© 2014 IBM Corporation
IBM Power Systems
52
POWER8 E870 Compares: 2-Node/Drawer System
9117-MMD
Power 770
POWER8 Enterprise
2 CEC Node-
drawer
CPU Sockets per Node/Drawer 4 4
Max processor nodes/Drawers 4 2
Max number sockets 16 8
Max Cores 64 64 or 80
Max Frequency 3.8 GHz 4 or 4.19GHz
Max Memory 1 TB per CEC Drw 2 TB per CEC Drw
Memory per core 64 GB 62 or 50 GB
Memory Bandwidth (peak)
272 GB/s per CEC
Drw
922 GB/s per CEC
Drw
I/O Bandwidth (peak)
80 GB/s per CEC
Drw (GX)
256 GB/s per CEC
Drw (PCIe Gen3)
Max PCIe I/O drws 16 (4 per Node) 4 (2 per Node)
Max PCIe I/O Slots
160 - in IO drws
24 - internal
48 in IO drws
8 - internal
IBM i levels supported IBM i 6.1 and later IBM i 7.1 and later
2014 & currently
© 2014 IBM Corporation
IBM Power Systems
53
POWER8 E870 Compares: 2-Node/Drawer System
9117-MMD
Power 770
POWER8 Enterprise
2 CEC Node-
drawer
CPU Sockets per Node/Drawer 4 4
Max processor nodes/Drawers 4 2
Max number sockets 16 8
Max Cores 64 64 or 80
Max Frequency 3.8 GHz 4 or 4.19 GHz
Max Memory 1 TB per CEC Drw 4 TB per CEC Drw
Memory per core 64 GB 62 or 50 GB
Memory Bandwidth (peak)
272 GB/s per CEC
Drw
922 GB/s per CEC
Drw
I/O Bandwidth (peak)
80 GB/s per CEC
Drw (GX)
256 GB/s per CEC
Drw (PCIe Gen3)
Max PCIe I/O drws 16 (4 per Node) 8 (4 per Node)
Max PCIe I/O Slots
160 - in IO drws
24 - internal
96 – in IO drws
0 - internal
IBM i levels supported IBM i 6.1 and later IBM i 7.1 and later
Planned
SOD *
SOD *
* SOD = statement of direction – represents IBM plans shared publically. As always plans subject to change.
© 2014 IBM Corporation
IBM Power Systems
56
PCIe I/O
Drawer
© 2014 IBM Corporation
IBM Power Systems
57
 4U in standard 19” rack
 PCIe Gen3 x8 or x16 slots
– Full-High, Full-Length slots
 PCIe x16 Gen3 cable connection to POWER8 CEC
 Dual fiber optic cables
POWER8 PCIe Gen3 IO Drawer
Today for Power E870 and E880
SOD for Scale-out
© 2014 IBM Corporation
IBM Power Systems
58
IO Bandwidth (Comparing I/O Drawers)
0 10 2 0 3 0 4 0 5 0 6 0 7 0
#5877
#EMX0
Total drawer GB/Sec
One PCIe Gen3 Drawer (12 PCIe slots)
10 or 20 slots
POWER8 PCIe-attached Gen3 I/O drawer has two fan-out modules and each fan-out module has 32GB/s
POWER7 12X-attached PCIe I/O drawer = #5877 or #5802
One or two #5877 or #5802 can share a single GX++ slot’s 20GB/s bandwidth
POWER8
POWER7+
© 2014 IBM Corporation
IBM Power Systems
61
DAS or SAN ?
 Both options are strategic
 Both options have their strengths
 Can use both options on the same server
 Application independent
–Ignoring operational options
Power System
running IBM i
DAS
Direct Attached Storage
(“internal”)
SAN
Storage Area Network
(“external”)
© 2014 IBM Corporation
IBM Power Systems
Power Hardware Update
Mark Olson
olsonm@us.ibm.com
© 2014 IBM Corporation
IBM Power Systems
63
This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in
other countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM
offerings available in your area.
Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions
on the capabilities of non-IBM products should be addressed to the suppliers of those products.
IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give
you any license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY
10504-1785 USA.
All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives
only.
The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or
guarantees either expressed or implied.
All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the
results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations
and conditions.
IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions
worldwide to qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment
type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal
without notice.
IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies.
All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary.
IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.
Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are
dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this
document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally-
available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document
should verify the applicable data for their specific environment.
Special notices
© 2014 IBM Corporation
IBM Power Systems
64
IBM, the IBM logo, ibm.com AIX, AIX (logo), AIX 6 (logo), AS/400, BladeCenter, Blue Gene, ClusterProven, DB2, ESCON, i5/OS, i5/OS (logo), IBM Business Partner
(logo), IntelliStation, LoadLeveler, Lotus, Lotus Notes, Notes, Operating System/400, OS/400, PartnerLink, PartnerWorld, PowerPC, pSeries, Rational, RISC
System/6000, RS/6000, THINK, Tivoli, Tivoli (logo), Tivoli Management Environment, WebSphere, xSeries, z/OS, zSeries, AIX 5L, Chiphopper, Chipkill, Cloudscape, DB2
Universal Database, DS4000, DS6000, DS8000, EnergyScale, Enterprise Workload Manager, General Purpose File System, , GPFS, HACMP, HACMP/6000, HASM, IBM
Systems Director Active Energy Manager, iSeries, Micro-Partitioning, POWER, PowerExecutive, PowerVM, PowerVM (logo), PowerHA, Power Architecture, Power
Everywhere, Power Family, POWER Hypervisor, Power Systems, Power Systems (logo), Power Systems Software, Power Systems Software (logo), POWER2,
POWER3, POWER4, POWER4+, POWER5, POWER5+, POWER6, POWER6+, System i, System p, System p5, System Storage, System z, Tivoli Enterprise, TME 10,
Workload Partitions Manager and X-Architecture are trademarks or registered trademarks of International Business Machines Corporation in the United States, other
countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a trademark symbol (® or ™), these symbols
indicate U.S. registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law
trademarks in other countries. A current list of IBM trademarks is available on the Web at "Copyright and trademark information" at www.ibm.com/legal/copytrade.shtml
The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org.
UNIX is a registered trademark of The Open Group in the United States, other countries or both.
Linux is a registered trademark of Linus Torvalds in the United States, other countries or both.
Microsoft, Windows and the Windows logo are registered trademarks of Microsoft Corporation in the United States, other countries or both.
Intel, Itanium, Pentium are registered trademarks and Xeon is a trademark of Intel Corporation or its subsidiaries in the United States, other countries or both.
AMD Opteron is a trademark of Advanced Micro Devices, Inc.
Java and all Java-based trademarks and logos are trademarks of Sun Microsystems, Inc. in the United States, other countries or both.
TPC-C and TPC-H are trademarks of the Transaction Performance Processing Council (TPPC).
SPECint, SPECfp, SPECjbb, SPECweb, SPECjAppServer, SPEC OMP, SPECviewperf, SPECapc, SPEChpc, SPECjvm, SPECmail, SPECimap and SPECsfs are
trademarks of the Standard Performance Evaluation Corp (SPEC).
NetBench is a registered trademark of Ziff Davis Media in the United States, other countries or both.
AltiVec is a trademark of Freescale Semiconductor, Inc.
Cell Broadband Engine is a trademark of Sony Computer Entertainment Inc.
InfiniBand, InfiniBand Trade Association and the InfiniBand design marks are trademarks and/or service marks of the InfiniBand Trade Association.
Other company, product and service names may be trademarks or service marks of others.
Special notices (cont.)

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POWER8 Power Hour with Mark Olson

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  • 11. © 2014 IBM Corporation IBM Power Systems Power Systems Hardware: Today and Tomorrow Jan, 2015 Mark Olson olsonm@us.ibm.com
  • 12. © 2014 IBM Corporation IBM Power Systems 2 Processor Technology Roadmap POWER8 22 nm POWER5 130 nm POWER6 65 nm POWER7 45 nm POWER10 Or whatever it is named 2004 2007 2010 Starting 2014 Future POWER9 Or whatever it is named
  • 13. © 2014 IBM Corporation IBM Power Systems 3 Processor Chip Comparisons POWER5 2004 POWER6 2007 POWER7 2010 POWER7+ 2012 130nm SOI 65nm SOI 45nm SOI eDRAM 32nm SOI eDRAM 2 SMT2 2 SMT2 8 SMT4 8 SMT4 1.9MB (L2) 36MB (L3) 8MB (L2) 32MB (L3) 2 + 32MB (L2+3) None 2 + 80MB (L2+3) None 15GB/s 6GB/s 30GB/s 20GB/s 100GB/s 40GB/s 100GB/s 40GB/s Technology Compute Cores Threads Caching On-chip Off-chip Bandwidth Sust. Mem. Peak I/O POWER8 22nm SOI eDRAM 12 SMT8 6 + 96MB (L2+3) 128MB (L4) 230GB/s 96GB/s
  • 14. © 2014 IBM Corporation IBM Power Systems 5 Innovation Drives Performance 0% 20% 40% 60% 80% 100% 180 nm 130 nm 90 nm 65 nm 45 nm 32 nm 22 nm Gain by Technology Scaling Gain by Innovation Relative % of Improvement IBM plans for future 22 nm technology are subject to change.
  • 15. © 2014 IBM Corporation IBM Power Systems 6 POWER8 Chip Packaging Bus Interfaces • Integrated PCIe Gen3 • SMP Interconnect • CAPI Accelerators • Crypto & memory expansion • Transactional Memory • Data Move / VM Mobility Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 L3 Cache & Chip Interconnect 8M L3 Region Mem. Ctrl.Mem. Ctrl. SMPLinks Accelerators SMPLinks PCIe Caches • 64K Data cache (L1) • 512 KB SRAM L2 / core • 96 MB eDRAM shared L3 • Up to 128 MB eDRAM L4 (off-chip) Cores • 12 cores (SMT8) • 8 dispatch, 10 issue, 16 exec pipe • 2X internal data flows/queues • Enhanced prefetching Memory • Dual memory Controllers • 230 GB/sec Sustained bandwidth Energy Management • On-chip Power Management Micro-controller • Integrated Per-core VRM • Critical Path Monitors Technology • 22nm SOI, eDRAM, 650mm2 • 15-layers = great bandwidth
  • 16. © 2014 IBM Corporation IBM Power Systems 7 Memory Buffer DRAM Chips Intelligence Moved into Memory • Previously on POWER7+ chip onto buffer Processor Interface • High speed interface Performance Value POWER8 Memory Buffer Chip “L4 cache”
  • 17. © 2014 IBM Corporation IBM Power Systems 8 Memory Bandwidth per Socket 0 10 20 30 40 50 60 70 POWER5 POWER6 POWER7 POWER8 GB/Sec
  • 18. © 2014 IBM Corporation IBM Power Systems 9 Memory Bandwidth per Socket 0 50 100 150 200 POWER5 POWER6 POWER7 POWER8 GB/Sec Reset the scale
  • 19. © 2014 IBM Corporation IBM Power Systems 10 POWER8 Memory Bandwidth per Socket 0 50 100 150 200 250 POWER5 POWER6 POWER7 POWER8 GB/Sec
  • 20. © 2014 IBM Corporation IBM Power Systems 11 POWER7 Chip I/O Bridge GX Bus PCIe Gen2 PCI Devices PCIe Gen3 PCI Device POWER8 Chip POWER8 Integrated PCI Gen 3
  • 21. © 2014 IBM Corporation IBM Power Systems 15 IO Bandwidth Comparing 2-Socket Servers 0 10 20 30 40 50 60 POWER6 POWER7 POWER7+ GB/Sec
  • 22. © 2014 IBM Corporation IBM Power Systems 16 IO Bandwidth Comparing 2-Socket Servers 0 50 100 150 200 POWER6 POWER7 POWER7+ POWER8 GB/Sec Reset the scale
  • 23. © 2014 IBM Corporation IBM Power Systems 17 POWER8 IO Bandwidth Comparing 2-Socket Servers 0 50 100 150 200 POWER6 POWER7 POWER7+ POWER8 GB/Sec
  • 24. © 2014 IBM Corporation IBM Power Systems 18 POWER8 Coherence Bus FPGA or ASIC Customizable Hardware / Application Accelerator • Specific system SW, middleware, or user application • Written to durable interface POWER8 PCIe Gen3 Transport for encapsulated messages POWER8 CAPI (Coherent Accelerator Processor Interface) Like an “extra” core for the POWER8 chip
  • 25. © 2014 IBM Corporation IBM Power Systems 19 Example: CAPI Attached Flash Optimization Pin buffers, Translate, Map DMA, Start I/O Application LVM Disk & Adapter DD Read/Write Syscall strategy() iodone() FileSystem strategy() iodone() Interrupt, unmap, unpin,Iodone scheduling 20K Instructions
  • 26. © 2014 IBM Corporation IBM Power Systems 20 Example: CAPI Attached Flash Optimization  Issues Read/Write Commands from applications to eliminate 97% of instruction path length CAPI Flash controller Operates in User Space  Saves 10 Cores per 1M IOPs Pin buffers, Translate, Map DMA, Start I/O Application LVM Disk & Adapter DD Read/Write Syscall strategy() iodone() FileSystem strategy() iodone() Interrupt, unmap, unpin,Iodone scheduling < 500 Instructions Application Posix Async I/O Style API User Library Shared Memory Work Queue aio_read() aio_write() 20K Instructions Attach flash memory to POWER8 via CAPI coherent Attach
  • 27. © 2014 IBM Corporation IBM Power Systems 21 POWER8 Leapfrogs 0 50 100 150 200 POWER5 POWER6 POWER7 POWER8 PCIe Gen3 0 50 100 150 200 POWER6 POWER7 POWER7+ POWER8 Memory Bandwidth I/O Bandwidth PCIe Gen3 PCI Device POWER8 POWER7 I/O Bridge GX Bus PCIe Gen2 PCI Devices PLUS …. CAPI Accelerators Transactional Memory Scaleability Smart use of energy … and more
  • 28. © 2014 IBM Corporation IBM Power Systems 22 Scale-out CPW Comparisons S824 (1 or 2 socket) – 6-core 3.8 GHz 72,000 – 12-core 3.8 GHz 130,000 – 8-core 4.1 GHz 94,500 – 16-core 4.1 GHz 173,500 – 12-core 1-socket not offered – 24-core 3.5 GHz 230,500 S814 (1 socket) – 4-core 3.0 GHz 39,500 – 6-core 3.0 GHz 59,500 – 8-core 3.7 GHz 85,500 740 POWER7+ (1 or 2 socket) – 6-core 4.2 GHz 49,000 – 12-core 4.2 GHz 91,700 – 8-core 3.6 GHz 56,300 – 16-core 3.6 GHz 106,500 – 8-core 4.2 GHz 64,500 – 16-core 4.2 GHz 120,000 720 POWER7+ (1 socket) – 4-core 3.6 GHz 28,400 – 6-core 3.6 GHz 42,400 – 8-core 3.6 GHz 56,300 +50% ~ GHz +40% +40% +60% +90%
  • 29. © 2014 IBM Corporation IBM Power Systems 23 CPW E880 – 32-core 4.35 GHz 381,000 – 64-core 4.35 GHz 755,000 – 96-core 4.35 GHz 1,114,000** (2015) – 128-core 4.35 GHz 1,495,000** (2015) E870 – 32-core 4.02 GHz 359,000 – 64-core 4.02 GHz 711,000 – 40-core 4.19 GHz 460,000 – 80-core 4.19 GHz 911,000 Measured using SMT8 SMT4 would be somewhat lower * planned to be published closer to their GA date. Early estimates can be provided under nondisclosure agreements if needed ** estimated value, not measured
  • 30. © 2014 IBM Corporation IBM Power Systems 24 Performance per Core Moves Up with POWER8 24 595 5GHz 770 3.5GHz 780 4.14GHz TurboCore rPerf performance estimate for fully configured systems divided by number of cores 795 4.25GHz TurboCore 770 4.2GHz 780 4.4GHz E870 4.19GHz E880 4.35GHz …up to 1.5X over POWER7+ up to 2X over POWER7 up to 2.5X over fastest POWER6 rPerfPer-core(CPWsamestory)
  • 31. © 2014 IBM Corporation IBM Power Systems 25 SAP SD Standard Application Benchmark Results, 2-Tier: SD Benchmark Users SAP enhancement package 5 for SAP ERP 6.0 Source: http//www.sap.com/solutions/benchmark/sd2tier.epx Fujitsu PQ 2800E Intel E7-8890 v2, 120c/240t Power E870 outperforms all other 8-socket systems (best Intel Xeon and best Oracle SPARC) 1.6X more users than Ivybridge-EX v2 Nearly 2X more users than Oracle T5-8 with 1/3 less cores! Oracle T5-8 T5, 128c/1024t IBM x3950 X6 Intel E7-8890 v2 120c/240t IBM Power 780 POWER7+ 96c/384t IBM Power E870 POWER8 80c/640t 128c 120c 120c 96c 80c (1) IBM Power System E870 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 80 cores / 640 threads, POWER8; 4.19GHz, 2048GB memory, 79,750 SD benchmark users, running AIX® 7.1 and DB2® 10.5, dialog response: 0.97 seconds, line items/hour:8,722,000, dialog steps/hour: 26,166,000 SAPS: 436,100 database response time (dialog/update): 0.013 sec / 0.026 sec, CPU utilization: 99%, Certification #: 2014033 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. (2) IBM Power System 780 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 96 cores / 384 threads, POWER7+; 3.72GHz, 1536GB memory, 57024 SD benchmark users, running AIX® 7.1 and DB2® 10, dialog response: 0.98 seconds, line items/hour: 6,234,330, dialog steps/hour: 18,703,000 SAPS: 311,720 database response time (dialog/update): 0.009 sec / 0.014 sec, CPU utilization: 99%, Certification #: 2014024 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. (3) IBM System x3950 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 120 cores / 240 threads, Intel Xeon Processor E7-8890 v2; 2.80GHz, 1024GB memory, 49,000 SD benchmark users, running Windows Server 2012 Standard Edition and DB2® 10, dialog response: 0.85 seconds, line items/hour: 5,421,670, dialog steps/hour: 16,265,000 SAPS: 271,080; database response time (dialog/update): 0.0083 sec / 0.022 sec, CPU utilization: 98%, Certification #: 2014024 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. (4) Fujitsu PRIMEQUEST 2800E on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 120 cores / 240 threads, Intel Xeon Processor E7-8890 v2; 2.80GHz, 1024GB memory, 49,000 SD benchmark users, running Windows Server 2012 Standard Edition and SQL Server 12, dialog response: 0.97 seconds, line items/hour: 5,193,670, dialog steps/hour: 15,581,000 SAPS: 259,680; database response time (dialog/update): 0.015 sec / 0.030 sec, CPU utilization: 99%, Certification #: 2014003 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. (5) (5) Oracle SPARC Server T5-8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors/128 cores/1024 threads, SPARC T5; 3.60 GHz, 2,048 GB memory; 40,000 SD benchmark users, running Solaris® 11 and Oracle 11g; Certification # 2012013008. Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. SAP and all SAP logos are trademarks or registered trademarks of SAP AG in Germany and in several other countries. All other product and service names mentioned are the trademarks of their respective companies.
  • 32. © 2014 IBM Corporation IBM Power Systems 26 Over twice the ERP users per core with Power E870/E880 than the best Intel Xeon and best Oracle SPARC results Nearly 1000 Users per Core with POWER8 based E870 26 SDBenchmarkUsersperCore SAP SD Standard Application Benchmark Results, 2-Tier: SD Benchmark Users per Core SAP enhancement package 5 for SAP ERP 6.0 As of April 28, 2014 Source: http//www.sap.com/solutions/benchmark/sd2tier.epx IBM E870 POWER8 80c/640t Oracle M5-32 M5 192c/1536t HP DL580 E7-4890 v2 60c/120t Oracle T5-8 T5 128c/1024t (1) IBM Power System E870 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 80 cores / 640 threads, POWER8; 4.19GHz, 2048GB memory, 79,750 SD benchmark users, running AIX® 7.1 and DB2® 10.5, dialog response: 0.97 seconds, line items/hour:8,722,000, dialog steps/hour: 26,166,000 SAPS: 436,100 database response time (dialog/update): 0.013 sec / 0.026 sec, CPU utilization: 99%, Certification #: 2014033 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. (2) HP ProLiant DL380 Gen9, on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors/36 cores/72 threads, Intel Xeon Processor 2699v3; 2.30 GHz, 256 GB memory; 16,101 SD benchmark users, running RHEL 6.5 and SAP ASE; Certification # 2014032. Results valid as of September 8, 2014. Source: http://www.sap.com/benchmark. (3) Oracle SPARC Server M5-32 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 32 processors/192 cores/1536 threads, SPARC M5; 3.60 GHz, 4,096 GB memory; 85,050 SD benchmark users, running Solaris® 11 and Oracle 11g; Certification # 2012013009. Results valid as of April 28, 2014. Source: http://www.sap.com/benchmark. (4) HP ProLiant DL580 Gen8on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 4 processors/60 cores/120 threads, Intel Xeon Processor 4890 v2; 2.80 GHz, 1024 GB memory; 24,450 SD benchmark users, running Windows Server 2012 Standard Edition and SQL Server 2012; Certification # 2043004. Results valid as of April 28, 2014. Source: http://www.sap.com/benchmark. (5) Oracle SPARC Server T5-8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors/128 cores/1024 threads, SPARC T5; 3.60 GHz, 2,048 GB memory; 40,000 SD benchmark users, running Solaris® 11 and Oracle 11g; Certification # 2012013008. Results valid as of April 28, 2014. Source: http://www.sap.com/benchmark. SAP and all SAP logos are trademarks or registered trademarks of SAP AG in Germany and in several other countries. All other product and service names mentioned are the trademarks of their respective companies. HP DL 380p E5-2699 v3 36c/72t 2.2Xmore users per core than the best competitors!
  • 33. © 2014 IBM Corporation IBM Power Systems 27 SAP Sales & Distribution 2-Tier ERP 6 Benchmarks IBM Power System S824 using DB2 10.5 vs. Competition Over 2 times better 24 core performance than nearest Intel competitive results Up to 2 times greater performance than previous Power generation Cisco UCS C240 M3 Fujitsu RX300 S8 HP ProLiant BL460c IBM Power S824 IBM Power S824 IBM p270 IBM p260 (1.0) IBM Power System S824 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 4 processors / 24 cores / 192 threads, POWER8; 3.52GHz, 512 GB memory, 21,212 SD benchmark users, running AIX® 7.1 and DB2® 10.5, dialog response: 0.98 seconds, line items/hour: 2,317,330, dialog steps/hour: 6.952,000 SAPS: 115,870 database response time (dialog/update): 0.011 sec / 0.019sec, CPU utilization: 99%, Certification #: 2014016 Results valid as of 3/24/14. Source: http://www.sap.com/benchmark. (1.1) Fujitsu RX300 S8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 24 cores / 48 threads. Intel Xeon E5-2697 processor 2.70 GHz, 256 GB memory, 10.240 SD benchmark users, running Windows Server 2012 SE and SQL Server 2012, Certification #: 2013024 (1.2) Cisco UCS c240 M3 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 24c ores / 48 threads. Intel Xeon E5-2697 processor 2.70 GHz, 256 GB memory, 10.045 SD benchmark users, running Windows Server 2012 DE and SQL Server 2012, Certification #: 2013038 (1.3) HP ProLiant BL460c Gen8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 24 cores / 48 threads. Intel Xeon E5- 2697 processor 2.70 GHz, 256 GB memory, 10.025 SD benchmark users, running Windows Server 2012 DE and SQL Server 2012, Certification #: 2013025 (2.1 IBM Flex System p270 Compute Node on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 4 processors / 24 cores / 96 threads, POWER7+; 3.4GHz, 256 GB memory, 12.528 SD benchmark users, running AIX® 7.1 and DB2® 10 .5 Certification #: 3012019 Source: http://www.sap.com/benchmark. (1.1)IBM Flex System p260 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 16 cores / 64 threads, POWER7+; 4.1GHz, 256 GB memory, 10,000 SD benchmark users, running AIX® 7.1 and DB2® 10, Certification #: 2012035 2Xmore users
  • 34. © 2014 IBM Corporation IBM Power Systems 28 IBM Power System S824 delivers Best of Breed eBS 12.1.3 Payroll performance Over 2 times more performance per-core than Cisco result with higher overall through-put on few cores Cisco UCS C240 M3 24-core Oracle BL460c 16-core IBM Power S824 12-core 2X ! • All results use Oracle eBS 12.1.3 Payroll Batch Extra Large Kit and are current as of 3/24/2014.  For more information go to http://www.oracle.com/us/solutions/benchmark/apps-benchmark/results-166922.html Cisco UCS C240 M3 24-core Oracle BL460c 16-core IBM Power S824 12-core
  • 35. © 2014 IBM Corporation IBM Power Systems 29 IBM Power System S824 delivers New High-water Siebel CRM Release 8.1.1.4 performance Over 3 times the DB performance per-core than previous results Highest overall users supported on fewer cores! Oracle SPRAC T4-2 16-core Cisco UCS B200 M3 16-core IBM Power S824 6-core 3.3 X (1) All results use Siebel 8.1.1.4 PSPP Kit and are current as of 3/24/2014. For more information go to http://www.oracle.com/us/solutions/benchmark/white- papers/siebel-167484.html New #1 Oracle SPRAC T4-2 16-core Cisco UCS B200 M3 16-core IBM Power S824 6-core
  • 36. © 2014 IBM Corporation IBM Power Systems 30 “Single-thread-oriented” Workloads and POWER8 Technology Good news Compared to POWER7/POWER7+, POWER8 chips with similar GHz run 20-25% faster from a wall clock perspective …… ASSUMING NOT I/O BOUND time POWER7 POWER8 20-25% reduction
  • 37. © 2014 IBM Corporation IBM Power Systems 31 A New Generation of IBM Power Systems Designed for Big Data Superior Cloud Economics Open Innovation Platform Open Innovation to put data to work
  • 38. © 2014 IBM Corporation IBM Power Systems 32 Collaborative innovation for highly advanced systems Produce open hardware, software, firmware and tools Expand industry skills and investment for Power ecosystem Provide alternative architectures OpenPOWER Consortium IBM Google NVIDIA TYAN Mellanox Open Innovation
  • 39. © 2014 IBM Corporation IBM Power Systems 33 Google® Mother Board using POWER8 Technology Development board previewed by Google at April 2014 POWER8 announcement
  • 40. © 2014 IBM Corporation IBM Power Systems 34 Building collaboration and innovation at all levels Boards / Systems I/O / Storage / Acceleration Chip / SOC System / Software / Services Implementation / HPC / Research Complete member list at www.openpowerfoundation.org
  • 41. © 2014 IBM Corporation IBM Power Systems 35 Power 770+ Power 780+ Power 750+ / 760+ Power 710+/730+ Power 720+/740+ P460+ 1Q 2014 Portfolio: POWER7/POWER7+ IBM PureFlex System p260+ p24L PowerLinux 7R4+ PowerLinux 7R1+ / 7R2+ Power 795
  • 42. © 2014 IBM Corporation IBM Power Systems 36 Power 770+ Power 780+ Power 750+ / 760+ Power 710+/730+ Power 720+/740+ P460+ 2Q 2014 Portfolio: POWER8/POWER7/POWER7+ IBM PureFlex System p260+ p24L PowerLinux 7R4+ PowerLinux 7R1+ / 7R2+ Power 795
  • 43. © 2014 IBM Corporation IBM Power Systems 37 Power 770+ Power 780+ Power 750+ / 760+ Power 710+/730+ Power 720+/740+ P460+ 4Q 2014 Portfolio: POWER8/POWER7/POWER7+ IBM PureFlex System p260+ p24L PowerLinux 7R4+ PowerLinux 7R1+ / 7R2+ Power 795
  • 44. © 2014 IBM Corporation IBM Power Systems 38 Scale-out
  • 45. © 2014 IBM Corporation IBM Power Systems 39 Scale-out Servers (with POWER8 technology) S824 (2 socket, 4U) S814 (1 socket, 4U) S822 (2 socket, 2U) S812L (1 socket, 2U) Linux-only S822L (2 socket, 2U) Linux-only S824L not shown – Linux Ubuntu only for GPU currently
  • 46. © 2014 IBM Corporation IBM Power Systems 40 Scale-out Servers (with IBM i or AIX or Linux support) S814 (1 socket, 4U) – 6 or 8 core (P10 IBM i software tier) – 4 core (P05 IBM i software tier) S824 (2 socket, 4U) – 6/12 or 8/16 or 24 core – P20 IBM i software tier
  • 47. © 2014 IBM Corporation IBM Power Systems 41 POWER8 1S4U Scale-out System Power S814  Form Factor: 4U or Tower  Single Socket  Cores: 4 (3.0 GHz), 6 (3.0 GHz) or 8 (3.7 GHz)  Memory: Up to 512 GB  Slots: 7 PCIe Gen3 Full-high (Hotplug)  Ethernet: Quad 1 Gbt in PCIe slot  Integrated ports: USB (4/5), Serial (1), HMC (2)  Internal Storage  DVD  12 SFF Bays -- Split Backplane: 6 + 6  or 18 SFF Bays with 7GB write cache  Hypervisor: PowerVM  OS: AIX, IBM i 7.1 or later (P10 software tier), Linux 3 Yr Warranty
  • 48. © 2014 IBM Corporation IBM Power Systems 42 POWER8 2S4U Scale-out System Power S824  Single Socket populated  Cores: 6 (3.8 GHz) or 8 (4.1 GHz)  Memory: Up to 512 GB (Up to 1TB Nov annc)  Slots: 7 PCIe Gen3 full-high (Hotplug)  Both Sockets populated  Cores: 12 (3.8 GHz), 16 (4.1 GHz), or 24 (3.5 GHz)  Memory: Up to 1 TB (Up to 2TB Nov annc)  Slots: 11 PCIe Gen3 full-high (Hotplug)  Ethernet: Quad 1 Gbt in PCIe slot  Integrated ports: USB (4/5), Serial (1), HMC (2)  Internal Storage  DVD  12 SFF Bays -- Split Backplane: 6 + 6  or 18 SFF bays & 8 SSD bays with 7GB write cache  Hypervisor: PowerVM  OS: AIX, IBM i 7.1 or later (P20 software tier), Linux 3 Yr Warranty
  • 49. © 2014 IBM Corporation IBM Power Systems 45 Enterprise
  • 50. © 2014 IBM Corporation IBM Power Systems 46 No Primary Node Midplane  Service Processors  Clocks  Oscillators Large Memory 19” Rack Modular design Up to 4 CEC drawers Blindswap IO Adapters POWER8 Enterprise Solutions Midplan e
  • 51. © 2014 IBM Corporation IBM Power Systems 48 Power E880: 1, 2, 3 or 4 Nodes Node Node Node Node MidPlane 22U in 19” rack 3- and 4-node configurations planned availability June 2015
  • 52. © 2014 IBM Corporation IBM Power Systems 49 Power E870: 1 or 2 Nodes Node Node MidPlane 12U in 19” rack
  • 53. © 2014 IBM Corporation IBM Power Systems 50 Power Scale Perspective Power 770 Power 780 Power 795 50
  • 54. © 2014 IBM Corporation IBM Power Systems 51 Power E870 & E880 servers • 8 to 128 cores @ 4.35 GHz • Up to 192 cores* in 2015 • 256 to 16TB Memory • 1 to 4 nodes • Built-in initial Elastic CoD days *Statement of Direction to support up to 8TB memory on E870 and up to 4 PCIe I/O Expansion Drawers per node on Power E870 & E880 in 2015. Initial GA in 4Q14 supports 4TB maximum on E870 and 0 or 2 PCIe I/O drawers per node on E870 & E880.  Increased performance and scale  Built-in PowerVM Enterprise Edition  Enterprise RAS  Active Memory Mirroring for Hypervisor  More performance per-watt  Capacity on Demand  Share resources in Power Enterprise Pool  Medium Software tier  24x7 Warranty Power E880Power E870 • 8 to 80 cores @ 4.19 GHz • 8 to 64 cores @ 4.0 GHz • 256 to 4TB Memory (8TB SOD*) • 1 or 2 nodes
  • 55. © 2014 IBM Corporation IBM Power Systems 52 POWER8 E870 Compares: 2-Node/Drawer System 9117-MMD Power 770 POWER8 Enterprise 2 CEC Node- drawer CPU Sockets per Node/Drawer 4 4 Max processor nodes/Drawers 4 2 Max number sockets 16 8 Max Cores 64 64 or 80 Max Frequency 3.8 GHz 4 or 4.19GHz Max Memory 1 TB per CEC Drw 2 TB per CEC Drw Memory per core 64 GB 62 or 50 GB Memory Bandwidth (peak) 272 GB/s per CEC Drw 922 GB/s per CEC Drw I/O Bandwidth (peak) 80 GB/s per CEC Drw (GX) 256 GB/s per CEC Drw (PCIe Gen3) Max PCIe I/O drws 16 (4 per Node) 4 (2 per Node) Max PCIe I/O Slots 160 - in IO drws 24 - internal 48 in IO drws 8 - internal IBM i levels supported IBM i 6.1 and later IBM i 7.1 and later 2014 & currently
  • 56. © 2014 IBM Corporation IBM Power Systems 53 POWER8 E870 Compares: 2-Node/Drawer System 9117-MMD Power 770 POWER8 Enterprise 2 CEC Node- drawer CPU Sockets per Node/Drawer 4 4 Max processor nodes/Drawers 4 2 Max number sockets 16 8 Max Cores 64 64 or 80 Max Frequency 3.8 GHz 4 or 4.19 GHz Max Memory 1 TB per CEC Drw 4 TB per CEC Drw Memory per core 64 GB 62 or 50 GB Memory Bandwidth (peak) 272 GB/s per CEC Drw 922 GB/s per CEC Drw I/O Bandwidth (peak) 80 GB/s per CEC Drw (GX) 256 GB/s per CEC Drw (PCIe Gen3) Max PCIe I/O drws 16 (4 per Node) 8 (4 per Node) Max PCIe I/O Slots 160 - in IO drws 24 - internal 96 – in IO drws 0 - internal IBM i levels supported IBM i 6.1 and later IBM i 7.1 and later Planned SOD * SOD * * SOD = statement of direction – represents IBM plans shared publically. As always plans subject to change.
  • 57. © 2014 IBM Corporation IBM Power Systems 56 PCIe I/O Drawer
  • 58. © 2014 IBM Corporation IBM Power Systems 57  4U in standard 19” rack  PCIe Gen3 x8 or x16 slots – Full-High, Full-Length slots  PCIe x16 Gen3 cable connection to POWER8 CEC  Dual fiber optic cables POWER8 PCIe Gen3 IO Drawer Today for Power E870 and E880 SOD for Scale-out
  • 59. © 2014 IBM Corporation IBM Power Systems 58 IO Bandwidth (Comparing I/O Drawers) 0 10 2 0 3 0 4 0 5 0 6 0 7 0 #5877 #EMX0 Total drawer GB/Sec One PCIe Gen3 Drawer (12 PCIe slots) 10 or 20 slots POWER8 PCIe-attached Gen3 I/O drawer has two fan-out modules and each fan-out module has 32GB/s POWER7 12X-attached PCIe I/O drawer = #5877 or #5802 One or two #5877 or #5802 can share a single GX++ slot’s 20GB/s bandwidth POWER8 POWER7+
  • 60. © 2014 IBM Corporation IBM Power Systems 61 DAS or SAN ?  Both options are strategic  Both options have their strengths  Can use both options on the same server  Application independent –Ignoring operational options Power System running IBM i DAS Direct Attached Storage (“internal”) SAN Storage Area Network (“external”)
  • 61. © 2014 IBM Corporation IBM Power Systems Power Hardware Update Mark Olson olsonm@us.ibm.com
  • 62. © 2014 IBM Corporation IBM Power Systems 63 This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings available in your area. Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785 USA. All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees either expressed or implied. All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and conditions. IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice. IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies. All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally- available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for their specific environment. Special notices
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