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IPM Overview for B.E. and M.E. Students of Best Engineering College in India
In the recent few years, majority of students have shown their huge interests to work in
power electronics industry. Whether you look over the scenario of B.E. or M.E. students,
you will likely find many of them as competing with one another to get best jobs in the
sector of power electronics.
If you are the one eager to work in the aforementioned competitive sector and studying
B.E. or M.E. from best engineering college in India, you should definitely give your
time to know about one of the power modules mentioned in this article.
IPM and Power Electronics
Higher level of integration and complicated subsystems are obviously few of the latest
mega trends prevailing in the sector of power electronics. Especially, students of best
engineering college in India should know about one of the highly demanded
subsystems as IPM or Intelligent Power Modules used primarily to perform large
numbers of motor driving applications.
M.E. and B.E. students of best engineering college in India will also be able to know
that the power module consists of a combination of various electronics components or
power semiconductors named as diodes, IGBTs and MOSFETs, along with peripheral
components, like for instance driver circuits.
Methods of Designing IPMs
Professionals associated with the technological industry including professors of best
engineering college in India primarily choose for two prime methods to design IPMs,
Transfer Moulded IPMs
According to the detailed analysis done by professors of best engineering college in
India, electronics industrial personnel mostly design IPMs by following transfer mould
process. Here, the step begins with the mounting of semiconductors and various other
related components on a particular lead frame.
Moulding process done with the help of plastic helps a lot in assuring protection and
isolation of every mounted component. Main benefit associated with this technology is
simple and easy production process.
Thick-film technology serves as another possible technique for large numbers of highly
integrated power electronics. Here, printing of different conduction layers and isolating
materials take place on ceramic sheet. Layers in this case are able to build pads, tracks
Main advantage of the technology is its ability to deliver good thermal conductivity and
allows various possibilities to design layouts, which are of identical to PCBs or Power
Card Boards. In addition, users will never find any limitation based on deigns of both
pins and housings of the entire product. Based on this fact, one would surely say that
thick-film is an advanced technology.
Regardless the chosen design technique, IPM will give countless significant benefits to
motor and other industries, provided individuals choose for proper matching of
subsystems to varying applications.