Intercomp USA provides value-added engineering services to visionary companies, including value analysis, engineering support from concept to production, supply chain management, and quality assurance services. Their services help customers reduce costs, accelerate product development, and optimize purchasing and operations.

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We deliver the future for visionary companies.
Together, we deliver beyond component sourcing
with VA/VE, engineering and supply chain
management services.

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Overview – Intercomp USA
Aerospace
& Defense
Automotive
& Off-Road
Medical
Devices
Consumer
Electronics

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Overview – Intercomp USA
 Passive Silicon Devices
 Active Silicon Devices
 Sensors
 Connectors
 Wireless Communications
 Power Conversion
 Franchise partner
From prototype to production to distribution

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Intercomp USA VA/VE and Engineering Services
 Complete BOM component selection and product life cycle analysis using Silicon Expert
 Manage component EOL with strategic last time buys
 Our EE’s will Identify component 2nd sources to mitigate single source supply risk.
 Transition from a fixed overhead cost to a project-based variable cost approach model
 Engineering support ranging from initial clean sheet product concept and prototyping
through full production.
 Complete reverse Engineering of electrical and mechanical assemblies.
 Engineering staffing services available for PCB layout, BOM configuration, schematics,
block diagrams, & mechanical enclosures
Your competitive advantage and friend to your bottom-line.

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Value Analysis / Value Engineering (VA/VE) Services
A 3 Tier Process for product teardown & reverse engineering with VAVE
analysis to reduce cost.
• BOM cost analysis
• DFM/DFA review
• Manufacturing process improvement
• Direct 2nd source drop-in alternatives
• Board level testing alternatives
• AOI/AXI or functional testing
TIER 1
• Complete PCB re-spin for 2nd sourcing
• Minor circuit & footprint layout optimization
• Material substitutions
• Manufacturing process changes
• Board level testing alternatives adding
test points for ICT or flying probe
TIER 2
• Complete system and architecture changes
• Tooling changes
• Fixture changes
TIER 3

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Supply Chain Management & Strategic Sourcing
• Pricing & contract negotiation
• Minimum order quantity optimization
• VA/VE services
• Third-party purchasing staffing support
• In-house prototyping
• EMS Kitting Services
• Box build assembly
• KPI dashboards including OTD, PPM, & PPV
• Inventory turn analysis
• Implementation of JIT, KANBAN, & PULL
• Business model scaling
• Vendor alignment
• Preferred strategic supplier collaboration
• Strategic outsourcing
Cost Reduction
Strategic Sourcing
Assistance
Product Acceleration
Purchasing & Operations
Optimization

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Quality Product Life Cycle Management
 Process quality documentation creation including APQP, DFMEA, and 8D Analysis.
 PPAP submissions including balloon drawings, dimensional reports, process flow,
control plans, PFMEA, and first article inspections.
 Continuous Improvement, Lean, Six Sigma
background.
 Assist with ISO 9001, 14001, and AS9100 certifications.
 Supplier process and systems audits.
 Product verification, validation, testing, and
certifications to ensure compliance.
 Advice on inspection techniques, quality control
gauges, fixtures, and tooling for optimal success.
 Quality sorting and rework capabilities in South Florida

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Sorting and Rework Services
 Onsite or offsite sorting and containment 24/7.
 Rework or repair in-house or at our warehouse location in South Florida.
 Warehouse and supply inventory back to you as needed.
 Improve Supplier relationships
 ISO-14001 disposition of scrap materials.
 Reduced scrap, labor, and operating costs.
 State-of-the-art scanning technology.
 Reflash support
 Reverse logistics

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A FREE Bill of Material Assessment
 Evaluation of your new or current bill of materials (BOM).
 Review of current suppliers and sourcing strategies
 Identification of end-of-life components using our proprietary software
 Plan and inventory last time buys for electronic components
 Suggest and sample new design with a low risk soft roll transition plan
 Suggest second sources to reduce supply chain risk and cost on PCBA’s
 Strategic suggestions to reduce cost of sheet metal, die cast, CNC machining,
and plastics parts.

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Questions?
For a copy of our Line Card please go to www.Intercomp.com
If you have questions or wish to have our engineering staff conduct a FREE
BOM Assessment contact your sales consultant or:
David Sepanik
Director – Engineering and Supply Chain Services
O 954.493.6461
C 954.706.9050
F 954.493.6573
E David.Sepanik@Intercomp.com

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Glossary of Terms
AOI: Automated optical inspection
AXI: Automated X-Ray Inspection
BOM: Bill of material
CAE: Computer aided engineering analysis
DFA: Design for assembly
DFM: Design for manufacturing
DFMA: Design failure mode and analysis
EMS: Electronics manufacturing service provider
FEA: Finite element analysis
ICT: Integrated circuit test
IP: Intellectual property
JIT: Just in time
KPI: Key performance indicators
OEE: Overall equipment effectiveness
OS: Operating system
OTD: On time delivery
PCB: Printed circuit board (raw fab)
PCBA: Printed circuit board assembly
PLM: Product lifecycle management
PPM: Parts per million
PPAP: Production part approval process
VAVE: Value add value engineering

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Counterfeit Mitigation
• Intercomp is ISO-9001 & AS9120 Certified and compliant to SAE AS6081 as
well as AS5553
• We purchase materials from authorized franchised source or OCM original
component manufactures
• We retain records providing supply chain traceability back to the OCM
• Intercomp receives counterfeit warnings from ERAI, GIDEP, & IDEA
• In the event our customers buy product without traceable certifications these
are the ways to mitigate any fraudulent or counterfeit parts:
Minimum required tests for ACTIVE and PASSIVE Components
o Documentation and packaging (non-destructive)
o External visual and microscopic inspections
o Remarking and resurfacing (destructive}
o Solvent test for remarking
o Radiological (X-Ray) inspection
o Lead finish evaluation
o Delid/Decapsulation internal analysis (destructive)
o Solderability testing