OIF Presents: Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels for Next-Generation Data Center Systems ECOC Market Focus New Technologies & Systems/New Markets/New Packaging Platforms Wed, 15 September 2021 Jeff Hutchins / Ranovus OIF PLL Working Group Co-Packaging Vice Chair

1. Co-Packaged Optics: The OIF’s Work to
Standardize Higher Integration Levels for
Next-Generation Data Center Systems
ECOC Market Focus
New Technologies & Systems/New Markets/New Packaging Platforms
Wed, 15 September 2021
Jeff Hutchins / Ranovus
OIF PLL Working Group Co-Packaging Vice Chair
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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2. Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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3. OIF Membership and Activities
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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Technical Committee
Networking &
Operations
WG
Interoperability
WG
Physical & Link
Layer WG
Physical Layer
User Group
Network
Operator WG
Interoperability
Demonstrations
Implementation
Agreements
Market Awareness and
Education Committee
https://www.oiforum.com/technical-
work/implementation-agreements-ias/
Educational Workshops
& Presentations

4. Motivation for Co-Packaging?
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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The portion of data center power that networking consumes
is growing with each generation and has become a key
driver for co-packaging
Co-packaging can significantly reduce the “network” power
by the reduction in electrical interface power – leaving
more power for ”compute”
But it also enables new applications needing high-density,
high-capacity, and disaggregated resources
Networking Power is becoming a larger portion of the data center power leaving less for useful computation
Adapted from
OIF Lightwave CPO Webinar,
Ram Huggahalli , 10-14-20

5. What are Some Configurations?
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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The Co-Packaging Assembly (CPA) is a Multi-Chip Module
(MCM) with either socketed …
Co-Packaging Architectures
Host PCB
Co-Packaged Assembly Substrate
ASIC Engine Substrate socketed
OE/EE
XSR
Some Engine locations can be populated with a passive
Copper Cable Assembly (CCA) to connect to engines
which might be too large to fit in the co-packaged
assembly
Copper Cable
Host PCB
Co-Packaged Assembly Substrate
ASIC
Engine Substrate
OE/EE
XSR
Host PCB (high performance material)
ASIC
ASIC Substrate / RDL RDL
Optical Engine
Or Pluggable
MR/LR SerDes
VSR
Pluggable or On-Board Architectures
ASIC
ASIC Substrate / RDL RDL
OE/EE
Host PCB
Or the ASIC may be packaged and mounted on a
high-quality substrate
XSR+
Near Packaging Architectures
Pluggable module at the front panel or on-board module

6. What are the Co-Packaging Applications?
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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OIF CPO Webinar,
Ram Huggahalli
10-14-20
Optics
Chiplet
Electrical
Chiplet
Data Center Networking AI Training / ML Disaggregation
End
Node
Switching
Node
Dense
Sparse
Low Latency I/F
Ethernet I/F
Poster
Child
Application

7. Co-Packaged Card
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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51.2T Ethernet Switch Card with 100G Lanes
oif2021.178.00
Ted Schmidt / Lumentum
Optical Engine Connector
Co-Packaged Assembly Optical Engine
Switch Card PCB
Remote Lasers
if needed
Switch ASIC

8. Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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Studying a Front Panel Pluggable Form Factor
• Easy to replace upon failure
• Using an external laser can improve the reliability of the
optical engine
• Employs a blind mate optical connector
Scope
• Mechanical form factor and thermal power classes
• Electrical and optical specifications
• Eye safety requirements
Specifying a Form Factor
Eye safety requirements are considered
Remote Laser Standardization

9. Extra connector
Extra connector
Optical Connector Contribution to Link Loss
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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Optical
Engine
Front
Panel
Pluggable
Optical
Engine
Front
Panel
Pluggable
Data Center Cabling
MDI MDI
TP2
Data Center Cabling
TP3
Sometimes it’s reasonable to convolve
these loss distributions
In either scenario, the Link Loss from TP2 to TP3 is fixed, per standards
OE Manufacturing
Test Point
OE Manufacturing
Test Point
Front Panel
Pluggable Link
Co-
Packaged
Given optical requirements for TP2 and TP3,
the requirements for the OE test point can be adjusted for the extra connector losses

10. Rework and Connector Loss
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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• Let’s assume that a particular connector has a 0.1% chance on first mating to
exhibit an IL > IL_LIMIT
Then for PF = 0.1%, the assembly yield “Y” is 99.9% for a single
mating
• The chance of of failing one or two of two fiber connections:
or
• For the general case of ”N” fiber connections, the chance of failure one or
more connections:
or
• So, we must choose a PF such that we achieve the desired card 1st pass
assembly yield loss which drives rework
1 − 𝑌2
1 − 𝑌𝑁
𝑌 = (1 − 𝑃𝐹)
1 − 1 − PF
N
1 − 1 − 𝑃𝐹
2
With PF = 0.1%
The target card rework rate drives the connector IL failure probability limit

11. How Should a Remote Laser & OE be Controlled?
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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Host for MIS
ELS
Optical
Engine
Host for MIS
ELS
Optical
Engine
Host for MIS
Integrated
Lasers
Optical
Engine
Host for MIS
Integrated
Lasers
Optical
Engine
CMIS I/F CMIS I/F CMIS I/F
MIS I/F
MIS I/F
? I/F
? I/F ? I/F
? I/F
The 3.2T OE for Ethernet switching will support both internal and external laser sources
The OIF is addressing the management interface architecture in its CMIS project
Laser Internal
To
Optical Engine
Laser External
To
Optical Engine
Controller directly
controls Laser
Looks like
pluggable optics

12. Co-Packaging Electrical Interfaces
for Ethernet Switching
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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Host PCB
Co-Packaged Assembly Substrate
ASIC Engine Substrate socketed
OE/EE
XSR ≤ 10dB
Optical Engine in a co-packaged architecture
The OIF is supporting both Near Packaging (XSR+) and Co-Packaging (XSR) electrical interfaces
Leveraging OIF’s existing XSR project
ASIC
ASIC Substrate / RDL RDL
OE/EE
Host PCB
XSR+ ≤ 13dB
Optical Engine in a near-packaged architecture
Newly created project in the electrical track

13. XSR+
3Q2021
How is Co-Packaging Being Tackled by the OIF?
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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Framework
IA
4Q2020
Initiated a ”Framework” umbrella level project to study co-packaging
• Defines the application spaces and explore technological considerations
3.2T OE
1Q2021
Initiated a ”3.2T OE” project for 51.2T Ethernet Switching Application
• Defines an optical engine module, 16 of which can be used to provide optical
interfaces for a 51.2Tb/s switch using XSR electrical interfaces and FR & DR
optical interfaces
ELSFP
2Q2021
Initiated a ”ELSFP” (External Laser Small Form Factor) project
• Defines a front panel pluggable laser source for co-packaging
Co-Packaging
The OIF has initiated multiple projects to study and address Co-packaging
Initiated an ”XSR+” electrical interface project to to CEI to support NPO
• Adds new clauses to support D2D and D2IOE at 13dB loss at ~26.5GHz
CMIS
Created a “Management Interface” Track and CPO MIS project
• Defines the management interface for co-packaging

14. Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels
for Next-Generation Data Center Systems Copyright © 2021
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Thank-you
Follow-on standards efforts
Co-Packaging
Framework
Framework
IA