Learn how PIllarHall® lateral high aspect ratio test structures are utilized by scientific professionals in Atomic Layer Deposition (ALD) fundamental research, thin film characterization and control and monitoring in manufacturing.

1. Mikko Utriainen, Dr.
Tel. +358 40 753 7415
mikko.utriainen@vtt.fi or
pillarhall@vtt.fi
The AVS 18th International Conference on Atomic Layer Deposition (ALD 2018),
29th July – 1st August 2018, Incheon, South Korea, https://ald2018.avs.org/
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Presentations in ALD 2018 with PillarHall®
PillarHall® Lateral High Aspect Ratio
(LHAR) MEMS-based test structure
technology is developed for
accelerating thin film R&D.
Technology is made available by
VTT Technical Research Centre of
Finlánd.
Learn how PIllarHall® is utilized by
scientific professionals in ALD
fundamentals, characterization and
manufacturing.
31st July
4:15pm
Thin Film Conformality Analysis‚ Reliability and
Modeling using All-silicon Lateral High Aspect
Ratio Structures
Oili Ylivaara, VTT
31st July
5:00pm
Mechanisms limiting conformality in thermal
and plasma-assisted ALD investigated by
Lateral High Aspect Ratio structures
Karsten Arts, TU-Eindhoven
31st July
5:00pm
Monitoring Conformality in ALD Manufacturing:
Comparing Lateral and Vertical High Aspect
Ratio Test Structures
Mikko Utriainen, VTT
(in collaboration with Fraunhofer IPMS)
31st July
5:30pm
Conformality Measurement Needs and
Challenges: Survey among ALD professionals
Mikko Utriainen, VTT (POSTER)
See you in ALD 2018 J
PillarHall® Test Chips
SPECIAL OFFER
only in ALD2018
http://www.pillarhall.com/
https://www.vttresearch.com/cleanroom-
facility-for-microelectronics-–-micronova
Let’s meet in ALD 2018