Muhamad Asril Abdullah
E-mail: muhamad.asril.abdullah@intel.com
LinkedIn: http://tinyurl.com/zh8kr9g
SUMMARY
Result-oriented, high discipline professional with 6 years experience managing & leading
Test R&D (Research & Development) team to achieve & deliver manufacturing test
solutions.
The deliverables includes design, develop, integrate and deploy Assembly Test & Functional
Test solution for PES (Platform Enabling Services) Asia manufacturing. Among the tasks are
reviewing product features and design spec; defining test strategy, CSI (Critical Success
Indicator), CTF (Critical to Function) parameters; seeking customer & stake-holder
expectations, performing risk assessment & mitigation plan; developing & executing own
tasks & schedule to meet PDT (Product Development Team) milestones.
Among the platforms supported are Internet of Things devices, Smartphones and Reference
Validation Platform Desktops.
Proven result in motherboard system manufacturing test solutions
Dedicated and effective high-quality deliverables that meet or exceed timeline. Worked
with various Intel sites globally including Oregon, Berlin, Bangalore, Singapore, and
Zhuhai.
 Able to work closely and establish strong rapport with manager, peers,
subordinates, stakeholder.
 Has very good leadership skills and has initiative in
 Identifying improvement, opportunities and troubleshooting competency.
 Able to deliver outcomes independently.
 A fast learner, and good stake holder, delivering good alignment, addressing the
needs.
 Possesses effective people-skills, an integral component in winning, managing
projects/improvement, working with.
 Highly adaptable to situations and environments.
Career aspiration: To contribute extensive knowledge and experience in a dynamic
challenging opportunity that contributes to the outstanding success of the business to
achieve & deliver manufacturing test solutions. To be a significant contributor in
empowering and engaging an organization that is able to inspire its people.

CORE SKILLS
 People
management
 Technical Leadership  Quality & Assurance
 Strategic
Manufacturing Test
Planning
 Functional Test
Development
 Failure Analysis &
Troubleshooting
 RF Test/Debug
Capability
Enablement
 Innovation & New
Platform Development
 Sustainability
Outsource
Management
 Decision maker  Continuous First Pass
Yield Improvement
 Continuous Retest
Rate Improvement
PROFESSIONAL TRAINING & DEVELOPMENT
 Code of Conduct  Anti-Corruption  Protecting Intel Asset when
Sampling
 Advance Electrical Safety  Control of
Hazardous
Energies (CoHE)
 Global Export Compliance
 Injury Incident Free
Environment
 STATS 101; JMP  Intro to MCA (Measurement
Capability Analysis) ; JMP
 Essential RF Microwave &
LTE Technical Concepts
Working Experiences
Intel Products (M) Sdn Bhd 2005 - Present
Test Program Manager (TPM) May’10 – Present
Functional Test Development (FTD) Engineer Aug’06–May’10
Technical Supervisor Aug’05–Aug’06
Key Responsibilities
 PDT Test lead
 Define and deliver Strategic Manufacturing Test Plan
 Lead team to Design, develop, integrate and deploy Assembly Test & Functional
Test solution to factory
 Lead team to Perform Failure Analysis (FA) for any excursion
 Continuous FPA (1st
Pass Analysis) Yield and Retest Rate improvement

Key Achievements
 1st
RF test and FA capability enablement. Equipment R&S (Rhode & Schwarz) CMW500
 Influenced Customer to recognize Graphical Diagnostic Tool Suite as the only automated
solution for Android FT in Smartphone platform. Android FT were delivered timely from
Android 4.4.4 Kit Kat, Android 5.1 Lollipop, and most recently to the new Android 6.0
Marshmallow respectively.
 Implemented Auto-Pilot (single click operation) throughout the entire FT stations despite
of the uniqueness of each FT station. Apps Sikuli
 Influenced Customer to utilize Takaya JFP (Javelin Flying Probe) & FT as the right test
combination to replace ICT (In-Circuit Test) for all low runner Processor Platform
Validation products. Cost avoidance of USD120k for ICT solution or 57% additional cost
per board.
 Implemented Robust Mechanical XDP (External Debug Probe) Platform to Factory to
avoid hi fallout of damaged XDP Tool and low FT 1st
Pass Yield. Return of Investment
(ROI) of RM50, 000.00 per year. Abstract selected to compete in Intel Malaysia
Innovation Day (MInD) 2008 and Technical Leadership Day (TLD) 2008
BCM Electronics Corp.; Test Engineer Nov’02 – Aug’05
BCM Electronics Corp.; Quality & Control (QC) Engineer Nov’00 – Nov’02
Key Responsibilities
 Platform Test Lead
 Owned test capability and engineering validation of Engineering run
 Implemented, set up and sustain test stations. Parametric solution: ICT. Functional
Test: NI (National Instruments) Labview
 Owned Preventive Maintenance (PM) procedure for test fixtures, First Level PM and
Recirculation E-Load (Burn-in process)
 Continuous Test Yield improvement
EDUCATION
Bachelor of Science in Electrical Engineering
The Universityof Tulsa, Oklahoma, United States of America
MEMBERSHIP
 Member of Board of Engineers Malaysia (BEM), 2015 – Present
 Member of Institute of Electrical and Electronics Engineers (IEEE),
United States of America 1997 - 1999