1. Quality Engineering Development
Summary Updates
By Muhammad Ruzainy Musa
Date: 2011-Feb-22

2. RENE CORTEZ
(SPONSOR)
KAREN WOON
(MENTOR)
RUZAINY
MAINTENANCE
TEAM
ENGINEERING
TEAM
PRODUCTION
TEAM
TEAM STRUCTURE

3. TITLE: Quality Engineering Development Summary Updates. Mentor: Karen Woon
JULY AUG SEPT OCT NOV DEC JAN FEB
Introduction of QA Organization Chart & QE jobs and
responsibility.
QUALITY ALERT
Defect Potential Assessment (DPA)
INTERNAL QUALITY ISSUE
Material review board (MRB)
Non-conformance report (NCR)
Voice of process (VOP)
CUSTOMER COMPLAINT
Voice of Customer (VOC)
Design of experiment (DOE)
AUDIT
TI BOAC Fan-out
MAXIM wire bond (broken stitch) Fan-out
TRAINING
TSDC - Wirebond training
Problem solving technique
FMEA 4th Edition
SPC- Method 1

4. QUALITY ALERT
Defect Potential Assessment - FMEA Approach (Do differently)
- Receive/acknowledge
- Do containment actions
- Examine the unit, it’s “failure mode & mechanism”
- Generate Quality Alert OPL (with Photo of Defect & details)
- Discuss in DBS the Quality Alert issue with the Line team
(Sensitize to detect it, containment, prevent escape).
- Validate Containment implementation & effectiveness.
VOC Rec’d
Samples
Validation
Containment
3D
Defect Potential
Assessment
Root cause
Validation
CAPA Validation

5. Voice of Customer (VOC)
• Receive complaint and provide 8D report.
• Quality issue assign by Customer.
• Coordinate the complaint with the respective team member within 7 calendar days.
CUSTOMER QUALITY ISSUE
SKYWORKS/ SIGE
• Depress wire
• Material without label and ESD bag
TIM
• Foreign Material on die
• Oxide Layer Fault - Invalidate
• Ball short to metal
• Abnormal Mark - Invalidate
• Mold flash
• Package contamination
SITIME • Lifted Bond
ELMOS
• Delamination
• Wafer map offset picking
• Misalignment Marking
• Burrs on terminals, Epoxy height - Invalidate
• Top side chipping & Back side chipping
MAXIM • Broken wedge
MELEXIS • Different size tube
TAO
• Color filter void - DOE
• Sticky wafer ring - DOE
CUSTOMER COMPLAINT
Receive complaint
D0: Review current OCAP & FMEA
D1: Team Member
D2: Background/ FA analysis
D3: Containment Actions
D4: Fishbone analysis / Fault
tree analysis
D5: Permanent corrective
action plan
D6: Verification of
effectiveness
D7: Prevent recurrence
D8: Congratulate team
8D Format flow

6. CUSTOMER COMPLAINT
Cust Ref# / Date code
/ Package
Problem description Root cause / finding Action taken
Carsem Reference # :
ALPCML111101-1
Package type / Part
description :
MLPQ2.3X2.3_X1A
Part Date Code : 1121
Feedback from Skyworks end customer, Samsung on
the SKY13397. 2 units show crushed wires that
passed the original ATE test, but then failed after the
customer reflow. Three SKY13397-11 devices were
sent for Failure Analysis. The devices reportedly
failed for having shorted VBAT to GND.
Two devices (S/N 1, S/N 2) had bond wire mechanical
damage resulting in short circuit from VDD to GND
on the die. The short was relieved when the devices
were decapsulated and they were then normal.
Device S/N 3
had electrical damage (EOS) on the OUT1A
transistor. The electrical damage was the closest
channel to the IN1
connection, indicating that there may have been EOS
applied to IN1 Pin.
Lot details
Carsem Lot : ALP*E-J104ZFT-01F7
MES ID : S201114022002-01
Device : EN13397-388LF-1
Package : MLPQ2.3X2.3_X1A
Lot Quantity : 5560 units
Technician accidentally hit the wires of
defective units when
removing jammed lead-frame from machine
track of wire bond.
To establish a proper lead-frame handling procedure for
removing jammed lead-frame from machine track by
pushing the lead-frame at bottom of lead-frame rail.
Resp : BT Chong
Date : 2011 Nov 21
Status : Done
2. To define jammed lead-frame as critical event at wire
bond operation and update in wire bond spec to alert 3rd
optical operator to perform 100% inspection for the
affected strip. ( QCG000013)
Resp : CK Yiow
Date : 2011 Nov 21
Status : Done
3. To study machine indexer track sensitivity to improve
lead frame jam incident.
Resp : Dalmeet
Date : 2011 Nov 25
Status : Done. Please refer attachment on the
improvement study.
4. Conduct training for item 1 & 2.
Resp : BT Chong/CK Yiow
Date : 2011 Nov 30
Status : Done. Brief to all the process tech for 3 shifts.
1
2
Jammed Leadframe
Improvement.ppt
Briefing List
ALPCML111101-1.jpg
- Tweezer cross on the bond ball
(Similar to the complaint unit)
Handling!!!

7. CUSTOMER COMPLAINT
SIT SIMULATION
RESULT.PPT
Machine!!!

8. CUSTOMER COMPLAINT
Cust Ref# / Date code
/ Package
Problem description Root cause / finding Action taken
Carsem Reference # :
ALPCML111101-1
Package type / Part
description :
MLPQ2.3X2.3_X1A
Part Date Code / : 1121
Maxim Test feedback on lot # SDJTBBX that
encountered low yield during set-up. It was only
yielding 66% with contact open. Rejects were also
verified valid using hand test socket. 5 sample units
were submitted to FA for analysis. Out of the 5
units, 1 unit was decapsulated for internal wire
dressing assessment. Broken wedge was found on
this decapsulated unit.
Affected Lot Details
Device/Pkg : MAX8686ETL+, 40L 6x6 TQFN
Failure rate : 66%
Lot numbers : SDJTBB
Datecode : 1150
Combination factors which includes steep
landing angle, with high end parameters
and bonding sequence.
Possible – Based on the simulations results
a similar signature crack on the affected
pins was produced, the crack tends to
further worsen and break when adjacent
unit (leads with multiple bonding) are
bonded.
Steep landing angle on 2nd bond
1) Optimize the looping profile/parameter to minimize
trajectory/landing angle. This will lessen the
concentration of stress at the heel of the stitch that
causes broken stitch.
Responsible : BT Chong
Status : On-going (actual dies will be required)
3) To update spec ASYML3101 FMEA.
Responsible : BT Chong
Status : On-going
Date : Upon completion items D5.1 & D5.2.
To perform DOE plan to study and understand the steep
landing angle / looping profile with relation to crack /
broken wedge on lead and also to put in related controls
to prevent crack / broken wedge.
Responsible: Prem Chand/BT Chong
Status: On-going. DOE plan just drafted and awaiting for
the arrival of dices from customer to start up. Refer the
attached preliminary DOE plan as attached below. For
the DOE run estimated qty required are 790 units.
Method!!!

9. CUSTOMER COMPLAINT
Design Of Experiment
• To involved in proactively reducing variation and eliminating defects
• Formal way of maximizing information gained while resources required.
• A series of structured tests are designed in which planned changes are made to the input
variables of a process or system.
• The effects of these changes on a pre-defined output are then assessed.
TAO - color filter void

10. Design Of Experiment
TAO - Drop test
simulation on
the packaging
DOE result:

11. AUDIT
• Performed to ascertain the validity and reliability of information or control in the MLP line.
• Also to provide an assessment of a system’s internal control.
• Conducted several customer audit :
 TIM – BOAC wafer fan-out
 Maxim – Broken stitch fan-out
Carsem Response
TIM – BOAC wafer fan-out

12. AUDIT FAN OUT ITEM
FAN OUT ACTIONS
DESCRIPTION OF BEST PRACTICES
Items
CARSEM
(Elias / Anselm)
1. Tighten Lead Placement Requirement
Requirement - No bond allowed on half etch area. Bond must be placed on center of the effective solid part of the lead.
Actions:
a. Sub must implement Video Lead Locator (VLL) or any
equivalent lead locator feature of the bonder to improve the
machine detection on the wedge placement centering during
wire bond process.
1
Carsem Practise:
During 1st time programing (Master recipe generated), technician need to visually confirm that the
wedge placement is at the center of the lead finger.
When the golden recipe downloaded from RMS (recipe management system, the wedge placement
location is limited to have 2mil tolerance for adjustment (control under parameter "bond point
tolerance").
The downloaded program pattern need to be align back to the actual leadframe location using the
leadframe alignment points. (Top left connection bar & Bottom right connection bar)
b. Sub must define the effective solid part of the lead for
bonding (no half etch) per package code/leadframe type.
Include actual drawing and X-ray shots.
2
During setup, technician will visually confirm the wedge location located on the center of the lead.
Note: Carsem MLP is using etch leadframe, once the wedge placement is program at the center, the
wedge place can be control within 1 mil.
c. Each bonding diagram must be reviewed and revised to
show effective bonding area and the correct lead placement.
3
Carsem had set a guideline for the maximum wire that a lead can support / allow based on the lead
length.
d. Sub must define controls to ensure the requirement is met
during machine set-up, machine repair, device change,
capillary change, or when changes are made to already
qualified set-up.
4
For every machine set-up, device change, parameter change & capillary change, ball shear test and
wire pull test are required.
2. Eliminate High Ultrasonic Power Setting at Second Bond
Requirement - high ultrasonic power setting must be avoided to prevent micro vibration or high resonance effect to the bonds that causes bond fatigue (stitch stress marks).
Actions:
a. Sub must review current bonding parameters and revalidate
parameters from RSM DOE performed particularly those that
have high 2nd ultrasonic energy settings.
5
Carsem is using Thermal Compression for all wire sizes. (on 2nd bond / Wedge bond)
Bonding Temperature is 200 ± 0.5 °C
b. RE must audit all parameters and report areas needing
reoptimization to achieve reliable bonds with less ultrasonic
power.
6
c. Submit RSM DOE plan on problem areas.
7

13. 3. Eliminate Steep Loop Trajectory/Steep bond landing
Requirement - Reject any stitch bond that is landing in an angle (steep loop) and will finish with more than 20 deg angle on the
heel of stitch bond to prevent stress related damage . This is prone to bonds that are short.
Actions:
a. Review all bonding diagrams and identify products that are susceptible to steep looping trajectory and verify
actual looping trajectory. Any product what will violate requirement must be validated using actual bonding and
necessary adjustment will be made accordingly.
8 DOE is on going to have the steep looping study.
b. Review and revise assembly design rule spec and incorporate criteria for shortest wire without steep loop
trajectory issue.
9 DOE is on going to have the steep looping study.
4. Revamp SPC on Wirebond Bond Pull Test
Requirement - Change Bond Pull test procedure to include long wires, short wires, corner wires, down/ground bonds, double or
multiple bonds and the wire of adjacent unit opposite them to the samples of wires to be bond pull tested.
Actions:
a. Recalculate LCL and UCL and bring closer to the centerline. Redefine current SPC requirement to include
OCAP on readings that drifted, failed set-up, monitors and inspection.
10
SPC show that the SPC data is within LCL and UCL
for Maxim 2.0mil wire device. Carsem do have OCAP
for SPC OOC situation.
5. Improve Visual Monitor to check quality of the bonds
Requirement - Reject for any stress mark on the stitch bond. Quality monitors and set-up buy-offs must include visual inspection
of the bonds. To check for quality of the stitch bond, inspection at high magnification (200X and above) is a must.
Actions:
a. Reinforce SEM inspection or 200X minimum optical inspection during machine set-up, change of device, change
of wire or changes to already qualified parameter setting.
11
QA do have inspection on wedge formation using
minimum 200X.
6. Implement Lead placement monitor by utilizing X-ray monitor done during mold set-up
Requirement - Reject any bond that is placed on any part of the half etched area of the lead. Utilize the existing mold X-ray
monitor that is currently in place.
Actions:
a. Revise mold monitor spec to include criteria for bond placement in addition to existing criteria for wire sweeping,
internal voids, etc. and frequency of monitor required.
12
Based on current monitoring, Carsem do not monitor
for lead placement. Attach are the criteria that
Carsem monitor at Mold x-ray.b. Define Mold mold monitor - add criteria on lead placement, in addition to wiresweep, voids, etc. Update OCAP
accordingly.
13
AUDIT FAN OUT ITEM
DONE ON-GOING NOT APPLICABLE WITH CONCERNS
7 3 0 2 13

14. PROCESS FMEA CONVERSION
QA Engineering Roles:
• Coordinate with Process Engineers, Production & Maintenance to establish a Macro-Micro process flow.
• Weekly meeting with team to mitigate the risk of each process step.
• Target completion by end of Mac 2012.
• Weekly Reporting (every Friday) by package lines / process to Quality system engineer.
• QE been assign to follow up on certain process:
PROCESS STATUS SPEC NO. REMARK
Wire bond ~ 30% ASYML3101
Molding ~ 10% ASYML4102
Pick & place ~ 90% ASYML5601
Tape attach 100% ASYML1602
Status:
Completed / Buy-Off Accepted & Released
In-Progress & within schedule / Pending for ECN approval

15. PROBLEM SOLVING TECHNIQUE
 Identify & select problem
 Understand on the feedback / complaint receive
 Use historical data to look into the trend problem. ( Downtime, Yield, Processing
time)
 Understand and present situation
 Identify root cause
 4M method (Man, Method, Machine & Material)
 Fishbone diagram
 Plan improvement
 Work out solution for potential risk
 Evaluate improvement actions (validation in assy line)
 Execute Improvement
 Confirm results
 Standardize improvement
 Documentation (SOP / Spec)
 FMEA
.Proliferation (Best practices are deployed)
 Future plan
 Monitor the effectiveness of the implementation by Goal PPM / repeated issue.
TRAINING

16. Benefits /
Gain
Analytical thinking
LeadershipTeam work/ player
Communication skills
SUMMARY

17. END of PRESENTATION