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Version: R15.0
Moldex3D Series Product
2
> Introduction
– Overview of Moldex3D
> Highlight Features in R15.0
– New module
• In-mold Decoration simulation
• PU Ch...
Introduction
4
> World’s leading 3D CAE software for plastic injection molding
industries
> Long-term solutions for customers to ensure...
5
> Working closely with leading alliance partners for more integrated
simulation performance to take care of different in...
6
> Adopted by 3,200+ renowned companies and industries
> Prove Moldex3D capabilities of bringing quality solutions
Featur...
7
Non-Stop Technology Innovation
R9.1
R10.0
R9.0
R8.1
R3.x
R4.x
R7.0
R5.x
R7.1
R6.x
R8.0
Shell Gas
Shell FPCW
Solid RIM
So...
Powerful Pre-Processing
9
Boost Work Efficiency in Pre-processing
Meshing Features
Moldex3D Mesh
Support various solid meshing types with elements...
10
Boost Work Efficiency in Pre-processing
Meshing Features
High Resolution 3D Mesh Technology (BLM)
- Support auto mesh g...
11
More Pre-Processor Enhancement in R15.0
Designer Boundary Layer Mesh (BLM)
New Structural Mesh for Runner and Cooling C...
12
More Pre-Processor Enhancement in R15.0
Designer Boundary Layer Mesh (BLM)
Enhance Capability on Runner Meshing
- Suppo...
13
More Pre-Processor Enhancement in R15.0
Solvers
[Flow/Pack/Cool/Warp] Non-Matching Mesh Enhancement
- Extend non-matchi...
14
Meshing Technology Positioning
Design Validation
(eDesign)
Molding Innovation
(BLM)
Molding Innovation+
(Solid)
Automat...
15
Boost Work Efficiency in Pre-processing
Integrated Applications
Geometry Healing Tool (CADdoctor)
- Enable multi-CAD da...
16
Boost Work Efficiency in Pre-processing
Integrated Applications
CAD Interoperability (SYNC)
- Integrate with PTC® Creo®...
R15 Portfolio and Extended
Advantages
18
> Comprehensive solutions with series of simulation packages:
– eDesign Basic
– eDesign
– Professional (eDesign + BLM +...
19
> Full range of flow simulation capabilities
> Decide ultimate gate location, eliminate weld
lines and air traps with t...
20
> Full auto-meshing feature and intelligent
wizards with intuitive workflow
> Simple, fast, and efficient for your part...
21
> Include eDesign, BLM, and Tetra meshing
technologies
> Support auto-features of eDesign and robust
meshing capabiliti...
22
> Include eDesign, BLM, Tetra, and Solid
meshing technologies
> Increase mesh resolution with flexible
control of diver...
23
> More advanced modules for specific process
demands
> Flexible functionality extensions for
innovative process concept...
24
IC Packaging
> A complete series solution for IC Packaging
process
> Provide in-depth analysis, and optimize
IC Packagi...
Standard Injection Molding Solutions
26
Flow
Most Potential Issues are Fixed Here
> Simulate the filling process
> Optimize gate and runner design with minimum...
27
Pack
Shrinkage Compensation. Good Packing Leads to Good Dimension
Standard Analysis - 2/5
> Predict gate freeze time an...
28
Cool
Dominate the Cycle Time = Money
> Support cooling simulation with advanced analysis capabilities for mold and
cool...
29
Warp
Good Product with Perfect Shape Design
> Validate part deformed ratio of shrinkage effect and identify warpage cau...
30
Multi-Component Molding (MCM)
Precise multi-component molding analysis
> Simulate insert molding, overmolding, and mult...
DOE & Optimization
32
Expert
Design of Experiment for optimal analysis decision
> Create analysis variation and provide graphical summaries a...
Injection Molded Plastic Optics
34
Optics/Viscoelasticity (VE)
Enhance Warpage Calculation Accuracy
Optics
> Predict flow- or thermally-induced birefringe...
Meet Growing Demands of
Lightweight Composite Products
36
Fiber
Fiber Orientation Decides Product Structural Strength
> Support complete predictions of fiber orientation, length...
37
Stress
Deformed Behaviour Validation for Better Structure of Products
> Evaluate mechanical properties and deformation ...
38
FEA Interface
Interactive Structural Analysis with Leading FEA Software
> Integrate with leading software with differen...
39
Micromechanics Interface
Direct Data Output for Structure Performance Validation
> Give a plus for integration of Digim...
40
Digimat-RP
More Accurate Simulations of Composite Materials
> A joint product with e-Xstream engineering
> Bridge a str...
41
Compression Molding (CM)
Dynamic Performance for Wall Thickness Design
> Control the process variation after the compre...
42
Injection Compression Molding (ICM)
Enhanced Replication for the Parts with Micro Structures
> Visualize property chang...
43
Foam Injection Molding
Utilize Physical Foaming to Enhance Product Quality
> Visualize melt expansion behaviour of poly...
44
Resin Transfer Molding (RTM)
Predict Filling Behaviours of Resin through Fiber Mat
> Simulate the filling performance t...
45
Polyurethane (PU) Chemical Foaming
Bubble Properties Validation under the Chemical Response
> New capability for simula...
Injection Temperature Matters:
Heat and Cool Management
47
Cooling Channel Designer (CCD)
Efficient Cooling Channels Design for Conformal Cooling Analysis
> Create conformal cool...
48
Advanced Hot Runner
Manage Thermal Control to Enhance Molding Efficiency
> Support quick steady analysis for complex ho...
49
3D Coolant CFD
Enhance Cooling Efficiency
> Simulate water flow in 3D cooling channels to guarantee cooling efficiency
...
50
Conformal Cooling
Enhance Cooling Efficiency
> Provide more efficient method to build complex cooling channel layout
> ...
51
Transient Cool
Enhance Cooling Efficiency
> Support various dynamic variotherm technologies
– Heat & Cool™, Induction H...
Innovative Molding Processes
53
Gas/Water-Assisted Injection Molding (GAIM/WAIM)
3D Visualization of Dynamic Gas and Fluid Penetration
> Determine poly...
54
Powder Injection Molding (PIM)
Freedom of Shaping Metal/Ceramic Parts
> Simulate injection molding stage in the process...
55
Co-Injection
Optimize Two Materials Dynamic Combinations
> Visualize dynamic filling interactions of skin and core mate...
56
Bi-Injection
Two Separated Melt Entrance Setting for Filling Optimization
> Define two independent melt entrance and pr...
57
In-Mold Decoration (IMD)
Efficient Decoration Layers Simulation
> New module in R15.0 to support IMD film boundary cond...
Computing Technology
59
High Performance Parallel Computing
Stay Ahead with Enhanced Speed
> Utilize the strength of multi-core, multi-CPU, and...
IC Packaging
61
> An independent product series of encapsulation solutions for
specific IC Packaging industry applications
– Transfer m...
62
Transfer Molding / Molded Underfill
Predict Void Location and Improve Quality of Packaging
Mold Encapsulation Innovatio...
63
Capillary Underfill
Visualize Filling Patterns between Die and Substrate Driven by Capillary Flow
Mold Encapsulation In...
64
Wire Sweep Analysis
Wire Structure Optimization
> Provide full insights of molding behaviour to assess wire curves unde...
65
Paddle Shift Analysis
IC Components Validation Under the Filling Force Effect
> Predict the paddle shift effect due to ...
66
Compression Molding (Embedded Wafer Level Packaging)
Support Different Process Conditions for Compression Process in IC...
67
IC Packaging (Post Mold Curing)
Warpage Validation under the Cure Shrinkage Effect
IC Packaging (Filler Concentration)
...
Conclusion
69
> Moldex3D complete series products lead you to explore your ideas,
prove your concept of designs, boost collaborative ...
Introducción Moldex 3D General
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Introducción Moldex 3D General

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Introduction
Overview of Moldex3D
Highlight Features in R15.0
New module
In-mold Decoration simulation
PU Chemical Foaming
Function Enhancements
New runner meshing technology
New structural mesh for runner and cooling channel
Non-matching mesh enhancement
Moldex3D R15.0 Portfolio and Extended Advantages
Moldex3D Products Summary

Publié dans : Logiciels
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Introducción Moldex 3D General

  1. 1. Version: R15.0 Moldex3D Series Product
  2. 2. 2 > Introduction – Overview of Moldex3D > Highlight Features in R15.0 – New module • In-mold Decoration simulation • PU Chemical Foaming – Function Enhancements • New runner meshing technology • New structural mesh for runner and cooling channel • Non-matching mesh enhancement > Moldex3D R15.0 Portfolio and Extended Advantages > Moldex3D Products Summary Contents
  3. 3. Introduction
  4. 4. 4 > World’s leading 3D CAE software for plastic injection molding industries > Long-term solutions for customers to ensure efficiency and mold savings in product design process > With over years heritage of analysis experiences, Moldex3D has made its success convincing its simulation capability for a wide variety of industry applications Iteration
  5. 5. 5 > Working closely with leading alliance partners for more integrated simulation performance to take care of different industrial needs > Help our customers increase productivity and improve time to market Integrated Solutions Product Lifecycle Management Molding Innovation
  6. 6. 6 > Adopted by 3,200+ renowned companies and industries > Prove Moldex3D capabilities of bringing quality solutions Featured Customers Automobile High Tech/Electronics Material/Equipment
  7. 7. 7 Non-Stop Technology Innovation R9.1 R10.0 R9.0 R8.1 R3.x R4.x R7.0 R5.x R7.1 R6.x R8.0 Shell Gas Shell FPCW Solid RIM Solid Fiber Solid FPCW Solid Mesh Enhanced Flow Parallel-SMP Tetra Mesh Solid MCM Solid I2 Hybrid Mesh Parallel- Cluster Windows x64 BLM Enhanced FastCool eDesign Optics Viscoelastic Transient Cool License Manager RHCM IC Packaging Optical Molding Automatic 3D Meshing Cooling Optimization Insert Molding Two-Color Molding FEA Integration Mold Insert Complete 3D Solid Simulations Remote Computing Solid Warp+ BLM+ eXplorer ICM Stress Remote Computing on Linux NX, Creo Embedded Design Verification Conformal Cooling Cloud Computing 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 R12.0 R11.0 Advanced Hot Runner Co-Injection Gas / Water Injection MuCell® DOE HyperWorks Partner Alliance Designer Underfill SolidWorks Embedded Viewer Underfill Project Microcellular Foaming eDesignSYNC Injection Compression PIM/MIM Compression Molding Bi-injection Annealing FSI Cloud Computing+ R13.0 Fiber+ Designer BLM CCD Cadence Interface 2014 Mold Deformation Customization R14.0 Moldex3D Digimat-RP Designer BLM+ Fiber+ Hot Runner Steady 2015 CADdoctor RTM Resin Transfer Molding MuCell®+ F/P/W+ 2016 R15.0 PU Chemical Foaming Runner Technology+ Non- matching mesh+ 2017 Public Cloud IMD+
  8. 8. Powerful Pre-Processing
  9. 9. 9 Boost Work Efficiency in Pre-processing Meshing Features Moldex3D Mesh Support various solid meshing types with elements of tetra, voxel, and hybrid Automatic 3D Meshing Engine (eDesign) - Full auto-meshing features and powerful wizards - User-friendly interface with intuitive setting guidance - Simple, fast, and efficient modeling and variant mesh preparation
  10. 10. 10 Boost Work Efficiency in Pre-processing Meshing Features High Resolution 3D Mesh Technology (BLM) - Support auto mesh generation with more precise quality for model preparation, especially for complicated 3D geometry - Enhance solver accuracy for viscous heating, pressure simulation, and warpage prediction - Support tetra elements, boundary layer mesh (BLM) and robust non-matching technology - Accurate, precise, and efficient for advanced molding processes Hybrid Mesh Technology - Create mesh manually for customized purpose - Increase mesh resolutions significantly with acceptable element count - Control uniform or biasing mesh pattern and element layer count in thickness direction - Support tetra, pyramid, prism, and hexahedral elements - Flexible, delicate, and accurate for complex geometry shapes
  11. 11. 11 More Pre-Processor Enhancement in R15.0 Designer Boundary Layer Mesh (BLM) New Structural Mesh for Runner and Cooling Channel - Hexa-based solid runner mesh - More connecting node types for line runner - Real time setting verification New in R15.0
  12. 12. 12 More Pre-Processor Enhancement in R15.0 Designer Boundary Layer Mesh (BLM) Enhance Capability on Runner Meshing - Support mixed type to construct runner system with combination of curve and geometry runner/gate - Regular auto solid runner mesh for more complex layout - Better mesh resolution and less element count New in R15.0
  13. 13. 13 More Pre-Processor Enhancement in R15.0 Solvers [Flow/Pack/Cool/Warp] Non-Matching Mesh Enhancement - Extend non-matching technology for mold insert and moldbase, besides cooling channels and heating rod - Provide better continuity and accuracy for cooling analysis result Moldbase Mold base Part Part Insert New in R15.0
  14. 14. 14 Meshing Technology Positioning Design Validation (eDesign) Molding Innovation (BLM) Molding Innovation+ (Solid) Automatic meshing Automatic meshing Advanced manual meshing (Tetra, Hexa, Prism, Pyramid, Hybrid) CAD/PLM integration CAD/PLM integration Process optimization Process optimization Innovative process supports Easy, fast, efficient Accurate, precise, efficient Customized, delicate, accurate
  15. 15. 15 Boost Work Efficiency in Pre-processing Integrated Applications Geometry Healing Tool (CADdoctor) - Enable multi-CAD data exchange between Moldex3D pre-processing and multi-CAD platforms - Fix the defects of part and simplify the complicated geometry structure with high-quality surfaces and entities for better BLM generation
  16. 16. 16 Boost Work Efficiency in Pre-processing Integrated Applications CAD Interoperability (SYNC) - Integrate with PTC® Creo®, NX, and SOLIDWORKS® - Provide automatic mesh engine and intelligent wizards for CAE analysis and help to build a complete injection molding system in CAD environment - Synchronize design changes with simulations to effectively optimize the process settings - Enable CAD users to quickly validate part designs directly in familiar CAD/CAM environments NXPTC® Creo® SOLIDWORKS®
  17. 17. R15 Portfolio and Extended Advantages
  18. 18. 18 > Comprehensive solutions with series of simulation packages: – eDesign Basic – eDesign – Professional (eDesign + BLM + Tetra) – Advanced (eDesign + BLM + Tetra + Hybrid) > More specific solutions for innovative process demands: – IC Packaging – Solution Add-on > One license for both thermoplastics and thermosets (* excluding IC Packaging) Moldex3D R15 Product Portfolio
  19. 19. 19 > Full range of flow simulation capabilities > Decide ultimate gate location, eliminate weld lines and air traps with the filling behavior prediction eDesign Basic Package Included Modules > Designer > Flow > Parallel Processing*4 > Project
  20. 20. 20 > Full auto-meshing feature and intelligent wizards with intuitive workflow > Simple, fast, and efficient for your part design validation eDesign Package Included Modules > Designer > Flow > Pack > Cool > Warp > MCM > Parallel Processing*4 > Project > Solution Add-ons* * optional
  21. 21. 21 > Include eDesign, BLM, and Tetra meshing technologies > Support auto-features of eDesign and robust meshing capabilities > Enhanced simulation efficiency for exact molding innovation Professional Package Included Modules > Designer > Designer BLM > 3D Coolant CFD > Flow > Pack > Cool > Warp > MCM > Parallel Processing*8 > Project > Solution Add-ons* * optional
  22. 22. 22 > Include eDesign, BLM, Tetra, and Solid meshing technologies > Increase mesh resolution with flexible control of diverse mesh elements creation > Give in-depth validation and bring innovation for the highest complex processes Advanced Package Included Modules > Designer > Designer BLM > 3D Coolant CFD > Flow > Pack > Cool > Warp > MCM > Parallel Processing*12 > Project > Solution Add-ons* * optional
  23. 23. 23 > More advanced modules for specific process demands > Flexible functionality extensions for innovative process concepts Solution Add-on Included Modules New in R15.0 > SYNC > CADdoctor > Expert > Optics > VE > Fiber > Stress > FEA Interface > Micromechanics Interface > Digimat-RP > Compression Molding > Injection Compression Molding > Foam Injection Molding > Resin Transfer Molding > Transient Cool > 3D Coolant CFD > Advanced Hot Runner > Cooling Channel Designer > GAIM /WAIM > Co-Injection > Bi-Injection > Powder Injection Molding > In-mold Decoration > PU Chemical Foaming
  24. 24. 24 IC Packaging > A complete series solution for IC Packaging process > Provide in-depth analysis, and optimize IC Packaging layout design Included Modules > Mesh > Designer > Cadence Interface* > Flow > Cure > Cool > Warp > MCM > Stress > FEA Interface > Compression Molding* > Underfill* > Viscoelasticity (VE)* > Wire Sweep > Paddle Shift > Post Mold Cure* * optional > Project > Parallel Processing*8
  25. 25. Standard Injection Molding Solutions
  26. 26. 26 Flow Most Potential Issues are Fixed Here > Simulate the filling process > Optimize gate and runner design with minimum weld lines, air traps, burn marks, and short shot problems > Optimize process conditions in filling stage, such as injection time, melt temperature, etc Standard Analysis - 1/5 > Provide coupled solvers to simulate Flow/Pack/Cool/Warp with synchronous data exchange > More effective temperature result can be performed New in R15.0
  27. 27. 27 Pack Shrinkage Compensation. Good Packing Leads to Good Dimension Standard Analysis - 2/5 > Predict gate freeze time and estimate effective packing profile for average pressure effect > Minimize sink marks and flash problems, etc > Predict the volumetric shrinkage and requirement of clamping force to minimize warpage control
  28. 28. 28 Cool Dominate the Cycle Time = Money > Support cooling simulation with advanced analysis capabilities for mold and cooling circuit designs – Transient cool – Variotherm – Conformal cooling – 3D coolant CFD > Control mold temperature variations to optimize cooling efficiency and minimize part warpage Standard Analysis - 3/5 1 bar 0.1 bar
  29. 29. 29 Warp Good Product with Perfect Shape Design > Validate part deformed ratio of shrinkage effect and identify warpage causes > Evaluate fiber orientation, residual stress and material viscoelasticity effects on warpage > Provide flatness to evaluate the warpage of surface plane > Provide Enhanced Warp analysis to consider transient effect in mold Standard Analysis - 4/5 New in R15.0 > Consider the film effect for better warpage results, and predict final part shape
  30. 30. 30 Multi-Component Molding (MCM) Precise multi-component molding analysis > Simulate insert molding, overmolding, and multi-shot sequential molding processes > Evaluate interactions of different materials, and consider the material properties to minimize warpage and delamination > Evaluate core deflection by unbalanced flow > Detect potential re-melt issue Standard Analysis - 5/5 Note: One-way FSI is supported. Two-way FSI analysis needs an additional Stress license
  31. 31. DOE & Optimization
  32. 32. 32 Expert Design of Experiment for optimal analysis decision > Create analysis variation and provide graphical summaries automatically > Use efficient DOE method to quickly obtain optimal process conditions for part quality evaluation An Effective Tool for Optimized Result Original warpage: 0.41 mm Optimized warpage: 0.17 mmFound the best result Objective 3 variables, each with 3 values
  33. 33. Injection Molded Plastic Optics
  34. 34. 34 Optics/Viscoelasticity (VE) Enhance Warpage Calculation Accuracy Optics > Predict flow- or thermally-induced birefringence, retardation, polarization, fringed orders, and fringed patterns > Integrate with CODE V for further non-uniform refractive index prediction Viscoelasticity (VE) > Analyze the viscous and elastic properties of polymeric materials > Support warpage analysis for further part deformed evaluation > Simulate with Moldex3D Optics module to validate flow-induced residual stress effect, and optimize optical properties Realistic Material Characteristics of Plastics
  35. 35. Meet Growing Demands of Lightweight Composite Products
  36. 36. 36 Fiber Fiber Orientation Decides Product Structural Strength > Support complete predictions of fiber orientation, length, breakage, and concentration for short and long fiber-reinforced plastics > Support flake orientation simulation > Evaluate the strength of parts and weld line regions > Further consideration of screw-induced fiber analysis > Provide validations of product dimensional stability and the resistance to deformation Fiber Reinforced Plastics Flake orientation indicates flow mark and weld line on the surface
  37. 37. 37 Stress Deformed Behaviour Validation for Better Structure of Products > Evaluate mechanical properties and deformation behaviour under certain external loadings > Support core shift analysis of core deflection simulation with inserts and fluid interaction > Support annealing simulation with Viscoelasticity Stress and Deformation Core Shift Note: Core Shift analysis is supported in Solid projects, except IC Packaging, ICM, and CM Total displacement
  38. 38. 38 FEA Interface Interactive Structural Analysis with Leading FEA Software > Integrate with leading software with different results format output – ANSYS / ABAQUS / LS-DYNA / MSC-Nastran / Marc / OptiStruct > Provide user interoperability with ANSYS Workbench and ABAQUS interface output efficiency > Support direct data output and 3D results mapping for efficient structural performance validation Integrated Interfaces for Structural Analysis
  39. 39. 39 Micromechanics Interface Direct Data Output for Structure Performance Validation > Give a plus for integration of Digimat and Converse to bring an enhanced prediction accuracy of structural behaviour with direct data output of: – Weld line – Fiber Orientation – Flow-induced residual stress – Temperature – MuCell® Integrated Interfaces for Structural Analysis Fiber orientation MuCell® Structural FEA Micromechanics Interface Composite material analysis FEA software Nonlinear analysis LS-DYNA
  40. 40. 40 Digimat-RP More Accurate Simulations of Composite Materials > A joint product with e-Xstream engineering > Bridge a straight-forward workflow from Moldex3D injection molding to Digimat advanced material non-linear analysis > Give more accurate structural non-linear material validation of reinforced plastic parts Better Non-linear Modeling Simulation New in R15.0 > Support automatic reverse engineering for material model generation based on experiment data Moldex3D Fiber orientation Moldex3D Stress Solver Linear behavior Moldex3D FEA Interface Moldex3D Micromechanics Interface Moldex3D Digimat-RP FEA software Non-linear behaviors ▪Failure ▪Large deformation ▪Crack FEA software Linear behavior
  41. 41. 41 Compression Molding (CM) Dynamic Performance for Wall Thickness Design > Control the process variation after the compression to decide the charge design > Predict optimized compression conditions for perfect shape of large and fairly intricate parts > Simulate with fiber length orientation to avoid degradation, bleeding or flashing, and optimize product strength Better Control of Compression Process Pressure distribution Fiber orientation New in R15.0 > Integrate with LS-DYNA to provide more accurate compression molding process from solid deformation stage to liquid filling stage
  42. 42. 42 Injection Compression Molding (ICM) Enhanced Replication for the Parts with Micro Structures > Visualize property changes in the compression molding process > Support with VE and Optics analysis for thin and flat products to optimize residual stress, shrinkage, and warpage Solution to Micro Structures Smaller shrinkage variation Compression birefringence effect Velocity vector movements prediction
  43. 43. 43 Foam Injection Molding Utilize Physical Foaming to Enhance Product Quality > Visualize melt expansion behaviour of polymer-gas during microcellular foaming process > Visualize cell size and density distribution with considerations of cell nucleation and growth > Evaluate surface quality and bubble effect to reduce weight, tonnage, and shrinkage, etc > Support core-back feature for better understanding of gas volume fraction variation of cell distribution > Provide cell size and density data output to Digimat for structural performance validation Make Products Lighter New in R15.0 > Support CBA material simulation as an initial gas concentration option for thermoplastic analysis MuCell® is a registered trademark of Trexel, Inc.
  44. 44. 44 Resin Transfer Molding (RTM) Predict Filling Behaviours of Resin through Fiber Mat > Simulate the filling performance to the effects on different fiber mat types and orientation > Predict the filling behaviours in thickness direction to find the cure reaction trend and optimal control of resin infusion Large Dimension Composite Molding Technique
  45. 45. 45 Polyurethane (PU) Chemical Foaming Bubble Properties Validation under the Chemical Response > New capability for simulation of polyurethane (PU) chemical foaming processes > Predict the bubble variation and density distribution under the chemical effects > Ensure a desired volume-to-weight ratio of the product Make Products Lighter New in R15.0
  46. 46. Injection Temperature Matters: Heat and Cool Management
  47. 47. 47 Cooling Channel Designer (CCD) Efficient Cooling Channels Design for Conformal Cooling Analysis > Create conformal cooling channels automatically based on the contour of product > Provide a fast and intuitive workflow to build complex cooling system > Observe the flow behaviour inside the channels with further 3D Coolant CFD analysis Cooling Channel Design Tool
  48. 48. 48 Advanced Hot Runner Manage Thermal Control to Enhance Molding Efficiency > Support quick steady analysis for complex hot runner system > Enable to prepare mesh at air gap region and visualize temperature distribution for better heating rod/coil design verification > Visualize melt temperature, pressure, and flow rate distribution inside hot runner > Improve thermal uniformity, optimize heating cycle, and prevent degradation of plastic material Insights of Thermal and Flow in Melt Delivery
  49. 49. 49 3D Coolant CFD Enhance Cooling Efficiency > Simulate water flow in 3D cooling channels to guarantee cooling efficiency > Visualize the streamline properties and predict hot spots along the conformal cooling channels > Optimize cooling system design and achieve cycle time reduction More Analysis Features for Cooling System Management New in R15.0 > Provide new 3D CFD solver with more powerful computing kernel to deliver more stability and realistic predictions for complicated coolant design
  50. 50. 50 Conformal Cooling Enhance Cooling Efficiency > Provide more efficient method to build complex cooling channel layout > Predict stream line, pressure loss, and velocity/temperature results inside the pipes to evaluate the dead end > Validate the pipe surface roughness effects and provide information for cooling system design revision > Minimize cooling rate difference through the whole part More Analysis Features for Cooling System Management Different velocity
  51. 51. 51 Transient Cool Enhance Cooling Efficiency > Support various dynamic variotherm technologies – Heat & Cool™, Induction Heating Molding (IHM), and Electricity Heating Mold (E-Mold), etc > Visualize the temperature variation to decide melt fluidity in filling stage and verify the target mold temperature during heating and cooling stages > Further improve part quality within a reasonable cycle time More Analysis Features for Cooling System Management
  52. 52. Innovative Molding Processes
  53. 53. 53 Gas/Water-Assisted Injection Molding (GAIM/WAIM) 3D Visualization of Dynamic Gas and Fluid Penetration > Determine polymer and gas entrances positions with proper injection time and injection volume of plastic and gas > Optimize skin thickness and core-out ratio distribution to predict corner effect and blow through Even Skin/Core Ratio Distribution Control
  54. 54. 54 Powder Injection Molding (PIM) Freedom of Shaping Metal/Ceramic Parts > Simulate injection molding stage in the process workflow > Visualize flow behaviours of feedstock > Consider the impact on powder concentration and predict black lines due to phase separation of powder and binder Monitor Powder Concentration Performance Black line prediction Weld line prediction
  55. 55. 55 Co-Injection Optimize Two Materials Dynamic Combinations > Visualize dynamic filling interactions of skin and core materials > Optimize geometry thickness and process conditions based on blow through prediction > Identify temperature imbalance and pressure resistance variations and optimize shrinkage and warpage Two Sequential Materials on Skin/Core Variation Blow through occurred
  56. 56. 56 Bi-Injection Two Separated Melt Entrance Setting for Filling Optimization > Define two independent melt entrance and process parameters for different materials > Visualize the two melt front advancement and predict the potential weld lines to optimize gate design Two Materials Filling Behaviour
  57. 57. 57 In-Mold Decoration (IMD) Efficient Decoration Layers Simulation > New module in R15.0 to support IMD film boundary condition (BC) setting with minimum human effort for model preparation > Provide wash-out index to better predict the wash-off ink decoration of the film > Predict the issues by considering injection speed and temperature effects Ensure Successful Decorative Products Thermal effect with IMD film Thermal effect without IMD film New in R15.0
  58. 58. Computing Technology
  59. 59. 59 High Performance Parallel Computing Stay Ahead with Enhanced Speed > Utilize the strength of multi-core, multi-CPU, and multi-PC cluster > Provide multiple remote computing farms for more efficient calculation on single computer with high analysis efficiency High Performance Parallel Processing Remote computing
  60. 60. IC Packaging
  61. 61. 61 > An independent product series of encapsulation solutions for specific IC Packaging industry applications – Transfer molding / Molded underfill – Capillary Underfill – Wire sweep – Paddle shift – Compression molding – Post mold cure warpage – Filler concentration > Complete validation of the mounting process from substrate to chip, including the interconnection between microchips and wire bonding, to identify IC components and drag force of resin flow IC Packaging Encapsulation Innovation
  62. 62. 62 Transfer Molding / Molded Underfill Predict Void Location and Improve Quality of Packaging Mold Encapsulation Innovation > Demonstrate the impact to flow behaviour to predict the defects such as voids, air traps, short shot, and race track > Provide solution to process of filling and curing phenomenon Ref: Jonathan Tamil, et. al. “Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Moldable Underfill Technology”, IMAPS, 2011
  63. 63. 63 Capillary Underfill Visualize Filling Patterns between Die and Substrate Driven by Capillary Flow Mold Encapsulation Innovation > Demonstrate flow behaviour under capillary phenomena during the dispensing process > Minimize the impact of surface tension, and consider the drag force on cavity wall > Simulate with the aim of obtaining a balanced melt front to reduce contact angle and avoid voids > Ensure moldability and increase reliability of flip chip packaging design
  64. 64. 64 Wire Sweep Analysis Wire Structure Optimization > Provide full insights of molding behaviour to assess wire curves under the impact of drag force, such as: – Wire deformation – Wire sweep index – Wire crossover > Enable to export linear or non-linear data of wire stress-strain behaviour to ANSYS and ABAQUS > Predict excessive amount of wires deformation and provide significant indicator of wire structural performance optimization Mold Encapsulation Innovation Wire-to-wire short Wire breakage © David Hsu
  65. 65. 65 Paddle Shift Analysis IC Components Validation Under the Filling Force Effect > Predict the paddle shift effect due to unbalanced force loading from EMC flow during encapsulation Mold Encapsulation Innovation Unbalanced pressure loading from EMC flow ChipLeadframe (a) Before deflection (b) After deflection
  66. 66. 66 Compression Molding (Embedded Wafer Level Packaging) Support Different Process Conditions for Compression Process in IC Packaging > Apply in compression molding, embedded wafer level packaging, no flow underfill, or non conductive paste > Examine the molding behaviour on stacked-die and substrate under the compression force effect > Visualize die shift behaviour and maximum shear stress distribution on wafer, wire sweep behaviors during molding Mold Encapsulation Innovation
  67. 67. 67 IC Packaging (Post Mold Curing) Warpage Validation under the Cure Shrinkage Effect IC Packaging (Filler Concentration) Filler Particles Behaviours Validation for An Even Concentration Distribution Mold Encapsulation Innovation > Predict the warpage behaviours affected by CTE mismatch and cure shrinkage effects > Accurately control the inherent stresses and validate the amount of warpage > Predict filler particles simulation to observe how the particles aggregate, how the concentration varies, and find an optimal gate design to achieve an uniform distribution > Simulate with Moldex3D Powder Injection Molding module to have in-depth verification of inner structure on IC products design
  68. 68. Conclusion
  69. 69. 69 > Moldex3D complete series products lead you to explore your ideas, prove your concept of designs, boost collaborative relationship, and keep business innovative ahead market > From start to finish, Moldex3D takes care of all the steps no matter from CAD design, CAE simulation to manufacturing > Definitely build your confidence to quality products and create competitiveness with industries Moldex3D Product

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