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YOLE DEVELOPPEMENT
FROM TECHNOLOGIES TO MARKET
COLLABORATION
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 AP Growth
Presentation Outline
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YOLE DEVELOPPEMENT
Introduction
YOLE DEVELOPPEMENT
FROM TECHN...
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Yole – A Group of Companies
The company is involved in the fo...
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Providing:
 market analysis
 technology evaluation
 strate...
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Providing:
 market analysis
 technology evaluation
 strate...
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Yole’s research is focused on:
 Applicative Packaging: movin...
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8 Increased integration and flexible packaging solutions
 Incr...
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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From TECHNOLOGIES to MARKET
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Fan-Out vs. Fan-In and Flip-Chip
1 2 3 5 Package/IC
size ra...
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From TECHNOLOGIES to MARKET
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Fan-Out Applications
Typical view of a smart phone board
RF
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Advanced Packaging Role after Moore’s Law: Transition from Technology Node Era to Functionality Era 2016 Presentation by Rozalia Beica of Yole Developpement at XXX conference

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The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
Small-form-factor
Lightweight technology
Low-profile technology
High-pin-count technology
High-speed technology
High Reliability
Improved thermal management
Lower cost

Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
• Reduced form factor
• Low cost
Demand is reaching available capacity
Technology innovation in fan-in WLP continues:
• Die size increases
• Bump pitch reduces
Foundry involvement is no longer a dent in fan-in WLP production
Increased activity of Chinese capital on the market
New applications are emerging while other are declining
• Disruptions also expected in the MEMS and CIS domains
• Internet of Things

Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole

Publié dans : Technologie
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Advanced Packaging Role after Moore’s Law: Transition from Technology Node Era to Functionality Era 2016 Presentation by Rozalia Beica of Yole Developpement at XXX conference

  1. 1. Copyrights © Yole Développement SA. All rights reserved. 1 1 YOLE DEVELOPPEMENT FROM TECHNOLOGIES TO MARKET COLLABORATION INNOVATION NEW PERSPECTIVES Advanced Packaging Role after Moore’s Law Transition from Technology Node Era to Functionality Era 13 January 2016 Rozalia Beica
  2. 2. Copyrights © Yole Développement SA. All rights reserved. 2 2  AP Growth Presentation Outline 2 Y O L E D E V E L O P P E M E N T 2 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T • Europea n Market  AP Platforms  WLCSP  Conclusions  Flip-Chip  Fan-Out  2.5D & 3D-IC  Market Drivers  Evolution  Platforms  Computing Trends
  3. 3. Copyrights © Yole Développement SA. All rights reserved. 3 3 YOLE DEVELOPPEMENT Introduction YOLE DEVELOPPEMENT FROM TECHNOLOGIES TO MARKET Founded in 1998 in Lyon, France Introduction
  4. 4. Copyrights © Yole Développement SA. All rights reserved. 4 4 Yole – A Group of Companies The company is involved in the following areas: From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Finance MEMS & Sensors Microfluidics & Bio Tech Photovoltaics LED & Compound Semi Materials Advanced Packaging Photonics Power Electronics Equipment Rev. Eng./Costing Intellectual PropertyMarket, technology & strategy consulting Manufacturing costs analysis Reverse engineering M&A operations Due diligences IP Analysis Patent Assessment Fundraising Maturation of companies IP Portfolio Management Innovation Mgmt.
  5. 5. Copyrights © Yole Développement SA. All rights reserved. 5 5 Providing:  market analysis  technology evaluation  strategic analysis  business plan  finance  …. Consultancy across multiple fields and entire value chain Serving the Entire Value Chain across Multiple Fields Non-exhaustive list of clients From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Transportation makers Mobile & consumer electronics Automotive Medical systems Industrial & defense Energy From A to Z…
  6. 6. Copyrights © Yole Développement SA. All rights reserved. 6 6 Providing:  market analysis  technology evaluation  strategic analysis  business plan  finance  …. Consultancy across multiple fields and entire value chain Serving the Entire Value Chain across Multiple Fields Non-exhaustive list of clients From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Integrators and end- users Device makers OSAT, foundries… R&D centers Financial Investores etc. Suppliers: Equipment & Materials
  7. 7. Copyrights © Yole Développement SA. All rights reserved. 7 7 Yole’s research is focused on:  Applicative Packaging: moving to high performance, low cost, application driven packaging techniques  Advanced Packaging: moving to high performance, low cost, collective wafer level packaging techniques Semiconductor Packaging Camera Level Packaging Power Module Packaging MEMS Packaging LED Packaging Lead-Frame LCC Wirebonding BGA WLCSP 3D WLP SIP 3DIC QFN PGA Flip Chip POP FOWLP 2.5D Interposer 7 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T
  8. 8. Copyrights © Yole Développement SA. All rights reserved. 8 8 Increased integration and flexible packaging solutions  Increased volumes  Growing applications  More users Computing Trends New Major Technology Cycles 10x More Users, Devices  Increased performance  Smaller form factor  Increased functionality  Reduced cost Mainframe Mini-computers PCs Desktop internet Mobile Internet Internet of Things 1MM+ 10MM+ 100MM+ 1Bill+ 10Bill+ 10Bill+ 1960 1970 1980 1990 2000 2010 2020 2030 2040…
  9. 9. Copyrights © Yole Développement SA. All rights reserved. 9 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 9 Y O L E D E V E L O P P E M E N T http://ec.europa.eu/digital-agenda/en/about-mobility The Driving Forces are Changing From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Driver Mainframe computers Fixed personal computer Mobile Consumer Internet of Things and the Cloud Key success Parameters 1. Performance 2. Cost 1. Cost 2. Performance 1. Cost 2. Power 3. Performance 4. Size 1. Cost 2. Power 3. Latency 4. Bandwidth density 5. Size Adapted after Bill Bottoms – ECS 2014, Orlando Time Wired Wireless
  10. 10. Copyrights © Yole Développement SA. All rights reserved. 10 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 10 Y O L E D E V E L O P P E M E N T Silicon / Interconnection trend 500 020406080100 Number I/O per cm² 20.000 10.000 1500 CMOS90 CMOS45 CMOS28 CMOS16 CMOS65 FinFET Technology Node CMOS [nm] Scaling of Transistor Nodes => I/Os Density Increase
  11. 11. Copyrights © Yole Développement SA. All rights reserved. 11 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 11 Y O L E D E V E L O P P E M E N T  Continue with development of advanced technology nodes (follow Moore’s Law)  Develop new alternative technologies/packages (More than Moore) in order to be able to meet the market requirements: What Options Do We Have?  The CMOS transistors continue to shrink but at the increase of fab expenses.  Although performance is increasing, the same trend of reduced cost has reached its end
  12. 12. Copyrights © Yole Développement SA. All rights reserved. 12 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 12 Y O L E D E V E L O P P E M E N T 3D Integration: Packaging Added Value Hybrid Memory Cube More Moore : miniaturization 130nm 90nm 65nm 45nm 32nm 22nm 14nm 10nm Analog +RF PassivesPowerSensorsEnergy Sources Biochips MoreThanMoore:diversification SoC SiP IPD RF CMOS SMOS Analog Power Low Power CMOS High Perf. SOI Non volatile Memory GaAs RF MEMS … 3DIC technology is seen today as a new paradigm for the future of the semiconductor industry, as it will enable several more decades of chip evolution at ever lower cost, higher performance and smaller-size features. …
  13. 13. Copyrights © Yole Développement SA. All rights reserved. 13 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 13 Y O L E D E V E L O P P E M E N T Microelectronics Packaging Evolution Surface Mount Ball grid arrays SiPs WLCSP FC BGA PoP More SiPs WLCSP Flip-Chip Fan-Out Interposers 3DIC SiP 1980 TechnologyIntroduction GapFeaturesSivsPCB Through hole Mature 1970 1990 2000 2010 DIP, PGA SOP, QFP, PLCC CSPs/BGAs Today Established Emerging Feature sizes CMOS Bridging the Gap Between Si and PCB Processing Capabilities Feature sizes of PCBs
  14. 14. Copyrights © Yole Développement SA. All rights reserved. 14 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 14 Y O L E D E V E L O P P E M E N T Advanced Packaging Evolution The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:  Small-form-factor  Lightweight technology  Low-profile technology  High-pin-count technology  High-speed technology  High Reliability  Improved thermal management  Lower cost Increased functionality, speed, higher bandwidth, increased I/Os, … Complexity: Lead-frame based Packages Wirebonded FCBGA Through Silicon Via FCCSP PoP, PiP 3D Wirebonding …. 3D SiP Performance:
  15. 15. Copyrights © Yole Développement SA. All rights reserved. 15 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 15 Y O L E D E V E L O P P E M E N T Advanced Packaging Platforms Leadframes QFN,QFP w/o IC substrates Fan-in Fan-out IC substrates-based BGA (organic substrate) W/B BGA Flip Chip BGA 3DIC Interposer based (Si, Glass, Org) SiP Embedded die (in substrate) PCB substrate Increased functionality, I/Os, integration complexity Interconnect: Single die Multiple Dies FO MCP Integration:2D 3D Embedded die (in substrate) 3D Stacking SiP Bumping, Pillars, Studs, Through-silicon-via, Bump-less, Embedded Technologies...
  16. 16. Copyrights © Yole Développement SA. All rights reserved. 16 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 16 Y O L E D E V E L O P P E M E N T Fan-In WLCSP Market Drivers & Activities  Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages: • Reduced form factor • Low cost  Demand is reaching available capacity  Technology innovation in fan-in WLP continues: • Die size increases • Bump pitch reduces  Foundry involvement is no longer a dent in fan-in WLP production  Increased activity of Chinese capital on the market  New applications are emerging while other are declining • Disruptions also expected in the MEMS and CIS domains • Internet of Things Mobile sector is driving fan-in WLP production and growing IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole Mobile
  17. 17. Copyrights © Yole Développement SA. All rights reserved. 17 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 17 Y O L E D E V E L O P P E M E N T CPU Drivers Devices packaged using ‘Fan-in’ WLP Discrete passives Devices using other packaging technologies (not ‘Fan-in’ WLP WLCSP ICs in Handsets WLCSP 27% Others 73% WLCSP 35% Others 65% WLCSP 33% Others 67% Samsung Galaxy S6 Huawei Ascend Mate 7 iPhone 6+  Avg. 30% WLCSP packages in the latest high end smartphones!
  18. 18. Copyrights © Yole Développement SA. All rights reserved. 18 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 18 Y O L E D E V E L O P P E M E N T Flip Chip Market Drivers & Benefits CPUs / GPUs/chipsets, the earlier adopters of flip chip Has transitioned to other devices – due to several benefits it can bring
  19. 19. Copyrights © Yole Développement SA. All rights reserved. 19 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 19 Y O L E D E V E L O P P E M E N T Flip Chip Markets  Applied across several different markets …and much more! Consumer Automotive Medical Industrial Mobile/wireless Computing Smartphones Tablets Laptops UHD TV Game Station Desktop PC Set-up Box Cars Ultrasonic Handler Servers
  20. 20. Copyrights © Yole Développement SA. All rights reserved. 20 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 20 Y O L E D E V E L O P P E M E N T Bumping in 2.5D/3DIC Package Bumps/Cu Pillars: 40-250µm PCB BGA Substrate 2.5D Silicon interposer X-PU Logic Die Memory stack 400-800µm µ-Bumps: 10-40µm µ-Bumps 20-80µm 1 2 3 BGA balls  broad range of bumps, from larger BGAs (connection to the substrate) to very small microbumps used in stacking the memories 4
  21. 21. Copyrights © Yole Développement SA. All rights reserved. 21 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 21 Y O L E D E V E L O P P E M E N T Top Players in 2014! 2014 (#1playe r) Bumping & Assembly location TAIWAN Advanced Underfill HENKEL Flip chip bonder BESI Solder ECD bumping SPIL Gold bumping ChipBOND Cu pillar bumping INTEL Top Players
  22. 22. Copyrights © Yole Développement SA. All rights reserved. 22 22 Fan-Out vs. Fan-In and Flip-Chip 1 2 3 5 Package/IC size ratio* Fan-in WLCSP Fan-out WLCSP Flip Chip This limit will move to higher ratios as eWLB production moves from 300mm wafers to large panels and the cost of eWLB/fan-out moves lowers. 4 6 IC IC IC Advantages of Fan-Out vs. Fan - In • Higher board-level reliability • Bumping is not limited to the die size, fan-out area beyond chip area limitation • Built-in back-side protection (protection available for WLCSP as an option only) • Lower thermal resistance • Higher potential for SiP integration vs. FCBGA • Smaller footprint • No substrate/interposer  Shorter interconnections • Higher electrical performance • lower cost • thinner package • Lower thermal resistance • Higher potential for SiP and 3D integration
  23. 23. Copyrights © Yole Développement SA. All rights reserved. 23 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 23 Y O L E D E V E L O P P E M E N T FOWLP End Applications Mobile and wireless applications are the main markets for FOWLP  LGE was the first OEM to integrate the eWLB to the wireless baseband in the following models: • PMB8810 phone, T310 phone, T300 phone, GD350 phone, GB220 phone, GB230 phone, GS170 phone, GU230 phones  We can also find eWLB in Samsung cell phones (baseband modem) • Galaxy Tab tablet, Galaxy S phones  Some Nokia phones use eWLB for the baseband modem and RF transceiver Extension of the technology platform to a wider field of application areas is starting  FOWLP is starting to be integrated into automotive and medical applications  Infineon is using it for its 77GHz RADAR System IC Chipset (RASIC™) • SiGe transmitter and receiver used by Bosch  Analogic Ultra Sound is using it for its Sonic Window handheld ultrasound device made for vascular observation • 10 dies embedded, 33*28 mm² package 2012 2013 20142011
  24. 24. Copyrights © Yole Développement SA. All rights reserved. 2424 Fan-Out Applications Typical view of a smart phone board RF SiP Digital SiP Sensor SiP Mixed Signal SiP SiP Modules: BGA/PoP/QFN/TSOP DC/DC converters Drivers IPD ESD/EMI Stand-alone chips: WL-CSP, SOT, QFN, UTLP, BGA Discrete passives Blue: Devices that can be found in FOWLP packages today Discrete passives Yellow: Devices that could be found in the future in FOWLP Grey: Devices that will likelyremain on WLCSP or flip-chip package or move to 3DIC or Embedded die TODAY TOMORROW From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved
  25. 25. Copyrights © Yole Développement SA. All rights reserved. 25 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 25 Y O L E D E V E L O P P E M E N T First Fan-out WLP Technologies eWLB RCP 59%25% 16% Main products: - Single Die: Mobile and Wireless - BB and Wireless SoC, RF, PMIC - MCP/SiP products for Mobile (PMU), Industrial, Medical and Security applications Main products: - Mobile and Wireless  BB and Wireless SoC - RF Transceivers - ASIC Others Total 2014 $174M Wider adoption
  26. 26. Copyrights © Yole Développement SA. All rights reserved. 26 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 26 Y O L E D E V E L O P P E M E N T $0M $500M $1,000M $1,500M $2,000M $2,500M 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 TOTAL $80 $115 $131 $158 $174 $244 $790 $1,223 $1,573 $1,993 $2,391 TSMC addition Mobile $471 $814 $1,088 $1,391 $1,715 TOTAL without TSMC $80 $115 $131 $158 $174 $244 $318 $409 $485 $602 $676 FO-WLPRevenues(M$) FOWLP activity Revenues (M$) Overall evolution since eWLB technology introduction Yole Developpement © Sep 2015 FO WLP Market Forecast CAGR ~ 55% CAGR ~ 15% Transition plateau • Entry of A10 APE of iPhone7, 7+ and newer from 2016! • Previous 2014-2020 CAGR was rated at 25%, while new 2014-2020 CAGR is estimated at 55%! • After the jump, further 2016-2020 CAGR estimated at 32% • Market estimated to exceed 2B$ by 2020 APPLE/TSMC entry
  27. 27. Copyrights © Yole Développement SA. All rights reserved. 27 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 27 Y O L E D E V E L O P P E M E N T 650x830mm – Gen 4 LCD 650x650mm – WLP/LCD/PCB 2009 - 2014 2015 2016 2017 > 20182018 450mm FOWLP 1st-gen - single die • BB SoC • RF Transceiver • ASIC • PMIC High yield Semiconductor WLP infrastructure Fusion WLP/PCB/LCD infrastructures ? 204x508mm (8”x20” ) - Semi/PCB laminate substrate 500x650mm – PCB laminate 470x370mm – LCD Gen 2 FOWLP 2nd-gen - MCP/SiP/PoP • DRAM memory • NAND Flash memory • APE/BB modem • RF Tx, RF connectivity • PMU/PMIC • GPS • MOEMS 330mm Fan-out Infrastructure Evolution
  28. 28. Copyrights © Yole Développement SA. All rights reserved. 28 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 28 Y O L E D E V E L O P P E M E N T Drivers and Trends for 2.5D & 3DIC Evolution or Revolution? 3DIC / 3D SiP2D SOC “All-in-One chip system integration” All functions on 28nm lithography  Chip area ↑, Cost ↑ MEMS 130 nm 200 mm Memory 45 nm 300 mm Logic 20 nm 450 mm Analog 90 nm 300 mm 3D enables integration of heterogeneous functions: • On different lithography nodes • On different wafer sizes • In different wafer fabs • By different players  Cost ↓, Performance ↑, Size ↓ Time to Market ↓, Flexibility ↑ Market Drivers
  29. 29. Copyrights © Yole Développement SA. All rights reserved. 29 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 29 Y O L E D E V E L O P P E M E N T Photonics Others (Power, LED, RF…) Memory TSV in a nutshell MEMS Logic CMOS Image Sensors Through Silicon Via TSV
  30. 30. Copyrights © Yole Développement SA. All rights reserved. 30 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 30 Y O L E D E V E L O P P E M E N T 2.5/3DIC Commercial Announcements!  Several product announcements using TSV 2014 2011 2015 2017 2016 Nvidia Pascal Graphics Module EX-800 Blade Server using HMC New second generation Xenon Phi processor “Knights Landing” using HMC Next Generation PRIMEHPC POST FX10 CPU memory board using 8 HMC DDR4 3D Dual Inline Memory Modules (RDIMMs) First Heterogeneous 3D FPGA Virtex-7 H580T AMD R9 390X Graphics product with HBM built with 20nm technology 2013 2012 Altera 10 Generation FPGA using HMC Stacked NAND Flash Arria 10 Stratix 10 HMC HBM DiRAM4
  31. 31. Copyrights © Yole Développement SA. All rights reserved. 31 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 31 Y O L E D E V E L O P P E M E N T Market Evolution 100µm 10µm 1µm 100nm 10nm PCB Design Rule Wafer Design Rule Organic Substrate Silicon/Glass Interposer ~8-> 5µm More functionalities and advanced technologies nodes OSAT / Wafer foundries Substrate Manufacturers High Cost Lower cost than Si/Glass Interposer Opportunity for organic interposers Opportunity for Fan-Out GAP! Competing technologies
  32. 32. Copyrights © Yole Développement SA. All rights reserved. 32 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 32 Y O L E D E V E L O P P E M E N T System in Package  Enabled by various packaging platforms & interconnect technologies: • Wirebonding • Flip-Chip • Embedded technologies: ‒ Mold (fan-out) ‒ Laminate (embedded dies) • 2.5D/3DIC  Substrates: • Lead-frames • Laminates • LTCC substrates  Protective features: • Metal lids • Overmold encapsulation • EMI shielding Source: ASE Side-by-side (Fan-Out) Stacked (PoP/PiP) Embedded die in laminate
  33. 33. Copyrights © Yole Développement SA. All rights reserved. 33 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 33 Y O L E D E V E L O P P E M E N T Major Benefits and Markets  Smaller form factor  Increased flexibility  Integrating different technologies  Higher performance: signal propagation, power dissipation, noise and EMC performance  Faster time-to-market  Lower cost  High added value  IP protection  Wireless communications  Consumer  Automotive  IoT (connectivity)  Medical  ... Various Markets
  34. 34. Copyrights © Yole Développement SA. All rights reserved. 34 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 34 Y O L E D E V E L O P P E M E N T Leadframes QFN,QFP w/o IC substrates Fan-in Fan-out IC substrates-based BGA (organic substrate) W/B BGA Flip Chip BGA 3DIC Interposer based (Si, Glass, Org) SiP Embedded die (in substrate) SiP Positioning in Advance Packaging PCB substrate Increased functionality, performance… Interconnect: Single die Multiple Dies Integration:2D 3D Embedded die (in substrate) Bumping, Pillas, Studs, Through-silicon-via, Bump-less, Embedded Technologies... Platform enabling functionality through the use of various packaging techniques
  35. 35. Copyrights © Yole Développement SA. All rights reserved. 35 From TECHNOLOGIES to MARKET Copyright @ Yole Developpement SA.. All rights reserved Y O L E D E V E L O P P E M E N T 35 Y O L E D E V E L O P P E M E N T  High interest in the industry in several packaging platforms: Conclusions and Future Perspectives  Fan-in – stable growth, still driven by low cost and introduction of new consumer applications requiring low cost and pin count  Flip-chip – will continue to grow, but expected to loose overall market share to platforms such as WLCSP, Fan- Out and 3DIC. Cu Pillar will continue to be the dominant flip chip metallurgy  Fan-Out – very promising platforms already established in production. Currently using wafer infrastructure, may move to panel manufacturing in the future  2.5D & 3DIC – finally in production and adoption expected to further grow. Fan-out could be a disruptive technology for consumer applications  SiP – enabling functionality packaging in a more flexible way and with a faster time to market. Expected to have a significant growth  Advanced Packaging will continue to grow – driven by consumer & IoT
  36. 36. Copyrights © Yole Développement SA. All rights reserved. 36 36 Thank you! YOLE DEVELOPPEMENT COLLABORATION INNOVATION NEW PERSPECTIVES For additional information visit our websites: www.yole.fr & www.i-micronews.com Online free registration to YOLE publications Please visit us at booth # E5813

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