MEMS Front-End Manufacturing Trends Though MEMS standardization will never happen, companies are optimizing their own technology platforms. Such process innovations will drive MEMS equipment and materials to a 7% CAGR over 2012-2018. CHANGES IN MEMS MANUFACTURING WILL DRIVE THE EQUIPMENT & MATERIALS MARKET FROM $378M TO $512M FOR EQUIPMENT AND $136M TO $248M FOR MATERIALS BETWEEN 2012-2018 Innovative processes are fueling the MEMS equipment & materials market. We forecast that demand for MEMS-related equipment will grow from ~ $378M in 2012 to > $510M by 2018, at a CAGR of 5.2% over the next five years. It’s interesting to note that our MEMS equipment market forecast will follow a cyclical up/downturn similar to what the mainstream IC equipment market underwent. The demand for materials and related MEMS consumables will grow from ~$136M in 2012 to > $248M by 2018 at a CAGR of 10.5% over the next five years. AS MEMS BECOME COMMODITY PRODUCTS, MANUFACTURING WILL CHANGE AND MATURE Today, MEMS fabrication is still very diversified and lacking in standardization; Yole Développement’s rule « one product, one process » still applies. Indeed, MEMS has a different story than IC and doesn’t follow the same roadmap as the semiconductor industry. Thus, it’s still common to see many players with radically different manufacturing approaches for the same MEMS device, sometimes within the same company (i.e. both the CMOS MEMS and hybrid approaches can be used for inertial devices or microphones). However, as MEMS becomes a commodity product with a quicker time-to-market compared to previous generations, anything that speeds up the commercialization process is welcome. MEMS packaging is evolving in a different direction than front-end processing, and Yole Développement has already identified that packaging standardization will become increasingly critical in order to support the massive volume growth in unit shipments, and decrease overall costs associated with MEMS & sensor content. For example, microphone packaging is very similar between one manufacturer and another. Additionally, this report shows that at the front-end level, companies are developing in-house technological platforms targeted for different MEMS devices. Main companies cited in the report AAC, Adeka Corp., Advanced Chemical Company, Aichi, Air Liquide, Air Products, AKM, Akustica, 3M, Alces, Altatech Semiconductor, AMAT, AMEC, AML, Analog Devices, Atotech, Avago, baolab, Bosch, bTendo, Brewer Science, Canon, Canon Anelva, Cavendish Kinetics, Colibrys, Cookson Electronics, Daetec, DelfMEMS, Discera, Dupont Electronic Technologies, Dynatex International, Ebara technologies Corp., EEJA, Epcos, Epson, Epson Toyocom, Everspin, EVGroup, FLIR, Freescale, Fujifilm, GE Sensing, Hermes Systems, Honeywell, hp, IBM, IceMOS, IMT, Infineon, Ion Torrent, Invensense, Irisys, Kionix... more information on http://www.i-micronews.com/reports/MEMS-Front-End-Manufacturing-Trends/1/349/

1. MEMS Front-End Manufacturing Trends
MEMS standardization will never happen but companies are optimizing their own
technological platforms. Such process innovations are driving the MEMS equipment
& materials with a 7% CAGR over 2012-2018.
February 2013
Source MEMSiC
Source Bosch Source SPTS Source Silex Source SUSS MiroTec Source Freescale
SAMPLE
6 & 6 mm
~100 sq mm ~25 sq mm ~125 sq mm
© 2013
1999 - today 2006
1995 1996-2002

2. Content of the report (1/3)
Scope of the report & definitions … 5 Introduction to the MEMS industry – Market dynamics &
• Key Objectives of the Report key players … 38
• What’s New in this Report Update? • MEMS Sensor & Actuator Applications
• Key Features Of The Report • MEMS Market Forecast Shipments (in Munits)
• Who should be interested in this report? • MEMS Market Sector Forecast (in M$)
• Companies cited in this Report • 2011-2017 MEMS Device Forecast (in M$)
• About the authors of this report • MEMS Market Value 2011 / 2017 (in M$)
• Glossary • 2011 MEMS Ranking in $M – TOP 30 players
• 2011 MEMS Ranking in $M – TOP 30 to 70 players
Executive Summary … 13 • Typology of MEMS Companies
• Introduction • Typology of MEMS Foundries
• MEMS belongs to the « More than Moore » law • 2011 MEMS Foundry Ranking
• MEMS has a long history for fabrication
• No Moore law, but MEMS technology is evolving anyway MEMS devices equipment & materials forecast … 50
• Towards standardization ? • Equipment & Material Demand in the MEMS area
• MEMS require special process steps • YOLE’s Methodology
• What makes MEMS different from the mainstream IC • MEMS devices Equipment market forecasts
industry – MEMS Wafers Shipment Forecast (8’’ eq.)
• MEMS Technologies to watch – Equipment Market Forecast for MEMS devices
• Examples of building blocks for MEMS platforms – Equipment Market Forecast Breakdown per type of tool
• Equipment Market Forecast for MEMS devices – Equipment Market Forecast Breakdown by type of
devices
• Materials Market Forecast for MEMS devices
• MEMS devices Material market forecasts
• Generic MEMS platforms
– Materials Market Forecast for MEMS devices
• Conclusions
– Materials Market Forecast Breakdown by Materials
– Materials Market Forecast Breakdown by type of devices
© 2013• 2

3. Content of the report (2/3)
Detailed MEMS process flows & manufacturing trends
analysis … 70
• Equipment & Material Supplier Overview • RF MEMS Cost Structure WiSpry Example
• Focus on MEMS accelerometer Bosch BMA250 3-Axis • Trends in RF MEMS Manufacturing
• Focus on MEMS gyroscope ST Micro L3G3250A 3-Axis • Oscillators Cost Structure SiTime Example
• Focus on MEMS microphone STM MP45DT01 • Trends in Oscillators MEMS Manufacturing
• Focus on MEMS Microbolometer FLIR ICS0601B • Micro Mirror Cost Structure TI Example
• Focus on MEMS Micro-mirror for pico projector - Texas • Trends in Micro Mirror Manufacturing
Instrument • Microbolometer Cost Structure FLIR Example
• Focus on RF MEMS for Antenna Tuner - Wispry • Trends in Microbolometer Manufacturing
• Focus on MEMS oscillator Discera DSC8002 • Others MEMS
• Micro Display Cost Structure Qualcomm Example
• MEMS devices Front End cost structure & manufacturing
trends • MEMS Auto Focus
• Introduction • MEMS Technologies for Si Photonics
• Ink-Jet Heads Cost Structure MEMJET Example • MEMS-based RFID
• Si microfluidics
• Trends in IJH Manufacturing
• TPMS P-Die Cost Structure Freescale Example
• Trends in Pressure Sensors Manufacturing
• Microphone Cost Structure STMicroelectronics Example
• Trends in Microphones Manufacturing
• 3-Axis Accelerometer Cost Structure STMicroelectronics
Example
• Trends in Accelerometer Manufacturing
• 3-Axis Gyro Cost Structure STMicroelectronics Example
• Trends in Gyro Manufacturing
• Compass Cost Structure AKM Example
• Trends in Compass Manufacturing
• IMU Cost Structure Invensense Example
• New Approach From Tronic’s: M&NEMS concept
• Trends in IMU Manufacturing
© 2013• 3

4. Content of the report (3/3)
MEMS Manufacturing Trends by Process … 118
• MEMS Manufacturing - what is changing, why …
• MEMS Si Substrates
– Thin wafers for MEMS
– Engineered SOI Wafers
– 6’’ vs 8’’ MEMS wafer size
• Lithography
• New MEMS Materials
• Etching
– DRIE
– Sacrificial etch
• MEMS 1st Level Packaging
– Thin Film Packaging
– Wafer Bonding
• MEMS to ASIC assembly
– CMOS MEMS frontier
– MEMS Interconnect
– TSV as an enabler for MEMS packaging
• From “standard” processes to technology platforms to
products
Conclusions … 272
• Final Conclusions
Appendices … 274
• Yole Développement presentation
© 2013• 4

5. Key Objectives of the Report
• This 2013 report is an update of the 2011 “Trends in MEMS Manufacturing &
Packaging” report
• The objectives of the report are:
– To give forecast in units and $M value for MEMS Equipment & Materials
– To provide an overview of the equipment & materials used for the wide range of
MEMS devices
– To present examples of MEMS processes manufacturing
– To show MEMS cost structures
– To highlight what is changing in MEMS manufacturing & why
• This report does not cover:
– Back-end and packaging equipment/materials forecast and related issues
– This has been covered in the Yole 2012 “MEMS Packaging, Market & Technology
Trends” report
© 2013• 5

6. What’s New in this Report Update?
• Up-to-date market forecast
– Equipment & material market forecasts in units, volume and
revenues from 2012-2018 and based on a methodology to
estimate realistic sales opportunities in the MEMS devices
– Cost breakdown per type of MEMS devices
• MEMS devices technologies process flows &
manufacturing trends analysis
– Analysis on the
• MEMS accelerometers/gyroscope
• MEMS microphone
• MEMS pressure sensors
• MEMS micro bolometers
• MEMS micro mirrors
• RF MEMS switch
• MEMS oscillators
© 2013• 6

7. What is changing in MEMS manufacturing, why …
• Today, MEMS fabrication is still very diversified without standarization:
– The Yole MEMS rule « one product, one process » still rules
• MEMS has a different sory and do not follow a roadmap as the semiconductor industry does.
‒ Indeed, many players have different manufacturing approaches for the same device and even in a same company,
processes will be radically different for same MEMS (e.g. CMOS MEMS or hybrid approach for inertial or
microphones).
• As from development to products, MEMS take typically 20-30 years from research to
commercialization, any way to speed up the commercialization process is welcome.
• So we see a clear trend for smaller, more cost effective MEMS devices specially for the consumer
market where small form factor and low cost are mandatory.
– For MEMS Packaging, there is already a trend toward standardization.
– And standardization is becoming increasingly critical to support the massive volume grow in unit shipments along
with decreasing overall costs associated with MEMS & sensor content, in particular related to their packaging.
• But MEMS size reduction cannot last forever  e.g. for inertial, a minimal mass is needed for
movement detection.
– Today, die size reduction is mostly achieved by packaging innovation (e.g. new gold bonding, TSV interconnect) that
adds extra manufacturing cost but reduce the Si size. Overall, the final cost is lower compared to previous generation.
– New detection principle are currently developed under the roof of R&D Institutes (M&NEMS concept at Tronics’) 
this could be the next step to lower MEMS size at the silicon level.
© 2013• 7

8. What is changing in MEMS manufacturing, why …
• After 50 years of development, the MEMS industry keeps innovating in processes.
• Standardization is on its way in packaging and, as MEMS competition shifts to the systems level,
competition at the process level could be less important.
• After years of developments, some process steps found their sweet spots:
– TSV technology is step by step diffusing into the MEMS industry. Both IDMs (ST, Bosch) and foundries now master
the technology.
– Thin films PZT (either CSD or sputtered deposition) is linked to new MEMS devices such as wafer-level auto focus or
uncooled IR sensors.
– Temporary bonding will be used as thinner wafers will be processed (e.g. oscillators).
– Cavity SOI success could depend on the success of NF as an open platform for MEMS manufacturing.
• The MEMS equipment & materials market will keep growing:
– The equipment market will have a 5.2 % CAGR, growing from $378M in 2012 to $512M in 2018.
– The equipment market will have a 10.5 % CAGR, growing from $136M in 2012 to $248M in 2018.
• It is unlikely to see standardization happening in the MEMS industry. But the need for more
performing, smaller and cost effective devices lead MEMS players to continuously modify &
adapt their process. Although no cross standardization like CMOS will happen, in-house
technology or product platforms help MEMS players to speed up time-to-market.
© 2013• 8

9. MEMS belongs to the « More than Moore » law
MEMS
© 2013• 9

10. Adoption cycle for MEMS processes
Room temperature bonding
Graph here shows the timeline for new
MEMS processes adoption. Temporary bonding
The left side of the arrow is showing the
starting time for the technology to be
used (e.g. DRIE started to be used in 96’
Thin film sealing
for Bosch inertial MEMS).
We expect to see more innovative MEMS
processes to be used in the future: TSV,
Steppers
litho steppers, temporary bonding for thin
wafers, room temperature bonding
TSV
Cavity SOI
XeF2
DRIE
Wafer Bonding
1995 2000 2005 2010 2015 2020
© 2013• 10

11. Example of MEMS accelerometer
Sensor Process Flow (2/4)
Sacrificial oxide 2 deposition Specific tools & equipment Specific materials
Sacrificial oxide deposition Source gases
o LPCVD o Silane (SiH4) and oxygen
o Dichlorosilane (SiCl2H2) and
nitrous oxide (N2O)
Photolithography for patterning o tetraethylorthosilicate (TEOS;
o Stepper or Mask aligner Si(OC2H5)4)
Polysilicon deposition Source gases
Polysilicon deposition as structural layer
o Epitaxial reactor o Silane SiH4
o LPCVD
Planarization CMP Slurry & cleaning chemistries
o CMP tools Dopant ions
Ion implantation o Boron,phosphorus or arsenic
Metal deposition Sputtering targets
o PVD sputtering
Photolithography for patterning
o Stepper or Mask aligner
Polysilicon etching
Photolithography for patterning Etching gases
o Stepper or Mask aligner o SFe/O2 etc…
Oxide layer etching
o Wet etch tools Wet etch chemistry
© 2013• 11

12. An Example of Diffusion for a MEMS
Process The adoption cycle for DRIE
Diffusion Model for DRIE 3D TSV is driving
a new growth for
300
DRIE
250
“Telecom bubble”:
many investments for
optical MEMS
200 2008/2009
Number of chambers
financial crisis
150 MEMS for consumer
“DRIE starting point”
for MEMS is driving a new
applications growth
100 (accelerometers)
50
0
1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012
R&D & Production Tools for non MEMS 0 0 1 4 10 15 27 30 28 29 34 48 55 61 82 107 127 153 191
Production Tools for MEMS 0 0 4 4 6 10 22 60 27 23 27 35 36 40 12 10 8 19 29
R&D Tools for MEMS 2 8 11 18 24 30 46 59 35 27 22 23 24 14 16 16 16 18 20
© 2013• 12

13. Equipment Market Forecast for MEMS devices
• We forecast the demand for equipment used in the MEMS area to grow from ~ $378M in 2012 to > $510M by 2018
at a CAGR of 5.2% over the next 5 years.
• It is interesting to see the MEMS market forecast to follow a cycle-like up & downturn similar to what the
mainstream IC equipment market undergo.
• Reasons behind is because the current MEMS devices market growth is driving a need for new tools investment.
But the capacity will exceed the real production need in 2016. After installed base will no longer cope with
increased MEMS demand, the need for new equipment will grow again (2018).
Global Equipment Market Forecast
for MEMS (in M$)
$600 M
Yole Developpement © January 2013
$500 M
Sales forecasts (M$)
$400 M
$300 M
$200 M
$100 M
$0 M
2012 2013 2014 2015 2016 2017 2018
© 2013• 13

14. For More Information …
Dr. Eric Mounier
– Dr. Eric Mounier co-founded Yole Developpement in
1998. He is in charge of technology analysis for MEMS
related manufacturing technologies, Optical MEMS
(including micro-mirrors, micro-displays, auto-focus
and IR micro-bolometers) applications within the
company. Eric has also developed a unique cost
modeling tool “MEMSCoSim” able to evaluate the cost
of MEMS module manufacturing
Contact: mounier@yole.fr
Amandine Pizzagalli
– Amandine recently joined Yole Development Advanced
Packaging and MEMS manufacturing teams after
graduating as an engineer in Electronics, with a
specialization in Semiconductors and Nano Electronics
Technologies. She worked in the past for Air Liquide
with an emphasis on CVD and ALD processes for
semiconductor applications
Contact: pizzagalli@yole.fr
© 2013• 14

15. Available MEMS Reports
MEMS Front-End Emerging Energy Status of the MEMS for Cell
Manufacturing 3-Axis Consumer
Harvesting CMOS Image Phones and
Trends Gyroscopes
Devices Sensors Tablets
New! New! New! New!
RF Filters, PAs, Uncooled Infrared IMU & Gyro for Infrared Detector
Antenna Switches & Technology Trends Imaging: Defense, Market, Applications
Tunability for Cellular for Inertials MEMS Commercial & Aerospace & and Technology
Handsets Military Applications Trends
Industrial
Sensor fusion of Ferro-Electric Trends in MEMS Motion Sensors for
Trends in MEMS
MEMS Ferro-Electric Consumer & Mobile
acceleros, gyros & Thin Films Manufacturing & Manufacturing &
magnetometers
Microphone Thin Films applications
Packaging Packaging
MEMS Cosim+
Thin Wafer MEMS Permanent Wafer
MEMJET Handling Manufacturing Cost Bonding
Simulation Tool
© 2013• 15

16. Yole activities in MEMS
Media business Reports Consulting services
News feed / Magazines / Market Market research,
Webcasts Research Technology & Strategy
www.yole.fr
© 2013• 16