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July © 2015
From Technologies to Market
Sapphire Applications
& Market 2015:
from LED to
Consumer Electronic.
Report Sample
From Technologies to Market
2
TABLE OF CONTENTS
Part 1/V
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
Sapphire properties vs. orientation
Value chain.
Example: Sapphire wafer process
Material defects and slicing
Core / brick length
Major industry players: crystal growth companies
Major industry players: wafer slicing and finishing
Major industry players: PSS
Status of the Sapphire Industry p67
Price trends: cores for LED and optical wafers
Material cost structure exemple:Aurora Sapphire
Price trends: Conventional sapphire substrates for LED
Price trends: Patterned sapphire substrates for LED (PSS)
Discussion
Price trends: bricks and optical wafers for consumer electronic
2008-2020 price forecast
2014 top 20 Sapphire company revenue for core, bricks & wafers
Detailed breakdown by segment
Revenue structure: captive and open markets
2014 revenue breakdown for Core & bricks and polished wafers
2014 revenue breakdown for optical and PSS wafers
Geographic breakdown per product category
Exchange rates impacts
Product categories and applications covered in this report p5
Executive Summary p7
The 3 page summary
China dominates
Sapphire industry growth drivers: Historical perspective
Application breakdown
Consumer electronic applications
List of mobile devices with sapphire components
Smartwatches
Sapphire display covers
2014 Sapphire company revenue
Sapphire supply and demand
LED applications
Alternative substrates
Sapphire wafer forecast
Core shipment forecasts
What happened to silicon on sapphire?
Past year and Noteworthy News p46
Introduction to the Sapphire Industry p56
Industry Overview
Sapphire properties overview
3
TABLE OF CONTENTS
Part 1I/V
Optical wafer manufacturing:
Camera lens covers: overview and adoption trends
Fingerprint reader covers: overview/emerging technologies/established
technologies/alternative technologies/sapphire use/adoption trends
Heart monitor sensor covers
OpticalWafers 2012 -2020 volume and revenue forecast/ingot (core)
forecast
Smart watches market review & forecast p138
Forecasting the Smartwatch market
Smartwatch volume forecast 2012-2020
Sapphire in Smartwatches:AppleWatch/other brands/sapphire adoption
rate forecast
Sapphire smartwatch cover volume & revenue forecast
Sapphire covers design and slicing pitch
Smartwatch volumes and forecast
Sapphire display covers - market review and forecast p148
Mobile devices display covers – Overview
Touch panels – technology overview
Display and touch sensor structures
Touch sensors and display panels supply chain
Display cover manufacturing process
Supply and demand analysis p86
Definitions and metrics
Brick and core extraction
Geographic and product category geographic breakdown
Crystal Growth Capacity: 2012-2015 evolution by region
Crystal Growth Capacity:Top 20 ranking
Crystal growth technology breakdown (Q3-2015)
HEM furnaces
Finishing Capacity: 2012-2015 evolution by region
Finishing Capacity:Top 20 ranking
PSS Capacity: 2012-2015 evolution by region
PSS Capacity:Top 20 ranking
Material, finishing and PSS Supply vs demand
Attrition and consolidation
Why does capacity keep increasing?
Focus on China/Taiwan/Korea/Europe/North America
Supply vs demand analysis: no sapphire display cover
Supply vs demand analysis: sapphire display cover adoption
Discussion
“OpticalWafers” market review and forecast: Camera lens,
fingerprint readers and heart rate monitors covers p123
Sapphire components at Apple
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
4
TABLE OF CONTENTS
Part 1II/V
iPhone display covers: current status
Partial roll out in a premium model
Full roll out in major iPhone model(s)
Material supply chain requirements
Most significant capacity investments 2014-2016
Material capacity evolution 2014-2016
Who will supply Apple display covers?
Who will supply material for Apple display covers?
Conclusions
Crystal growth technologies for display covers p198
Sapphire growth methods for display covers: KY etc…
Sapphire technology –VHGF
HEM CHESS
EFG Method
Orientation for display covers
Sapphire display cover manufacturing cost p205
2014 cost model
Sapphire brick – GTAT ASF cost
Sapphire brick – Kyropoulos cost
Brick cost modeling Results
Potential benefits of sapphire display covers: mechanical strength /
dielectric constant
Putting sapphire to the test: GTAT vs Corning/Ubreakifix.com / impact of
finishing process
Conclusions on mechanical testing
Major issues of Sapphire display covers
Summary
Current status
Apple sapphire patent portfolio overview
Which Strategy for differentiation?
Sapphire adoption trends
Display cover adoption scenario
Display cover adoption rate forecast 2015-2020.
Apple Sapphire ecosystem and strategy p173
Apple supply chain: overview
2014 revenue from Apple
Optical wafers supply chain
AppleWatch supply Chain
Discussion
Display cover supply chain overview: GTAT, Biel and Lens.
GTAT – Apple partnership:what went wrong?
What’s next for GTAT and the mesa furnace
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
5
TABLE OF CONTENTS
Part 1V/V
Alternative LED substrates p238
Gan-on-Si overview
GaN-on-Si cost of ownership
Gan-on-Si adoption
Key players and strategic positioning
GaN-On-Gan
Alternative substrates adoption forecast
LED Epitaxy (MOCVD) capacity trends p245
Gan MOCVD capacity 2010-2015 evolution per region
GaN MOCVD capacity supply vs demand trends
Gan MOCVD Q3-2015 utilization rate per region
Gan MOCVD Q3-2015 utilization rate in China
Geographic breakdown and conclusions
LED wafer market & forecast p251
LED wafer forecast methodology
LED wafers value chain
Sapphire wafer consumption Q3-2015 geographic breakdown
Incentive for adoption of large diameter wafers
Challenges for the adoption of large diameter wafers
Q3-2015 Diameter breakdown per region
Q3-2015 Diameter breakdown – global
6” adoption and beyond
LED wafer diameter breakdown forecast 2012-2020.
2008-2020 sapphire wafer start by diameter
Discussions
Brick cost structure
Yields impact
Full display cover cost
Conclusions
Alternative technologies for display covers p221
Strengthened glass - Gorilla glass
Alternative technologies – Coatings
Schott “Hard and clear” solution.
Alternative technologies – Exfoliation & laminates
Alternative technologies – DLC
Transparent ceramics:ALONTM & spinel
LED market overview p229
LED market growth cycles
LED adoption trends per application
General lighting market segmentation and main drivers
Previous LED market forecast (2014)
Updated LED forecast
Discussion
LED bulb lifetimes
LED marketTrends – Display
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
6
TABLE OF CONTENTS
PartV/V
2012-2015 ASP and gross margins trends per product
2012-2014 capacity and utilization rates trends
2015 capacity expansion plans
2012-2014 revenue by product & application
2014 revenue breakdown by product & application
2012-2014 revenue geographic breakdown
Major customers 2012-2014
LENSTechnology (蓝思科技股份有限公司) p301
Overview
Capacity
Revenue breakdown by product and customers
Sapphire revenue breakdown
Sapphire investment status and future plans
Other Company Profiles p309
BIEL Crystal (伯恩光学有限公司)
Biel-Roshow Sapphire (伯恩露笑蓝宝石有限公司)
Sapphire technology
Rubicon technology
Monocrystal
Saifei (广东赛翡蓝宝石科技有限公司)
Crystal Optech (浙江水晶光电科技股份有限公司)
NJC (南京京晶光电科技有限公司)
Kama Crystal
Patterned sapphire substrates – benefits
When are PSS used?
Pattern design
PSS manufacturing process overview
Lithography techniques for LED
Nano-Imprint Litography
PSS market: historical perspectives
Q3-2015 CSS and PSS consumption per region
PSS supply chain
2008-2020 CSS and PSS volume forecast
2008-2020 core shipment forecasts
2008-2020 LED wafer revenue forecast
LED filaments p279
Overview
Filament material
Filament manufacturing process
Performance and cost
Analysis
LED filament 2012-2020 shipment and revenue forecast
Aurora Sapphire (哈尔滨奥瑞德光电技术股份有限公司) p288
Overview
2011-2015 revenue and gross margins trends
Growth technology and cost control
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
7
Biography & contact
ABOUT THE AUTHORS
Eric VIREY received a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble. He’s held various R&D,
engineering, manufacturing and marketing positions with Fortune 500 company Saint-Gobain in France and the United States. In
its most recent position, he was Market Manager Optoelectronics in charge various product lines and serving the LED and
optical telecommunication industries. In parallel, he was leading the corporate “Lighting Community” effort, acting as a market
and technology competitive intelligence evangelist to identify and develop new business opportunities in solid state lighting
(LED/OLEDs) across multiple business units.
Eric has a broad knowledge of the entire solid state lighting value chain. In 2009, he joined Yole Developpement as a Senior
Market andTechnology Analyst for LED Devices and Materials.
Eric is also author / co-author of the following reports:
• LED Packaging
• LED Front End Manufacturing
• III-V Epitaxy
• Bulk GaN
• GaN on Silicon
• Status of the LED Industry
• Sapphire Market & Applications
• High Purity Alumina
Contact: virey@yole.fr
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
8
ACRONYMS
A: Ampere
AMOLED: Active Matrix OLED
ASP: Average Selling Price
CAGR: compound Annual Growth Rate
Capex: Capital Expenditure
CCFL: Cold Cathode Fluorescence Lamp
CE: Consumer Electronic
CHES: Controlled Heat Extraction System
CSS: Conventional Sapphire Wafer
CTE: Coefficient of Thermal Expansion
CZ: Czochralski
DD: Dislocations density
EFG: Edge-defined Film-fed Growth
FPR: FingerPrint Reader
GES : Growth from an Element of Shape
HB-LED: High-Brightness Light Emitting Diodes
HEM: Heat Exchange Method
HPA: High Purity Alumina
HVPE: Hybrid Vapor Phase Epitaxy
KY: Kyropoulos
LCD: Liquid Crystal Display
LD: Laser Diode
LEC : Liquid Encapsulation Czochralski
LED: Light Emitting Diode
LEE: Light Extraction Efficiency
LOG: Lateral Over-Growth
MBE: Molecular Beam Epitaxy
MOCVD: Metal-Organic Chemical Vapor Deposition
Msi: Million Square Inch
nPSS: Nano-PSS
OEM: Original Equipment Manufacturer
OLED: Organic LED
PA: Power Amplifier
PSS: Patterned Sapphire Substrate
PV: Photovoltaic
RF: Radio Frequency
RFIC: Radio Frequency Integrated Circuit
SoI: Silicon on Insulator
SOS: Silicon on Sapphire
TAM: Total Accessible Market
Tc: Thermal Conductivity
Tj: Junction Temperature
TIE: Two Inch Equivalent
TTV: Total Thickness Variation
V: Volt
VHGF: Vertical Horizontal Gradient Freezing
W: Watt
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
9
PRODUCT CATEGORIES AND APPLICATIONS COVERED IN THIS REPORT
Volume and
revenue
forecast for
the check
marked
items are
covered in
this report.
Cores
Bricks
Single side polished Conventional
Sapphire Wafers (CSS) for LED and
Silicon On Sapphire epitaxy
Patterned Sapphire Substrates
(PSS) for LED epitaxy
Double Side Polished
OpticalWafer
Covers for camera lens, fingerprint
reader and heart rate monitor
Covers for camera lens, fingerprint
reader and heart rate monitor
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
10
CONSUMER ELECTRONIC APPLICATIONS
• In 2012, Apple introduced the iPhone 5, the first smartphone to use a sapphire camera lens cover. In 2013, it
introduced the iPhone 5s which featured a Fingerprint Reader (FPR) protected by a sapphire cover in the
“Home Button”. The technology was unrolled in iPad products in 2014. Finally, in 2015, Apple introduced its first
smart watch, the Apple Watch which features a heart rate monitor constituted of a combination of green and
infrared LEDs and photodiodes protected by 4 transparent sapphire lenses.
• As of H1-2015, adoption of sapphire camera lens covers at non-Apple cell phone manufacturers is still
limited. But with manufacturing process now reasonably mature, the ASP of sapphire lens covers is expected
to fall below $0.5/unit which will increase adoption from 2016. In 2015, leading Tier 2 brands Huawei and
HTC both already announced new flagship models featuring sapphire lens covers.
• We expect fingerprint readers to become standard on all smartphone by 2020. But the use of sapphire will likely
remain an Apple oddity. So far only one other OEM has adopted sapphire in a model introduce in 2015.
By successively
introducing
camera lens
covers, fingerprint
readers and
smartwatch,
Apple has created
an entire new
market for
sapphire wafers
The HTC One M9 (2015) features
a sapphire camera lens
The Huawei Honor 7 (2015) features a
sapphire camera lens
The Meizu MX4 Pro features a front face
fingerprint reader with a sapphire cover
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
11
SAPPHIRE DISPLAY COVERS
• But KY and GTAT’s ASF both have room for improvement: GTAT could eventually succeed in producing larger
boules of 200, 240 or 260 kg and Monocrystal recently demonstrated a 300 kg KY process.
• Other possible options include ARC Energy which also recently announced a 300 kg process based on its new
generation of CHES furnaces. Sapphire Technology VHGF technology produces much smaller boules in brick
shapes and short cycle times which could prove competitive for display cover applications.
• With the ability to produce multiple rectangular ribbons of adjustable width and length in parallel, EFG has
always seemed a good fit for the application. Trading companies recently signed an agreement with a Japanese
supplier with 20 years of EFG experience to sell high performance furnaces in China which could produce up to
3000 parts per month. The companies claim to already have orders for 300 units in 2015 and expect to sell 1000
in 2016.Various
technologies and
companies are
positioning
themselves to
win the market
Different sizes of slabs produced by Sapphire
Technology with the VHGF technology
(source: company)
A 300 kg boule produced with ARC Energy
new CHES furnaces design
A 300 kg boule produced by Monocrystal
using its Kyropoulos technology
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
12
SAPPHIRE DISPLAY COVERS
• But in any case, we don’t see a quick path for the industry to achieve the kind of cost that Apple and GTAT initially
targeted for 2015.
• For the bricks, while not out of reach, sub $XX/mm cost will require further process development, economies of
scale (consumable, spare parts…) and are at least 2 years away. In the short term, it is going to be challenging for
sapphire makers to offer prices even approaching $XX/mm.
• As of 2015, we estimate that even in high volume (millions), the price for sapphire display covers would hover
around $XX/pcs. With rapid process improvements and economies of scale achieved by the large projects currently
under construction, this could drop to around $XX in 2016 and below $XX in 2017.We don’t expect
that initial targets
set by Apple in
2013 can be
achieved until
2017 when the
price of a
sapphire display
cover could
finally pass below
the $XX bar.
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
13
2014 SAPPHIRE COMPANY REVENUE
[1] Revenue generated by GTAT from smartphone bricks shipped to Biel and Lens for the aborted iPhone 6 sapphire display ramp up are not included (est.: US$ 45M)
[2] Lens claims US$412M of sapphire related revenue in 2014.We estimate that US$284 was generated from actual component sales (next page)
Adding finished components (lens covers etc…), revenue reached US$1.8b dominated by Biel and Lens:
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
14
Q3-2014
Toshiba, JP announces plans to invest US$ 500m
to ramp up capacity for its GaN-On-Silicon LED
technology 150x by 2016 to capture 10% of the
white LED market.
LED maker Epistar, TW (晶元光電股份有限公司),
currently the 2nd largest in term of GaN MOCVD
capacity acquires rival Formosa Epitaxy, TW (璨
圓光電股份有限公司).
July August September
TDG Core, CN ( 天 通 控 股 股 份 有 限 公 司 )
announces a JV with Taiwan-based PSS foundry
Phecda Technology,TW (德晶科技股份有限公司)
to set up a new PSS manufacturing factory. Each
company will invest RMB 20m in the JV.
PSS foundry Aceplux Optotech, TW (兆鑫光電
科技股份有限公司) increases capital by NT$297m
(US$10m) by issuing 3500 shares at NT$85 each.
The proceed will be used to increase capacity
from 150k TIE/m to 300k TIE/m. The company will
have a total of 15 production lines.
EGing Photovoltaic Technology, CN (EGing
PV) (亿晶光电科技股份有限公司) will install 50x
100kg sapphire for annual capacity of 750,000 mm
of 4” ingot + 370k mm of 2” ingots. Total
investment: RMB 132m.
Tera Xtal, TW (鑫晶鑽科技股份有限公司) will
increase PSS capacity from 100k to 200k
TIE/month by the end of 2014. The company
intends to implement nano imprint lithography
technology. Competitor Rigidtech, CN (銳捷科
技股份有限公司) plans to set up a manufacturing
plant in Suzhou (CN) and expand PSS capacity
from 800k to 1.2m TIE/month.
Sunyes Electronic Manufacturing, CN (深圳市
新亚电子制程股份有限公司) acquires 10.3% of
Guangdong Saifei, CN (广东赛翡蓝宝石科技有限
公司) for RMB 280m, valuating the company at
RMB 2.72b (~US$440m) and approves a RMB
180m loan to supplement working capital.
Southwest Pharmaceutical, CN (西南药业股
份有限公司) acquires Aurora Sapphire, CN (哈
尔滨奥瑞德光电技术股份有限公司) via an asset
swap valuing the company at RMB 4.12b
(US$644m) and will raise an additional US$167m
to fund capacity expansion close to 10 mm of TIE
million in 2015.
Anhui Guofeng Plastic, CN (安徽国风塑业股份
有限公司) acquires 29.59% of Ning Xia Jiajing
Technology (宁夏佳晶科技有限公司), the China-
based subsidiary of sapphire maker Procrystal,
TW (佳晶科技股份有限公司). Guofeng will later
increase participation to 51.02% in February 2015
after further equity transfer and capital increase.
Huawei, CN and Vivo, CN release limited edition
of their new flagship models with sapphire cover
glass
Apple announces new iPhone 6 and 6+. None
features the highly anticipated cover glass. The
company also presents its first line of smartwatch
with 2 of the 3 models featuring a sapphire cover.
X
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
15
EXAMPLE: SAPPHIRE WAFER PROCESS
Crystal Growth
Boule Cropping,
X-Ray orientation, Core
Extraction & Cropping
Core cropping, X-ray core
orientation, OD grinding /
orientation adjustment,
Notch or flat grinding
Picture:Thermal
Technology
Illustration :Rubicon
Technology
Metrology: Thickness,
BOW, TTV, TV5
Thickness and quality
sorting (up to 30 bins)
Illustration: Meyer Burger
Illustration: Meyer Burger
Slicing
Illustration: Meyer Burger Illustration: Meyer Burger
Lapping or Grinding
Picture:TeraXtal
Shape measurement, flip
sorting (concave / convex)
Illustration: Meyer Burger
Mechanical Polishing
+ CMP
Illustration: Meyer Burger
Picture:Corning/Tropel
Metrology (Bow, Warp,
TTV, LTV, Sori, Sag…)
Laser marking
Final cleaning
Core mounting
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
16
After severe
shortage in
2010-2011,
excess supply
since 2012
sent back
prices to
levels close
to or below
cost for most
suppliers.
PRICE TRENDS: CORES FOR LED AND OPTICAL WAFERS
Cores (cylinders) for the manufacturing of LED or optical wafers are sold by the length (measured in mm)
at a given diameter.
6”
4”
2”
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
17
PRICE TRENDS: CORES FOR LED AND OPTICAL WAFERS
• Core prices recovered briefly from Q3-2013 to Q2-2014. This allowed many
material suppliers to finally break even. Those which operated at high utilization
rates and with the most competitive cost structures even generated reasonable
profits (Aurora Sapphire, Monocrystal …).
• However, prices starting falling again from Q3-2014 and are likely to reach their
lowest level ever by the end of 2015:
• 2” ASP might pass below the US$XX/mm level
• 4” will get close to or slightly below the $XX/mm bar on spot offers by players eager
to utilize their capacity.
• 6” is proven more resilient because few suppliers have so far been able to deliver long
cores with high quality.
• Leading suppliers have made significant progresses in reducing cost in the last 18
months. Improved yields is the most significant contributor but raw materials
and crucible cost have also decreased significantly. Some credit should actually
be given for that to the Apple-GTAT project which aggressively negotiated prices,
and coaxed various suppliers into increasing capacity, developing and
implementing new capabilities and new manufacturing paradigms to reduce their
costs.
• Most high volume suppliers such as Aurora, Monocrystal, STC, USIO, Biel-
Roshow design and assemble their furnaces internally, allowing for further
savings on equipment and depreciation cost.
It’s a cost game
and few
suppliers can
win. Price
probably
haven’t hit
bottom yet and
are constantly
challenging
suppliers ability
to reduce cost.
Ingots and cores at Monocrystal
(source: company)
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
18
MATERIAL COST STRUCTURE:AURORA SAPPHIRE
Aurora highly
competitive
cost position
combined with
high utilization
rate allowed
the company
to achieve a
XX% gross
margin in 2015
US$XX
[1] RMB 11.41 at 6.394 RMB/US$ exchange rate
Aurora Sapphire 2” cost structure and raw
material cost
(source: company)
• Aurora Sapphire (奥瑞德) claimed a cost around US$XX/mm of 2
inch core in 2014 [1] and expects to bring that figure to $XX/mm by
the end of the decade.
• The company achieved significant cost structure improvements
through reduction of depreciation (improved furnace throughput) and
raw material cost.
• One however has to be cautious when comparing costs for a given
product category from one manufacturer to another. Cost accounting
allows some flexibility for example on how fixed costs and overheads
are distributed between product lines etc…
• Nevertheless, we believe that the company indeed has a very
competitive cost structure as demonstrated by a company-level gross
margin above 20% in 2014.
• We believe that only a handful of manufacturers currently have a cost
position close to those levels and can breakeven at current US$XX-
$XX /mmm price levels.
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
19
CRYSTAL GROWTH TECHNOLOGY BREAKDOWN (Q3-2015)
• As of Q3 2015, Kyropoulos (“KY”) dominates the worldwide installed capacity, followed by GTAT’s ASF HEM
furnaces.
• Turnkey equipment is available off the shelves from a dozen suppliers located mostly in Eastern Europe and Asia.
Leading Suppliers are Apeks, Juropol, Yufeng New Energy etc…However, the bulk of the installed KY capacity still
derives from sapphire companies that design and assemble their furnaces internally such as Monocrystal, Rubicon,
Biel-Roshow, USI Opto, DK-Aztec. New companies willing to get a quick start will typically purchase off the
shelve equipment and later on, customize the design and build additional or upgrade furnaces internally.
Kyropoulos
dominates the
installed
capacity thanks
to its long
history and the
availability of
quality off-the-
shelves
equipment
from various
vendors.
Kyropoulos boules at Monocrystal
(Source: company)
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
20
CHINA: EMERGING COMPANIES
Q3-2015 Capacity
(TIE/month)
Comment
• New project. Plans 170 furnaces (HEM type, 110-120 kg boules)
• Have installed 700x 80Kg furnaces in Ordos, Inner Mongolia. Plan to upgrade to 120 kg.
• Plans to set up capacity for 100 millions sapphire windows per year in Inner Mongolia.
Applications include 50M display covers, 37.5M smaller displays , 82.25M nn2 (equivalent to
12.5M windows) for watches.
• Will install 600 crystal grower (already 260 as of Q2-2015), 889 crystal processing, cutting
and other equipment.
• Furnaces supplied by Aurora Sapphire,
• Growing100kg boules (equipment from XXXXXXXXXXXXX)
• Initial plan for 260t/year. Long term: Plan to install 600x 100 kg KY for annual output of 600 t
• Initial plan for 50x 100kg furnaces.
• Announced new plan in July 2015 for US$640M and 1000 furnaces.
• JV agreement signed with XXX
• RMB 1.05b investment to set up PSS capacity of 12m /year with first line to start in 2015
• Sapphire division of XXXXXXXX (CN)
• Growth will be 400k in 2016
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
21
FINGERPRINT READER COVERS: ESTABLISHED TECHNOLOGIES
iPhone + iPad Galaxy S5 Galaxy S6 Huawei Ascend Mate 7
• Apple/Authentec touch sensor
• 2D matrix
• 7,744 pixels at 500 DPI
• Sapphire cover
• Synaptic/Validity swipe sensor
• Linear
• 20 µm linewidth at 40 µm pitch
• Hard polymer coating
• Synaptic/Validity swipe sensor
• Linear
• 25 µm linewidth at 47 µm pitch
• Hard polymer coating
• Finger print Cards AB touch
sensor
• 2D matrix
• 36,864 pixels at 508 DPI
• Hard polymer coating
6 x 6.3 mm2
4 x 15 mm2
5 x 14 mm2
10 x 10 mm2
Source: System + Consulting; teardown and reverse costing analysis of the Apple 5s, Samsung Galaxy S5, S6 and Huawei Ascend Mate 7 fingerprint readers.
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
22
SAPPHIRE COVERS DESIGN AND SLICING PITCH
• The Apple Watch display cover design is a 3D design with complex curvatures and edge shapes. We assume a fairly low
manufacturing yield for this product (75% exiting 2015) and a slicing pitch of XXX mm.
• Other smart watch makers seem so far to have adopted a simpler 2D design.We assumed higher manufacturing yields (>90%).
Illustration: the different type of covers The AppleWatch cover has a complex 3D shape
(Pictures:Apple, iFixit)
The LG Urbane (showed here) or the HuaweiWatch
have a much simpler 2D design (pictures: iFixtit)
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
23
APPLE SAPPHIRE PATENT PORTFOLIO OVERVIEW
• We have identified 17 families of patents relevant to sapphire with priority dates dating back from 2012 (the 2007 patent just
mentions sapphire amongst a long list of possible transparent material):
Mar.
2012
Apr.
2012
May.
2012
Jun.
2012
Jul.
2012
Aug.
2012
Sep.
2012
Oct.
2012
Nov.
2012
Dec.
2012
Jan.
2013
Jul.
2007
Sapphire growth
Sapphire strengthening
Sapphire Cutting
Sapphire parts and components
Solving issues specific to the use of sapphire components
Apple Inc, sapphire related patents organized by priority date
Mar.
2013
Aug.
2013
Sep.
2013
Note: due to the normal delay between filing and publication, its is expected that many more patents have been filled by
Apple between Sept 2013 and now (Jul.2015) but have not yet been published by the patent offices.
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
24
OPTICAL WAFERS SUPPLY CHAIN: LENS, FINGERPRINT READER, HEART SENSOR
Material (Cores) Slicing + Polishing
Coating + Laser Cutting – Silk
Printing Assembly
100%
2014 Material fluxes (in volumes)
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
25
ALTERNATIVE TECHNOLOGIES - COATINGS
• Various companies have announced Al2O3 coating technologies which we estimate could be brought to the market in
high volume for less than US$XX per unit, bringing the total glass + coating cost to less than $XX per unit,
compared to > $20 for a pure bulk sapphire solution.
• Such technologies are being developed by Rubicon and GTAT and various other companies. China-based cell
phone OEM Desay (德赛) and Dakele (大可乐) already unrolled such coating in commercial products. We
believe that Corning’s “Project Phire” announced in February 2015 relies on a similar approach.
• Schott “Hard and Clear” coating technology (next page) expected to be available for mass production from July 2015
also offers performance close to sapphire in term of scratch resistance and doubles as an efficient anti reflective
coating (although there seem to be a compromise between reflectivity and hardness)
As of July 2015,
the overall
potential
benefits of
sapphire
remain unclear.
Desay “Magic Mirror X5” smartphone retails for RMB 999 (US$160)
and feature a strengthened glass display cover with an Al2O3 coating.
Hard & Clear -
Type I Ultra Hard
Hard & Clear
-Type II AR
Standard toughened
Alumino Silicate glass
Scratch
Resistance
Excellent
(>95 % scratches
reduced)
High
(>90 % scratches
reduced)
Medium
Residual
Reflection
(air – glass)
Low
(~1 %)
Excellent
(~0.6 %)
Standard
(~4 %)
Coating
Visibility
Very low Close to neutral
Neutral
(bare glass)
Breakage
Strength
Excellent Excellent High
Schott “Hard and Clear” coating performance. 2 variations are available with
emphasize on hardness or reflectivity,
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
26
GAN-ON-SI OVERVIEW
• With the most recent product from Toshiba, performance of GaN-On-Si LEDs have made dramatic
progress and essentially bridged the gap with sapphire based best in class LEDs, making those GaN-On-Si LEDs
a credible alternative:
The best GaN-
On-Si LED are
now on par
with state of
the art sapphire
LEDs in term of
performance.
Dec. 2013
Plessey
PLW114050:
64 lm/W
Jul. 2013
Plessey LED
PLW111010 :
36 lm/W30
60
120
150
180
0
Seoul Semiconductor
STW8Q14C
175 lm/w
Apr. 2013
Low and Mid power
package, cold white (5000-
5500k)
Best performance based
on company claims
Samsung
LM561B
170 lm/W
Everlight
L62-217D
150 lm/W
Osram
Lab result:
104lm/W
Lumileds
Luxeon 3535 2D
150 lm/W
Sapphire
Silicon
Cree
XLamp XH
170 lm/w
Toshiba
TL2FK :
110 lm/W
90
January 2013
Lattice Power*
LPIBB55A:
140 lm/W
*Available as die. Lm/w of white package Led is extrapolated
Toshiba
TL1F4 :
160 lm/W
Jun. 2014
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
27
GAN-ON-SI COST OF OWNERSHIP
• The tear down analysis conducted by System+ Consulting however indicate that droop is still an issue and that to
deliver similar efficiency as a state of the art sapphire LEDs, the die size has to be significantly larger.
• To achieve the same efficiency as a sapphire LED, the epi surface of the GaN-On-Si LED is therefore XXx larger.
• Using the LED CoSim+ cost simulation tool developed by System+ Consulting, we calculated that the epitaxy cost of
GaN-On-Si was about US$ XXX/mm2 compared to compared to 4” PSS was about US$XXX/mm2.
• To achieve the same efficiency, the GaN-On-Si die cost is therefore still about 25% higher than sapphire.
To achieve the
same efficiency,
the GaN-On-Si
die cost is still
about 25%
more
expensive
compared to
sapphire
ToshibaTL1F1 ToshibaTL1L4 Typical Sapphire
Year
Die Size (GaN Epitaxy
surface)
Current Density
Efficiency
(Intermediate
Bin @ 25 C)
Est. die cost per mm2
Die cost for this LED
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
28
2008-2020 SAPPHIRE WAFER START BY DIAMETER
Total
substrate
surface
shipment is
expected to
increase by
28% between
2015 and
2020.
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
29
NANO-IMPRINT LITOGRAPHY
• Nano Imprint Lithography (NIL) has emerged as an alternative
and potentially cost-effective solution to create nanoscale
patterns over large surfaces.
• NIL creates the nanostructures by stamping a deformable
material (polymer) with a mold. The material is then UV cured
and forms a hard mask used to pattern the wafer with standard
etching processes.
• NIL is based on mechanical replication and is not limited by
optical diffraction. It can potentially achieve < 5nm resolution
and very good critical defect (CD) control at a very low cost.
• The stamp is produced from a master created by using high-
resolution electron beam or optical interference lithography.
The master’s lifetime is essentially infinite, while stamps can be
re-used multiple times.
• Different variations of the NIL process are available:
• Hard molds: silicon, metal, silica
• Conformable molds: PDMS polymer
• Due to the higher bow of larger sapphire wafers, a soft mold is
preferable for PSS.
Nano-
Imprint
Lithography
is a full field,
high
resolution
technology.
Resist spin
coating
Stamp Loading
Imprinting + UV
curing
Stamp
Releasing
Etching
(Pattern transfer)
Resist
RemovalImprint Lithography process
(Source: EVG)
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
30
AURORA SAPPHIRE: MAJOR CUSTOMERS 2012-2014
• In 2012, XX represented XX% of the
revenue but includes the sale of 37
growth furnaces for the JV with XX +
4 directly to XX for a total estimated
at US$XX m. the balance is cores and
optical wafers.
Biel and/or
Lens have
been the
single largest
customers
since 2012.
• In 2014, sales to XX are material and
wafers only (no equipment).
• Sales to XX are mostly for 101
sapphire furnaces
• Other notable 2014 customers
included XX at around US$6m as
well as XX (the sapphire substrate
venture of XX), XX, XX (15 furnaces)
and XX.
• 2013 sales to XX and XX Sapphire
are mostly constituted of sapphire
growth furnaces.
• Sales to XX are mostly to the
Chinese branch (88% of the total).
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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© 2015
Yole Développement
FromTechnologies to Market
32
MEMS 
Sensors
LED / OLED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced
Packaging
PV
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
33
4 BUSINESS MODELS
o Consulting and Analysis
• Market data  research, marketing analysis
• Technology analysis
• Strategy consulting
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www.yole.fr
o Reports
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Blu Morpho
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• Events
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34
A GROUP OF COMPANIES
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IP analysis
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www.knowmade.fr
Blu Morpho
35
OUR GLOBAL ACTIVITY
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North America
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Blu Morpho
36
RESEARCH PRODUCTS - CONTENT COMPARISON
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Standard Reports
37
SERVING THE ENTIRE SUPPLY CHAIN
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foundries…
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38
SERVING MULTIPLE INDUSTRIAL FIELDS
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More-than-
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39
REPORTS COLLECTION
o Yole Développement publishes a comprehensive collection of market  technology reports and patent analysis in:
• MEMS  Sensors
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o Every year, Yole Développement, System Plus Consulting and Knowmade publish +60 reports.
o Take the full benefit from our Bundle and Annual Subscription offers.
www.i-Micronews.com
40
OUR 2015 REPORTS PLANNING
MARKET TECHNOLOGY REPORTS byYole Développement
o MEMS  SENSORS
− Sensors and Data Management for Autonomous Vehicles
− AlN Thin Film Markets And Applications
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled IR Imagers
− IR Detectors
− High End Gyro, Accelerometers and IMU
− Non-Volatile Memory
o IMAGING  OPTOELECTRONICS
− Camera Module Packaging (Vol 1 : Market  Technology Trends / Vol 2 Teardowns 
Reverse Engineering)
− Uncooled IR Imagers
− Wafer Level Optics
− Status of the CMOS Image Sensors
− Machine Vision
o MEDTECH
− Microfluidic for Sample Preparation
− Microfluidic Applications
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− High Purity Alumina (HPA)
− Sapphire
− Wide Bandgap Materials For Power Electronics: SiC, GaN (and also Ga2O3, AlN,
Diamond, Graphene… as a trend)
* Reports to be decided within 2015
o LED
− LED Module
− OLED for Lighting
− UV LED
− LED Phosphors Market
o POWER ELECTRONICS
− Power Packaging
− Thermal Management for LED and Power
− Power Electronics for Renewable Energy
− Energy Management For Smart Grid And Smart Cities
− Status of Chinese Power Electronics Industry
− New Technologies For Data Center
− Inverter Market Trends For 2013 – 2020 And Major Technology Changes*
− IGBT Markets And Application Trends
− Power Electronics for HEV/EV*
− Status of Power Electronics Industry
o ADVANCED PACKAGING
− Advanced Packaging in Emerging Markets in China
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− WLCSP*
− Flip Chip Business Update
− 2.5D  3DIC Business Update
− Fan-Out and Embedded Business Update
o MANUFACTURING
− Lithography for MEMS, Advanced Packaging and LED
− Thinning  Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS
Image Sensors
− Non-Volatile Memory
41
OUR 2015 REPORTS PLANNING
PATENT ANALYSIS by Knowmade
o Patent Infringement (crossed analysis based on Knowmade and System Plus Analysis expertise)
− MEMS Microphone Applications
− Infrared Imaging
o Patent Investigation (crossed analysis based on Knowmade Yole Développement expertise)
− Power GaN
− MEMS Gyroscope
− 6-axis  9-axis Inertial MEMS IMUs
− Microbatteries
− Embedded Active  Passive Packages
− Interposer
− Phosphors for LED
TEARDOWN  REVERSE COSTING by System Plus Consulting
More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2015.
* Reports to be decided within 2015
42
OUR 2014 PUBLISHED REPORTS LIST
MARKET TECHNOLOGY REPORTS
byYole Développement
o MEMS  SENSORS
− Technologies  Sensors for the Internet of Things: Businesses  Market Trends 2014-2024
− MEMS Microphone: Market, Applications and Business Trends 2014
− Status of the MEMS industry
− MEMS  Sensors for Mobile Phones and Tablets
− High End Gyroscopes and Accelerometer Applications
− Inertial MEMS Manufacturing Technical Trends
− New Detection Principles  Technical Evolution for MEMS  NEMS
− 6/9 DOF Applications in Consumer Electronics
o IMAGING  OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry
− Uncooled Infrared Imaging Technology  Market Trends
− Silicon Photonics
o MEDTECH
− Point of Care Testing: Applications for Microfluidic Technologies
− Solid State Medical Imaging: X-ray and Endoscopy
o COMPOUND SEMICONDUCTORS
− RF GaN Technology  Market Analysis: Applications, Players, Devices  Substrates 2010-
2020
− SiC Modules, Devices and Substrates for Power Electronics Market
− GaN-on-Si Substrate Technology and Market for LED and Power Electronics
− Power GaN Market
− Graphene Materials for Opto  Electronic Applications
− Sapphire Applications and Market: from LED to Consumer Electronics
o LED
− LED Packaging
− LED Front-End Manufacturing Trends
− LED Front-End Equipment Market
o POWER ELECTRONICS
− Power Electronics for HEV/EV
− Inverters
− Gate Driver Unit Market for Power Transistors
o PHOTOVOLTAICS
− Emerging and Innovative Technology Approaches in the Solar Industry
o ADVANCED PACKAGING
− 3DIC Equipment and Materials
− 3DIC  2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
o MANUFACTURING
− Market  Technology Trends in Materials  Equipment for Printed  Flexible Electronics
− Permanent Wafer Bonding for Semiconductor: Application Trends  Technology
PATENT ANALYSIS
by Knowmade
− LED Based on Nano-wires Patent Investigation
− GaN on Si Patent Investigation (LED, Power devices and RF Devices)
− New MEMS Devices Patent Investigation
− Non Volatile Memory Patent Investigation
TEARDOWN  REVERSE COSTING
by System Plus Consulting
More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2014.
43
MICRONEWS MEDIA
o About Micronews Media
Micronews Media, powered by Yole
Développement, ensures you the best visibility
in the disruptive semiconductor community.
With our services, we help you to reach your
customers worldwide with the media products
they prefer, including our website, e-newsletter,
webcasts, and magazines. Invest in a high added-
value editorial program and get access to Yole
Développement’s network (48 000+ contacts).
o Five supports and channels for your visibility
• A technology magazine to highlight
your visibility with advertisements,
company profiles, product descriptions and
white papers
• A webcast to highlight your expertise and
develop your business identifying
commercial leads
• Articles, advertisements  logo and
banners dedicated to your company, its
products and expertise in @Micronews e-
newsletter and on i-Micronews.com
Focused
community
Identified
contacts
Large
community
Mass contacts
44
COMMUNICATION SERVICES
All services listed below are available on–demand.
o i-Micronews.com, the website
Slider – Banners (on English or Japanese websites) – Articles –
Logo and profile as sponsor
o @Micronews, the e-newsletter
Headline article - Tiles
o Custom webcast
Develop your dedicated event with a high added-value program. A
turnkey event withYole support (logistics, promotion, data…)
o Technology Magazines: Custom – Co-produced
Increase your visibility through a dedicated technology magazine
with ads, company profile, product descriptions and white papers.
It can be a custom magazine: your company is the only one to
benefit from it – or a co-produced one: up to 2 companies.
Contacts:
Camille Veyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr),
Media  Communication Coordinators.
45
CONTACT INFORMATION
o Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr
• Japan:Yutaka Katano, General Manager,Yole Japan  President,Yole K.K.
Email: katano@yole.fr
• RoW: Jean-Christophe Eloy, President  CEO,Yole Développement
Email: eloy@yole.fr
o Report business
• North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination  Customer Service
Email: khamassi@yole.fr
• Japan  Asia:Takashi Onozawa, Sales Asia  General Manager,Yole K.K.
Email: onozawa@yole.fr
• Korea: HaileyYang, Business Development Manager, Korean Office
Email: yang@yole.fr
o Financial services
• Jean-Christophe Eloy, CEO  President
Email: eloy@yole.fr
o General
• Email: info@yole.fr
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Sapphire Applications & Market 2015 Report by Yole Developpement

  • 1. July © 2015 From Technologies to Market Sapphire Applications & Market 2015: from LED to Consumer Electronic. Report Sample From Technologies to Market
  • 2. 2 TABLE OF CONTENTS Part 1/V ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report Sapphire properties vs. orientation Value chain. Example: Sapphire wafer process Material defects and slicing Core / brick length Major industry players: crystal growth companies Major industry players: wafer slicing and finishing Major industry players: PSS Status of the Sapphire Industry p67 Price trends: cores for LED and optical wafers Material cost structure exemple:Aurora Sapphire Price trends: Conventional sapphire substrates for LED Price trends: Patterned sapphire substrates for LED (PSS) Discussion Price trends: bricks and optical wafers for consumer electronic 2008-2020 price forecast 2014 top 20 Sapphire company revenue for core, bricks & wafers Detailed breakdown by segment Revenue structure: captive and open markets 2014 revenue breakdown for Core & bricks and polished wafers 2014 revenue breakdown for optical and PSS wafers Geographic breakdown per product category Exchange rates impacts Product categories and applications covered in this report p5 Executive Summary p7 The 3 page summary China dominates Sapphire industry growth drivers: Historical perspective Application breakdown Consumer electronic applications List of mobile devices with sapphire components Smartwatches Sapphire display covers 2014 Sapphire company revenue Sapphire supply and demand LED applications Alternative substrates Sapphire wafer forecast Core shipment forecasts What happened to silicon on sapphire? Past year and Noteworthy News p46 Introduction to the Sapphire Industry p56 Industry Overview Sapphire properties overview
  • 3. 3 TABLE OF CONTENTS Part 1I/V Optical wafer manufacturing: Camera lens covers: overview and adoption trends Fingerprint reader covers: overview/emerging technologies/established technologies/alternative technologies/sapphire use/adoption trends Heart monitor sensor covers OpticalWafers 2012 -2020 volume and revenue forecast/ingot (core) forecast Smart watches market review & forecast p138 Forecasting the Smartwatch market Smartwatch volume forecast 2012-2020 Sapphire in Smartwatches:AppleWatch/other brands/sapphire adoption rate forecast Sapphire smartwatch cover volume & revenue forecast Sapphire covers design and slicing pitch Smartwatch volumes and forecast Sapphire display covers - market review and forecast p148 Mobile devices display covers – Overview Touch panels – technology overview Display and touch sensor structures Touch sensors and display panels supply chain Display cover manufacturing process Supply and demand analysis p86 Definitions and metrics Brick and core extraction Geographic and product category geographic breakdown Crystal Growth Capacity: 2012-2015 evolution by region Crystal Growth Capacity:Top 20 ranking Crystal growth technology breakdown (Q3-2015) HEM furnaces Finishing Capacity: 2012-2015 evolution by region Finishing Capacity:Top 20 ranking PSS Capacity: 2012-2015 evolution by region PSS Capacity:Top 20 ranking Material, finishing and PSS Supply vs demand Attrition and consolidation Why does capacity keep increasing? Focus on China/Taiwan/Korea/Europe/North America Supply vs demand analysis: no sapphire display cover Supply vs demand analysis: sapphire display cover adoption Discussion “OpticalWafers” market review and forecast: Camera lens, fingerprint readers and heart rate monitors covers p123 Sapphire components at Apple ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 4. 4 TABLE OF CONTENTS Part 1II/V iPhone display covers: current status Partial roll out in a premium model Full roll out in major iPhone model(s) Material supply chain requirements Most significant capacity investments 2014-2016 Material capacity evolution 2014-2016 Who will supply Apple display covers? Who will supply material for Apple display covers? Conclusions Crystal growth technologies for display covers p198 Sapphire growth methods for display covers: KY etc… Sapphire technology –VHGF HEM CHESS EFG Method Orientation for display covers Sapphire display cover manufacturing cost p205 2014 cost model Sapphire brick – GTAT ASF cost Sapphire brick – Kyropoulos cost Brick cost modeling Results Potential benefits of sapphire display covers: mechanical strength / dielectric constant Putting sapphire to the test: GTAT vs Corning/Ubreakifix.com / impact of finishing process Conclusions on mechanical testing Major issues of Sapphire display covers Summary Current status Apple sapphire patent portfolio overview Which Strategy for differentiation? Sapphire adoption trends Display cover adoption scenario Display cover adoption rate forecast 2015-2020. Apple Sapphire ecosystem and strategy p173 Apple supply chain: overview 2014 revenue from Apple Optical wafers supply chain AppleWatch supply Chain Discussion Display cover supply chain overview: GTAT, Biel and Lens. GTAT – Apple partnership:what went wrong? What’s next for GTAT and the mesa furnace ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 5. 5 TABLE OF CONTENTS Part 1V/V Alternative LED substrates p238 Gan-on-Si overview GaN-on-Si cost of ownership Gan-on-Si adoption Key players and strategic positioning GaN-On-Gan Alternative substrates adoption forecast LED Epitaxy (MOCVD) capacity trends p245 Gan MOCVD capacity 2010-2015 evolution per region GaN MOCVD capacity supply vs demand trends Gan MOCVD Q3-2015 utilization rate per region Gan MOCVD Q3-2015 utilization rate in China Geographic breakdown and conclusions LED wafer market & forecast p251 LED wafer forecast methodology LED wafers value chain Sapphire wafer consumption Q3-2015 geographic breakdown Incentive for adoption of large diameter wafers Challenges for the adoption of large diameter wafers Q3-2015 Diameter breakdown per region Q3-2015 Diameter breakdown – global 6” adoption and beyond LED wafer diameter breakdown forecast 2012-2020. 2008-2020 sapphire wafer start by diameter Discussions Brick cost structure Yields impact Full display cover cost Conclusions Alternative technologies for display covers p221 Strengthened glass - Gorilla glass Alternative technologies – Coatings Schott “Hard and clear” solution. Alternative technologies – Exfoliation & laminates Alternative technologies – DLC Transparent ceramics:ALONTM & spinel LED market overview p229 LED market growth cycles LED adoption trends per application General lighting market segmentation and main drivers Previous LED market forecast (2014) Updated LED forecast Discussion LED bulb lifetimes LED marketTrends – Display ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 6. 6 TABLE OF CONTENTS PartV/V 2012-2015 ASP and gross margins trends per product 2012-2014 capacity and utilization rates trends 2015 capacity expansion plans 2012-2014 revenue by product & application 2014 revenue breakdown by product & application 2012-2014 revenue geographic breakdown Major customers 2012-2014 LENSTechnology (蓝思科技股份有限公司) p301 Overview Capacity Revenue breakdown by product and customers Sapphire revenue breakdown Sapphire investment status and future plans Other Company Profiles p309 BIEL Crystal (伯恩光学有限公司) Biel-Roshow Sapphire (伯恩露笑蓝宝石有限公司) Sapphire technology Rubicon technology Monocrystal Saifei (广东赛翡蓝宝石科技有限公司) Crystal Optech (浙江水晶光电科技股份有限公司) NJC (南京京晶光电科技有限公司) Kama Crystal Patterned sapphire substrates – benefits When are PSS used? Pattern design PSS manufacturing process overview Lithography techniques for LED Nano-Imprint Litography PSS market: historical perspectives Q3-2015 CSS and PSS consumption per region PSS supply chain 2008-2020 CSS and PSS volume forecast 2008-2020 core shipment forecasts 2008-2020 LED wafer revenue forecast LED filaments p279 Overview Filament material Filament manufacturing process Performance and cost Analysis LED filament 2012-2020 shipment and revenue forecast Aurora Sapphire (哈尔滨奥瑞德光电技术股份有限公司) p288 Overview 2011-2015 revenue and gross margins trends Growth technology and cost control ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 7. 7 Biography & contact ABOUT THE AUTHORS Eric VIREY received a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble. He’s held various R&D, engineering, manufacturing and marketing positions with Fortune 500 company Saint-Gobain in France and the United States. In its most recent position, he was Market Manager Optoelectronics in charge various product lines and serving the LED and optical telecommunication industries. In parallel, he was leading the corporate “Lighting Community” effort, acting as a market and technology competitive intelligence evangelist to identify and develop new business opportunities in solid state lighting (LED/OLEDs) across multiple business units. Eric has a broad knowledge of the entire solid state lighting value chain. In 2009, he joined Yole Developpement as a Senior Market andTechnology Analyst for LED Devices and Materials. Eric is also author / co-author of the following reports: • LED Packaging • LED Front End Manufacturing • III-V Epitaxy • Bulk GaN • GaN on Silicon • Status of the LED Industry • Sapphire Market & Applications • High Purity Alumina Contact: virey@yole.fr ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 8. 8 ACRONYMS A: Ampere AMOLED: Active Matrix OLED ASP: Average Selling Price CAGR: compound Annual Growth Rate Capex: Capital Expenditure CCFL: Cold Cathode Fluorescence Lamp CE: Consumer Electronic CHES: Controlled Heat Extraction System CSS: Conventional Sapphire Wafer CTE: Coefficient of Thermal Expansion CZ: Czochralski DD: Dislocations density EFG: Edge-defined Film-fed Growth FPR: FingerPrint Reader GES : Growth from an Element of Shape HB-LED: High-Brightness Light Emitting Diodes HEM: Heat Exchange Method HPA: High Purity Alumina HVPE: Hybrid Vapor Phase Epitaxy KY: Kyropoulos LCD: Liquid Crystal Display LD: Laser Diode LEC : Liquid Encapsulation Czochralski LED: Light Emitting Diode LEE: Light Extraction Efficiency LOG: Lateral Over-Growth MBE: Molecular Beam Epitaxy MOCVD: Metal-Organic Chemical Vapor Deposition Msi: Million Square Inch nPSS: Nano-PSS OEM: Original Equipment Manufacturer OLED: Organic LED PA: Power Amplifier PSS: Patterned Sapphire Substrate PV: Photovoltaic RF: Radio Frequency RFIC: Radio Frequency Integrated Circuit SoI: Silicon on Insulator SOS: Silicon on Sapphire TAM: Total Accessible Market Tc: Thermal Conductivity Tj: Junction Temperature TIE: Two Inch Equivalent TTV: Total Thickness Variation V: Volt VHGF: Vertical Horizontal Gradient Freezing W: Watt ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 9. 9 PRODUCT CATEGORIES AND APPLICATIONS COVERED IN THIS REPORT Volume and revenue forecast for the check marked items are covered in this report. Cores Bricks Single side polished Conventional Sapphire Wafers (CSS) for LED and Silicon On Sapphire epitaxy Patterned Sapphire Substrates (PSS) for LED epitaxy Double Side Polished OpticalWafer Covers for camera lens, fingerprint reader and heart rate monitor Covers for camera lens, fingerprint reader and heart rate monitor ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 10. 10 CONSUMER ELECTRONIC APPLICATIONS • In 2012, Apple introduced the iPhone 5, the first smartphone to use a sapphire camera lens cover. In 2013, it introduced the iPhone 5s which featured a Fingerprint Reader (FPR) protected by a sapphire cover in the “Home Button”. The technology was unrolled in iPad products in 2014. Finally, in 2015, Apple introduced its first smart watch, the Apple Watch which features a heart rate monitor constituted of a combination of green and infrared LEDs and photodiodes protected by 4 transparent sapphire lenses. • As of H1-2015, adoption of sapphire camera lens covers at non-Apple cell phone manufacturers is still limited. But with manufacturing process now reasonably mature, the ASP of sapphire lens covers is expected to fall below $0.5/unit which will increase adoption from 2016. In 2015, leading Tier 2 brands Huawei and HTC both already announced new flagship models featuring sapphire lens covers. • We expect fingerprint readers to become standard on all smartphone by 2020. But the use of sapphire will likely remain an Apple oddity. So far only one other OEM has adopted sapphire in a model introduce in 2015. By successively introducing camera lens covers, fingerprint readers and smartwatch, Apple has created an entire new market for sapphire wafers The HTC One M9 (2015) features a sapphire camera lens The Huawei Honor 7 (2015) features a sapphire camera lens The Meizu MX4 Pro features a front face fingerprint reader with a sapphire cover ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 11. 11 SAPPHIRE DISPLAY COVERS • But KY and GTAT’s ASF both have room for improvement: GTAT could eventually succeed in producing larger boules of 200, 240 or 260 kg and Monocrystal recently demonstrated a 300 kg KY process. • Other possible options include ARC Energy which also recently announced a 300 kg process based on its new generation of CHES furnaces. Sapphire Technology VHGF technology produces much smaller boules in brick shapes and short cycle times which could prove competitive for display cover applications. • With the ability to produce multiple rectangular ribbons of adjustable width and length in parallel, EFG has always seemed a good fit for the application. Trading companies recently signed an agreement with a Japanese supplier with 20 years of EFG experience to sell high performance furnaces in China which could produce up to 3000 parts per month. The companies claim to already have orders for 300 units in 2015 and expect to sell 1000 in 2016.Various technologies and companies are positioning themselves to win the market Different sizes of slabs produced by Sapphire Technology with the VHGF technology (source: company) A 300 kg boule produced with ARC Energy new CHES furnaces design A 300 kg boule produced by Monocrystal using its Kyropoulos technology ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 12. 12 SAPPHIRE DISPLAY COVERS • But in any case, we don’t see a quick path for the industry to achieve the kind of cost that Apple and GTAT initially targeted for 2015. • For the bricks, while not out of reach, sub $XX/mm cost will require further process development, economies of scale (consumable, spare parts…) and are at least 2 years away. In the short term, it is going to be challenging for sapphire makers to offer prices even approaching $XX/mm. • As of 2015, we estimate that even in high volume (millions), the price for sapphire display covers would hover around $XX/pcs. With rapid process improvements and economies of scale achieved by the large projects currently under construction, this could drop to around $XX in 2016 and below $XX in 2017.We don’t expect that initial targets set by Apple in 2013 can be achieved until 2017 when the price of a sapphire display cover could finally pass below the $XX bar. ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 13. 13 2014 SAPPHIRE COMPANY REVENUE [1] Revenue generated by GTAT from smartphone bricks shipped to Biel and Lens for the aborted iPhone 6 sapphire display ramp up are not included (est.: US$ 45M) [2] Lens claims US$412M of sapphire related revenue in 2014.We estimate that US$284 was generated from actual component sales (next page) Adding finished components (lens covers etc…), revenue reached US$1.8b dominated by Biel and Lens: ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 14. 14 Q3-2014 Toshiba, JP announces plans to invest US$ 500m to ramp up capacity for its GaN-On-Silicon LED technology 150x by 2016 to capture 10% of the white LED market. LED maker Epistar, TW (晶元光電股份有限公司), currently the 2nd largest in term of GaN MOCVD capacity acquires rival Formosa Epitaxy, TW (璨 圓光電股份有限公司). July August September TDG Core, CN ( 天 通 控 股 股 份 有 限 公 司 ) announces a JV with Taiwan-based PSS foundry Phecda Technology,TW (德晶科技股份有限公司) to set up a new PSS manufacturing factory. Each company will invest RMB 20m in the JV. PSS foundry Aceplux Optotech, TW (兆鑫光電 科技股份有限公司) increases capital by NT$297m (US$10m) by issuing 3500 shares at NT$85 each. The proceed will be used to increase capacity from 150k TIE/m to 300k TIE/m. The company will have a total of 15 production lines. EGing Photovoltaic Technology, CN (EGing PV) (亿晶光电科技股份有限公司) will install 50x 100kg sapphire for annual capacity of 750,000 mm of 4” ingot + 370k mm of 2” ingots. Total investment: RMB 132m. Tera Xtal, TW (鑫晶鑽科技股份有限公司) will increase PSS capacity from 100k to 200k TIE/month by the end of 2014. The company intends to implement nano imprint lithography technology. Competitor Rigidtech, CN (銳捷科 技股份有限公司) plans to set up a manufacturing plant in Suzhou (CN) and expand PSS capacity from 800k to 1.2m TIE/month. Sunyes Electronic Manufacturing, CN (深圳市 新亚电子制程股份有限公司) acquires 10.3% of Guangdong Saifei, CN (广东赛翡蓝宝石科技有限 公司) for RMB 280m, valuating the company at RMB 2.72b (~US$440m) and approves a RMB 180m loan to supplement working capital. Southwest Pharmaceutical, CN (西南药业股 份有限公司) acquires Aurora Sapphire, CN (哈 尔滨奥瑞德光电技术股份有限公司) via an asset swap valuing the company at RMB 4.12b (US$644m) and will raise an additional US$167m to fund capacity expansion close to 10 mm of TIE million in 2015. Anhui Guofeng Plastic, CN (安徽国风塑业股份 有限公司) acquires 29.59% of Ning Xia Jiajing Technology (宁夏佳晶科技有限公司), the China- based subsidiary of sapphire maker Procrystal, TW (佳晶科技股份有限公司). Guofeng will later increase participation to 51.02% in February 2015 after further equity transfer and capital increase. Huawei, CN and Vivo, CN release limited edition of their new flagship models with sapphire cover glass Apple announces new iPhone 6 and 6+. None features the highly anticipated cover glass. The company also presents its first line of smartwatch with 2 of the 3 models featuring a sapphire cover. X ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 15. 15 EXAMPLE: SAPPHIRE WAFER PROCESS Crystal Growth Boule Cropping, X-Ray orientation, Core Extraction & Cropping Core cropping, X-ray core orientation, OD grinding / orientation adjustment, Notch or flat grinding Picture:Thermal Technology Illustration :Rubicon Technology Metrology: Thickness, BOW, TTV, TV5 Thickness and quality sorting (up to 30 bins) Illustration: Meyer Burger Illustration: Meyer Burger Slicing Illustration: Meyer Burger Illustration: Meyer Burger Lapping or Grinding Picture:TeraXtal Shape measurement, flip sorting (concave / convex) Illustration: Meyer Burger Mechanical Polishing + CMP Illustration: Meyer Burger Picture:Corning/Tropel Metrology (Bow, Warp, TTV, LTV, Sori, Sag…) Laser marking Final cleaning Core mounting ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 16. 16 After severe shortage in 2010-2011, excess supply since 2012 sent back prices to levels close to or below cost for most suppliers. PRICE TRENDS: CORES FOR LED AND OPTICAL WAFERS Cores (cylinders) for the manufacturing of LED or optical wafers are sold by the length (measured in mm) at a given diameter. 6” 4” 2” ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 17. 17 PRICE TRENDS: CORES FOR LED AND OPTICAL WAFERS • Core prices recovered briefly from Q3-2013 to Q2-2014. This allowed many material suppliers to finally break even. Those which operated at high utilization rates and with the most competitive cost structures even generated reasonable profits (Aurora Sapphire, Monocrystal …). • However, prices starting falling again from Q3-2014 and are likely to reach their lowest level ever by the end of 2015: • 2” ASP might pass below the US$XX/mm level • 4” will get close to or slightly below the $XX/mm bar on spot offers by players eager to utilize their capacity. • 6” is proven more resilient because few suppliers have so far been able to deliver long cores with high quality. • Leading suppliers have made significant progresses in reducing cost in the last 18 months. Improved yields is the most significant contributor but raw materials and crucible cost have also decreased significantly. Some credit should actually be given for that to the Apple-GTAT project which aggressively negotiated prices, and coaxed various suppliers into increasing capacity, developing and implementing new capabilities and new manufacturing paradigms to reduce their costs. • Most high volume suppliers such as Aurora, Monocrystal, STC, USIO, Biel- Roshow design and assemble their furnaces internally, allowing for further savings on equipment and depreciation cost. It’s a cost game and few suppliers can win. Price probably haven’t hit bottom yet and are constantly challenging suppliers ability to reduce cost. Ingots and cores at Monocrystal (source: company) ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 18. 18 MATERIAL COST STRUCTURE:AURORA SAPPHIRE Aurora highly competitive cost position combined with high utilization rate allowed the company to achieve a XX% gross margin in 2015 US$XX [1] RMB 11.41 at 6.394 RMB/US$ exchange rate Aurora Sapphire 2” cost structure and raw material cost (source: company) • Aurora Sapphire (奥瑞德) claimed a cost around US$XX/mm of 2 inch core in 2014 [1] and expects to bring that figure to $XX/mm by the end of the decade. • The company achieved significant cost structure improvements through reduction of depreciation (improved furnace throughput) and raw material cost. • One however has to be cautious when comparing costs for a given product category from one manufacturer to another. Cost accounting allows some flexibility for example on how fixed costs and overheads are distributed between product lines etc… • Nevertheless, we believe that the company indeed has a very competitive cost structure as demonstrated by a company-level gross margin above 20% in 2014. • We believe that only a handful of manufacturers currently have a cost position close to those levels and can breakeven at current US$XX- $XX /mmm price levels. ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 19. 19 CRYSTAL GROWTH TECHNOLOGY BREAKDOWN (Q3-2015) • As of Q3 2015, Kyropoulos (“KY”) dominates the worldwide installed capacity, followed by GTAT’s ASF HEM furnaces. • Turnkey equipment is available off the shelves from a dozen suppliers located mostly in Eastern Europe and Asia. Leading Suppliers are Apeks, Juropol, Yufeng New Energy etc…However, the bulk of the installed KY capacity still derives from sapphire companies that design and assemble their furnaces internally such as Monocrystal, Rubicon, Biel-Roshow, USI Opto, DK-Aztec. New companies willing to get a quick start will typically purchase off the shelve equipment and later on, customize the design and build additional or upgrade furnaces internally. Kyropoulos dominates the installed capacity thanks to its long history and the availability of quality off-the- shelves equipment from various vendors. Kyropoulos boules at Monocrystal (Source: company) ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 20. 20 CHINA: EMERGING COMPANIES Q3-2015 Capacity (TIE/month) Comment • New project. Plans 170 furnaces (HEM type, 110-120 kg boules) • Have installed 700x 80Kg furnaces in Ordos, Inner Mongolia. Plan to upgrade to 120 kg. • Plans to set up capacity for 100 millions sapphire windows per year in Inner Mongolia. Applications include 50M display covers, 37.5M smaller displays , 82.25M nn2 (equivalent to 12.5M windows) for watches. • Will install 600 crystal grower (already 260 as of Q2-2015), 889 crystal processing, cutting and other equipment. • Furnaces supplied by Aurora Sapphire, • Growing100kg boules (equipment from XXXXXXXXXXXXX) • Initial plan for 260t/year. Long term: Plan to install 600x 100 kg KY for annual output of 600 t • Initial plan for 50x 100kg furnaces. • Announced new plan in July 2015 for US$640M and 1000 furnaces. • JV agreement signed with XXX • RMB 1.05b investment to set up PSS capacity of 12m /year with first line to start in 2015 • Sapphire division of XXXXXXXX (CN) • Growth will be 400k in 2016 ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 21. 21 FINGERPRINT READER COVERS: ESTABLISHED TECHNOLOGIES iPhone + iPad Galaxy S5 Galaxy S6 Huawei Ascend Mate 7 • Apple/Authentec touch sensor • 2D matrix • 7,744 pixels at 500 DPI • Sapphire cover • Synaptic/Validity swipe sensor • Linear • 20 µm linewidth at 40 µm pitch • Hard polymer coating • Synaptic/Validity swipe sensor • Linear • 25 µm linewidth at 47 µm pitch • Hard polymer coating • Finger print Cards AB touch sensor • 2D matrix • 36,864 pixels at 508 DPI • Hard polymer coating 6 x 6.3 mm2 4 x 15 mm2 5 x 14 mm2 10 x 10 mm2 Source: System + Consulting; teardown and reverse costing analysis of the Apple 5s, Samsung Galaxy S5, S6 and Huawei Ascend Mate 7 fingerprint readers. ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 22. 22 SAPPHIRE COVERS DESIGN AND SLICING PITCH • The Apple Watch display cover design is a 3D design with complex curvatures and edge shapes. We assume a fairly low manufacturing yield for this product (75% exiting 2015) and a slicing pitch of XXX mm. • Other smart watch makers seem so far to have adopted a simpler 2D design.We assumed higher manufacturing yields (>90%). Illustration: the different type of covers The AppleWatch cover has a complex 3D shape (Pictures:Apple, iFixit) The LG Urbane (showed here) or the HuaweiWatch have a much simpler 2D design (pictures: iFixtit) ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 23. 23 APPLE SAPPHIRE PATENT PORTFOLIO OVERVIEW • We have identified 17 families of patents relevant to sapphire with priority dates dating back from 2012 (the 2007 patent just mentions sapphire amongst a long list of possible transparent material): Mar. 2012 Apr. 2012 May. 2012 Jun. 2012 Jul. 2012 Aug. 2012 Sep. 2012 Oct. 2012 Nov. 2012 Dec. 2012 Jan. 2013 Jul. 2007 Sapphire growth Sapphire strengthening Sapphire Cutting Sapphire parts and components Solving issues specific to the use of sapphire components Apple Inc, sapphire related patents organized by priority date Mar. 2013 Aug. 2013 Sep. 2013 Note: due to the normal delay between filing and publication, its is expected that many more patents have been filled by Apple between Sept 2013 and now (Jul.2015) but have not yet been published by the patent offices. ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 24. 24 OPTICAL WAFERS SUPPLY CHAIN: LENS, FINGERPRINT READER, HEART SENSOR Material (Cores) Slicing + Polishing Coating + Laser Cutting – Silk Printing Assembly 100% 2014 Material fluxes (in volumes) ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 25. 25 ALTERNATIVE TECHNOLOGIES - COATINGS • Various companies have announced Al2O3 coating technologies which we estimate could be brought to the market in high volume for less than US$XX per unit, bringing the total glass + coating cost to less than $XX per unit, compared to > $20 for a pure bulk sapphire solution. • Such technologies are being developed by Rubicon and GTAT and various other companies. China-based cell phone OEM Desay (德赛) and Dakele (大可乐) already unrolled such coating in commercial products. We believe that Corning’s “Project Phire” announced in February 2015 relies on a similar approach. • Schott “Hard and Clear” coating technology (next page) expected to be available for mass production from July 2015 also offers performance close to sapphire in term of scratch resistance and doubles as an efficient anti reflective coating (although there seem to be a compromise between reflectivity and hardness) As of July 2015, the overall potential benefits of sapphire remain unclear. Desay “Magic Mirror X5” smartphone retails for RMB 999 (US$160) and feature a strengthened glass display cover with an Al2O3 coating. Hard & Clear - Type I Ultra Hard Hard & Clear -Type II AR Standard toughened Alumino Silicate glass Scratch Resistance Excellent (>95 % scratches reduced) High (>90 % scratches reduced) Medium Residual Reflection (air – glass) Low (~1 %) Excellent (~0.6 %) Standard (~4 %) Coating Visibility Very low Close to neutral Neutral (bare glass) Breakage Strength Excellent Excellent High Schott “Hard and Clear” coating performance. 2 variations are available with emphasize on hardness or reflectivity, ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 26. 26 GAN-ON-SI OVERVIEW • With the most recent product from Toshiba, performance of GaN-On-Si LEDs have made dramatic progress and essentially bridged the gap with sapphire based best in class LEDs, making those GaN-On-Si LEDs a credible alternative: The best GaN- On-Si LED are now on par with state of the art sapphire LEDs in term of performance. Dec. 2013 Plessey PLW114050: 64 lm/W Jul. 2013 Plessey LED PLW111010 : 36 lm/W30 60 120 150 180 0 Seoul Semiconductor STW8Q14C 175 lm/w Apr. 2013 Low and Mid power package, cold white (5000- 5500k) Best performance based on company claims Samsung LM561B 170 lm/W Everlight L62-217D 150 lm/W Osram Lab result: 104lm/W Lumileds Luxeon 3535 2D 150 lm/W Sapphire Silicon Cree XLamp XH 170 lm/w Toshiba TL2FK : 110 lm/W 90 January 2013 Lattice Power* LPIBB55A: 140 lm/W *Available as die. Lm/w of white package Led is extrapolated Toshiba TL1F4 : 160 lm/W Jun. 2014 ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 27. 27 GAN-ON-SI COST OF OWNERSHIP • The tear down analysis conducted by System+ Consulting however indicate that droop is still an issue and that to deliver similar efficiency as a state of the art sapphire LEDs, the die size has to be significantly larger. • To achieve the same efficiency as a sapphire LED, the epi surface of the GaN-On-Si LED is therefore XXx larger. • Using the LED CoSim+ cost simulation tool developed by System+ Consulting, we calculated that the epitaxy cost of GaN-On-Si was about US$ XXX/mm2 compared to compared to 4” PSS was about US$XXX/mm2. • To achieve the same efficiency, the GaN-On-Si die cost is therefore still about 25% higher than sapphire. To achieve the same efficiency, the GaN-On-Si die cost is still about 25% more expensive compared to sapphire ToshibaTL1F1 ToshibaTL1L4 Typical Sapphire Year Die Size (GaN Epitaxy surface) Current Density Efficiency (Intermediate Bin @ 25 C) Est. die cost per mm2 Die cost for this LED ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 28. 28 2008-2020 SAPPHIRE WAFER START BY DIAMETER Total substrate surface shipment is expected to increase by 28% between 2015 and 2020. ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 29. 29 NANO-IMPRINT LITOGRAPHY • Nano Imprint Lithography (NIL) has emerged as an alternative and potentially cost-effective solution to create nanoscale patterns over large surfaces. • NIL creates the nanostructures by stamping a deformable material (polymer) with a mold. The material is then UV cured and forms a hard mask used to pattern the wafer with standard etching processes. • NIL is based on mechanical replication and is not limited by optical diffraction. It can potentially achieve < 5nm resolution and very good critical defect (CD) control at a very low cost. • The stamp is produced from a master created by using high- resolution electron beam or optical interference lithography. The master’s lifetime is essentially infinite, while stamps can be re-used multiple times. • Different variations of the NIL process are available: • Hard molds: silicon, metal, silica • Conformable molds: PDMS polymer • Due to the higher bow of larger sapphire wafers, a soft mold is preferable for PSS. Nano- Imprint Lithography is a full field, high resolution technology. Resist spin coating Stamp Loading Imprinting + UV curing Stamp Releasing Etching (Pattern transfer) Resist RemovalImprint Lithography process (Source: EVG) ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 30. 30 AURORA SAPPHIRE: MAJOR CUSTOMERS 2012-2014 • In 2012, XX represented XX% of the revenue but includes the sale of 37 growth furnaces for the JV with XX + 4 directly to XX for a total estimated at US$XX m. the balance is cores and optical wafers. Biel and/or Lens have been the single largest customers since 2012. • In 2014, sales to XX are material and wafers only (no equipment). • Sales to XX are mostly for 101 sapphire furnaces • Other notable 2014 customers included XX at around US$6m as well as XX (the sapphire substrate venture of XX), XX, XX (15 furnaces) and XX. • 2013 sales to XX and XX Sapphire are mostly constituted of sapphire growth furnaces. • Sales to XX are mostly to the Chinese branch (88% of the total). ©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
  • 31. ORDER FORM Sapphire Applications & Market 2015: from LED to Consumer Electronic SHIPPING CONTACT First Name: Email: Last Name: Phone: PAYMENT BY CREDIT CARD Visa Mastercard Amex Name of the Card Holder: Credit Card Number: Card Verification Value (3 digits except AMEX: 4 digits): Expiration date: BY BANK TRANSFER BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code: 30056, Branch code : 00170 Account No: 0170 200 1565  87, SWIFT or BIC code: CCFRFRPP, IBAN: FR76 3005 6001 7001 7020 0156 587 RETURN ORDER BY • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DÉVELOPPEMENT, Le Quartz, 75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France SALES CONTACTS • North America: Steve Laferriere - laferriere@yole.fr • Japan Asia: Takashi Onozawa - onozawa@yole.fr • Europe RoW: Jérôme Azemar - azemar@yole.fr • Korea: Hailey Yang - yang@yole.fr • General: info@yole.fr (1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: July 28th , 2015 / ABOUT YOLE DEVELOPPEMENT BILL TO Name (Mr/Ms/Dr/Pr): Job Title: Company: Address: City: State: Postcode/Zip: Country*: *VAT ID Number for EU members: Tel: Email: Date: PRODUCT ORDER Please enter my order for above named report : One user license*: Euro 4,990 Multi user license: Euro 5,990 - The report will be ready for delivery from August 5th , 2015 - For price in dollars, please use the day’s exchange rate. All reports are delivered electronically at payment reception. For French customers, add 20% for VAT I hereby accept Yole Développement’s Terms and Conditions of Sale(1) Signature: *One user license means only one person at the company can use the report. Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology trends to develop their business. MEDIA EVENTS • i-Micronews.com, online disruptive technologies website • @Micronews, weekly e-newsletter • Technology Magazines dedicated to MEMS, Advanced Packaging, LED and Power Electronics • Communication webcasts services • Events: Yole Seminars, Market Briefings… More information on www.i-micronews.com CONTACTS For more information about : • Consulting Services: Jean-Christophe Eloy (eloy@yole.fr) • Financial Services: Jean-Christophe Eloy (eloy@yole.fr) • Report Business: David Jourdan (jourdan@yole.fr) • Press relations: Sandrine Leroy (leroy@yole.fr) CONSULTING • Market data research, marketing analysis • Technology analysis • Reverse engineering costing services • Strategy consulting • Patent analysis More information on www.yole.fr REPORTS • Collection of technology market reports • Manufacturing cost simulation tools • Component reverse engineering costing analysis • Patent investigation More information on www.i-micronews.com/reports FINANCIAL SERVICES • Mergers Acquisitions • Due diligence • Fundraising More information on www.yolefinance.com
  • 32. Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. “Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal interests. “Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand. “Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of one of the above mentioned rights. “License”: For the reports and databases, 3 different licenses are proposed. 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Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files. “Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20 market analysts, Yole works worldwide with the key industrial companies, RD institutes and investors to help them understand the markets and technology trends. 1. SCOPE 1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER. 1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer. 1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted. 2. 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The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product. 2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. . 2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. 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The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors. 4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered. 4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. 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Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection. 5. FORCE MAJEURE The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller. 6. 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TERMINATION 7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision. 7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non- breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation. 8. MISCELLANEOUS All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time. 9. GOVERNING LAW AND JURISDICTION 9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues. 9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions. TERMS AND CONDITIONS OF SALES 
  • 34. 32 MEMS Sensors LED / OLED Compound Semi. Imaging Photonics MedTech Manufacturing Advanced Packaging PV Power Electronics FIELDS OF EXPERTISE Yole Développement’s 30 analysts operate in the following areas
  • 35. 33 4 BUSINESS MODELS o Consulting and Analysis • Market data research, marketing analysis • Technology analysis • Strategy consulting • Reverse engineering costing • Patent analysis www.yole.fr o Reports • Market Technology reports • Patent Investigation and patent infringement risk analysis • Teardowns Reverse Costing Analysis • Cost SimulationTool www.i-Micronews.com/reports o Financial services • MA (buying and selling) • Due diligence • Fundraising • Maturation of companies • IP portfolio management optimization www.yolefinance.com Blu Morpho o Media • i-Micronews.com website • @Micronews e-newsletter • Technology magazines • Communication webcast services • Events www.i-Micronews.com
  • 36. 34 A GROUP OF COMPANIES Market, technology and strategy consulting www.yole.fr MA operations Due diligences www.yolefinance.com Fundraising Maturation of companies IP portfolio management optimization TBA Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools www.systemplus.fr IP analysis Patent assessment www.knowmade.fr Blu Morpho
  • 37. 35 OUR GLOBAL ACTIVITY Yole Japan Yole Inc. Yole Korea 40% of our business is in EU countries 30% of our business is in North America 30% of our business is in Asia Blu Morpho
  • 38. 36 RESEARCH PRODUCTS - CONTENT COMPARISON Custom analysis scope is defined with you to meet your information and budget needs Breadth of the analysis Depthoftheanalysis Custom Analysis Workshops Standard Reports
  • 39. 37 SERVING THE ENTIRE SUPPLY CHAIN Our analysts provide market analysis, technology evaluation, and business plan along the entire supply chain Integrators and end-users Device makers Suppliers: material, equipment, OSAT, foundries… Financial investors, RD centers
  • 40. 38 SERVING MULTIPLE INDUSTRIAL FIELDS • We are working accross multiples industries to understand the impact of More-than- Moore technologies from device to system From A to Z… Transportation makers Mobile phone and consumer electronics Automotive Medical systems Industrial and defense Energy
  • 41. 39 REPORTS COLLECTION o Yole Développement publishes a comprehensive collection of market technology reports and patent analysis in: • MEMS Sensors • Imaging • Medical technologies (MedTech) • Advanced packaging • Power electronics • Compound semiconductors • OLED, LED Laser diode • Semiconductor Manufacturing • Photovoltaics • Batteries o Our reports are unmatched in quality and technology depth and typically include: • Technology trends and evolution: costs, barriers, roadmaps, etc. • Supply value chain analysis: business models, relationships, value flows, etc. • In-depth analysis of applications and market drivers: challenges, inflection points, etc. • Market data ($, units, wafer starts, etc.) o Every year, Yole Développement, System Plus Consulting and Knowmade publish +60 reports. o Take the full benefit from our Bundle and Annual Subscription offers. www.i-Micronews.com
  • 42. 40 OUR 2015 REPORTS PLANNING MARKET TECHNOLOGY REPORTS byYole Développement o MEMS SENSORS − Sensors and Data Management for Autonomous Vehicles − AlN Thin Film Markets And Applications − Sensors for Wearable Electronics And Mobile Healthcare − Status of the MEMS Industry − Uncooled IR Imagers − IR Detectors − High End Gyro, Accelerometers and IMU − Non-Volatile Memory o IMAGING OPTOELECTRONICS − Camera Module Packaging (Vol 1 : Market Technology Trends / Vol 2 Teardowns Reverse Engineering) − Uncooled IR Imagers − Wafer Level Optics − Status of the CMOS Image Sensors − Machine Vision o MEDTECH − Microfluidic for Sample Preparation − Microfluidic Applications − Sensors for Wearable Electronics And Mobile Healthcare o COMPOUND SEMICONDUCTORS − High Purity Alumina (HPA) − Sapphire − Wide Bandgap Materials For Power Electronics: SiC, GaN (and also Ga2O3, AlN, Diamond, Graphene… as a trend) * Reports to be decided within 2015 o LED − LED Module − OLED for Lighting − UV LED − LED Phosphors Market o POWER ELECTRONICS − Power Packaging − Thermal Management for LED and Power − Power Electronics for Renewable Energy − Energy Management For Smart Grid And Smart Cities − Status of Chinese Power Electronics Industry − New Technologies For Data Center − Inverter Market Trends For 2013 – 2020 And Major Technology Changes* − IGBT Markets And Application Trends − Power Electronics for HEV/EV* − Status of Power Electronics Industry o ADVANCED PACKAGING − Advanced Packaging in Emerging Markets in China − Status of the Advanced Packaging Industry − Supply Chain Readiness for Panel Manufacturing in Packaging − WLCSP* − Flip Chip Business Update − 2.5D 3DIC Business Update − Fan-Out and Embedded Business Update o MANUFACTURING − Lithography for MEMS, Advanced Packaging and LED − Thinning Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS Image Sensors − Non-Volatile Memory
  • 43. 41 OUR 2015 REPORTS PLANNING PATENT ANALYSIS by Knowmade o Patent Infringement (crossed analysis based on Knowmade and System Plus Analysis expertise) − MEMS Microphone Applications − Infrared Imaging o Patent Investigation (crossed analysis based on Knowmade Yole Développement expertise) − Power GaN − MEMS Gyroscope − 6-axis 9-axis Inertial MEMS IMUs − Microbatteries − Embedded Active Passive Packages − Interposer − Phosphors for LED TEARDOWN REVERSE COSTING by System Plus Consulting More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2015. * Reports to be decided within 2015
  • 44. 42 OUR 2014 PUBLISHED REPORTS LIST MARKET TECHNOLOGY REPORTS byYole Développement o MEMS SENSORS − Technologies Sensors for the Internet of Things: Businesses Market Trends 2014-2024 − MEMS Microphone: Market, Applications and Business Trends 2014 − Status of the MEMS industry − MEMS Sensors for Mobile Phones and Tablets − High End Gyroscopes and Accelerometer Applications − Inertial MEMS Manufacturing Technical Trends − New Detection Principles Technical Evolution for MEMS NEMS − 6/9 DOF Applications in Consumer Electronics o IMAGING OPTOELECTRONICS − Status of the CMOS Image Sensor Industry − Uncooled Infrared Imaging Technology Market Trends − Silicon Photonics o MEDTECH − Point of Care Testing: Applications for Microfluidic Technologies − Solid State Medical Imaging: X-ray and Endoscopy o COMPOUND SEMICONDUCTORS − RF GaN Technology Market Analysis: Applications, Players, Devices Substrates 2010- 2020 − SiC Modules, Devices and Substrates for Power Electronics Market − GaN-on-Si Substrate Technology and Market for LED and Power Electronics − Power GaN Market − Graphene Materials for Opto Electronic Applications − Sapphire Applications and Market: from LED to Consumer Electronics o LED − LED Packaging − LED Front-End Manufacturing Trends − LED Front-End Equipment Market o POWER ELECTRONICS − Power Electronics for HEV/EV − Inverters − Gate Driver Unit Market for Power Transistors o PHOTOVOLTAICS − Emerging and Innovative Technology Approaches in the Solar Industry o ADVANCED PACKAGING − 3DIC Equipment and Materials − 3DIC 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update o MANUFACTURING − Market Technology Trends in Materials Equipment for Printed Flexible Electronics − Permanent Wafer Bonding for Semiconductor: Application Trends Technology PATENT ANALYSIS by Knowmade − LED Based on Nano-wires Patent Investigation − GaN on Si Patent Investigation (LED, Power devices and RF Devices) − New MEMS Devices Patent Investigation − Non Volatile Memory Patent Investigation TEARDOWN REVERSE COSTING by System Plus Consulting More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2014.
  • 45. 43 MICRONEWS MEDIA o About Micronews Media Micronews Media, powered by Yole Développement, ensures you the best visibility in the disruptive semiconductor community. With our services, we help you to reach your customers worldwide with the media products they prefer, including our website, e-newsletter, webcasts, and magazines. Invest in a high added- value editorial program and get access to Yole Développement’s network (48 000+ contacts). o Five supports and channels for your visibility • A technology magazine to highlight your visibility with advertisements, company profiles, product descriptions and white papers • A webcast to highlight your expertise and develop your business identifying commercial leads • Articles, advertisements logo and banners dedicated to your company, its products and expertise in @Micronews e- newsletter and on i-Micronews.com Focused community Identified contacts Large community Mass contacts
  • 46. 44 COMMUNICATION SERVICES All services listed below are available on–demand. o i-Micronews.com, the website Slider – Banners (on English or Japanese websites) – Articles – Logo and profile as sponsor o @Micronews, the e-newsletter Headline article - Tiles o Custom webcast Develop your dedicated event with a high added-value program. A turnkey event withYole support (logistics, promotion, data…) o Technology Magazines: Custom – Co-produced Increase your visibility through a dedicated technology magazine with ads, company profile, product descriptions and white papers. It can be a custom magazine: your company is the only one to benefit from it – or a co-produced one: up to 2 companies. Contacts: Camille Veyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr), Media Communication Coordinators.
  • 47. 45 CONTACT INFORMATION o Consulting and Specific Analysis • North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc. Email: laferriere@yole.fr • Japan:Yutaka Katano, General Manager,Yole Japan President,Yole K.K. Email: katano@yole.fr • RoW: Jean-Christophe Eloy, President CEO,Yole Développement Email: eloy@yole.fr o Report business • North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc. Email: laferriere@yole.fr • Europe: Fayçal El Khamassi, Headquarter Sales Coordination Customer Service Email: khamassi@yole.fr • Japan Asia:Takashi Onozawa, Sales Asia General Manager,Yole K.K. Email: onozawa@yole.fr • Korea: HaileyYang, Business Development Manager, Korean Office Email: yang@yole.fr o Financial services • Jean-Christophe Eloy, CEO President Email: eloy@yole.fr o General • Email: info@yole.fr Follow us on