VCSELs Technology Industry and Market Trends

From Technologies to Market
VCSELs
Technology, Industry and
Market Trends
2018 Report
Sample
July 2018

2
Biographies and contacts
ABOUTTHE AUTHORS
Pierrick BOULAY-Technology & MarketAnalyst,Solid-stateLighting
As part of the Photonics, Sensing & Display division at Yole Développement (Yole), Pierrick Boulay works as Market and Technology Analyst
in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience in both LED
lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting
applications. Pierrick holds a master degree in Electronics (ESEO - France).
Contact: boulay@yole.fr
Pars MUKISH - Business UnitManager,Solid-State Lighting& Display
Pars Mukish holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology
Management (EM Lyon - France). Since 2015, Pars has taken on responsibility for developing SSL and Display activities activities as Business
Unit Manager at Yole Développement (Yole). Pars is part of the Photonics, Sensing & Display division at Yole. Previously, he has worked as
MarketingAnalyst andTechno-Economic Analyst for several years at the CEA (French Research Center).
Contact: mukish@yole.fr
VCSELs: Technology, Industry and Market Trends | Sample | www.yole.fr | ©2018

3
o About the Authors P6
o Report Objectives P7
o Glossary P8
o Companies cited P9
o Executive Summary P10
o Preliminary Definitions and Principles P33
• Laser diodes - Definitions used in the report
• Incoherent light vs. Coherent light
• Time-of-flight (ToF)
• Single mode vs. multi mode
o VCSEL Overview P39
• Definitions
• Applications as a function of the electromagnetic spectrum
• VCSEL in the semiconductor light source environment
• History of VCSELs
• VCSEL structure
• VCSELs in the electromagnetic spectrum
• IR spectrum
• Visible spectrum
• UV spectrum
• Timeline of main applications for VCSELs
o VCSEL Landscape P51
• Classification of VCSEL applications by wavelength
• Classification of VCSEL applications by market segment
• Classification of VCSEL applications by function
• Introduction
• Segmentation matrix
• Mapping of applications
• Focus on detection
o VCSEL Market P59
• 2017-2023 market volume (Munits)
• Split by application
• Split by segment
• Relative market share by application
• Relative market share by segment
• 2017-2023 market revenue ($M)
• Split by application
• Split by segment
• Relative market share by application
• Relative market share by segment
• 2017-2023 growth trends by application
• Market growth relays
• VCSEL ASP
• Trend related to VCSEL surface
• Trend related to VCSEL power
• MOCVD reactor opportunity
TABLE OF CONTENT (1/4)

4
o VCSEL Applications P75
• Datacom
• Active optical cable
• Plastic Optical Fibre (POF) in automotive
• Laser printer
• Industrial heating system
• Proximity sensors
• Autofocus systems
• Gas sensors
• Computer mice
• Pulse oximeters
• LIDAR
• Surveillance cameras
• Eye tracking systems
• Face recognition
• Gesture recognition
• Optical Coherence Tomography (OCT)
o VCSEL Manufacturing (1/2) P123
• VCSEL vs EEL
• Basic properties of VCSELs
• VCSEL specifications vs. Application requirements
• Epitaxy
• Molecular Beam Epitaxy (MBE) technique
• Metalorganic Chemical Vapor Deposition (MOCVD) technique
• Main challenge
• MBE vs. MOCVD
• Trends - Toward 6” manufacturing
o VCSEL Manufacturing (2/2) P123
• Key front-end process steps
• Distributed Bragg Reflector (DBR)
• Confinement
• Main methods
• Focus on selective lateral oxidation
• Oxide aperture diameter
• Reliability aspects
• Failure modes
• Use of ESD protection
• The case of array manufacturing
• Overview
• Process example
• Front-end manufacturing control
• Overview
• Epitaxy
• MESA etching
• Oxidation
• Packaging
• Overview
• Focus on bonding
o VCSEL Industry (1/3) P153
• Overview
• Device players - Mapping by country and application
• Epiwafer suppliers
• Players mapping by position on the supply chain and business models

5
• Trends
• From datacom to 3D sensing
• Evolution of players positioning
• A new wave of investment / M&A has already started!
• Datacom vs. consumer ecosystem
• Focus on datacom ecosystem
• Focus on consumer ecosystem
• New entrants
• Apple vs. Android ecosystem - Status & Trends
• Apple’s IPhone X supply chain (tentative)
• VCSELs in iPhones - 2017 vs. 2023
• Android smartphone makers supply chain (tentative)
• Discussion on supply chains
• Other supply chain examples (tentative)
• Capacity of main VCSEL device players
• Key players
• 2017 market shares (tentative)
• Company profile
• Lumentum
• Finisar
• II-VI
• ams and Princeton Optronics
• Philips Photonics
• Capacity of main VCSEL device players
• Consumer and mobile Landscape
• Status of the 3D imaging industry
• Recent key moves in the 3D imaging industry
• Current companies’ positioning within the industry
• 3D sensing could be the magic bullet for mobile user interface
• Use cases and opportunities of the rear 3D camera
• 3D camera adoption scenarios
• Automotive landscape
• Status of the 3D imaging industry
• Recent key moves in the 3D imaging industry
• Overview of potential applications
• Automotive LiDAR ecosystem
• Growing Interest of Tier-1s for LIDAR
o VCSEL Intellectual Property Landscape (1/2) P207
• Overview
• Timeline of IP activity related to VCSELs
• Geographic map of patent applications and corresponding current legal status
• Focus on China
• Ranking of patent applicants according to the number of their patent families
• Current legal status of patents filed by the main patent applicants
• Ranking of patent assignees according the number of their enforceable patents
• Ranking of patent applicants according the number of their pending patent
applications
• Focus on historical IP players - Time evolution of patent publications
• Focus on IP newcomers - Time evolution of patent publications

6
o VCSEL Intellectual Property Landscape (2/2) P207
• Patent segmentation
• Main patent applicants per applications
• Time evolution of patent publications by applications mentioned in the patents
• Promising segments analysis - 2/3D imaging, LIDAR and consumer applications
• Main patent applicants per application segment according to the number of
patent families
• Main IP players
o Conclusion P226

7
COMPANIES CITED INTHIS REPORT (NON-EXHAUSTIVE)
Accelink,Aixtron,Alight, ams,Anadigics,Apple,Arima Lasers Corporation,Asus,Audi,Avago,AWSC, Beam Express,Blackmore,
Bosch, Broadcom, Cable solutions, Canon, Changelight,Continental,Device Innovation,Egismos Technology Corporation, Emcore,
Epistar,Epiworks, Excelitas,Finetech,Finisar, FLIR, Foxconn,Fuji Xerox,Fujitsu, Global Communication Semiconductor, Google,
Hamamatsu,Hella,Heptagon,Himax, HLJ,Honeywell,Honor, HTC, Huawei,Ibeo, iHealth, II-VI, Infineon, Infinera,Inneos, Innoluce,
Innoviz, Intel, IntelliEpi, IQE, JDSU, Journal of semiconductors,Kaiam, Koito, Landmark Opto, Lasermate,Lasertel,Laytec,
LeddarTech,Lenovo,LG, Lumentum, Luminar, Luxnet, Magneti Marelli,MantisVision, Masimo, Namuga,Oclaro, Oculus, Omnivision,
OnePlus, Oppo, Optek Technology,Optical Society of America, Optovue, Optowell, Orbbec, Osram, Oxford Instruments,Palomar
Technologies,Philips Photonics, Picolight, pmd, POET Technologies,Primesense, Princeton Optronics,QSI, Quanergy,Rasirc, Raycan,
Realsense,Riber, Ricoh, Robosense,Samsung, Sanan,Santec Corporation, SCAT, Seiko Epson, Seminex, SensL, Shiraz University,Sick,
SinoSemic, SoftKinetic, Sony Corporation, Stanley,STMicroelectronics,Sumitomo Chemicals, Sunny optical technology, Suoer,Taiyo
Nippon Sanso,Tetravue,Texas Advanced Optoelectronic Solutions,Thorlabs,Trilumina,Truelight Corporation,TysonTechnology,
Ulm Photonics, Ultra Communication, US Lasers Inc., Ushio,Valeo,Varroc,Veeco,Velodyne,Vertically Integrated Systems,Vertilas,
Vertilite,Viavi,Vivo,Vixar,VPEC,Wavetek,Win Semiconductor, Xiaomi, Zephyr Photonics, ZF, and more.

8
This report aims to give a comprehensive picture of the forces driving the VCSEL light source market, technology
and industry in the short,middle and long term.
• Allow readers to understand the global landscape related toVCSELs.
• Review main applications of VCSELs, giving insights on principles, technology, technical requirements, trends,
key players and more.
• Analyse the technology and industry behind VCSEL light sources and their integration into sensors and
modules.
• Provide and analyze market forecasts forVCSEL light sources from 2017 - 2023.
• Also, an Intellectual Property (IP) analysis is presented in order for the reader to better understand the patent
landscape related to VCSEL device, system and applications.
REPORT OBJECTIVES

9
ToF camera history:
• According to different measurement methods of flight time, ToF technology can be classified into pulse/flash, continuous wave, pseudo-
random number and compressed sensing.The continuous wave flight time system is also called the ToF camera.
• ToF cameras were invented at the Stanford Research Institute in 1977. Limited by the detector technology of the time, the
technique wasn’t widely used.Fast sampling of received light didn’t appear until the lock-in CCD technique was invented in the 1990s.
• In1997, Dr. R Schwarte (of the University of Siegen, Germany) put forward a method of measuring the phases and/or
magnitudes of electromagnetic waves based on the lock-in CCD technique. With this technique, his team invented the first
CCD-basedToF camera prototype. Afterwards,ToF cameras began to develop rapidly.
Time-of-flight (ToF)
PRELIMINARY DEFINITIONSAND PRINCIPLES
Time-of-flight principle
Source: TeraRanger
Principle:
• The ToF principle is a method for measuring the distance between a sensor and an object, based on the
time difference between the emission of a signal and its return to the sensor after being reflected
by an object.The ToF principle can be used to measure a distance in 2D but can also be used in cameras
for 3D applications.
Development history of ToF
cameras
Source: Depth Errors Analysis
and Correction for Time-of-
Flight (ToF) Cameras; Ying He,
Bin Liang, Yu Zou, Jin He and
Jun Yang

10
• The laser diode family falls into two basic structures:
• Edge Emitting Lasers (EEL) which emit from the edge of their structure.
• Surface Emitting Lasers (SEL) which emit from the top (or bottom in some cases) of their structure.
• VCSEL is the acronym for Vertical Cavity Surface Emitting Laser and is considered as a surface emitting laser.
• Regarding the structure of SEL, they are more complex than EELs as the resonant cavity must be built using up to 40 epitaxial
layers of p-type and n-type material and various optical materials to create a Bragg reflector that uses the different refractivity
of material layers to create full mirrors at the bottom and partial mirrorsat the top.
• VCSELs can be packaged in SMD like LEDs or in TO-46 package.A VCSEL array is usually hermetically sealed in a package with
an optical element.
Definitions
VCSEL OVERVIEW
VCSEL inTO-46 package VCSEL in SMD package
Source: Philips Photonic
Source: The Optical Society of America
Surface emitting laser

11
Applications as a function of the electromagnetic spectrum
VCSEL OVERVIEW
Visible Light
380 to 750 nm
Ultraviolet Light
100 to 380nm
Infrared Light
750 to 1,000 nm
General lighting
Horticultural
lighting
Automotive
lighting
Remotes
850nm Fiber telecom
Up to 1,400nm
Security camera
850 to 940nm
Ink curing
380nm
Water disinfection
285nm
There are plenty of applications,each using a dedicated part of the electromagnetic spectrum. In these applications,
traditional light sources can be used but also Solid State Lighting (SSL) sources like LED, lasers or VCSELs.

12
VCSELs in the electromagnetic spectrum - IR spectrum (1/2)
VCSEL OVERVIEW
VCSEL in the infrared (IR) spectrum:
• The VCSEL is a new class of semiconductor laser that can be monolithically fabricated.The first device that came out in 1979,
was manufactured using GaInAsP/InP materials for the active region and emitted at a wavelength of 1,300nm.
• The first room-temperature continuous-wave (CW) device using GaAs material was demonstrated in 1988 and emitted at a
wavelength of 850nm.
• Since 1992,devices at wavelengthof 980,850 and 780nm were commercialized.
• To emit at a longer wavelength (i.e.: 1,300 or 1,500nm) in the infrared range,materials like GaInAsP/InP have to be used.
• InfraredVCSELsare used in a wide variety of applications:
• Optical communications.
• Optoelectronicequipment.
• Optical sensing.
• 3D sensing.
• (…).
• Up to now,VCSELs at 850nm or 940nm are mainly used in optical communications or optical sensing applications.
Most of current
applications use
VCSELs in the
infrared
spectrum.
A GaAs-based VCSEL structure
Source: "Etch damage and deposition repair of vertical-cavity
surface-emitting lasers" article

13
Classification ofVCSEL applications by wavelength
VCSEL LANDSCAPE
Most of today’s
VCSEL
applications are
in the red or
near-infrared
(NIR) ranges.
REDAND IRVCSEL SOURCES
RED
650nm – 750nm
NIR
750nm – 1,400nm
SWIR
1,400nm – 3,000nm
XX
ComputerMice
XX
XX
Datacom
XX
XX
Proximity sensors
XX
XX
XX
XX

14
2017-2023 market volume (Munits) - Split by application
VCSEL MARKET
TheVCSEL
market is
expected to
grow from
652M units in
2017 to
3.3Bunits in
2023.
CAGR 2017-
2023 = 31%

15
VCSELASP -Trend related toVCSEL power
VCSEL MARKET
RegardingASP
trend,consumer
applications are
the first able to
implement
VCSELs at low
price.
Automotive
applications will
implement
VCSELs at longer
term due to
their highASP.
Legend:
Consumer
Automotive

16
• Description:
• Laser printing is an electrostatic digital printing process. It produces moderate to high-
quality text and by repeatedly passing a laser beam back and forth over a negatively
charged cylinder called a "drum" to define a differentially charged image.
• Principle:
• A laser beam projects the required image to be printed onto an electrically charged
cylinder known as a "Drum Unit". The Drum Unit is a rotating selenium cylinder with
photoconductive properties.
• The drum then selectively collects electrically charged powdered ink (toner), and
transfers the image to paper, which is then heated in order to permanently fuse the text,
imagery,or both.
• Characteristics:
• Lasers are used because they are able to form highly focused, precise, and intense beams
of light, especially over the short distances inside of a printer.
• The typical laser for this application is the aluminum-gallium-arsenide (AlGaAs) laser at
760 nm.
• Since 1995, Fuji Xerox has investigated in replacing the laser diode by a VCSEL array and
a laser printer based onVCSEL was launched in 2003.
Overview
LASER PRINTER
Focus on laser diode application
Laser printing principle
Emission

17
A device with multiple applications
PROXIMITY SENSORS
And enabling gesture recognition capabilities with the implementation of a single or multiple sensors…
XX
Range Applications
XX m
XX m
10 cm
Smart lighting / smart buildingDronesVacuum cleanersLaptops
Laptops Vacuum cleaners
Smartphones
Tablets
Tablets
Automatic faucet Automatic soap dispenser
• Optical 3D gestures can complement
existing systems.
• It can reduce XX with more
informationon order and position.
• More XX can be recognized enabling
more functions.
DETECTION /
SENSING
PHOTODIODE

18
• The human vision has two components:Foveal and peripheral.
• The small foveal region is densely packed with cones providing sharp and detailed vision over an approximately 15° FOV.
• Peripheral vision covers a much wider FOV but lacks acuity.
• Tracking the user’s gaze allows the improvement of graphics performance in the foveal area and a reduction in rendered image
quality in the periphery.
• Foveated rendering is an area of active development in VR. Current limitations include speed and accuracy of eye tracking and
the high sensitivity of the peripheral vision to flickering.
Focus on virtual reality (VR) (2/2)
EYETRACKING SYSTEMS
The eye tracking system detects that the user is focusing on the clock above the blackboard.
In the left image, the system renders the whole scene at high resolution.
In the right image, the system uses foveated rendering to render an extremely high level of detail in an approximately 15° area around the point where the eye is looking, and a much lower level of
detail in the periphery.
Source: NVIDIA
DETECTION /
IMAGING
CIS + IMAGE
PROCESSING

19
IPHONE X –TRUEDEPTH MODULEANALYSIS
FACE RECOGNITION
High-contrast IR dot projector
30K density (200x150) (Min. for FR 160x120)
VCSEL XXnm
VCSEL +ToF detector
VCSEL + XX XXMp XX CIS camera
1.4Mp IR CIS camera
DETECTION /
IMAGING
CIS + IMAGE
PROCESSING
• VCSELs are used for several applications in the iPhone X:
• In the proximity sensor module: XXnm VCSEL with XX cavities packaged near a XX array
• In the flood illuminator module: 850nmVCSEL made of XX cavities (XXxXX matrix).
• In the dot projector module: XXnm VCSEL made of XX cavities in a random pattern
• The dot projector module is used to project a 30,000 dots pattern on the user's face.

20
VCSEL specifications vs.Application requirements (2/2)
VCSEL MANUFACTURING
High power
VCSELs will
need a high
power output
and high
number of
cavities.
Die Size:
0.02 to 0.06mm²
Power:
XX to XXmW
Applications:
XX, proximity sensor
Die Size:
0.06 to XXmm²
Power:
10 to XXmW
Applications:
XX, XX, iris scan,XX
Die Size:
0.4 to XXmm²
Power:
200 to XXmW
Applications:
XX
Die Size:
XX to XXmm²
Power:
XX to XXW
Applications:
ADAS LIDAR, XX
Source: Daiwa, System Plus Consulting, Yole Développement
Number of cavity:
1 to 8
Number of cavity:
3 to XX
Number of cavity:
XX to 200
Number of cavity:
XX to > 5,000

21
Key front-end process steps - Confinement - Main methods
VCSEL MANUFACTURING
• Several methods have been used to achieve currentconfinementto a pre-defined active area:
• Simple mesa etching of the top mirror.
• XX to create highly resistive semiconductor regions.
• XX.
• Mesa etching incurs scattering losses of the optical field and may cause reliability problems if the active region is exposed to
air.
• XX has been the first method employed to fabricate commercialVCSELs of outstanding producibility and reliability.
• XX, introduces less optical losses in the cavity and has led to a leap ofVCSEL performance.
• Nowadays, the vast majority of commercialVCSELs relies on XX.
The XX will
force the
current to flow
through a small
aperture.
Major methods for current confinement in VCSELs

22
Device players - Mapping by country (i.e.:design and manufacturing activities)
VCSEL INDUSTRY - OVERVIEW
More than 50
VCSEL
manufacturers
have been
identified with
more than third
of located (i.e.:
HQ) in the US.
US (21):
• II-VI
• XX
• Finisar
• XX
• XX
• XX
• XX
• XX
• Lasertel
• Lumentum
• XX
• XX
• XX
• XX
• XX (part of ams)
• XX
• XX
• XX
• XX
• XX
• Vixar (part of
Osram)
EUROPE (10):
• XX
• Beam Express (CH)
(part of NeoPhotonics)
• XX
• XX
• XX
• XX
• Philips Photonic
(NL/DE)
• XX
• XX
• XX
JAPAN (6):
• XX
• XX
• XX
• XX
• XX
• Sony Semi.
TAIWAN (9):
• XX
• XX
• XX
• Epistar (from pilot mass production)
• HLJ
• XX (under qualification)
• XX
• XX
• XX
CHINA (7):
• XX
• XX (under
qualification)
• XX (under
qualification)
• San’an (from pilot to
mass production)
• XX
• XX
• XX
SOUTH KOREA (2):
• XX
• Raycan
CANADA (1):
• XX
NOTE:
• Pure epiwafer manufacturer are not listed on this map
• Only players involved in die, array or package design /
manufacturing are listed.
• Only players having IR VCSEL products are listed.

23
Players mapping by position on the supply chain and business models (1/2)
VCSEL INDUSTRY - OVERVIEW
• 2 different supply chain starting from packaging level and depending on final applications:
• Consumer applicationssupply chain (smartphone,automotive…).
• VCSEL light source need to be integrated into a complex module assembly (i.e.: VCSEL  Tx Module  (…) 
Camera Module  System OEM).
• In order to meet system OEM requirements, no “standard” package can be developed and VCSEL manufacturer supply “chip
on submount” only to easier integration by the rest of the supply chain.
• Other applicationssupply chain (datacom/telecom,industry…).
• Those applications can integrate much more standard VCSEL package (e.g.:TO can,TOSA, SMD…).
• 7 different typologies of actors with different business models can be highlighted on theVCSEL-centric supply chain:
From epiwafer
to package /
chip-on-
submount, 7
categories of
actors can be
distinguished
depending on
their business
models.
Chip-on -
Submount
Package
Epiwafer
(Front End L0)
Die / Array
(Front End L1
+ Back End
L0)
Consumer Applications Supply Chain (smartphone,
automotive…)
Other Applications Supply Chain (datacom/telecom, industry…
VCSEL-CENTRIC SUPPLY CHAIN
PureVCSEL Epiwafer Manufacturer
VCSEL Epiwafer Manufacturer and Foundry Service Supplier
PureVCSEL Foundry Service Supplier
VCSEL Device Manufacturer and Foundry Service Supplier
VCSEL Device Manufacturer - XX
VCSEL-CENTRIC SUPPLY
CHAIN

24
From datacom to 3D sensing
VCSEL INDUSTRY - TRENDS
Historically
involved in
datacom
applications,
VCSEL industry
is now entering
the consumer
3D sensing era.
• Datacom has been the first industrial application for VCSELs that are favoured in datacentres due to
their low power consumption and competitive price compared to EELs. However, VCSELs are limited
to short distance communication applications.
• Volume of VCSEL production boomed with the explosion of Internet in the 2000's and generate a
steady growth since then.
• VCSELs appeared first in
smartphone with their
integration in the autofocus
and proximity sensing
applications.
• But the boom really
occurred when Apple
released its iPhone X in
2017 integrating VCSELs for
the Face ID module,
generating high volume
production, high investment
from Apple to secure its
supply chain and creating a
strong interest from new
VCSEL suppliers and from
Android-based OEMs.

25
Apple’s IPhone X supply chain (tentative)
VCSEL INDUSTRY - TRENDS
Epi wafer growth Die/array fabrication Module Customer
Dot
Projector
Proximity
Sensor
Flood
Illuminator
Main source
Alternative source
Main source
Alternative source
3Dsensing
…

26
Use cases and opportunities of the rear 3D camera
VCSEL INDUSTRY - CONSUMERAND MOBILE LANDSCAPE
Augmented Reality
Use cases for mobile is a
hard call :
• Augmented sales pitch
• Augmented gaming
As far as 2018 the
attraction of the use
cases are not market
proven and could remain
a niche feature.
Is it worth
an added
3D sensing
hardware ?

27
Automotive LiDAR Ecosystem
VCSEL INDUSTRY - AUTOMOTIVE LANDSCAPE
FPGA: Field-Programmable Gate Array
SiPM: Silicon Photomultiplier
SPAD: Single-Photon Avalanche Diode
VCSEL: Vertical Cavity Surface-Emitting Laser
LiDAR systems Laser sourcesPhotodetectors
Active players
R&D players
VCSELXXXX SPAD/SiPM
FPGA XX
Amplifier
Optical elementsIC
XX Optical filters
Optical systems

28
• IP activity related to VCSEL started in the 90’s with the development of laser for datacom applications (i.e.: fiber optic). Shortly after,
IP players have started to file patents related to XX applications.
• These two applications have driven the development of IP activity related toVCSEL until 2006-2007.
• From 1995 to 2003 the IP landscape experienced a strong increase of the number of patent publications that also corresponds to the
increase of the geographic expansion of datacom/telecom and laser printing players IP activity.
• Since 2010, many newcomers have entered the IP landscape. The most noticeable newcomers are players from the consumer and
automotive markets.
Timeline of IP activity related toVCSELs
VCSEL INTELLECTUAL PROPERTY LANDSCAPE

29
RELATED REPORTS

Data communications (datacoms) was the first
industrial application to start integrating Vertical
Cavity Surface Emitting Lasers (VCSELs). Their
sweet spot has been in short-distance data
communication due to their low power consumption
and competitive price compared to Edge Emitting
Lasers (EELs). Driven by the development of
datacenters, the VCSEL market and production
boomed in the 2000s with the internet’s popularity,
and then grew steadily. Some new applications for
VCSEL emerged, like laser printers and optical mice,
but weren’t strong growth drivers.
Only in 2014, almost 20 years since the first use of
the technology in datacom, VCSELs started to make
their way into high volume consumer smartphones.
But this coupling with sensors for proximity sensing
and autofocus functions was only the beginning of
the VCSEL success story. In 2017 Apple released the
iPhone X, with a 3D sensing function based on this
technology. The iPhone X integrates three different
VCSEL dies for the proximity sensor and the Face
ID module, and made the VCSEL market explode in
2017, propelling overall revenue to ~$330M.
GoodiPhoneXsaleshavenowtriggeredtheinterest
of other smartphone brands in this breakthrough
3D sensing function. Less than one year after the
release of Apple’s flagship, its competitors are now
following the same trend and starting to integrate
3D sensing technologies. Xiaomi and Oppo were
the quickest on the draw, with the Xiaomi Mi8 and
the Oppo Find X models presented in the second
quarter of 2018. Other leading smartphone players
like Huawei, Vivo or Samsung are also expected
to integrate VCSELs into their flagship models
by 2019. In this context, the explosion of VCSEL
demand initiated in 2017 will persist for the next
five years, potentially multiplying the business
opportunity more than tenfold. During that time,
the technology might also find some new growth
drivers into some other high volume applications
such as automotive Light Detection and Ranging
(LiDAR) or gas sensors.
This trend will likely cause rapid evolution in
the VCSEL industry in coming years in the form
of investment, new entrants and mergers and
acquisitions.
This report presents a comprehensive review of the
main VCSEL applications including in-depth analysis of
the consumer and automotive landscapes, including 3D
sensing, LiDAR and gas sensing.
VCSELS - TECHNOLOGY, INDUSTRY AND MARKET TRENDS
Market & Technology report - July 2018
AFTER 20 YEARS, THE VCSEL BUSINESS HAS FOUND ITS KILLER
APPLICATION – AND IS LIKELY TO EXPLODE
3D sensing – and more – in smartphones will drive theVCSEL market for the next five years.
KEY FEATURES
• VCSEL market revenue and
volume: 2017-2023
• Detailed technical and market
analysis of VCSEL applications, with
in-depth analysis of the consumer
and automotive landscapes
• VCSEL industry analysis: from
epiwafer to system
• VCSEL specifications and price
analysis
• VCSEL manufacturing analysis
• VCSEL IP analysis
(Yole Développement, July 2018)
The variety of applications using VCSELs involves a
variety of specifications at the device level, mostly
in size, output power and number of laser cavities.
As a result, the surface of a VCSEL chip or array
can range from less than 0.1mm² for datacom
and proximity sensing applications to more than
70mm² for LiDAR application. As the VCSEL
surface increases with the needed output power,
VCSEL market forecast by segment
NOT ALL VCSELS ARE CREATED EQUAL! APPLICATIONS DRIVE DEVICE
SPECIFICATIONS
2017
$330M
2023
$3,500M
Consumer Datacom Industry Automotive
Courtesy of Apple
CAGR +48%
$86M
$80M
$165M
$3,100M
$105M
$205M
$46M

VCSELS - TECHNOLOGY, INDUSTRY AND MARKET TRENDS
A NEWWAVE OF INVESTMENT AND MA HAS STARTED
VCSEL market volume is expected to grow from
652M units in 2017 to more than 3.3B units in 2023 at
a 31% compound annual growth rate for this period
(CAGR2017-2023). This booming trend is likely
to trigger interest in VCSEL technology at many
industry levels, including OEMs, integrators, device
manufacturers, epi houses, foundries, equipment and
material suppliers. To be able to follow this booming
demand, more than 100 MOCVD reactors will be
needed, which is likely to please companies that
supply this equipment, such as Aixtron, Veeco and
Taiyo Nippon Sanso.
Yole Développement (Yole) expects therefore strong
investment and proliferation in the VCSEL industry
with the entry of several new players, mostly from
the LED industry, whose technology is similar. Since
2016, Yole analysts’ have already seen some MA, like
ams’ acquisition of Princeton Optronics and Osram’s
deal for Vixar and investment in manufacturing
expansion or supply chain reinforcement, like Apple
investing $390M in Finisar. Yole expects the bulk of
these investments to occur in the coming years.
And once VCSEL hype reaches its peak, Yole also
expects a necessary consolidation phase with more
MA occurring at all level of the supply chain and to
support different strategies:
• Vertical integration - from system to module and/or
from module to component
• Application diversification - from datacom to
sensing
• Business diversification - from LED or EEL devices
to VCSELs
This report presents an in-depth analysis of the VCSEL
industry, which highlights supply chain trends and key
players. The reports also analyze VCSEL device market
size, broken down by application and segment, and the
related MOCVD reactor market. In addition, it details an
overview of the VCSEL IP landscape.
so do the number of cavities and the complexity of
the manufacturing process, mostly in ‘front-end’ chip
fabrication.
The current shift from the datacom industrial era
to the 3D sensing consumer era is likely to have a
strong impact on manufacturing expertise related to
VCSELs. Typically, whereas datacom uses 3” or 4”
diameter wafer manufacturing processes, consumer
applications requires 6” wafer processing to hit
their cost targets and also larger VCSEL arrays. This
evolution has a direct impact on manufacturing yield,
which is still low today for 6” processes. This is mostly
related to epiwafer manufacturing, for which the
epitaxy uniformity is still a major challenge, compared
to 3” or 4” wafer epitaxy. Typically, a difference of
1% in the layer thickness will result in a wavelength
deviation of 10nm. And knowing that epitaxy yield
will drive overall VCSEL manufacturing yield, it is now
at the heart of VCSEL industry investments in key
equipment for MOCVD and metrology.
This report present a detailed analysis of VCSEL
manufacturing processes, associated challenges, recent
trends and player positioning. This report also presents
main specifications for VCSELs in leading applications.
VCSEL specifications vs. Application requirements
• Datacom
• Proximity
sensor
• Gesture
recognition
• Laser autofocus
• Iris scan
• Optical mice
• 3D sensing
• Depth camera
• Medical
• ADAS LiDAR
• Industrial
cutting
Increase of die
size, number
of cavities,
power output
and so
manufacturing
complexity.
Also, different
package, single chip
vs. array to be
considered.
0.02 to
0.06mm2
3 to 40mW
0.06 to
0.4mm2
10 to 350mW
0.4 to
1.3mm2
200 to
1,000mW
10 to 75mm2
5 to 40W
VCSEL players* ecosystem
Epiwafer Foundry IDM Fabless Internal use
VCSEL device manufacturers
*Non-exhaustive list of companies

MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
Accelink, Aixtron, Alight, ams, Anadigics, Apple, Arima Lasers Corporation, Asus, Audi, Avago, AWSC,
Beam Express, Blackmore, Bosch, Broadcom, Cable solutions, Canon, Changelight, Continental, Device
Innovation, Egismos Technology Corporation, Emcore, Epistar, Epiworks, Excelitas, Finetech, Finisar,
FLIR, Foxconn, Fuji Xerox, Fujitsu, Global Communication Semiconductor, Google, Hamamatsu,
Hella, Heptagon, Himax, HLJ, Honeywell, Honor, HTC, Huawei, Ibeo, iHealth, II-VI, Infineon, Infinera,
Inneos, Innoluce, Innoviz, Intel, IntelliEpi, IQE, JDSU, Journal of semiconductors, Kaiam, Koito,
Landmark Opto, Lasermate, Lasertel, Laytec, LeddarTech, Lenovo, LG, Lumentum, Luminar, Luxnet,
Magneti Marelli, Mantis Vision, Masimo, Namuga, Oclaro, Oculus, Omnivision, OnePlus, Oppo, Optek
Technology, Optical Society of America, Optovue, Optowell, Orbbec, Osram, Oxford Instruments,
Palomar Technologies, Philips Photonics, Picolight, pmd, POET Technologies, Primesense, Princeton
Optronics, QSI, Quanergy, Rasirc, Raycan, Realsense, Riber, Ricoh, Robosense, Samsung, Sanan, Santec
Corporation, SCAT, Seiko Epson, Seminex, SensL, Shiraz University, Sick, SinoSemic, SoftKinetic, Sony
Corporation, Stanley, STMicroelectronics, Sumitomo Chemicals, Sunny optical technology, Suoer, Taiyo
Nippon Sanso, Tetravue, Texas Advanced Optoelectronic Solutions, Thorlabs, Trilumina, Truelight
Corporation, Tyson Technology, Ulm Photonics, Ultra Communication, US Lasers Inc., Ushio, Valeo,
Varroc, Veeco, Velodyne, Vertically Integrated Systems, Vertilas, Vertilite, Viavi, Vivo, Vixar, VPEC,
Wavetek, Win Semiconductor, Xiaomi, Zephyr Photonics, ZF (…)

Preliminary Definitions and Principles 33
VCSEL Overview 39
Definitions
Applications as a function of the
electromagnetic spectrum
VCSEL in the semiconductor light source
environment
History of VCSELs
VCSEL structure
VCSELs in the electromagnetic spectrum
Timeline of main applications for VCSELs
VCSEL Landscape 51
Classification of VCSEL applications by
wavelength
Classification of VCSEL applications by market
segment
Classification of VCSEL applications by function
VCSEL Market 59
2017-2023 market volume (Munits) - By
application
2017-2023 market revenue ($M) - By application
2017-2023 growth trends by application
Market growth relays
VCSEL ASP
MOCVD reactor opportunity
VCSEL Applications 75
Datacom
Active optical cable
Plastic Optical Fibre (POF) in automotive
Laser printer
Industrial heating system
Proximity sensors
Autofocus systems
Gas sensors
Computer mice
Pulse oximeters
LIDAR
Surveillance cameras
Eye tracking systems
Face recognition
Gesture recognition
Optical Coherence Tomography (OCT)
VCSEL Manufacturing 123
VCSEL vs EEL
Basic properties of VCSELs
VCSEL specifications vs. Application requirements
Epitaxy - Technologies and trends
Key front-end process steps
Reliability aspects
The case of array manufacturing
Front-end manufacturing control
Packaging
VCSEL Industry 153
Overview
Trends
Key players
Consumer and mobile landscape
Automotive landscape
VCSEL Intellectual Property Landscape 207
Overview
Patent segmentation
Conclusion 226
TABLE OF CONTENTS (complete content on i-Micronews.com)
OBJECTIVES OF THE REPORT
• Give a comprehensive picture of the forces driving the VCSEL light source market, technology and
industry in the short, middle and long term
• Allow readers to understand the global landscape related to VCSELs
• Review main applications of VCSELs, giving insights on principles, technology, technical requirements,
trends, key players and more
• Analyse the technology and industry behind VCSEL light sources and their integration into sensors
and modules
• Provide and analyze market forecasts for VCSEL light sources from 2017 - 2023
• Present an Intellectual Property (IP) analysis in order for the reader to better understand the
patent landscape related to VCSEL device, system and applications
AUTHORS
Pierrick Boulay works as Market and
Technology Analyst in the fields of LED,
OLED and Lighting Systems to carry out
technical, economic and marketing analysis.
He has experience in both LED lighting
(general lighting, automotive lighting…) and
OLED lighting. In the past, he has mostly
worked in RD department for LED lighting
applications. Pierrick holds a master degree
in Electronics (ESEO - France).
Find more
details about
this report here:
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Pars Mukish holds a master degree in
Materials Science Polymers (ITECH -
France) and a master degree in Innovation
Technology Management (EM Lyon -
France). Since 2015, Pars has taken on
responsibility for developing SSL and Display
activities as Business Unit Manager at Yole.
Previously, he has worked as Marketing
Analyst and Techno-Economic Analyst for
several years at the CEA (French Research
Center).
Pierrick Boulay and Pars Mukish, all part of
the Photonics, Sensing Display division at
Yole Développement (Yole) co-authored the
VCSEL - Technology, Industry and market
Trends report:

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• MEMS Sensors
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• Solid state lighting
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• Software
• Memory

OUR 2018 REPORTS COLLECTION (1/4)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS Sensors for Automotive Market Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process Cost Report
− Gas Particles 2018 – Market Technology Report
− Gas Particles Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process Cost Report
RF DEVICES ANDTECHNOLOGIES
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF Photonic Components Technologies for 5G Infrastructure2018
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
o LINKED REPORTS – by Yole Développement, System Plus Consulting andKnowMade
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed

IMAGING OPTOELECTRONICS
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
− iPhone X Dot Projector – Patent-to-Product Mapping
− Status of the CMOS Image Sensor Industry 2018 – Market Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report
− CMOS Image Sensors Monitor 2018* – Quaterly Update**
− Camera Module 2017 – Market Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die andInterconnects,
Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 2
− Integrated Passive Devices (IPD) 2018
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− Fan-Out Packaging 2018 – Market Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report
MANUFACTURING
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology Market Trends
for Lithography Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology Market Trends for
Lithography Bonding/Debonding 2018 – Market Technology Report
− Wafer Bonding Comparison2018 – Structure, Process Cost Report

MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND DRAM)
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
− Power SiC 2018: Materials, Devices, and Applications – Market Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report
− Status of the GaN IP – Patent Watch 2018 Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market Technology Report – Update
− Automotive Power Module Packaging Comparison2018 – Structure,
Process Cost Report
− Power ICs Market Monitor 2018 – Quaterly Update**
− Power ICs Market Comparison 2018* – Structure, Process Cost Report
BATTERY AND ENERGY MANAGEMENT
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –
Update
− Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

SOLID STATE LIGHTING
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market Technology
Report
− VCSELs Comparison 2018 – Structure, Process Cost Report
DISPLAYS
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market Technology Report – Update
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound technologies for Medical, Industrial and Consumer 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market Technology Analysis 2017
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications– Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
− Organs-On-Chips 2017 – Market Technology Report
− Organ-on-a-Chip– Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent LandscapeAnalysis
− RF Acoustic Wave Filters Patent LandscapeAnalysis
− NMC Lithium-Ion Batteries Patent LandscapeAnalysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ON L IN E ON SITE IN PERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility,networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly,and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person.Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful,dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: Camille Veyrier (veyrier@yole.fr),Marketing Communication Project Manager

CONTACT INFORMATION
o CONSULTINGANDSPECIFICANALYSIS,REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan Rest ofAsia:
• Takashi Onozawa, General Manager,Asia Business
Development (Korea, Singapore, India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: MavisWang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez,EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy,CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnershipwithWoodside
CapitalPartners)
• Jean-Christophe Eloy,CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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