2. 2
1950 1955 1960 1975 1980 1985 1990 1995 2000 2001 2002 2003 2004 2005 2006
2006
1952
3 Amp power
Transistor
1960
Si-Base Transistor
1979
16-Bit Processor MC68000
1975
MC6800 is first
microprocessor used in
automotive application
1984
32-Bit Processor
MC68020
1989
MC68302
Communications
Processor
Late 1980’s
Development of the first
surface micromachined
inertial sensors for the
automotive airbag
1991
PowerPC® (1) Alliance
1994
First PowerPC®
(1) MPC601
1991
Company becomes
leading supplier of
automotive embedded
processors
1998
First PowerQUICC II
communications
processor (MPC8260)
2001
MPC7455 SOI
Volume Production
2003
Low-K Volume Production
2003
First single core modem: MXC.
“Smartphone-on –a-postage
stamp”
2003
The pressure sensor
portfolio expands with the
tire pressure monitor sensor
with capacitive technology
to save power
2004
60 millionth applications
processor for portable
multimedia devices
2005
First PowerQUICC
communications processor
with
QUICC Engine (MPC8360E)
Building on a 50+ Year Heritage of Innovation
1995
MPC860
PowerQUICC™
2005
i.MX31 processor
for mobile multimedia
entertainment
2006
MC9RS08KA2
Ultra-low end
MCU with
RS08 core
2006
MSC8144 multicore DSP
targeting wireless and
wireline infrastructure
2006
Industry’s First
Commercial MRAM
Product
7. Data Analysis for Yield Improvement – Wafer Maps
Single Wafer
Multiple Wafer
A single wafer map represents
100’s to 1,000’s of data points; a
multiple wafer map can represent
1,000’s to 100,000’s of data points.
Very high performance graphical data visualization …
8. The IC Market
• The semiconductor industry is approaching $300B/yr in sales
Transportation
8%
Consumer Electronics
16%
Communications
24%
Computers
42%
Industrial
8%
Military
2%
Courtesy of Dr. Bill Flounders, UC Berkeley Microlab
9. IC Technology Advancement
Improvements in IC performance and cost have been enabled
by the steady miniaturization of the transistor
Better Performance/Cost
Market Growth
2000 2005 2010 2015 2020
1
10
100
GATELENGTH(nm)
YEAR
LOW POWER
HIGH PERFORMANCE
International Technology
Roadmap for Semiconductors
Transistor Scaling
Investment
SMIC’s Fab 4 (Beijing, China)
Photo by L.R. Huang, DigiTimes
PITCH
YEAR: 2004 2007 2010 2013 2016
HALF-PITCH: 90nm 65nm 45nm 32nm 22nm
11. • Goal: Mass fabrication (i.e. simultaneous fabrication)
of many IC “chips” on each wafer, each containing
millions or billions of transistors
• Approach: Form thin films of semiconductors, metals,
and insulators over an entire wafer, and pattern each
layer with a process much like printing (lithography).
IC Fabrication
Planar processing consists of a sequence of
additive and subtractive steps with lateral patterning
oxidation
deposition
ion implantation
etching lithography
12. • DEPOSITION of a thin film
• LITHOGRAPHY
– Coat with a protective layer
– Selectively expose the protective layer
– Develop the protective layer
• ETCH to selectively remove the thin film
• Strip (etch) the protective layer
Planar Processing
(patented by Fairchild Semiconductor in 1959: J. A. Hoerni, US Patent 3,064,167)
Courtesy of Dr. Bill Flounders, UC Berkeley Microlab
14. G
S D
Si classical
multi-gate
G
S DSi
G
high-k gate dielectric
metallic gate
strained Si
Lg (nm): 50 40 30 20 10
MOSFET Scaling Scenario
• Advanced structures will enable Si MOSFET scaling to Lg <10 nm
forward body biasing
15. The End is Not the Limit !
Information technology
pervasive
embedded
human-centered
solving societal-
scale problems
Philips
Innovations in process technology,
materials, and device design will sustain
the Si revolution
Lower Power,
Lower Cost
Market Growth
Technology, Device & Circuit
Innovations,
Heterogeneous Integration
Investment
Acknowledgement:
Mark Weiser
UbiComp (>1 computers per person)
today
SALES($)/YR
TIME
PCs (1 person/computer)
Mainframes (>1 persons per computer)
Transportation
Health
care
Disaster response
Energy
Environment
Sensatex
Information technology will be
pervasive
embedded
human-centered
for better quality-of-life
