Aprenda a desenvolver aplicações em Sensor-to-Cloud para monitoramento industrial utilizando o kit SensorTile Wireless Industrial Node (STWIN). Assista ao nosso webinar de 1 hora para explorar os desafios da Indústria 4.0 e aprender a construir uma aplicação completa de sensor para nuvem utilizando sensores de nível industrial avançados. Assista o webinar em: https://www.youtube.com/watch?v=o9X0o8AeNcU

1. ST Sensors and
Solutions in Smart
Industry Applications:
STEVAL-STWINKT1
Thiago Reis

2. • Industry 1.0: Mechanization, Steam Power
• Industry 2.0: Mass Production, Assembly Line, Electrical Energy
• Industry 3.0: Automation, Computers and Electronics
• Industry 4.0: Cyber Physical Systems, IoT, Networks
What is “Smart Industry”?
2

3. Market and applications
• Rotating equipment and related parts
(i.e. motors, fans, pumps, bearings,
spindles)
• Elevators, escalators, …
• Electric equipment (i.e. circuit
breakers)
• Chemical industry
• Structural monitoring (i.e. bridges,
railways)
• Automotive (i.e. electrical motors and
parts - bearings, battery management)
• Consumer Industrial (i.e. HVAC)
3

4. Continuous condition monitoring (sensing)
Preventive, Condition Based
and Predictive Maintenance
4
Q1 Q2 Q3 Q4
Preventive Maintenance (scheduled)
Predictive Maintenance (at the optimal moment)
alarm alarm
Condition Based Maintenance (at inspection or symptom)
Q1 Q2 Q3 Q4

5. Architecture for Predictive Maintenance
5

6. Sensors for Predictive Maintenance
6
Machine
conditions
Time
Conditions
start to
change
Power
days
Smoke
minutes
months
Ultrasound
weeks
Noise
Vibration
The curve slope depends
on the life-cycle of the
equipment
Failure
Temperature

7. Leading Industrial Sensors
7
HIGH PRECISION
INCLINOMETER
ACCELEROMETER &
MAGNETOMETER
COMPASS
LOW POWER
ACCELEROMETER
ACCELEROMETER &
GYROSCOPE
6-AXIS IMU
ISM330DHCX/DLC IIS2DH/IIS2DLPC IIS2MDC/ISM303DACIIS3DHHC
• Power Consumption / Noise
• Stability Temperature & Time
• Dedicated signal path for
stabilization control loop
• Smart FIFO up to 9 kbyte
• Ultra-low noise
• Stability over temperature
and time
• Package size (2x2mm)
• Versatility: low power and
high ODR/wide bandwidth
operating modes
• Power Consumption
• Dynamic range
• Thermal Stability
• Precision
IMU = Inertial Measurement Unit
MLC = Machine Learning Core
Smart
Industry
ST Advantage
WIDE BANDWIDTH
VIBROMETER
IIS3DWB
• Ultra-wide and flat bandwidth
(5kHz)
• Low noise (90 µg/√Hz)
• Low power (1.1mA)
• Extended Temp: +105°C
Accuracy and ultra-low
noise
Ultra-wide and flat
bandwidth
Ultra-low power, low noise,
embedded features, MLC
Compact, low
power, versatile
High Resolution,
Wide Dynamic
Range, Low power
consumption

8. MEMS microphones portfolio
8
• Ultra-flat frequency resp (15Hz)
• 64dB SNR, 130dB AoP
• Best in class THD in 3x4x1
• Improved PSR
• Sensitivity ±1 dB (06J)
• 64dB SNR, 135dBSLP AoP
• Low Power Mode
• Proven on A2B system
• Best in class THD in 3x4x1
• Sound acquisition up to 24kHz
High performance
Top Port Microphone
Battery powered &
Automotive
MP23DB01HP
Industry standard
3.5x2.65x0.98, 5Leads
Low Power mode
Optimized @ 3MHz
for A2B Systems
Smart Home / IoT
MP34DT05-A
MP34DT06J
Industry standard
3x4x1, 5Leads
Performance
Flexibility
Top Port
Accessories
MP23ABS1
Analog, Flat
Frequency
Highest fidelity
Industry standard
3.5x2.65x0.98, 5Leads
Industrial
IMP34DT05
Industry standard
3x4x1, 5Leads
SNR = Signal to Noise Ratio
AoP = Acoustic Overload Point
THD = Total Harmonic Distortion
ST Advantage
Smart
Things
Smart Home
& City
Smart
Industry
Smart
Driving

9. Environmental Sensors
9
PRESSURE SENSOR TEMP + HUMIDITYTEMPERATURE
LPS22HH / LPS27HHW
STTS751/STTS22H(*)
STLM20
HTS221
• High Performance (200Hz data rate,
0.025hPa relative pressure accuracy)
• LPS22HH: Dust resistant full-molded
package
• LPS27HHW: Waterproof
• STTS22H: High accuracy (0.25C
typ), SMBus 2.0
• STLM20: Analog Output sensor
• Best in class Power consumption
(One Shot Mode for Digital)
• Compact package
• Low power
• Industrial temperature operating range
Compact, low
power, water
resistant
Relative Humidity and
Temperature
High accuracy,
low power, digital
or analog
Smart
Things
Smart Home
& City
Smart
Industry
ST Advantage

10. Mechanical Vibration / Sound analysis (1 ÷ 10KHz)
MEMS for vibration analysis
Sensors and defects over bandwidth
10
kHz
2 >505 10
IIS3DWB
MP23ABS1
Inertial
IMP34DT05
Acoustic
Ultrasound analysis
Use cases
ISM330DHCX
IIS2DH
Unbalance
Looseness
Misalignment
Roller Bearings
Gearing
Cavitation
Bearings
Gear boxes
Lubrication
Fan bearings
Venting occlusion
Cooling failure
NEW!

11. Focus on IIS3DWB vibration sensor

12. • MEMS Pros
• Low power, small size, low weight
• Cost effective
• Digital output: easy wiring and no need for external ADC or other signal conditioning circuits
• Fast recovery after high shock and in power up
• Frequency response includes DC
• Good stability over time and across temperatures
• Integrated self-test
• Embedded functionalities
• Cons
• Lower achievable BW vs. Piezoelectric
• Higher noise, lower resolution
Vibration Sensors:
MEMS vs. Piezoelectric
12

13. Key Features
• 3-axis application specific accelerometer for
vibration monitoring
• From ±2 to 16g Full Scale
• Ultra Wide Bandwidth 5kHz (ODR @26.6kHz)
• Ultra-low noise density: down to 75 µg/√Hz in 3-axis
mode, 60 µg/√Hz in single-axis mode
• -40 to 105°C temperature range
• Embedded features (Filters, FIFO, Temperature
sensor, Self-Test)
• Interrupts for wake-up / activity - inactivity / FIFO
thresholds
IIS3DWB
13
Target applications
• Vibration monitoring
• Condition monitoring
Ultra-wide bandwidth, low-noise 3-axis digital Vibration Sensor
• Predictive maintenance
• Test and measurements

14. IIS3DWB KPIs for Vibration Monitoring
14
#1 Wide & Flat measurement bandwidth
#2 Flat freq. response, Sharp out of band roll-off, No aliasing
#3 Low noise levels
#4 Stable thermal behavior over extended temperature range

15. • Frequency response:
• Bandwidth
• frequency response flatness in pass band
• attenuation in stop band (to avoid frequency aliasing)
• Noise density
• Full Scale and number of axis
• Operating temperature range
• Power consumption (for wireless sensor nodes)
• Interface (analog / digital)
IIS3DWB frequency response
15
Freq. Resp ±5%
+3dB
-3dB
Resonance Freq
Example of a typical Frequency response of
an Analog Accelerometer with the relevant features.
Frequency response of ST’s IIS3DWB Digital Accelerometer, no external
component needed for A2D conversion, nor for frequency response equalization
Freq. Resp ±5% -3dB
KPI for Accelerometer for Vibration Monitoring

16. • The output of the ADC converter is filtered with a digital low pass filter LPF1 to
ensure the intended sensor’s frequency response:
IIS3DWB filtering chain
16
Frequency response determined by CAD simulation – at the output of LPF1
Frequency response at the output of LPF1
#2 KPI
Sharp out of band roll-off
(>90 dB/dec)
Attenuation >70 dB at
frequencies higher than ODR
6.3kHz
#1 KPI
Wide & Flat measurement
bandwidth 5kHz min (6.3kHz
typ)

17. Noise density
17
• The filtering chain is composed of:
MEMS ADC
Analog
Front-end+
ADC
LPF1
Low Pass
Filter
Composite Filter
Composite
Filter
26.7KHz
f0=7kHz
#3 KPI
IIS3DWB recalculated velocity resolution in mm/s, with respect to the sensor noise is typically
~0.05 mm/s, which is much better than requirement (1.4 - 2.8 mm/s RMS velocity limit) for medium sized
motors, in rigid support in Zone B of ISO10816-3

18. Sensitivity drift vs temperature
18
#4 KPI
IIS3DWB sensitivity drift over temperature range is negligible. Zero g offset drift over temperature is
not important for a vibrometer (DC component is not of interest)

19. MEMS Vibrometers Competitors Map
Performances
Price
$$$$
$
Competitor B offer both 3-axis analog and
digital devices, with medium bandwidth but
with inferior noise performance. Their price
is however on low end
ST is going to offer the best plug and play
vibrometer on the market; with best
performance/cost ratio
Competitor A has a specific offer of single
axis, analog, low power, low noise, wide
bandwidth devices. These sensors are
high performance but high price
19
A
B

20. • STEVAL-MKI208V1K
• IIS3DWB connected via cable to an adapter board to
render it compatible with STEVAL-MKI109V3
(Professional MEMS tool)
• Unico GUI (STSW-MKI109W/M/L)
• STEVAL-STWINKT1: SensorTile Wireless
Industrial Node
20
IIS3DWB Evaluation Tools

21. SensorTile Wireless Industrial Node
21

22. SensorTile Wireless Industrial Node
STEVAL-STWINKT1
22
EquipmentMotors Environment
Power
Local Processing & Security
• Ultra-low-power ARM® Cortex®‐M4 STM32L4R9
• Secure Element STSAFE-A110
Industrial-grade sensors for
• Vibration analysis
• Sound Emission up to 80 kHz
• Environment monitoring
▪
Sensing
Connectivity
Power Management
• Li-Ion linear battery charger with load switches
• Miniaturized synchronous step down converter with
high-efficiency conversion
Processing
Embedded Wireless and Extension
• BLE, WiFi (Inventek)
• Modular expansion: LTE, LoRa, Industrial Ethernet
https://www.st.com/content/st_com/en/products/evaluation-tools/solution-evaluation-tools/sensor-solution-eval-boards/steval-stwinkt1.html
STEVAL-STWINWFV1 (Optional)

23. STWIN Development Kit
23
Micro USB
connector
BLE
module
Microphone
Environmental
sensors
Motion
sensors
STLINK-V3MINI
Case and Battery
WIFI
Socket
Mic-Array
Socket
WiFi Expansion
(optional)
STM32L4+
Sound
Inlet
STMOD+
VIN
(Optional)
STBC14

24. STEVAL-STWINKT1
Block diagram, ICs and features
SPI3
ADC1
USART2
DFSDM1
I2C2
IMP34DT05-A
Digital Microphone
LPS22HH
Pressure
Sensor
HTS221
Humidity and
Temp. Sensor
STTS751
Temperature
Sensor
IIS2MDC
3D Magnetometer
STM32L4R9ZIJ6
Microcontroller
Ultra-low-power Cortex-M4F@120MHz
32 kHz
Crystal
16 MHz
Crystal
SPBTLE-1S
BLE Application
Processor Module
STR485LV
RS485 Interface
SPI2
MP23ABS1
Analog
Microphone
TS922EIJT
Low noise, low
distortion Op Amp
20-pin STMOD+
connector
12-pin female
sensors connector
12-pin male comm.
connector
40-pin Flex
connector
STSAFE-110
Secure Element
I2C2
SPI2, I2C4
USART3
IIS2DH
3D Accelerometer
IIS3DWB
Vibrometer
ISM330DHCX
6-Axis IMU
USBLC6-2P6
USB ESD protection
EMIF06-MSD02N16
EMI filter and ESD protection
STBC02
Li-Ion linerar
battery charger
ST1PS01EJR
step-down switching
regulator
LDK130
Low Noise LDO
DSI, CAN, ..
SPI1, I2C3,
USART3
SAI1, I2C2,
DFSDM2
ESDALC6V1-1U2
Single Line ESD protection
• Best-in-class Industrial Grade Sensors
• Multiple algorithms running on the
STM32L4+
• Secure Connection and Authentication
with STSAFE-110 (footprint)
• BLE Connectivity
• Connectivity and sensor expansions
support
• Power supply: Li-Po battery or ext. 5V
• Smart Power to increase battery life
• USB and SD-Card holder
• STSW-STWINKT1 support sample
projects (simple functions)
• STSW-STWINCELL to connect to the
Internet via cellular networks (Under
Evaluation in AME)
• FP-IND-PREDMNT1 to connect to the
Predictive Maintenance Cloud app
Powered by AWS (Wi-Fi expansion)
• FP-CLD-AZURE1 to connect to Azure
Cloud with Wi-Fi expansion kit
24

25. MEMS & Sensors for Condition Monitoring
and Predictive Maintenance
25
Function IC Description Package
Vibration
IIS3DWB
Ultra Wide Bandwidth
Accelerometer
LGA-14, 2.5x3 mm
ISM330DHCX
Wide Bandwidth
Accelerometer + Gyroscope
IIS2DH
Ultra-low-power
Accelerometer
LGA-12, 2x2 mm
IIS2MDC
Low-Noise, Low Power
Magnetometer
Acoustic
MP23ABS1TR
Analog Differential
Microphone
RHLGA metal cap 5-L,
3.5x2.65x0.98 mm
IMP34DT05-A Digital Top Port Microphone 3x4x1 mm
Environmental
LPS22HH
High Accuracy – Compact Size
Absolute Pressure Sensor
HLGA-10-L, 2x2x0.76 mm
Ultra Compact full molded
STTS751 Digital Temperature Sensor 2 x 2 x 0.50 mm 6-lead UDFN
HTS221
Humidity and Temperature
Sensor
2 x 2 x 0.90 mm 6-lead HLGA

26. Core system board and components location
• U2: HTS221 relative humidity and temperature sensor
• U3: LPS22HH digital absolute pressure sensor
• U6: STTS751 low-voltage digital local temperature
sensor
• U9: ISM330DHCX 3D acc. + 3D gyro iNEMO IMU with
machine learning core
• U11: IIS3DWB ultra-wide bandwidth (up to 6 kHz), low-
noise, 3-axis digital vibration sensor
• U12: IIS2DH ultra-low-power high performance MEMS
motion sensor
• U13: IIS2MDC ultra-low-power 3-axis magnetometer
• U8: TS922 rail-to-rail, high output current, dual
operational amplifier
• M1: MP23ABS1 wideband analog MEMS microphone
• M2: IMP34DT05 industrial grade digital MEMS
microphone
• U5: SPBTLE-1S Bluetooth® Low Energy 4.2 Module
26

27. Available STWIN expansions
STEVAL-STWINWFV1 (link)
• Wi-Fi adapter for STWIN (STEVAL-STWINKT1)
• Plugs into STWIN core system board through
dedicated 12-pin connector
• ISM43362-M3G-L44-E Wi-Fi module:
• 802.11 b/g/n Compatible based on Broadcom MAC/Baseband/Radio
device
• Fully contained TCP/IP stack
• Secure Wi-Fi authentication WEP-128, WPA-PSK (TKIP), WPA2-
PSK
• CE certified – FCC certified – IC certified
• RoHS and China RoHS compliant
• WEEE compliant
27
STEVAL-STWINMAV1 (link)
• Analog microphone array expansion for STWIN
(STEVAL-STWINKT1)
• Connects to STWIN core system board through
dedicated 12-pin connector
• 4 mm square-shaped differential microphone array
• 4x MP23ABS1 high-performance, single-ended,
analog, bottom-port MEMS microphones
• LDK130 300mA low quiescent current very low noise
LDO
• On-board audio-grade quad ADC
• Serial Audio Interface (SAI) digital output

28. STSW-STWINKT1
(link)
• Set of firmware examples that show how to
implement basic functions on the STWIN:
• Terminal DataLog Sensor data streaming
example via USB terminal (VCP)
• OnboardMics Analog and digital microphone
signal acquisition and streaming via USB
• WiFi_Connectivity Wi-Fi network
functionality using the connectivity framework
(with Wi-Fi expansion board)
• BLE_SampleApp Sensor data streaming via
BLE
• HS_DataLog High speed sensor data logger
to SD card or via USB
• MicArrayCoupon Microphone array audio
acquisition example (with microphone
expansion board)
28
• Embedded software, middleware and
drivers:
• FatFS third party FAT file system module for
small embedded systems
• FreeRTOS third party RTOS kernel for
embedded devices
• STWIN Low-Level BSP drivers

29. FP-IND-PREDMNT1
(link)
• FP-IND-PREDMNT1 is an STM32Cube function pack
including dedicated algorithms for advanced time and
frequency domain signal processing and analysis of
the 3D digital accelerometer with flat bandwidth up to
5kHz. The package includes also pressure, relative
humidity and temperature sensor monitoring and audio
algorithms for acoustic emission (AE) up to 20 kHz,
and ultrasound emission analysis up to 80 kHz.
• With STEVAL-STWINKT1 kit with BLE connectivity is
possible to monitor and log the algorithm output and
sensor data using the ST BLE Sensor app. This
original FW that comes with STWIN out of the box.
• By using the STEVAL-STWINKT1 kit with Wi-Fi
expansion STEVAL-STWINWFV1 is possible to
connect the device directly to the dedicated DSH-
PREDMNT web-based dashboard to monitor and log
the algorithm output, sensor data and equipment
status.
29

30. BIN
STWIN to ST BLE Sensor App
30
1. Program the STWIN
• Connect STLINKV3_MINI to STWIN
• Use STM32L4R9ZI-STWIN_PredictiveMaintenance_BL_v2.2.0.bin
from FP-IND-PREDMNT1
• Drag and Drop file to STLINK_V3M
or
• Or use STM32CubeProgrammer
2. Open the ST BLE Sensor
And connect to device
See Quick Start for details.
3. Environmental
Environmental dashboard with temperature
humidity and pressure
Temperature
Pressure Humidity
ST BLE Sensor

31. STWIN to ST BLE Sensor App
31
4. FFT Amplitude
FFT Amplitude visualization
5. Plot data
Data visualization of various sensors
Start/Stop
FFT Settings
Sensor selection
Raw data
Note: For faster response,
recommendation to use
500ms acquisition time
6. Predictive
Maintenance
Interactive set of information for
predictive maintenance
3 levels of classification – good,
warning, alarm (*)
(*) 3 levels of classification – thresholds can be
changed by recompiling the project
(MotionSP_Threshold.h)

32. HARDWARE
• STEVAL-STWINKT1
• STEVAL-STWINWFV1
FIRMWARE
• FP-IND-PREDMNT1
DASHBOARD
• dsh-predmnt.st.com
• Free with my.st.com login
• Up to 5 Sensor Nodes
• Up to 6 Months usage
See also:
• SL-PREDMNT-E2C on st.com
STWIN to DSH-PREDMNT
32

33. • Environmental data
• Humidity and Temperature data from
HTS221
• Pressure data from LPS22HH
• Wide band Accelerometer (FFT
processed on STWIN’s MCU)
• Data from IIS3DWB
• Ultrasound Emission (FFT
processed on STWIN’s MCU)
• Data from MP23ABS1
DSH-PREDMNT
33

34. LIVE DEMO
34
• Connect STEVAL-STWINKT1+STEVAL-STWINWFV1 to your PC, running FP-IND-PREDMNT1
(Use STM32L4R9ZI-STWIN_PredictiveMaintenance_WIFI_v2.2.0.bin)
• Go to: https://dsh-predmnt.st.com/

35. (Amazon) FreeRTOS Solutions
https://devices.amazonaws.com/
• Full Feature
FreeRTOS
• Wi-Fi Integration
• Over-the-Air (OTA)
Updates
• Code available
upon request from
AWS Partner
Device Catalog
• Alpha customer
whitelist process in
place

36. FP-CLD-AZURE1
(link)
• FP-CLD-AZURE1 is an STM32Cube function pack
which lets you safely connect a B-L475E-IOT01A or
STEVAL-STWINKT1 node to Microsoft Azure IoT,
transmit sensor data and receive commands from
Azure cloud applications.
• The package contains a sample application for data
telemetry/device management and firmware update to
be connected to Azure IoT Central PnP application.
• This software, together with the suggested
combination of STM32 and ST devices, can be used,
for example, to develop sensor-to-cloud applications
for a broad range of use cases, such as smart home
or smart industry.
• The software runs on the STM32 microcontroller and
includes drivers for the Wi-Fi connectivity, and motion
and environmental sensors.
36

37. Microsoft IoT Central Support
37
https://apps.azureiotcentral.com/build/new/4da7263e-510f-4784-91a7-01e26357589e

38. DEMO
38
• Connect STEVAL-STWINKT1+STEVAL-STWINWFV1 to your PC, running FP-CLD-AZURE1
• Go to: https://apps.azureiotcentral.com/build/new/4da7263e-510f-4784-91a7-01e26357589e
STLINK-V3MINI

39. Discovery Kit
IoT Node
SensorTile.boxNFC Dynamic Tag
Sensor Node
SensorTile Wireless
Industrial Node
Complete ecosystem offering by ST
39
Lower barriers from
prototyping to first product
Connectivity solutions
Analog components
Sensors & actuators
Power management
Microcontrollers
Secure solutions
Motor control
All building blocks
for IoT devices
Lower barriers for
developers getting started
Enable product & service
commercialization
Stackable boards
& modular SW
Form-factor boards
Pre-integrated software
for vertical applications
Development ecosystem
Partner Program and ST community
Integration of Cloud Provider SDKs
STM32 Nucleo Development
& Expansion Boards

40. © STMicroelectronics - All rights reserved.
The STMicroelectronics corporate logo is a registered trademark of the STMicroelectronics
group of companies. All other names are the property of their respective owners.
Thank you