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Manufacturing That Eliminates Risk & Improves Reliability
Utilizing Rigid-Flex PCBs to
Improve Design Reliability
02.21.2020
Manufacturing That Eliminates Risk & Improves Reliability
2
Agenda
 Mechanical Reliability:
– Points of Interconnect
– Shock & Vibe Performance
– Minimum Bend Capabilities
– Durability
 Electrical Reliability:
– High Speed Signals
– EMI / RF Shielding
 IPC 2223 Guidelines for Reliable Constructions
Manufacturing That Eliminates Risk & Improves Reliability
3
Introduction
Manufacturing That Eliminates Risk & Improves Reliability
4
 Definition: Reliability
– Ability of an apparatus or system to consistently perform its required function
without degradation or failure.
 Reliability engineering studies identified:
– “Majority of electronic failures occur at a point
of interconnect.”
 Critical to many Class 3 applications
– Military
– Aerospace
– Life-supporting medical
– Automotive
Introduction
Manufacturing That Eliminates Risk & Improves Reliability
5
Introduction
 Cost Benefits
– Improved final assembly yields.
– Eliminates latent, in the field, failures, and associated product return and or
replacement.
– Opportunity to offset added rigid-flex solution costs.
– Securing repeat business.
Manufacturing That Eliminates Risk & Improves Reliability
6
Mechanical Reliability:
Points of Interconnect
Manufacturing That Eliminates Risk & Improves Reliability
7
Mechanical Reliability: Points of Interconnect
 Interconnects are potential sources of failure.
 Rigid-flex is deemed to be an integrated construction.
 Eliminates all points of interconnect between
independent rigid component areas.
 No additional interconnects required between flex and
rigid layers.
 All connections are plated vias/holes with same
reliability as rigid PCBs.
Manufacturing That Eliminates Risk & Improves Reliability
8
Mechanical Reliability: Points of Interconnect
Manufacturing That Eliminates Risk & Improves Reliability
9
Mechanical Reliability: Points of Interconnect
 Example
– Standard “wired” solution:
• Up to 6 interconnect points for each circuit.
• PCB to connector solder joints (2).
• Header to receptacle connections (2).
• Wire to receptacle connections:
– Soldered or crimped (2).
 Added Benefit
– Reduces potential assembly errors.
– Cannot be assembled incorrectly.
Manufacturing That Eliminates Risk & Improves Reliability
10
Mechanical Reliability:
Shock & Vibe Performance
Manufacturing That Eliminates Risk & Improves Reliability
11
Mechanical Reliability: Shock & Vibe
 Reduced Weight
– Improved shock & vibe performance.
– Weight = approx. 20% or less of a wired solution.
 Impact dependent upon length of flex section(s)
– Longer the flex, the greater the weight savings, the
greater the improvement.
 Flex sections easily attached/strain relieved to
enclosure with pre-attached PSAs (double sided tape).
 Material ductility & flexibility reduces impact of shock & vibration
events.
Manufacturing That Eliminates Risk & Improves Reliability
12
Mechanical Reliability:
Bend Capabilities
Manufacturing That Eliminates Risk & Improves Reliability
13
Mechanical Reliability: Bend Capabilities
 Thinner flex constructions allow for:
– Tighter bend capabilities due to:
• Thinner copper circuit layers.
• Thinner core & insulating layers.
– Min. bend radius capability guidelines:
• Function of finished flex thickness:
• Static Bend: 10-30 X
• Dynamic Bend: 80-100 X
– Less potential induced stress in the bend areas as
compared to bulkier wired solutions.
Manufacturing That Eliminates Risk & Improves Reliability
14
Mechanical Reliability:
Durability
Manufacturing That Eliminates Risk & Improves Reliability
15
Mechanical Reliability: Durability
 Polyimide Materials
– Excellent resistance to wide range of chemistries
and environments:
• Acids, Basics, Solvents, Gasses
• UV exposure
• Radiation exposure
• Temperature
– Abrasion resistant
– Long life mechanical properties
– High dielectric strength: > 5 KV per 0.001”
Manufacturing That Eliminates Risk & Improves Reliability
16
Electrical Reliability:
High Speed Signal Performance
Manufacturing That Eliminates Risk & Improves Reliability
17
Electrical Reliability: High Speed Signal Performance
 Flex circuit materials and constructions inherently
well-suited to high speed signal applications.
– Highly uniform material thicknesses.
– Improved DK values over standard rigid materials.
– Uniform line width and spacings.
– Eliminates signal reflections due to connector systems.
• Added benefit:
– Eliminates high-cost controlled impedance connector
systems.
Manufacturing That Eliminates Risk & Improves Reliability
18
Electrical Reliability: High Speed Signal Performance
Manufacturing That Eliminates Risk & Improves Reliability
19
Electrical Reliability:
EMI / RF Shielding
Manufacturing That Eliminates Risk & Improves Reliability
20
Electrical Reliability: EMI / RF Shielding
 Flex can easily and effectively be shielded to high levels against EMI & RF.
 Multiple shielding methods available:
– Flex specific shielding films
• Preferred solution for shielding only requirements
• Highly flexible, slip properties
Manufacturing That Eliminates Risk & Improves Reliability
21
Electrical Reliability: EMI / RF Shielding
– Addition copper shield layers
• Necessary for controlled impedance applications
– Silver ink shield layers
• Replaced by shielding films
Manufacturing That Eliminates Risk & Improves Reliability
22
IPC 2223 Design Standard:
Reliability Guidelines
Manufacturing That Eliminates Risk & Improves Reliability
23
IPC 2223 Design Standard: Reliability Guidelines
 Released: 1998
 Established specific design, material, and structure
requirements for flex & rigid-flex circuits.
 Collaborative program between:
– IPC, material suppliers, manufacturers.
– Address developing plated hole reliability concerns
in flex and rigid-flex due to increased design
complexity.
Ebook Download:
https://info.epectec.com/guides/ipc-2223-design-standard-for-flex-and-rigid-flex-circuits
Manufacturing That Eliminates Risk & Improves Reliability
24
IPC 2223 Design Standard: Reliability Guidelines
 Materials
– Adhesiveless flex materials
 Construction / Manufacturing
– Selective flex coverlay
– Pre-preg only laminations
– Air gap constructions
 Design
– Min. via/plated hole spacing to flex
transition(s)
– Min. bend capability guidelines
• Static & dynamic
Transition Zone
Manufacturing That Eliminates Risk & Improves Reliability
25
IPC 2223 Design Standard: Reliability Guidelines
Manufacturing That Eliminates Risk & Improves Reliability
26
Summary
 Design Reliability
– Critical element of all projects.
– Consequences of a failure in Class 3 products require every effort to ensure highest
possible reliability.
 Rigid-flex Technology Improves
– Reliability:
• Significant reduction in points of interconnect/failure locations.
– Performance:
• High Speed Signals & Shielded Designs.
– Durability in harsh environments.
– Shock & vibe performance through weight reduction.
Manufacturing That Eliminates Risk & Improves Reliability
27
Summary
 IPC 2223 Design guidelines
– Must be followed to ensure finished part reliability.
 Added Benefits
– Smaller/tighter packaging requirements.
– Cost-savings opportunities:
• Reduced/simplified assembly requirements.
• Overall packing size reduction.
• Purchasing/inventory management costs.
Manufacturing That Eliminates Risk & Improves Reliability
28
Our Products
Battery Packs Flex & Rigid-Flex PCBs Cable Assemblies Printed Circuit Boards
RF Products User Interfaces Flexible Heaters EC Fans & Motors
Manufacturing That Eliminates Risk & Improves Reliability
29
Q&A
 Questions?
– Enter any questions you may have
in the Control Panel
– If we don’t have time to get to it, we
will reply via email
Manufacturing That Eliminates Risk & Improves Reliability
30
Thank You
Check out our website at www.epectec.com.
For more information email sales@epectec.com.
Stay Connected with Epec Engineered Technologies
Follow us on our social media sites for continuous technical updates and information:

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Using Rigid-Flex PCBs to Improve Design Reliability

  • 1. Manufacturing That Eliminates Risk & Improves Reliability Utilizing Rigid-Flex PCBs to Improve Design Reliability 02.21.2020
  • 2. Manufacturing That Eliminates Risk & Improves Reliability 2 Agenda  Mechanical Reliability: – Points of Interconnect – Shock & Vibe Performance – Minimum Bend Capabilities – Durability  Electrical Reliability: – High Speed Signals – EMI / RF Shielding  IPC 2223 Guidelines for Reliable Constructions
  • 3. Manufacturing That Eliminates Risk & Improves Reliability 3 Introduction
  • 4. Manufacturing That Eliminates Risk & Improves Reliability 4  Definition: Reliability – Ability of an apparatus or system to consistently perform its required function without degradation or failure.  Reliability engineering studies identified: – “Majority of electronic failures occur at a point of interconnect.”  Critical to many Class 3 applications – Military – Aerospace – Life-supporting medical – Automotive Introduction
  • 5. Manufacturing That Eliminates Risk & Improves Reliability 5 Introduction  Cost Benefits – Improved final assembly yields. – Eliminates latent, in the field, failures, and associated product return and or replacement. – Opportunity to offset added rigid-flex solution costs. – Securing repeat business.
  • 6. Manufacturing That Eliminates Risk & Improves Reliability 6 Mechanical Reliability: Points of Interconnect
  • 7. Manufacturing That Eliminates Risk & Improves Reliability 7 Mechanical Reliability: Points of Interconnect  Interconnects are potential sources of failure.  Rigid-flex is deemed to be an integrated construction.  Eliminates all points of interconnect between independent rigid component areas.  No additional interconnects required between flex and rigid layers.  All connections are plated vias/holes with same reliability as rigid PCBs.
  • 8. Manufacturing That Eliminates Risk & Improves Reliability 8 Mechanical Reliability: Points of Interconnect
  • 9. Manufacturing That Eliminates Risk & Improves Reliability 9 Mechanical Reliability: Points of Interconnect  Example – Standard “wired” solution: • Up to 6 interconnect points for each circuit. • PCB to connector solder joints (2). • Header to receptacle connections (2). • Wire to receptacle connections: – Soldered or crimped (2).  Added Benefit – Reduces potential assembly errors. – Cannot be assembled incorrectly.
  • 10. Manufacturing That Eliminates Risk & Improves Reliability 10 Mechanical Reliability: Shock & Vibe Performance
  • 11. Manufacturing That Eliminates Risk & Improves Reliability 11 Mechanical Reliability: Shock & Vibe  Reduced Weight – Improved shock & vibe performance. – Weight = approx. 20% or less of a wired solution.  Impact dependent upon length of flex section(s) – Longer the flex, the greater the weight savings, the greater the improvement.  Flex sections easily attached/strain relieved to enclosure with pre-attached PSAs (double sided tape).  Material ductility & flexibility reduces impact of shock & vibration events.
  • 12. Manufacturing That Eliminates Risk & Improves Reliability 12 Mechanical Reliability: Bend Capabilities
  • 13. Manufacturing That Eliminates Risk & Improves Reliability 13 Mechanical Reliability: Bend Capabilities  Thinner flex constructions allow for: – Tighter bend capabilities due to: • Thinner copper circuit layers. • Thinner core & insulating layers. – Min. bend radius capability guidelines: • Function of finished flex thickness: • Static Bend: 10-30 X • Dynamic Bend: 80-100 X – Less potential induced stress in the bend areas as compared to bulkier wired solutions.
  • 14. Manufacturing That Eliminates Risk & Improves Reliability 14 Mechanical Reliability: Durability
  • 15. Manufacturing That Eliminates Risk & Improves Reliability 15 Mechanical Reliability: Durability  Polyimide Materials – Excellent resistance to wide range of chemistries and environments: • Acids, Basics, Solvents, Gasses • UV exposure • Radiation exposure • Temperature – Abrasion resistant – Long life mechanical properties – High dielectric strength: > 5 KV per 0.001”
  • 16. Manufacturing That Eliminates Risk & Improves Reliability 16 Electrical Reliability: High Speed Signal Performance
  • 17. Manufacturing That Eliminates Risk & Improves Reliability 17 Electrical Reliability: High Speed Signal Performance  Flex circuit materials and constructions inherently well-suited to high speed signal applications. – Highly uniform material thicknesses. – Improved DK values over standard rigid materials. – Uniform line width and spacings. – Eliminates signal reflections due to connector systems. • Added benefit: – Eliminates high-cost controlled impedance connector systems.
  • 18. Manufacturing That Eliminates Risk & Improves Reliability 18 Electrical Reliability: High Speed Signal Performance
  • 19. Manufacturing That Eliminates Risk & Improves Reliability 19 Electrical Reliability: EMI / RF Shielding
  • 20. Manufacturing That Eliminates Risk & Improves Reliability 20 Electrical Reliability: EMI / RF Shielding  Flex can easily and effectively be shielded to high levels against EMI & RF.  Multiple shielding methods available: – Flex specific shielding films • Preferred solution for shielding only requirements • Highly flexible, slip properties
  • 21. Manufacturing That Eliminates Risk & Improves Reliability 21 Electrical Reliability: EMI / RF Shielding – Addition copper shield layers • Necessary for controlled impedance applications – Silver ink shield layers • Replaced by shielding films
  • 22. Manufacturing That Eliminates Risk & Improves Reliability 22 IPC 2223 Design Standard: Reliability Guidelines
  • 23. Manufacturing That Eliminates Risk & Improves Reliability 23 IPC 2223 Design Standard: Reliability Guidelines  Released: 1998  Established specific design, material, and structure requirements for flex & rigid-flex circuits.  Collaborative program between: – IPC, material suppliers, manufacturers. – Address developing plated hole reliability concerns in flex and rigid-flex due to increased design complexity. Ebook Download: https://info.epectec.com/guides/ipc-2223-design-standard-for-flex-and-rigid-flex-circuits
  • 24. Manufacturing That Eliminates Risk & Improves Reliability 24 IPC 2223 Design Standard: Reliability Guidelines  Materials – Adhesiveless flex materials  Construction / Manufacturing – Selective flex coverlay – Pre-preg only laminations – Air gap constructions  Design – Min. via/plated hole spacing to flex transition(s) – Min. bend capability guidelines • Static & dynamic Transition Zone
  • 25. Manufacturing That Eliminates Risk & Improves Reliability 25 IPC 2223 Design Standard: Reliability Guidelines
  • 26. Manufacturing That Eliminates Risk & Improves Reliability 26 Summary  Design Reliability – Critical element of all projects. – Consequences of a failure in Class 3 products require every effort to ensure highest possible reliability.  Rigid-flex Technology Improves – Reliability: • Significant reduction in points of interconnect/failure locations. – Performance: • High Speed Signals & Shielded Designs. – Durability in harsh environments. – Shock & vibe performance through weight reduction.
  • 27. Manufacturing That Eliminates Risk & Improves Reliability 27 Summary  IPC 2223 Design guidelines – Must be followed to ensure finished part reliability.  Added Benefits – Smaller/tighter packaging requirements. – Cost-savings opportunities: • Reduced/simplified assembly requirements. • Overall packing size reduction. • Purchasing/inventory management costs.
  • 28. Manufacturing That Eliminates Risk & Improves Reliability 28 Our Products Battery Packs Flex & Rigid-Flex PCBs Cable Assemblies Printed Circuit Boards RF Products User Interfaces Flexible Heaters EC Fans & Motors
  • 29. Manufacturing That Eliminates Risk & Improves Reliability 29 Q&A  Questions? – Enter any questions you may have in the Control Panel – If we don’t have time to get to it, we will reply via email
  • 30. Manufacturing That Eliminates Risk & Improves Reliability 30 Thank You Check out our website at www.epectec.com. For more information email sales@epectec.com. Stay Connected with Epec Engineered Technologies Follow us on our social media sites for continuous technical updates and information: