Reliability is a significant consideration in all designs, but more so in specific industries. The costs of either initial failures during assembly or more critically latent in the field failures can be excessive in both the expense and consequences. A benefit of rigid-flex technology is the ability to improve the reliability of a design. This applies to both the electrical functionality, and more importantly, the mechanical performance of the finished parts.
Mechanically, reliability is improved in two areas: the elimination of many points of interconnect between multiple rigid sections and a reduction in the total weight for improved shock and vibe performance. Electrically, rigid-flex designs allow for both improved signal integrity, for high-speed controlled impedance requirements, and effective shielding for EMI and RF sensitive designs.
In this webinar we review the multiple aspects of rigid-flex technology that will improve the reliability of your designs.
For more information on our rigid-flex PCBs, visit http://www.epectec.com/flex/.
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Definition: Reliability
– Ability of an apparatus or system to consistently perform its required function
without degradation or failure.
Reliability engineering studies identified:
– “Majority of electronic failures occur at a point
of interconnect.”
Critical to many Class 3 applications
– Military
– Aerospace
– Life-supporting medical
– Automotive
Introduction
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Introduction
Cost Benefits
– Improved final assembly yields.
– Eliminates latent, in the field, failures, and associated product return and or
replacement.
– Opportunity to offset added rigid-flex solution costs.
– Securing repeat business.
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Mechanical Reliability: Points of Interconnect
Interconnects are potential sources of failure.
Rigid-flex is deemed to be an integrated construction.
Eliminates all points of interconnect between
independent rigid component areas.
No additional interconnects required between flex and
rigid layers.
All connections are plated vias/holes with same
reliability as rigid PCBs.
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Mechanical Reliability: Points of Interconnect
Example
– Standard “wired” solution:
• Up to 6 interconnect points for each circuit.
• PCB to connector solder joints (2).
• Header to receptacle connections (2).
• Wire to receptacle connections:
– Soldered or crimped (2).
Added Benefit
– Reduces potential assembly errors.
– Cannot be assembled incorrectly.
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Mechanical Reliability: Bend Capabilities
Thinner flex constructions allow for:
– Tighter bend capabilities due to:
• Thinner copper circuit layers.
• Thinner core & insulating layers.
– Min. bend radius capability guidelines:
• Function of finished flex thickness:
• Static Bend: 10-30 X
• Dynamic Bend: 80-100 X
– Less potential induced stress in the bend areas as
compared to bulkier wired solutions.
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Electrical Reliability: High Speed Signal Performance
Flex circuit materials and constructions inherently
well-suited to high speed signal applications.
– Highly uniform material thicknesses.
– Improved DK values over standard rigid materials.
– Uniform line width and spacings.
– Eliminates signal reflections due to connector systems.
• Added benefit:
– Eliminates high-cost controlled impedance connector
systems.
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Electrical Reliability: EMI / RF Shielding
Flex can easily and effectively be shielded to high levels against EMI & RF.
Multiple shielding methods available:
– Flex specific shielding films
• Preferred solution for shielding only requirements
• Highly flexible, slip properties
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Electrical Reliability: EMI / RF Shielding
– Addition copper shield layers
• Necessary for controlled impedance applications
– Silver ink shield layers
• Replaced by shielding films
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Summary
Design Reliability
– Critical element of all projects.
– Consequences of a failure in Class 3 products require every effort to ensure highest
possible reliability.
Rigid-flex Technology Improves
– Reliability:
• Significant reduction in points of interconnect/failure locations.
– Performance:
• High Speed Signals & Shielded Designs.
– Durability in harsh environments.
– Shock & vibe performance through weight reduction.
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Summary
IPC 2223 Design guidelines
– Must be followed to ensure finished part reliability.
Added Benefits
– Smaller/tighter packaging requirements.
– Cost-savings opportunities:
• Reduced/simplified assembly requirements.
• Overall packing size reduction.
• Purchasing/inventory management costs.
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Q&A
Questions?
– Enter any questions you may have
in the Control Panel
– If we don’t have time to get to it, we
will reply via email
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Thank You
Check out our website at www.epectec.com.
For more information email sales@epectec.com.
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