9000 wedge-bonder overview

David Rasmussen
General Manager
Palomar Technologies, Inc.
Sept 2, 2015
9000 Wedge Bonder
Automated High-Speed Fine Wire Wedge & Ribbon Bonder

WIRE SIZES (Au & Al)
• Au 17.5μm to 75μm (0.7mil to 3mil)
• Al 17.5μm to 75μm (0.7mil to 3mil)
RIBBON SIZES (Au)
• 12.7μm x 50.8μm up to 25.4 x 254μm
(0.5mil x 2mil up to 1mil x 10mil)
WIRE FEED ANGLE
• 45 to 60 degree (Standard 45/60 clamp)
• 90 degree (Optional clamp)
www.palomartechnologies.com 2© Palomar Technologies, Inc.
9000 Wedge Bonder At a Glance

CYCLIC RATE
• Up to 6 wires per second
• Up to 10 loops per second
LOOPING
• 70μm to 20mm lengths
• Standard forward and reverse
• Constant wire length
• Jumpers
• Chain wires (bond – loop – bond – loop – bond)
• Orthogonal bonding (B1 and B2 with separate bond foot angles)

2mil Al Wire Length: 55-200 mils / Wire Pitch: 6.3 mils / 188 wires
LM2 LM3 Constant Wire Length

2mil Al Wire Length: 60-75 mils / Wire Pitch: 7.25-15.3mils / Length 60-75mil
Fan Out Fan Out + Orthogonal Bond 1

(To Fit on fine pitch die pads)

2mil Al Wire RFSOE Pattern Wires and Chains
Chain

2mil Al Wire Length: 50 mils Wire Pitch: 8 mils Loop Height 8 mil

1x10mil Au on Au

PRECISION
• 1μm, 3σ, repeatability1
• High-precision touchdown without time delay*
*Programmable search speed and touch sense threshold values similar to the
8000 Wire Bonder. The system will search from the search tolerance above the
part at the programmed search speed until the tool touches the surface
according to the programmed threshold. There is no delay between sensing
touch and continuing the rest of the bond and wire sequence.
• Precise control of bond force (voice coil)
HIGH THROUGHPUT
• Continuous bond technology (CBT)
• 2+ smaller bond stations for
efficient handling of smaller
products or substrates, eliminating
indexing time and maximizing
throughput
1 Vision Test

9000 Wedge Bonder
At a Glance
i2GI (Intelligent Interactive Graphical Interface)
• Interactive wedge bond control via Program Tree
Display (PTD)
• Video Graphic Display (VGD), Man-Machine
Interface (MMI) and Part Graphic Display (PGD)
• Cognex 8500 Series Vision Processing engine for
real-time video
• Loop process view camera on Ѳ rotary enabling side
view of wire at all times (390-degree max Ѳ rotation)
(view wire formation)
• Set-up wizards for simplified calibration, setup, and
programming
• Microsoft® Windows 7® software platform

9000 Wedge Bonder
At a Glance
QUALITY CONTROL
• Real-time bond monitoring and process
control software
• Robust, low maintenance voice coil bond
head
BOND DATA MINER™ - comprehensive
and centralized data management
and analysis system
• Aggregates run data and timestamp data
sets
• Process tool analysis
• Machine and process trends monitoring
for increased yields and predictive
maintenance

View Cameras
VISION TARGETING
• Programing and Rework Target
• Runtime referencing
• Operator wire inspection
PROCESS VIEW
• Operator Real-time bond
viewing of wires
• Quick check for wire in tool
without a microscope
• Operator rethread guide

25+ Years of Legacy Wedge Bond
Technology
90002470-V2470-III2470-II2470-I 3470-I 3470-II

Unique, Versatility and Flexibility
9000
Wedge
Bonder
Large Work
Area
Factory
Automation
Advanced
User
Control
(i2GI )
Bond Data
Miner
High-Speed
Wire Feed
Clamp
Versatility
High-
Precision

Large Work Area with
Unobstructed Accessibility

9000 Wedge Bonder
At a Glance
LARGE BONDING AREA
• 305 x 150 mm (12” x 6”)
AUTOMATED ASSEMBLY
• Material handler options
available for full production
line assembly
• Unheated and heated work
stages available

Large Bonding Area = More Flexibility
305mm x 150 mm (12” x 6”): X-Y bond area minimizes index time and
improves throughput time
Large area ideal for:
• Large parts
• Multiple parts
• Wafers
• Low wire counts
12”
6”

Three Work Area Access Points
1: Front Access Door
• Designed as dominant entry
• Load and unload parts
(manual process)
• Wire threading
(possible with use of process
camera)
• Tooling change

2: Hood
Unobstructed access to entire
work envelope
• Microscope
• Tooling change
• System maintenance
• Wire threading
(also possible with use
of process camera
or microscope)

3: Bottom Door
• Access to tools and
bonding stage(s)
• More rarely used, but
available for flexibility
in accessibility of
entire large work area

Ergonomics
• The keyboard and
monitor move a unit
together in Z
• The keyboard height is
adjusted from 32.3” to
47.2” from the floor
• Microscope glides easily
for viewing

Wire Sizes, Materials,
Types & Clamp Feed Angles

Wire Specifications
• Materials: Au & Al
• Wire Type Sizes
– Wire: 17.5µm – 75µm (0.7mil – 3mil)
• Ribbon: 12.7μm x 50.8μm up to 25.4μm x 254μm
(0.5mil x 2mil up to 1mil x 10mil)
• Feed Angles
– 45 °to 60°
– 90°deep access

Bond Head
At a Glance
The de-spooler rides on theta
so that wire and ribbon will not
get twisted during bonding.
This is unique to Palomar
Technologies.

Bond Head
At a Glance
• Bond force is applied
using a robust, low
maintenance voice coil
bond head
Force range:
3 gram to 200 gram
• Maximum Ѳ rotation
range: 390 degree
Axis Resolution
• XYZ are all 0.1um
• Theta 0.01125 degree

Process View Camera
• Used for many different functions since it rides on theta which
is carried by Z-coarse
• View the bond tool at all theta angles
• Simply check the wire and tail position under the tool without
the need for a microscope
• Although, we do have a microscope, it is much more efficient
and faster to just look in the process view camera
• Other functions
– Watching loop formation during bonding
– Viewing wires from an angle to see wire profile, and
inspecting wires at backside orientations that a microscope
cannot see

Process View Camera
• Example of the lookdown
targeting camera on the left and
the process view camera on the
right
• These two images are
available at the same time
and allow the operator to
inspect the bonds from the top
down using the targeting
camera and to also see if the
wire is in the tool using the
process view camera
• Note: The process view camera
can also be used to thread the
tool. The image shows the wire
just after rethreading

Changing Clamp Angles
No need for an expensive bond head change! Simply
change the clamp.
• Loosen screw for angle adjust and adjust
for position of clamp relative to tool
• The rest of the bond head remains the
same

Wire Clamp Clearance - 60°
* inches
*750mil tool

* inches
*750mil tool

Close-up Tool View
Left of Tool – 45-Deg Feed Left of Tool – 60-Deg Feed

The 9000 0.472” clearance near
the 0.750” wedge tool and 0.446
to bottom of head..
A 1.078” tool will allow .780”
clearance.

Common Applications
• RF-SOE
• Disk Drives
• Large Complex Hybrids
• RF and Microwave Devices
• COB
• Compact Hybrids
• Fine Pitch Devices
• High Frequency Passive and
Active Components
• MCM Power Connections
• Fine Pitch Devices
• Running Stitch Interconnects (die-to-die)
• Ribbon Bonding
• Low Profile Wire Bonds
*partial list

Ribbon Bonding
1x10mil Au on Au

Loop Bonding
3mil Au on Au
1mil Au on Au

Chain Bonding

The World’s FIRST
Interactive Wedge Bonder
i2GI (Intelligent Interactive Graphical Interface)
Touch-Screen Computer Screen
Process Camera
Programming Specifications

9000 Tool Kit
• Windows 7®
• Intuitive Touch-Screen
Graphical User Interface
• Bond Data Miner™
• Repair and Maintenance
Statistics (RAMS)
• Process Control Software
• Cognex® On-Screen
Video for real-time viewing
• PC Back-Up & Recovery
• Auto Bond-Set Layout for
bond pad programming
efficiency
• CAD Interface
• Adaptive Bond
Deformation
• Auto Focus for material
variances and bond height
compensation = high
quality & high throughput

i2GI Enables Intuitive & Interactive
Wedge Bond Control
• Program Tree Display
– Hierarchal tree controls
– Intuitive wizards simplify calibration, set-up, and
programming
– Parent-child relationship of the build program and materials
• Natural navigation flow and intuition
• Interactive live graphical display
• Man-Machine Interface for familiar jog and program capabilities
for 8000 Wire Bonder users
**Operator experiences real-time bonding and quality
validation

Part Tree Display
(PTD)
• Familiar hierarchal tree infrastructure
displaying parent-child part
relationships
• “Who caries who” – clear
understanding of which
materials/wires/bond pads are
dependent upon others
• Intuitive wizard to simplify calibration,
set-up and programming
• New element are graphically
displayed in real-time on the Part
Graphic Display

Part Graphical Display
(PGD)
• “You are here” aspect of
the program and build
design
• True, graphical
representation of build
• Excellent reference
for a manufacturing
document
Ex: export number
or wires in seconds
rather than manual
counting from tree
structure
• Interactive approach to
ease the reference points
between program tree
structure and MMI
Can toggle between
PGD to
corresponding wire
in tree structure
“Lock” view to zoom
in/out
Highlight
parent-child
related parts

• Video Graphical Display (VGD) is an overlay on
the Man-Machine Interface (MMI) view from the
Cognex Vision System
• Graphical representation of the build based
upon the Part Tree Display
• Images/elements are to-scale within this
view
• Program creation support and accuracy check
– Program set-up assistance
– Ability to lay graphics on top of live video to
double check, for example, on correct bond
pad
– “Step Mode” step through program check
• Master reference between PTD and PGD
• Familiar jogging capabilities for 8000 Wire Bonder
users
Video Graphical Display
(VGD)

Touch Screen
• i2GI supports both traditional track-
ball control and a bright, large touch
screen
• Glove-touch compatible
• Crisp, clear high fidelity graphics in
multiple dynamic panes in a single
view
• Vertical orientation
– Enhances user control
– Minimizes need for archaic hardware,
such as joysticks
– Efficient, clean and reduced machine
footprint
– 22 to 24” diagonal monitor

Program Compatibility
• 8000 programs can be transferred to the 9000 operating platform
– The parts with references and bond sets are direct mapping matches
– The user then creates wedge wire sets with proper bond and loop
parameters
• For example, a program may have many components in a package that share
die that have both ball bond and wedge bond wires on the same die
– This would mean that you could generate a program structure with all of
the parts
– This program could then be used as a starting point for the 8000 and 9000
– On each machine, the process engineer would then add bonds sets and
wire sets specific to the machine—there would be no reason to then share
the programs across machines any longer
Process Development Consulting offers in-house process advancements and
decades of expertise in machine, process and materials for seamless program
transfers

Bond Data Miner
TM
“Smart” Bonder
• Monitors machine and process
trends providing yields and
predictive maintenance
• Links together system and
bonding parameters
• Proven improvement of yield,
process development time, and
repair time
• Familiarity for 8000 Wire Bond
users
• Three levels of capability
through BDM software system
Level 1: Data collection, archiving
& analysis
– Traceable data
Level 2: Process monitoring
– Set upper & lower control
limits
Level 3: Closed-loop automatic
process control
– “Smart” system

BDM = The Ultimate Analytical Tool
• BDM collects electrical and robotic data from extensive array
of sensors
– Analyzes, time-stamps and archives data
– Provides clear picture of process, machine performance
and stability
– Allows traceability of bond parameters and system state
for individual bonds
– Data can be viewed across multiple systems and
platforms, including third-party equipment
• Powerful tool to improve yield and utilization

BDM = Unparalled Process Control
RAM Statistics
Wedge-Off Monitoring
Bond Deformation Monitoring
(process control)
Adaptive Bond Deformation
Bond Data Miner (BDM)
Data Acquisition & Analysis Tool
Third-Party
Equipment BDM
Level 1
Level 3
Level 2
Calibration & Validation Data
Factory BDM
Trending

Repair and Maintenance Statistics (RAMS)
• Tracks uptime statistics per SEMI E10-0701 & E58-0301
• Tracks accumulated bond statistics

Process Control Software
• Collects real-time
Bond 1 / Bond 2
deformation data
• User can set upper &
lower deformation
control limits
– Bonder stops
bonding if limits
exceeded
– Prevents yield loss

Production Line Automation
& Handler Options
Full Production Lines
Inline and Small Islands of Automation
Solutions for Phased Approach to Production Ramping

SMEMA Compatible
• SMEMA compatible inline factory integration
(production line automation solution)
• Compact design promotes efficient clean
room layout in stand-alone installation or
integrated into a full line
• Innovative handling systems eliminate
indexing to create non-stop bonding
(zero-wait state)

Handler Options for Factory Automation
Inline Configuration
• 1 = preheat, 2 = bond site, 3 = cooling (output buffer)
• Design to handle Auer boat (12” x [2.95, 3.1, 4.3, 5.4”])
or substrates with similar size
1 2 3

Handler Workcells
Stand-Alone Magazine Handler (mag-to-mag)
• Multi-magazine capacity
• Ability of removable for in-line integration
1 2 3
SMEMA SMEMA

Handler Workcells
Attached Magazine Handlers (mag-to-mag)
• Single magazine capacity
• Attached to Orion for single system leveling
1 2 3
SMEMA SMEMA

Handler Workcells
Auto Continuous
• Designed to handle substrates (square & rect.)
1 2

Islands of Automation
9000 Wedge Bonder Magazine HandlerMagazine Handler

In-Line Assembly for
Automated Production Lines

Summary
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63
© Palomar Technologies, Inc.
• Modern wedge bond requirements demand an
automated, large bonding area system with
scalability to increase production capacity without
limiting performance
• Programmers and operators should experience
real-time build and production feedback to
increase efficiency and decrease costs
• Lab managers should have peace of mind that
their bonder is fully supported by a highly trained
team of field service and process development
consultants
• Precision, reliability and consistency should be
inherent to the system’s capabilities

Wedge Bond Basics
Technology Overview

Anatomy of a Wedge Bond Sequence
www.palomartechnologies.com© 2011 Palomar Technologies, Inc.

Anatomy of a Wedge Bond
www.palomartechnologies.com© 2011 Palomar Technologies, Inc.

i2Gi & MMI & Process camera &
Microscope
Technology Overview 1

Process Inspection
www.palomartechnologies.com 69© 2011 Palomar Technologies, Inc.
Combination Camera Views
• Minimize Microscope use
• Minimize cover opening
• Maximize operator efficiency
Inspection
• Targeting camera checks
– Wire / bonds on package
• Process View Camera
– Wire in tool & under foot
– Wire loop formation real time
Targeting View Process View

Bond Deformation (Capture,
Monitor/Control, Adaptive Control)

Bond Deformation
Deformation & Height Tracking per bond
• Time stamped for every bond
• Accessible with bond data miner
• Process inputs / Machine Cal Tracked
Monitor using Process Control per Bond (Missing Wire Detect)
• Deformation Limit UCL & LCL
• Bond Height Limit UCL & LCL
Deformation Control (Adaptive Bond Deformation)
• Deformation Target UCL & LCL
• Bond Time Target UCL & LCL

Bond Deformation
Process Setup
• Start with baseline bond parameters for wires
• Capture deformation data (Max, Min, Avg)
• Set Process Control Limits (Missing Wire Detect)
• Validate missing detection
Optional Deformation Control (Adaptive Bond Deformation)
• Deformation Target UCL & LCL
• Bond Time Target UCL & LCL

Bond Deformation
(BDEFn)

1mil Au Wire
BOND 1 Deformation
Process Limit UCL
Process Limit LCL
ABD Limit UCL
ABD Limit LCL
Machine prompts
operator if outside
Process Limits
Adaptive Bond
Deformation (ABD)
tries to control
deformation to
within ABD Limits

1mil Au Wire
BOND 2 Deformation
Process Limit UCL
Process Limit LCL
ABD Limit UCL
ABD Limit LCL
Machine prompts
operator if outside
Process Limits
Adaptive Bond
Deformation (ABD)
tries to control
deformation to
within ABD Limits

2mil Al Wire
Process Control Setup Images
Bond 1 and Bond 2

2mil Al Wire
c c
Process Limit UCL
Process Limit LCL
Double Bond or other Errors
Missing Wires
Over bonding
above UCL can
occur if bonding
over another wire.
Under bonding
below LCL
generally
indicates a
missing wire.

Wire Clamp Configurations and
Clearances
Cost Effectiveness
Ease of change over

Clamp 45/60
• Clamp adjustable between 45 and 60 degree
• Clamp supports 0.7mil round to 1x10 ribbon

Loop Modes – LM0, LM1, LM2, LM3, LM4
Tail Modes – TM0, TM1, TM2 (Tuck)
Loop formation views per wire (Examples
images of loop motions)
Orthogonal bonding

Loop Modes
• LM0 – Simplified up-over-down
• LM1 – Formed loop with clamp open
• LM2 – Formed loop with clamp close
• LM3 – Constant wire length
• LM4 – Low jumps (Very fast)

Loop Mode 2 and 3
2mil Al Wire Length: 55-200 mils / Wire Pitch: 6.3 mils / 188 wires
LM2 LM3 Constant Wire Length
Loop Height 17 to 40 mil Loop Height 10-26 mils

Fan Out Bonding

Fan Out & Orthogonal Bonding
(To Fit on fine pitch die pads)

2mil Al Wire RFSOE Pattern Wires and Chains
Chain

2mil Al Wire Length: 50 mils Wire Pitch: 8 mils Loop Height 8 mil

1x10mil Au on Au

2mil Al Wire 45 Degree
4.2.1
LM1
Parallel Wires Forward Bonding
Ordinal Directions
12 wires per side
Wire Pitch: 7.25 mils
Wire Length: 60 mils
Direction: Forward
Typical layout for small
packages.

4.2.2
LM1
Parallel Wires Reverse Bonding
Ordinal Directions
12 wires per side
Wire Length: 60 mils
Direction: Reverse
Reverse bonding is used
where the package edge is too
close to allow normal tear-off
motions.

4.2.3
LM1
Fanned Wires, All Angles
Wire Length: 60 - 75 mils
Wire Pitch: 7.25 mils/ 15.3 mils
12 wires per side
Bonding Direction: Forward

4.2.4
LM1O
Short Fanned Orthogonal B1
Fanned Wires, All Angles,
Orthogonal B1
Wire Length: 60 - 75 mils
Wire Pitch: 7.25 mils/15.3 mils
12 wires per side
Bonding Direction: Forward

4.2.9
LM2
LM3
Chain
RFSOE Vertical
Demonstrates chain wires,
loop control, and bond
placement critical in high
frequency applications.

4.2.16 Varying Wire Span LM1 keeps loop height consistent
Wire Length: 55-200 mils
188 wires

4.2.15 Varying Wire Span LM2 keeps loop height consistent
188 wires

4.2.14 LM3 Constant Wire Length causes varying Wire Span to vary height
188 wires
Loop height from 10-26 mils

4.2.17 LM4 Row Wires are fast and low loop for jumpers
Link Length: 50 mils
Wire Pitch: 8 mils
648 wires per row

4.2.18 LM4 Chain Wires
Link Length: 50mils
Wire Pitch: 8mils
27 wires per chain

Segment 12 – Shrinking Spiral LM2
40 wires per side
Direction: Forward

Segment 13 – Shrinking Spiral LM3 Constant length
40 wires per side
Direction: Forward

Height Learning and Adaptation
Optical Autofocus
Real-time Touching
Adaptive Search Tolerance

Height learning and running
• Height learning – Competitors have to touch onto
the die surfaces to measure the expected heights
during programming or editing. (Customers do not
like this)
• Palomar learns height automatically when
focused
• Runtime automatic touching and search tolerance
optimization
• Autofocus and part height update adjust expected
height based on a autofocus

9000 wedge-bonder overview

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