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Intel 2014 Overview
Mariusz Jadwiszczok & Patrik Staaf
EMEA Sales and Marketing Group
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Intel’s Mission
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Utilize the power of Moore’s Law to
bring smart, connected devices to
every person on earth.

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Intel’s Vision
If it is smart and connected, it is best with Intel.
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Data Center Client Ultra-Mobile Wearables/IoT

4.
ASMO
EMEA
PRC
APJ
>75% of Business is outside the U.S.*
*Business defined as end market consumption based on units sold
Geographies
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Hi-K Metal Gate
Strained Silicon
3D Transistors
65 nm 45 nm 32 nm 22 nm 14 nm 10 nm 7 nm90 nm
Enabling new devices with higher
functionality and complexity while
controlling power, cost, and size
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Predictable Silicon Track Record
Executing to
Moore’s Law

6.
Leading Edge Process Technology
* Forecast
Transistor Performance/ Generation
32nm45nm
1x
0.1x
0.01x
0.001x
65nm 22nm
LowerTransistorLeakage
Higher Transistor Performance (Switching Speed)
14nm*
Mobile Always-on Circuits
Client Computing
Mobile Computing
Server Computing
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7.
Network
Storage
Software
Servers
Enterprise IT Cloud Service
Providers
Communication
Service Providers
Technical
Computing
Data Center Group
Defining and leading an open data center,
cloud computing, and connected systems
infrastructure that will connect and enrich
the lives of every person on earth through
seamless and pervasive computing.
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8.
PC Client Group
Win the Hearts of Users by Creating and Bringing to Market
the Next Generation of Personal Computing Experiences
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9.
Powering the next generation of tablets, smartphones, feature
phones and communication solutions
Mobile and Communications Group
* Other names and brands may be claimed as the property of others.
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10.
New Devices Group
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Deliver groundbreaking new device technologies and platforms that inspire
and create the best human interaction to our virtual and physical worlds
Smart Devices Platforms for Creators

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Internet of Things Group
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Lead the industry in transforming businesses and the way we live by making
it simple to create exciting, new IoT solutions
GATEWAY
NETWORK
INFRASTRUCTURE
DATA CENTER/ CLOUD
THINGS
7
YEARS
SILICON, SOFTWARE AND SECURITY
SCALABILITY
Devices that connect to the Internet
integrating greater compute capabilities
using data analytics to extract information
THE INTERNET OF
THINGS:

12.
Cloud API Services
Client Software Platforms
Intel Software & Services Group
SSG enhances computing and connectivity for Intel Architecture across the
software ecosystem and through our software products and services.
Network
Infrastructure
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Cloud and Data Center Products
Intel Developer Zone
* Other names and brands may be claimed as the property of others.

13.
Deliver breakthrough
innovations to fuel
Intel’s growth and
technology leadership
INTEL LABS
COLLABORATE FOR RESULTS
UNIVERSITIES GOVERNMENTS INDUSTRY
KEY RESEARCH FOCUS AREAS
USER
EXPERIENCE
ARCHITECTURE
AND DESIGN
SYSTEMS AND
SOFTWARE
SECURITY AND
PRIVACY
INTEGRATED
COMPUTING
STRATEGY,
PLANNING and
COLLABORATION
INTEL LABS EUROPE
Sustainable
Intelligent Systems
INTEL LABS CHINA
China Tech
Ecosystem
ADDITIONAL ORGANIZATIONS
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14.
Making and managing financially attractive investments
in support of Intel’s strategic objectives
STRATEGIC FINANCIAL
Intel Capital
1,339 Companies • US $11B+ Invested
55 Countries • 344 M&A Transactions • 206 IPOs
1414
Capital

15.
Intel® Education
Empowering Youth. Transforming Communities.
150M Students Learning with Technology
10M Teachers Empowered with Professional Development
7M Students in Affiliated Science Competitions
4M Employee Volunteer Hours for Education
$100M Annual Investment
to Improve Education in
100 Countries
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Embedded:
Internet of Things,
Industrial & F.A.,
Retail, Energy, Transport
and more…

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Configurable TDP / Low Power Mode (cTDP/LPM)
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- Starting from Haswell (Broadwell & Skylake also enabled)
- Not for battery saving – it’s about thermals
- Also affects Turbo modes
- LPM does processor off-lining or enables minimum
frequency (depends on workload)

27.
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Broadwell
all 14-nm technology

28.
Wearables, start with Edison
Intel
Expansion Boards
Partner
Expansion Boards
Built to Order
Expansion Boards
https://www.sparkfun.com/categories/272

29.
Intel Quark (Galileo)
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- Processor UnCore
- DDR3 memory controller
- Up to 2GB @ 800MTs
- ECC-On-Chip Option
- Embedded 512KB SRAM
- Legacy Block
- PC compatible IO, APICs,RTC, etc.
- 20MHz Legacy SPI for boot code
- Low cost 5-pin JTAG Port
- Industry Standard I/O Hardware
- 2 - x1 PCIe Gen 2*
- 2 - 10/100Mb Ethernet MACs
- 2 - USB2 host ports (EHCI, OHCI)
- 2 - HS UART controller
- 2 – 25MHz SPI ports for peripherals
- 1 – USB2 HS Device port
- 1 - SD/SDIO/eMMC interface
- 1 – I2C/GPIO Host controller
- 16 - GPIOs w prog interrupts
- Industry Standard Software Support
- Standard Compiler Support
- Pentium ISA Compatibility (.586)
- Runs unmodified Linux Kernels (v3.8+)
- Yocto based distribution
- Validated w WR IDP 2.0 (Linux & VxWorks)
- Open Source UEFI EDK II
- GRUB boot loader support
- Open OCD Debugging support
- Compliant with PCIe, USB, ACPI standards
- Thermals
- TDP = 1.9W Extended temp (-40 to +85 C)
- TDP = 2.2W Commercial Temp: 0 – 70°C
- Programmable Thermal sensor
- Electricals:
- Single xtal for internal/external clocks
- Enabled Single std external VR solution
- Physical
- Package size 15x15mm
- 393 Pin, FC BGA bare die
- 0.593 Ball Pitch
- Enables FR4 SFF Board
- Security
- Secure Boot Technology Option
- Supervisory Mode Execution Protection
- Secure Recovery for UEFI FW
- Secure Remote Upgrade w/ WR IDP 2.0
- Intel® Quark™ Processor Core
- Single Quark CPU Core, Single Thread
- 32 bit, x86, @ 400MHz
- 16KB L1
- 1.25 DMIPs/MHz

30.
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mSATA
M.2
2.5” SATA
Phi co-proc
Network (10/25/40/100G)
Core
Atom
Wireless
WiFi / BT
3G / LTE
Quark and Edison
Xeon 1S, 2S, 4S, …
NVMe / SATA

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Back Up

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Production MI Gateways are
ready for the end customer!
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OEM gives image to
ODM to load onto GW’s.
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From Development to Production: MI Gateway
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WRS creates BSP
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Intel qualifies HW
design & BSP
1
ODM selects
design based on
MI spec
4*
OEM buys a
production DK
(from Intel or ODM) to
build image & get
distribution rights
5*
OEM gets IDP
release w/support of
target ODM HW &
builds image
ODM creates BSP
OR
4* Qualifications: SK100 is needed by ODM if they want to produce their own dev kit. DK50 is NOT production ready. Must use DK100, DK200 or qualified ODM dev kit.
5* Note: the “Binary” image includes OS, middleware & OEM-specific value-add app all in one single image.
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ODM purchases MI-
specific SoC (w/ rights to
distribute image)
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ODM builds MI GWs
and loads image on
them

42.
Competitive Analysis Key Results
Key Findings:
• Moon Island positioned well in all five categories
vs. competition
• Crowded industry with solutions ranging in
features and price
• Low end offerings <$100 with basic encryption
to pass through data
• High end offerings with router like functionality
>$1000
Key Moon Island Differentiators:
• Comprehensive security features
• IA stability & scalability
• Development environment with open platform
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*Other names and brands may be claimed as the property of others.

43.
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v2.0
(Shipping now)
v2.1
(2014)
Targeted 3.0+ Features
(2015+)
Ecosystem and
3rd Party Support
 Development Tools
 Data Storage
 Analytics
 Predictive Maintenance
 EMS-IBM
 Energy
Services
 Eurotech
 End Point Device
Manageability
 AT&T
Security
and
Manageability
 White Listing
 Read/Write Control
 Web interface
 OMA-DM, TR-069
 UEFI Secure Boot
Cloud-based manageability
 Pre-loaded and
Validated Wind River
EMS agent
EMS and McAfee (MEC)
 White List
 Read/Write Control
Enhanced Security
 Device Attestation
 Deep Packet Inspection
UX
 Getting Started Guides  Quick Start Guides  Include out-of-box usages with Dev Kits
Protocols
 MQTT, SSH, ZigBee, etc.  Same as v2.0  Expanded communication: CDMA + LTE
 Wireless Hart, 6LoWPan, EnOcean
HW / OS
 Wind River Linux 32bit
 Wind River IDP
 Intel® Quark SoC
 Intel® Atom™ Processor
 eMMC Support  Intel® Core Processor
 Virtualization (legacy app support)
 Wind River OS
 64bit Support (Atom, Core)
 VXworks RTOS
Intel® Gateways for IoT Roadmap
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice *Other names and brands may be claimed as the property of others.

44.
Connectivity
DevelopmentEnvironment
Intel BSP: Board and Modules (Intel® Quark™ SoC, Intel® Atom™ SoC)
Linux* 5.0.1
Ecosystem
Apps &
Services
SI/ITOs,
Customers
Manageability Security
Cloud
Connector
OMA DM
TR-069
Web Config
OpenSSL* Library
SRM Signing Tool
Certificate Management
Secure Boot
Application Integrity Monitor
Application Resource Control
Secure Package
Management
Encrypted Storage
McAfee* Embedded
Control
Intel Gateways Solutions for IoT Software
Third Party
2G/3G/4G
Bluetooth*
Ethernet
Zigbee*† Stack
Serial / USB
VPN
WiFi Access Point
MQTT
Lua*
Java*
OSGi*
McAfee*
Embedded
Control
Runtime
Environment
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All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
*Other names and brands may be claimed as the property of others.
†Enabled by third party hardware,

45.
History of Intel
Back in 1968, two scientists, Robert Noyce and Gordon Moore, founded
Intel with a vision for semiconductor memory products.
By 1971, they had introduced the world’s first microprocessor. Since
then, Intel has established a heritage of innovation that continues to
expand the reach and promise of computing while advancing the ways
people work and live worldwide.
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Intel Corporation
The World’s Largest Semiconductor Manufacturer
• Leading Manufacturer of Computer, Networking & Communications Products
• Founded by Gordon Moore and Robert Noyce in 1968
• Headquartered in Santa Clara, California
• $52.7B in Annual Revenues - 25+ Consecutive Years of Positive Net Income
• 170 Sites in 66 Countries
• Over 107,000 Employees – 84,600 technical roles, 10,200 Masters in Science,
5,400 PhDs, 4,000 MBAs
• Named one of the Top Ten Most Valuable Brands in the World by Interbrand
• Ranked #42 on Fortune’s World’s Most Admired Companies
• Largest Voluntary Purchaser of Green Power in the United States for 6 years in a row
• Invests $100 Million Each Year in Education Across More than 100 Countries
• 4 Million Hours of Volunteer Service toward improving education over the past decade
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Intel’s Advantage
Packaging
Software
Intel Architecture Product Design
Manufacturing
Co-Optimized Process & Product
Co-Optimized Architecture & Software
Best Performance, Power, Security
Rapid Product Ramp
Process Technology
Common
TOOLS
Common
GOALS
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48.
Fab and Assembly / Test Sites
IrelandOregon
Arizona
New Mexico
Massachusetts
Costa Rica
Chengdu
Vietnam
Penang
Kulim
Dalian
Israel
Wafer Fabs
Assembly/Test
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49.
Intel® Processors
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QUARKQUARK

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World’s First Conflict-Free Microprocessors1
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TANTALUMTUNGSTEN
TIN GOLD
1 Intel has manufactured the world’s first commercially available “conflict-free” processors. “Conflict-free” means “DRC conflict-free”, which is defined by the Securities and Exchange Commission rules to mean
products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.
What are Conflict Minerals?
Conflict Minerals are metals that come
from the Democratic Republic of Congo
(DRC), a place where violent militias and
rebel groups control trade, exploit workers,
and finance violence.
What has Intel done?
Intel, along with partners, created an
audit and verification system that
supports responsible sourcing of
minerals from the DRC and the
pursuit of conflict-free supply chains.

51.
Innovation for the Planet
Energy Efficient Computing
Next billion PCs and servers will consume HALF the
energy and deliver 17X the compute capacity
(2007-2014) Source: Intel
Eco Technology Innovation
Technology innovation is fundamental to finding
solutions to the world’s environmental challenges
Pursuing a Gentler Footprint
Largest voluntary purchaser of “green” power in the U.S.
for 6 years in a row*
*According to EPA Green Power Program ratings
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SSDs – from datacenter to consumer, all FFs

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AMT implementation
CPT
LAN
CPU/iGFX
IMC
DDR3
PEG
LAN
SMBusPCIe
SPI FLASH
NVM
SPISus
Well
DDR3
Sideband
Signals
Embedded
Keyboard
Controller
(EC)
Embedded
Keyboard
Controller
(EC)
LAN
Intel®
ME
ME+
ME
System
SPISPI
LAN
DISPLAY
SRAM
- Intel® Ethernet controller
- Intel® Chipset
- Embedded controller or SIO
- Additional Power Wells
(for OOB ops, V3.3M and V1.1M)
- Enough SPI Flash to store Intel®
Management Engine Firmware

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Web UI

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VNC (graph KVM)

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VNC (text and BIOS)

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Serial console
(text, commands)