Ldb Convergenze Parallele_07

Application of Thin Films in
Contemporary Industry
Henrik Obst
VON ARDENNE
Dresden, Germany

15.10.2013
provides
industrial vacuum coaters &
approved layer stacks e.g. for
• Architecture Glazing
• Photovoltaic
• Solar Absorbers and
Reflectors on Metal Strip
• Web Coating

15.10.2013 Seminar University of Salento4
Application of Thin Films in Contemporary Industry
Outline
• Introduction
• Methods of Deposition
• EB-evaporation
• Sputtering
• Applications & Equipment for Production
• Architectural Glass Coating
• (Thin Film) Photovoltaic
• Sputter Roll Coater for Polymer Films
• Metal Strip Coater
• Developments for OELD Applications
• Summary

Introduction
Examples of Thin Film Application
15.10.2013 Seminar University of Salento
Solar Park near Leipzig
40 MWp CdTe Solar Farm
(former Russian Military Airport)World Jewellery Center Milano
www.juwi.de
5

Introduction
Examples of Thin Film Application

Introduction
What means “THIN”
• 0.01 .. 10 nm semiconductor, barrier,
passivation, EUV-optics
• 20 nm transparent metallic layers
• 10 .. > 100 nm optical (refractive) layers
e.g. thickness for interference with λ/4 in SiO2:
550 nm /4 /1,5 = 91,6 nm
• 200 µm thermal barrier
coatings (TBC) YSZ

Methods of Deposition
Plating
Spin Coating
Pyrolytic Coating
and many others …
Chemical Vapor Deposition (CVD)
Atomic Layer Deposition (ALD)
Physical Vapor Deposition (PVD)
• Evaporation (e.g. by electron beam)
• Sputtering
• Molecular Beam Epitaxy (MBE)
• Cathodic Arc Deposition

Methods of Deposition
PVD-Process Conditions: Vacuum
• Mean free path of particles
l ∼ 1/p
air, room temperature, p = 10-2 mbar l = 10 mm
p = 10-3 mbar l = 100 mm
• Scattered particles due to collisions
• Processes with inherent ion-bombardment, e.g. Ar+
• Parasitic incorporation vs. reactive processes
• Common pressure for evaporation < 1*10-4 mbar
• Common pressure for sputtering 5*10-3 mbar

Methods of Deposition: Electron Beam Technology
EB-Gun
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EB Generation and EB Guidance
Seminar University of Salento

Methods of Deposition: EB-Technology
EB-Gun
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EH150V EH300V EH800V
- Max. Process Chamber Pressure 5 Pa
- Beam Power 30 ... 800 kW
- Acceleration Voltage 30 ... 60 kV
- Cathode System Quick and Easy Exchange
- Space Charge Limited Mode
Option: Temperature Limited Mode
- Power control
patented
Variocathode

Methods of Deposition: Sputtering
Basic Mechanisms of a DC Plasma Discharg

Vacuum + Argon inlet + electrical
discharge generate the plasma,
i. e. negative electrons and
Argon ions.
High-energetic Argon ions hit the
target surface provoking
energy cascades.
A layer is built up on the substrate
by sputtering the target material.
Substrate
Target
hv
e-

Basic Principles of Magnetron Sputtering
• Magnetron-Principle:
Closed magnetic tunnel in front of the sputter target (cathode)
-500 V

Planar Magnetron Technology
16.10.201315
Plasma Target
Utilization max 45%

Re-deposition zones
and oxide deposition:
clamping ledges
powder formation
flaking
film quality disturbed
Reactive Sputtering of
SiO2
Planar Target with Re-Depositions

Dual Rotatable Magnetron RDM 3800
Target Utilization 85%
ZnO-Al Ceramic Target
17 15.10.2013

Why rotatable targets?
• Much higher target utilization (factor 2)
• No re-deposition zones at the target surface
• 1.5 to 2 times higher dynamic deposition rates
• Better uniformity < ± 1.5%
• Less arcing, less flaking
• Enhanced magnetic field strength, tunable magnetbars
• Total: lower cost of ownership, CoO

Coating Technology- RDM Process in DC Mode
DC, DC-DC or DC-Pulse
conductive Targets (ρ ≤ 1 Ωcm),
long-term stable TCO processes (e.g. ITO or ZnO:Al2O3)
Anode AnodeDC DC
Seminar University of Salento19 15.10.2013

Coating Technology – RDM Process in AC Mode
AC/MF
+ +- -
AC/MF
++ --
Electron drift
Film condensation with densification by ion impact
Moving substrate

Working Ranges for High Rate Reactive Sputtering
21
P = constant!
metallic mode
reactive mode
transition mode
stabilization
by fast control of
reactive gas flow,
only

Film
Material
Target
Material
Type of sputter
process
Max. Dyn. Dep. Rate [nm*m/min]
Rotatable Planar
SiOx Si/Si:Al AC reactive 120 (RDM) 73 (SDM)
Nb2O5 NbxO AC ceramic 80 (RDM) 39 (SDM)
SiO2 Si/Si:Al AC reactive 80 (RDM) 39 (SDM)
ITO ITO DC/DC ceramic 180 (RSM/RSM) 67 (SSM/SSM)
Mo Mo DC/DC metallic 200 (RSM/RSM) 130 (WSM)
ZnO:Al
Zn:Al/
AZO
DC reactive 120 (RSM) N/A
Typical Maximal Dynamic Deposition Rates
Rotatable
RDM – Rotatable Dual Magnetron
RSM – Rotatable Single Magnetron
Planar
SDM – Standard Dual Magnetron
SSM – Standard Single Magnetron
WSM – Wide Single Magnetron

Application: Architectural Glass Coating
2008 – New TV-Tower (CCTV) in Peking

Application: Architectural Glas Coating
GC330H
LowE- und Solar Control-Coatings
Substrate sizes up 3.3 x 6.0 m²
Cycle time 40 sec

Equipment: GC330H

Benefits of Architectural Low-E Glass Coating
65 % Transmittance
Outdoors Indoors
Reflectance 23 %
Absorption 12 %
U= 1.2 W/m2K
15 liter fuel oil
per m2 and year
U= 5.8 W/m2K
68 liter fuel oil
per m2 and year
Reflectance 8 %
Absorption 4 %
Energy
savings
heating and cooling costs saving
environmental protection
Fuel
consumption 100% 21%
88 % Transmittance

Improved Silver Layer: Lower Resistance =
Higher NIR Reflectance
Bottom Layer: TiO2
Increased transmittance and neutral color
Split Top Layer: SnO2/Si3N4
Improved mechanical and chemical robustness of
layer stack
Si3N4
SnO2
NiCrOx
Ag
ZnO
TiO2(TxO)
Glass
Application: Architectural Glass Coating
Heat protection coating with U = 1.1 W/m2K (Single Low-E)

Application: Thin Film PV
Solar Cell Structures
Cd Te > 3 µm
ITO or SnO2:F
CdS0.3 µm
Glass pane 4 mm
CIGS > 2 µm
Cu In (Ga) Se, S
Mo 0.5 µm
i-ZnO and ZnO:Al 1µm
Glass pane 4 mm
Thin Film
a-Si:H CdTe CIGS
Metal 0.5 µm
η = 7% η = 10% η = 13%
ZnO:Al or SnO2:F
Metal Reflector 0.3 µm
ZnO:Al
p a-Si : H
i a-Si : H
n a-Si : H
CdS 50 nm
Glass pane 4 mm

Applications for Web Coating
• Invisible ITO-films for touch panels or EMI shielding
• Window films i.e. Low-E, electrochromic, IR blocker
• Antireflection, dry AR coatings
• Flexible PV, contact and absorber layers
• Enhanced mirrors, optical filters
• Barrier and adhesion layers

FOSA1600 Web Coating System
• Modular design of multi-chamber platform for R2R vacuum coatings
• Deposition of high-quality layers using advanced sputtering technology
• Flexible substrates, polymer films with multiple coil handling
• Industrial mass production

Systems and Features
FOSA1600 D8 Dual Drum Web Coater

Modularity of
Multi-Chamber System
System
• 1x unwinding, 1x rewinding, 1 to 3x process chambers
• 1 drum per process chamber
• Concept allows up to 24 magnetrons
FOSA1600S4FOSA1600D8FOSA1600T12

Pre-Treatment Setup Compartment Mode Type
Plasma Treatment for
all Substrates
DC
LION
Plasma and
Ion Impact
AC Glow Discharge AC
Electron
Impact
Free Span Heaters
Heat and
Desorption
Infra Red
IR
Cryo – Traps
Effective H2O
Pumping within the
Sputter Compartment
Trapping
@ T < -125°C
Pumping
of Water
Vapor
Techniques for Applied Web Coatings
Processes for Pre-treatment of Polymer Films
Substrate
≈AC
Substrat
Drum @ 80°C
15.10.201333

Film Materials Setup Compartment Mode Type
Ag, Al, Cu, Ti, Metals
NiV, NiCr, Alloys
ITO, NbOx, Ceramics
DC
(pulsed)
WSM
planar
NiV, NiCr, Alloys
ITO, NbOx, Ceramics
DC
(pulsed)
RSM
rotatable
NiV, NiCr, Alloys
ITO, AZO, Ceramics
DC/DC
separated
(pulsed)
RSM/RSM
rotatable
ITO, AZO, TCO’s
TiOx, NbOx, Ceramics
DC/DC
DAS (pulsed)
RSM/RSM
rotatable
DC Magnetron Sputtering
Substrat
Substrat
Substrat
Substrat
15.10.201334

Film Materials Setup Compartment Mode Type
Al-reactive Oxides
Si-reactive Oxides
TiO2, Nb2O5, Oxides
AC-MF
dense
Plasma
SDM
planar
Al-reactive Oxides
Si-reactive Oxides
TiO2, Nb2O5, Oxides
AC-MF
dense
Plasma
RDM
rotatable
Al-reactive Nitrides
Si-reactive Nitrides
mixed Oxide-Nitrides
AC-MF
dense
Plasma
RDM
rotatable
AC-MF Magnetron Sputtering
Substrat
Substrat
Substrat
15.10.201335

Metrology
In-Situ
Measurement
• Multi-track optical measurement (Transmit., Reflectance)
• Non contact sheet resistance measurement
• Other parameters on request
• Marker cathode
Process
Control
• Impedance control for SiOxNY deposition

Applications & Equipment for Production
Air-to-Air Metal Strip Coating

Air-to-Air Metal Strip Coater MCS1250
• Substrate 1.25 m (W)
• R2R for Metal Strip Coating 24h/5d onto Al, Cu, Steel
• EB-PVD and Rotatable Magnetron Sputtering
• Film materials: Al, CrN, SiO2, TiO2,

Metallbandbeschichter MSC 1200
Air-to-Air Metal Strip Coater
Coatings and Applications
onto Al, Cu and SST metal strip:
Reflectors
Absorbers
Technologies:
• Glow Discharge
• Sputter Etching
• Metallic and Reactive Sputtering
• Electron Beam Evaporation
Length 106 m, Strip width 1,2 m

Plasma Pre-Treatment
Glow Discharge Sputter etching
Electron impact Ar+ Ion impact

Reflectors with Metal Strips
Light Reflectors made from Aluminium
Reflectatance:
Electro plated < 85%
Vacuum coating > 96%
20% less energy consumption
with constant illumination strength

Enhanced Reflectance vs. Mirror Material
• Enhanced Al Mirror • Enhanced Ag Mirror

Seminar University of Salento43
EB-PVD: Layer Properties
Parameter SiO2 TiO2
Index of refraction n = 1.44 n = 2.2...2.3
(λ = 670 nm)
λ/(4n)-thickness 85 nm 45 nm
O2 partial pressure 1 x 10-4 mbar 1 x 10-4 mbar
density 0.8 ... 0.9 ρbulk 0.8 .... 0.9 ρbulk
Maximum dynamic rate
(absorption free) 30 nm/s 5...6 nm/s
Evaporated material
per cycle (120 h) 80 kg 75 kg
Techn. Challenges Sublimation residual absorption
(re-oxidation of
suboxides)
15.10.2013

Solar Absorber with Metal Strip
Solar Absorber – Top Roof Modul Copper Metal Strip – PVD coated

Solar water heating
• Goals
Best usage of solar energy High solar absorbance Ae
Reduced losses low Emissivity ε
15.10.2013

Process Monitoring Using Ellipsometry
In-Situ / Ex-Situ
• in situ: Ellipsometry, XRF
• ex situ: Reflectometry
• reverse thickness
calculation
• position matching
15.10.2013

Air-to-Air
Metal Strip Coater MSC1250

Ldb Convergenze Parallele_07

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